BAS70W /-04 /-05 /-06
SURFACE MOUNT SCHOTTKY BARRIER DIODE
Features
• Low Turn-on Voltage
• Fast Switching
• PN Junction Guard Ring for Transient and ESD Protection
• Ultra-Small Surface Mount Package
• Lead Free/RoHS Compliant (Note 3)
• "Green" Device (Note 4 and 5)
Mechanical Data
• Case: SOT-323
• Case Material: Molded Plastic, "Green" Molding Compound,
Note 5. UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
• Polarity: See Diagrams Below
• Marking Information: See Page 2
• Ordering Information: See Page 2
• Weight: 0.006 grams (approximate)
Top View BAS70W BAS70W-04 BAS70W-05 BAS70W-06
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR 70 V
RMS Reverse Voltage VR(RMS) 49 V
Forward Continuous Current (Note 1) IF 70 mA
Non-Repetitive Peak Forward Surge Current @ tp < 1.0s IFSM 100 mA
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 1) PD 200 mW
Thermal Resistance Junction to Ambient Air (Note 1) RθJA 625 °C/W
Operating Temperature Range TJ -55 to +125 °C
Storage Temperature Range TSTG -65 to +150 °C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic Symbol Min Max Unit Test Condition
Reverse Breakdown Voltage (Note 2) V(BR)R 70 — — IR = 10μA
Forward Voltage VF — 410
1000 mV tp <300µs, IF = 1.0mA
tp <300µs, IF = 15mA
Reverse Current (Note 2) IR ⎯ 100 nA tp < 300µs, VR = 50V
Total Capacitance CT ⎯ 2.0 pF VR = 0V, f = 1.0MHz
Reverse Recovery Time trr — 5.0 ns IF = IR = 10mA to IR = 1.0mA,
Irr = 0.1 x IR, RL = 100Ω
Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
BAS70W /-04 /-05 /-06
Document number: DS30113 Rev. 13 - 2 1 of 3
www.diodes.com July 2008
© Diodes Incorporated