AgilentHCPL-270L/070L/273L/073L Low Input Current High Gain LVTTL/LVCMOS Compatible 3.3 V Optocouplers Data Sheet Features * Low power consumption * High current transfer ratio * Low input current requirements - 0.5 mA Description These high gain series couplers use a Light Emitting Diode and an integrated high gain photodetector to provide extremely high current transfer ratio between input and output. Separate pins for the photodiode and output stage result in LVTTL compatible saturation voltages and high speed operation. Where desired, the VCC and VO terminals may be tied together to achieve conventional photo- darlington operation. A base access terminal allows a gain bandwidth adjustment to be made. These optocouplers are for use in LVTTL/LVCMOS or other low power applications. A 400% minimum current transfer ratio is guaranteed over 0 to +70C operating range for only 0.5 mA of LED current. * LVTTL/LVCMOS compatible output * Performance guaranteed over temperature 0C to +70C * Base access allows gain bandwidth adjustment * High output current - 60 mA * Safety approval, UL, IEC/EN/DIN EN 60747-5-2, CSA Applications * Ground isolate most logic families - LVTTL/LVCMOS * Low input current line receiver Functional Diagram * High voltage insulation * EIA RS-232C line receiver HCPL-270L/070L NC 1 HCPL-273L/073L 8 VCC * Telephone ring detector ANODE 1 1 8 VCC ANODE 2 7 VB CATHODE 1 2 7 VO1 CATHODE 3 6 VO CATHODE 2 3 6 VO2 NC 4 5 GND * V AC line voltage status indicator - low input power dissipation * Low power systems - ground isolation 5 GND ANODE 2 4 SHIELD TRUTH TABLE LED VO LOW ON HIGH OFF A 0.1 F bypass capacitor connected between pins 8 and 5 is recommended. CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. The HCPL-070L and HCPL-073L are surface mount devices packaged in an industry standard SOIC-8 footprint. The SOIC-8 does not require "through holes" in a PCB. This package occupies approximately one-third the footprint area of the standard dual-in-line package. The lead profile is designed to be compatible with standard surface mount processes. Ordering Information Specify Part Number followed by Option Number (if desired). Example: HCPL-270L #XXXX 060 = IEC/EN/DIN EN 60747-5-2 Option 500 = Tape and Reel Packaging Option XXXE = Lead Free Option Option data sheets available. Contact your Agilent sales representative or authorized distributor for information. Remarks: The notation "#" is used for existing products, while (new) products launched since 15th July 2001 and lead free option will use "-" Selection Guide 8-Pin DIP (300 Mil) Single Channel Dual Channel Package HCPLPackage HCPL270L 273L Small Outline SO-8 Single Channel Dual Channel Package HCPLPackage HCPL070L 073L Minimum Input ON Current (IF) 0.5 mA Schematic 1 Minimum CTR 400% I CC I F1 + 8 VCC VF1 VCC 8 - ICC 2 ANODE I O1 VO1 2 7 IF 3 + I F2 - I O2 VF CATHODE 6 VF2 - IO 3 6 VO VO2 + 4 5 SHIELD 2 5 SHIELD IB 7 VB HCPL-270L/HCPL-070L GND GND USE OF A 0.1 F BYPASS CAPACITOR CONNECTED BETWEEN PINS 5 AND 8 IS RECOMMENDED HCPL-273L/HCPL-073L Package Outline Drawings 8-Pin DIP Package 7.62 0.25 (0.300 0.010) 9.65 0.25 (0.380 0.010) 8 TYPE NUMBER 7 6 5 6.35 0.25 (0.250 0.010) OPTION CODE* DATE CODE A XXXXZ YYWW RU 1 2 3 4 UL RECOGNITION 1.78 (0.070) MAX. 1.19 (0.047) MAX. + 0.076 0.254 - 0.051 + 0.003) (0.010 - 0.002) 5 TYP. 3.56 0.13 (0.140 0.005) 4.70 (0.185) MAX. 0.51 (0.020) MIN. 2.92 (0.115) MIN. DIMENSIONS IN MILLIMETERS AND (INCHES). 0.65 (0.025) MAX. 1.080 0.320 (0.043 0.013) * MARKING CODE LETTER FOR OPTION NUMBERS "L" = OPTION 020 "V" = OPTION 060 OPTION NUMBERS 300 AND 500 NOT MARKED. 2.54 0.25 (0.100 0.010) NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX. Small Outline SO-8 Package LAND PATTERN RECOMMENDATION TYPE NUMBER (LAST 3 DIGITS) 8 7 OPTION 060 CODE 6 5 5.994 0.203 (0.236 0.008) XXXV YWW 3.937 0.127 (0.155 0.005) 7.49 (0.295) DATE CODE PIN ONE 1 2 3 0.406 0.076 (0.016 0.003) 4 1.9 (0.075) 1.270 BSC (0.050) 0.64 (0.025) * 5.080 0.127 (0.200 0.005) 3.175 0.127 (0.125 0.005) 7 45 X 0.432 (0.017) 0 ~ 7 0.228 0.025 (0.009 0.001) 1.524 (0.060) 0.203 0.102 (0.008 0.004) * TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH) 5.207 0.254 (0.205 0.010) 0.305 MIN. (0.012) DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX. OPTION NUMBER 500 NOT MARKED. NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX. 3 Solder Reflow Temperature Profile Regulatory Information The devices contained in this data sheet have been approved by the following organizations: 300 TEMPERATURE (C) PREHEATING RATE 3C + 1C/-0.5C/SEC. REFLOW HEATING RATE 2.5C 0.5C/SEC. PEAK TEMP. 245C PEAK TEMP. 240C 200 2.5C 0.5C/SEC. 160C 150C 140C 30 SEC. 3C + 1C/-0.5C CSA 100 50 SEC. TIGHT TYPICAL LOOSE ROOM TEMPERATURE 0 0 50 100 150 200 TIME (SECONDS) tp Tp TL Tsmax TIME WITHIN 5 C of ACTUAL PEAK TEMPERATURE 20-40 SEC. 260 +0/-5 C 217 C RAMP-UP 3 C/SEC. MAX. 150 - 200 C RAMP-DOWN 6 C/SEC. MAX. Tsmin ts PREHEAT 60 to 180 SEC. Approval under CSA Component Acceptance Notice #5, File CA 88324. 250 IEC/EN/DIN EN 60747-5-2 Approved under IEC 60747-5-2:1997 + A1:2002 EN 60747-5-2:2001 + A1:2002 DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01 (Option 060 only) Recommended Pb-Free IR Profile TEMPERATURE Approval under UL 1577, Component Recognition Program, File E55361. SOLDERING TIME 200C 30 SEC. PREHEATING TIME 150C, 90 + 30 SEC. tL 60 to 150 SEC. 25 t 25 C to PEAK TIME NOTES: THE TIME FROM 25 C to PEAK TEMPERATURE = 8 MINUTES MAX. Tsmax = 200 C, Tsmin = 150 C 4 UL PEAK TEMP. 230C Insulation and Safety Related Specifications Parameter Minimum External Air Gap (External Clearance) Minimum External Tracking (External Creepage) Minimum Internal Plastic Gap (Internal Clearance) Tracking Resistance (Comparative Tracking Index) Isolation Group Symbol L (101) 8-Pin DIP (300 Mil) Value 7.1 SO-8 Value 4.9 Units mm L (102) 7.4 4.8 mm 0.08 0.08 mm 200 200 Volts IIIa IIIa CTI Conditions Measured from input terminals to output terminals, shortest distance through air. Measured from input terminals to output terminals, shortest distance path along body. Through insulation distance, conductor to conductor, usually the direct distance between the photoemitter and photodetector inside the optocoupler cavity. DIN IEC 112/VDE 0303 Part 1. Material Group (DIN VDE 0110, 1/89, Table 1). IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics Description Installation classification per DIN VDE 0110/1.89, Table 1 for rated mains voltage 150 V rms for rated mains voltage 300 V rms for rated mains voltage 600 V rms Climatic Classification Pollution Degree (DIN VDE 0110/1.89) Maximum Working Insulation Voltage Input to Output Test Voltage, Method b* VPR = 1.875 x VIORM, 100% Production Test with tP = 1 sec, Partial Discharge < 5 pC Input to Output Test Voltage, Method a* VPR = 1.5 x VIORM, Type and Sample Test, tP = 60 sec, Partial Discharge < 5 pC Highest Allowable Overvoltage* (Transient Overvoltage, tini = 10 sec) Safety Limiting Values (Maximum values allowed in the event of a failure, also see Figure 11, Thermal Derating curve.) Case Temperature Current (Input Current IF, PS = 0) Output Power Insulation Resistance at TS, VIO = 500 V Symbol 8-pin DIP (300 mil) SO-8 Units VIORM I-IV I-III 55/100/21 2 630 I-IV I-III I-II 55/100/21 2 566 Vpeak VPR 1181 1063 Vpeak VPR 945 849 Vpeak VIOTM 6000 4000 Vpeak TS IS,INPUT PS,OUTPUT RS 175 400 600 109 150 150 600 109 C mA mW *Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, IEC/EN/DIN EN 60747-5-2, for a detailed description. Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application. 5 Absolute Maximum Ratings (No Derating Required up to +85C) Parameter Storage Temperature Operating Temperature Average Forward Input Current Peak Forward Input Current (50% Duty Cycle, 1 ms Pulse Width) Peak Transient Input Current (< 1 s Pulse Width, 300 pps) Reverse Input Voltage Input Power Dissipation Output Current (Pin 6) Emitter Base Reverse Voltage (Pin 5-7) Supply Voltage and Output Voltage Output Power Dissipation Total Power Dissipation Lead Solder Temperature (for Through Hole Devices) Reflow Temperature Profile (for SOIC-8 and Option #300) Symbol TS TA IF(AVG) IF(PEAK) IF(TRAN) 6 Symbol VCC IF(ON) VF(OFF) TA Min. 2.7 0.5 0 0 Max. 125 85 20 40 Units C C mA mA 1.0 A VR 5 V PI 35 mW IO 60 mA VEB 0.5 V VCC -0.5 7 V PO 100 mW PT 135 mW 260C for 10 sec., 1.6 mm below seating plane. See Package Outline Drawings section. Recommended Operating Conditions Parameter Power Supply Voltage Forward Input Current (ON) Forward Input Voltage (OFF) Operating Temperature Min. -55 -40 Max. 3.6 12.0 0.8 70 Units V mA V C Electrical Specifications 0C TA +70C, 2.7 V VCC 3.3 V, 0.5 mA IF(ON) 12 mA, 0 V VF(OFF) 0.8 V, unless otherwise specified. All typicals at TA = 25C. (See Note 8.) Device Parameter Sym. HCPLCurrent Transfer CTR Ratio Logic Low VOL Output Voltage Logic High Output Current Logic Low Supply Current Logic High Supply Current Input Forward Voltage Input Reverse Breakdown Voltage Input Capacitance Min. Typ.* Max. Units 400 1300 5000 % VCC = 3.3 V VO = 0.4 V VCC = 3.3 V Fig. Note 1, 2 2 0.05 0.3 V 0.05 0.4 V IOH 5 25 A IF = 1.6 mA, IO = 8 mA IF = 5.0 mA, IO = 15 mA VO = VCC = 3.3 V ICCL 270L/070L 0.4 1.3 mA VCC = 3.3 V IF1 = IF2 = 1.6 mA VO1 = VO2 = Open 273L/073L 270L/070L 0.8 2.7 0.002 1 mA A VCC = 3.3 V IF1 = IF2 = 0 mA VO1 = VO2 = Open 273L/073L 0.002 2 1.5 1.7 A V TA = 25C IF = 1.6 mA V IR = 10 A, TA = 25C 2 pF f = 1 MHz, VF = 0 2 ICCH VF BVR CIN 5.0 60 *All typical values at TA = 25C and VCC = 3.3 V, unless otherwise noted. 7 Test Conditions IF = 0.5 mA IF = 0 mA 2 3, 4 Switching Specifications (AC) Over Recommended Operating Conditions (TA = 0C to +70C), VCC = 3.3 V, unless otherwise specified. (See Note 8.) Parameter Propagation Delay Time to Logic Low at Output Propagation Delay Time to Logic High at Output Common Mode Transient Immunity at Logic High Level Output Common Mode Transient Immunity at Logic Low Level Output Sym. tPHL Device HCPL- Min. Typ.* tPLH Units s Test Conditions IF = 0.5 mA, Rl = 4.7 k Fig. 5 Note 2 90 s IF = 0.5 mA, RL = 4.7 k 5 2 |CMH| 1000 10000 V/s IF = 0 mA, TA = 25C, Rl = 2.2 k |VCM| = 10 Vp-p 6 2, 6, 7 |CML| 1000 10000 V/s IF = 1.6 mA, TA = 25C, Rl = 2.2 k |VCM| = 10 Vp-p 6 2, 6, 7 *All typical values at TA = 25C and VCC = 3.3 V, unless otherwise noted. 8 Max. 30 Package Characteristics Parameter Sym. Input-Output VISO Momentary Withstand Voltage** Resistance RI-O (Input-Output) Capacitance C I-O (Input-Output) Input-Input I I-I Insulation Leakage Current Input-Input R I-I Insulation Leakage Current Capacitance C I-I (Input-Input) Device HCPL- Min. 3750 Typ.* Max. Units V rms Test Conditions RH 50%, t = 1 min., TA = 25C 1012 0.6 pF VI-O = 500 Vdc RH 45% f = 1 MHz A 0.005 2730 2731 0730 0731 RH 45% VI-I = 500 Vdc Fig. Note 4, 9 4 11 5 1011 5 0.03 pF 5 0.25 *All typical values at TA = 25C, unless otherwise noted. **The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous voltage rating. For the continuous voltage rating refer to the IEC/EN/DIN EN 60747-5-2 Insulation Characteristics Table (if applicable), your equipment level safety specification or Agilent Application Note 1074 entitled "Optocoupler Input-Output Endurance Voltage." Notes: 1. Pin 5 should be the most negative voltage at the detector side. 2. Each channel. 3. DC CURRENT TRANSFER RATIO (CTR) is defined as the ratio of output collector current, IO, to the forward LED input current, IF, times 100%. 4. Device considered a two-terminal device: pins 1, 2, 3, and 4 shorted together, and pins 5, 6, 7, and 8 shorted together. 5. Measured between pins 1 and 2 shorted together, and pins 3 and 4 shorted together. 6. Common mode transient immunity in a Logic High level is the maximum tolerable (positive) dVCM/dt of the common mode pulse, VCM, to assure that the output will remain in a Logic High state (i.e., VO > 2.0 V). Common mode transient immunity in a Logic Low level is the maximum tolerable (negative) dVCM/dt of the common mode pulse, VCM, to assure that the output will remain in a Logic Low state (i.e., VO < 0.8 V). 7. In applications where dV/dt may exceed 50,000 V/s (such as static discharge) a series resistor, RCC, should be included to protect the detector IC from destructively high surge currents. The recommended value is RCC = 110 . 8. Use of a 0.1 F bypass capacitor connected between pins 5 and 8 adjacent to the device is recommended. 9. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage > 4500 V rms for 1 second (leakage detection current limit, II-O < 5 A). 10. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage > 6000 V rms for 1 second (leakage detection current limit, II-O < 5 A). 11. Measured between the LED anode and cathode shorted together and pins 5 through 8 shorted together. 12. Derate linearly above 65C free-air temperature at a rate of 2.3 mW/C for the SO-8 package. 9 25C 1600 70C -40C 1200 800 400 VCC = 3.3 V VO = 0.4 V 0 0.1 1.0 10 IF - FORWARD CURRENT - mA Figure 1. Current transfer ratio vs. forward current. VF - FORWARD VOLTAGE - V 1.6 IF = 1.6 mA 1.5 1.4 1.3 1.2 -60 -40 -20 0 20 40 60 80 100 TA - TEMPERATURE - C Figure 4. Forward voltage vs. temperature. 10 100 IF - FORWARD CURRENT - mA 70C IO - OUTPUT CURRENT - mA CTR - CURRENT TRANSFER RATIO - % 1000 85C 2000 10 TA = 85 C 1.0 0.1 0.01 0.01 TA = 70 C TA = 25 C TA = 0 C TA = -40 C 0.1 1 10 IF - INPUT DIODE FORWARD CURRENT - mA Figure 2. Output current vs. input diode forward current. 100 IF + VF - 10 1.0 TA = 85C TA = 70C 0.1 TA = 25C 0.01 0.001 1.1 TA = 0C TA = -40C 1.2 1.3 1.4 1.5 VF - FORWARD VOLTAGE - V Figure 3. Input diode forward current vs. forward voltage. 1.6 IF PULSE GEN. ZO = 50 t r = 5 ns 0 3.3 V VO (SATURATED RESPONSE) 50% IF 10% DUTY CYCLE I/f < 100 s 50% 1 8 2 7 3 6 3.3 V RL VO VOL t PHL t PLH 0.1 F I F MONITOR 5 4 CL = 15 pF* RM VO 3.3 V 90% (NON-SATURATED RESPONSE) 10% * INCLUDES PROBE AND FIXTURE CAPACITANCE 90% 10% tf tr Figure 5. Switching test circuit. VCM 10 V 0 V 10% IF tr, tf = 16 ns 90% 90% tr VO 8 RCC (SEE NOTE 6) +3.3 V 2 7 RL 3 6 4 5 B 10% tf A 3.3 V VFF SWITCH AT A: IF = 0 mA VO 1 VOL SWITCH AT B: IF = 1.6 mA VCM + - PULSE GEN. Figure 6. Test circuit for transient immunity and typical waveforms. 11 VO www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152 (Domestic/International), or 0120-61-1280 (Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright (c) 2004 Agilent Technologies, Inc. Obsoletes 5989-0298EN December 20, 2004 5989-2103EN