Description
These high gain series couplers use
a Light Emitting Diode and an
integrated high gain photodetector
to provide extremely high current
transfer ratio between input and
output. Separate pins for the
photodiode and output stage result
in LVTTL compatible saturation
voltages and high speed operation.
Where desired, the VCC and VO
terminals may be tied together to
achieve conventional photo-
Agilent HCPL-270L/ 070L/273L/073L
Low Input Current High Gain
LVTTL/LVCMOS Compatible
3.3 V Optocouplers
Data Sheet
Features
• Low power consumption
• High current transfer ratio
• Low input current requirements –
0.5 mA
• LVTTL/LVCMOS compatible output
• Performance guaranteed over
temperature 0˚C to +70˚C
• Base access allows gain
bandwidth adjustment
• High output current – 60 mA
• Safety approval, UL, IEC/EN/DIN EN
60747-5-2, CSA
Applications
• Ground isolate most logic
families – LVTTL/LVCMOS
• Low input current line receiver
• High voltage insulation
• EIA RS-232C line receiver
• Telephone ring detector
• V AC line voltage status
indicator – low input power
dissipation
• Low power systems – ground
isolation
Functional Diagram
A 0.1 µF bypass capacitor connected between pins 8 and 5 is recommended.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent
damage and/or degradation which may be induced by ESD.
darlington operation. A base
access terminal allows a gain
bandwidth adjustment to be
made.
These optocouplers are for use in
LVTTL/LVCMOS or other low
power applications. A 400%
minimum current transfer ratio is
guaranteed over 0 to +70˚C
operating range for only 0.5 mA
of LED current.
7
1
2
3
45
6
8
NC
ANODE
CATHODE
NC
V
CC
V
O
GND
TRUTH TABLE
LED
ON
OFF
V
O
LOW
HIGH
V
B
V
O2
V
O1
V
CC
GND
ANODE
1
CATHODE
1
CATHODE
2
ANODE
2
7
5
6
8
2
3
4
1
SHIELD
HCPL-270L/070L HCPL-273L/073L
2
Selection Guide
8-Pin DIP (300 Mil) Small Outline SO-8
Single Channel Dual Channel Single Channel Dual Channel Minimum Input
Package HCPL- Package HCPL- Package HCPL- Package HCPL- ON Current (IF) Minimum CTR
270L 273L 070L 073L 0.5 mA 400%
Ordering Information
Specify Part Number followed by Option Number (if desired).
Example:
HCPL-270L #XXXX
060 = IEC/EN/DIN EN 60747-5-2 Option
500 = Tape and Reel Packaging Option
XXXE = Lead Free Option
Option data sheets available. Contact your Agilent sales representative
or authorized distributor for information.
Schematic
The HCPL-070L and HCPL-073L
are surface mount devices
packaged in an industry standard
SOIC-8 footprint.
The SOIC-8 does not require
"through holes" in a PCB. This
package occupies approximately
one-third the footprint area of the
standard dual-in-line package.
The lead profile is designed to be
compatible with standard surface
mount processes.
HCPL-270L/HCPL-070L HCPL-273L/HCPL-073L
I
F
8
V
CC
2
3
I
CC
V
F
ANODE
CATHODE
+
–
VB
I
B
6
5GND
V
O
I
O
7
SHIELD
Remarks: The notation “#” is used for existing products, while (new)
products launched since 15th July 2001 and lead free option will use “-”
I
F2
6
5GND
3
4
V
O2
V
F2
I
O2
+
–
I
F1
8
7V
CC
1
2
V
O1
I
CC
V
F1
I
O1
–
+
SHIELD
USE OF A 0.1 µF BYPASS CAPACITOR CONNECTED
BETWEEN PINS 5 AND 8 IS RECOMMENDED
3
Package Outline Drawings
8-Pin DIP Package
1.080 ± 0.320
(0.043 ± 0.013) 2.54 ± 0.25
(0.100 ± 0.010)
0.51 (0.020) MIN.
0.65 (0.025) MAX.
4.70 (0.185) MAX.
2.92 (0.115) MIN.
5° TYP. 0.254 + 0.076
- 0.051
(0.010+ 0.003)
- 0.002)
7.62 ± 0.25
(0.300 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
9.65 ± 0.25
(0.380 ± 0.010)
1.78 (0.070) MAX.
1.19 (0.047) MAX.
A XXXXZ
YYWW
DATE CODE
DIMENSIONS IN MILLIMETERS AND (INCHES).
5678
4321
OPTION CODE*
UL
RECOGNITION
UR
TYPE NUMBER
* MARKING CODE LETTER FOR OPTION NUMBERS
"L" = OPTION 020
"V" = OPTION 060
OPTION NUMBERS 300 AND 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
3.56 ± 0.13
(0.140 ± 0.005)
Small Outline SO-8 Package
XXXV
YWW
8765
4321
5.994 ± 0.203
(0.236 ± 0.008)
3.937 ± 0.127
(0.155 ± 0.005)
0.406 ± 0.076
(0.016 ± 0.003) 1.270
(0.050)BSC
5.080 ± 0.127
(0.200 ± 0.005)
3.175 ± 0.127
(0.125 ± 0.005) 1.524
(0.060)
45° X 0.432
(0.017)
0.228 ± 0.025
(0.009 ± 0.001)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
0.305
(0.012)MIN.
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
OPTION NUMBER 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
0.203 ± 0.102
(0.008 ± 0.004)
7°
PIN ONE
0 ~ 7°
*
*
OPTION 060 CODE
7.49 (0.295)
1.9 (0.075)
0.64 (0.025)
LAND PATTERN RECOMMENDATION
4
Solder Reflow Temperature Profile Regulatory Information
The devices contained in this
data sheet have been approved by
the following organizations:
UL
Approval under UL 1577,
Component Recognition
Program, File E55361.
CSA
Approval under CSA Component
Acceptance
Notice #5, File CA 88324.
IEC/EN/DIN EN 60747-5-2
Approved under
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01
(Option 060 only)
Recommended Pb-Free IR Profile
0
TIME (SECONDS)
TEMPERATURE (°C)
200
100
50 150100 200 250
300
0
30
SEC.
50 SEC.
30
SEC.
160°C
140°C
150°C
PEAK
TEMP.
245°C
PEAK
TEMP.
240°CPEAK
TEMP.
230°C
SOLDERING
TIME
200°C
PREHEATING TIME
150°C, 90 + 30 SEC.
2.5°C ± 0.5°C/SEC.
3°C + 1°C/–0.5°C
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
217 °C
RAMP-DOWN
6 °C/SEC. MAX.
RAMP-UP
3 °C/SEC. MAX.
150 - 200 °C
260 +0/-5 °C
t 25 °C to PEAK
60 to 150 SEC.
20-40 SEC.
TIME WITHIN 5 °C of A CTUAL
PEAK TEMPERA TURE
t
p
t
s
PREHEAT
60 to 180 SEC.
t
L
T
L
T
smax
T
smin
25
T
p
TIME
TEMPERATURE
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200 °C, T
smin
= 150 °C
5
Insulation and Safety Related Specifications
8-Pin DIP
(300 Mil) SO-8
Parameter Symbol Value Value Units Conditions
Minimum External Air L (101) 7.1 4.9 mm Measured from input terminals to output
Gap (External Clearance) terminals, shortest distance through air.
Minimum External Tracking L (102) 7.4 4.8 mm Measured from input terminals to output
(External Creepage) terminals, shortest distance path along body.
Minimum Internal Plastic 0.08 0.08 mm Through insulation distance, conductor to
Gap (Internal Clearance) conductor, usually the direct distance
between the photoemitter and photodetector
inside the optocoupler cavity.
Tracking Resistance CTI 200 200 Volts DIN IEC 112/VDE 0303 Part 1.
(Comparative Tracking
Index)
Isolation Group IIIa IIIa Material Group (DIN VDE 0110, 1/89, Table 1).
IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics
8-pin DIP
Description Symbol (300 mil) SO-8 Units
Installation classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage ≤ 150 V rms I-IV
for rated mains voltage ≤ 300 V rms I-IV I-III
for rated mains voltage ≤ 600 V rms I-III I-II
Climatic Classification 55/100/21 55/100/21
Pollution Degree (DIN VDE 0110/1.89) 2 2
Maximum Working Insulation Voltage VIORM 630 566 Vpeak
Input to Output Test Voltage, Method b*
VPR = 1.875 x VIORM, 100% Production Test with tP = 1 sec, VPR 1181 1063 Vpeak
Partial Discharge < 5 pC
Input to Output Test Voltage, Method a*
VPR = 1.5 x VIORM, Type and Sample Test, VPR 945 849 Vpeak
tP = 60 sec, Partial Discharge < 5 pC
Highest Allowable Overvoltage* VIOTM 6000 4000 Vpeak
(Transient Overvoltage, tini = 10 sec)
Safety Limiting Values
(Maximum values allowed in the event of a failure,
also see Figure 11, Thermal Derating curve.)
Case Temperature TS175 150 ˚C
Current (Input Current IF, PS = 0) IS,INPUT 400 150 mA
Output Power PS,OUTPUT 600 600 mW
Insulation Resistance at TS, VIO = 500 V RS≥ 109≥ 109Ω
*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, IEC/EN/DIN EN 60747-5-2, for a detailed
description.
Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application.
6
Absolute Maximum Ratings (No Derating Required up to +85˚C)
Parameter Symbol Min. Max. Units
Storage Temperature TS–55 125 ˚C
Operating Temperature TA–40 85 ˚C
Average Forward Input Current IF(AVG) 20 mA
Peak Forward Input Current IF(PEAK) 40 mA
(50% Duty Cycle, 1 ms Pulse Width)
Peak Transient Input Current IF(TRAN) 1.0 A
(< 1 µs Pulse Width, 300 pps)
Reverse Input Voltage VR5V
Input Power Dissipation PI35 mW
Output Current (Pin 6) IO60 mA
Emitter Base Reverse Voltage (Pin 5-7) VEB 0.5 V
Supply Voltage and Output Voltage VCC –0.5 7 V
Output Power Dissipation PO100 mW
Total Power Dissipation PT135 mW
Lead Solder Temperature (for Through Hole Devices) 260˚C for 10 sec., 1.6 mm below seating plane.
Reflow Temperature Profile See Package Outline Drawings section.
(for SOIC-8 and Option #300)
Recommended Operating Conditions
Parameter Symbol Min. Max. Units
Power Supply Voltage VCC 2.7 3.6 V
Forward Input Current (ON) IF(ON) 0.5 12.0 mA
Forward Input Voltage (OFF) VF(OFF) 00.8V
Operating Temperature TA070˚C
7
Electrical Specifications
0˚C ≤ TA ≤ +70˚C, 2.7 V ≤ VCC ≤ 3.3 V, 0.5 mA ≤ IF(ON) ≤ 12 mA, 0 V ≤ VF(OFF) ≤ 0.8 V, unless otherwise specified. All
typicals at TA = 25˚C. (See Note 8.)
Device
Parameter Sym. HCPL- Min. Typ.* Max. Units Test Conditions Fig. Note
Current Transfer CTR 400 1300 5000 % IF = 0.5 mA VCC = 3.3 V 1, 2 2
Ratio VO = 0.4 V
Logic Low VOL 0.05 0.3 V IF = 1.6 mA, VCC = 3.3 V
Output Voltage IO = 8 mA
0.05 0.4 V IF = 5.0 mA,
IO = 15 mA
Logic High IOH 525µAV
O = VCC = 3.3 V IF = 0 mA 2
Output Current
Logic Low ICCL 270L/070L 0.4 1.3 mA VCC = 3.3 V IF1 = IF2 = 1.6 mA
Supply Current VO1 = VO2 = Open
273L/073L 0.8 2.7 mA
Logic High ICCH 270L/070L 0.002 1 µAV
CC = 3.3 V IF1 = IF2 = 0 mA
Supply Current VO1 = VO2 = Open
273L/073L 0.002 2 µA
Input Forward VF1.5 1.7 V TA = 25˚C IF = 1.6 mA 3, 4
Voltage
Input Reverse BVR5.0 V IR = 10 µA, TA = 25˚C 2
Breakdown
Voltage
Input CIN 60 pF f = 1 MHz, VF = 0 2
Capacitance
*All typical values at TA = 25˚C and VCC = 3.3 V, unless otherwise noted.
8
Switching Specifications (AC)
Over Recommended Operating Conditions (TA = 0˚C to +70˚C), VCC = 3.3 V, unless otherwise specified. (See Note 8.)
Device
Parameter Sym. HCPL- Min. Typ.* Max. Units Test Conditions Fig. Note
Propagation Delay tPHL 30 µsI
F = 0.5 mA, Rl = 4.7 kΩ52
Time to Logic Low
at Output
Propagation Delay tPLH 90 µsI
F = 0.5 mA, RL = 4.7 kΩ52
Time to Logic High
at Output
Common Mode |CM
H
| 1000 10000 V/µsI
F = 0 mA, TA = 25˚C, 6 2, 6, 7
Transient Immunity Rl = 2.2 kΩ
at Logic High |VCM| = 10 Vp-p
Level Output
Common Mode |CM
L
| 1000 10000 V/µsI
F = 1.6 mA, TA = 25˚C, 6 2, 6, 7
Transient Immunity Rl = 2.2 kΩ
at Logic Low |VCM| = 10 Vp-p
Level Output
*All typical values at TA = 25˚C and VCC = 3.3 V, unless otherwise noted.
9
Package Characteristics
Parameter Sym. Device HCPL- Min. Typ.* Max. Units Test Conditions Fig. Note
Input-Output VISO 3750 V rms RH ≤ 50%, 4, 9
Momentary t = 1 min.,
Withstand TA = 25˚C
Voltage**
Resistance RI-O 1012 ΩVI-O = 500 Vdc 4
(Input-Output) RH ≤ 45%
Capacitance CI-O 0.6 pF f = 1 MHz 11
(Input-Output)
Input-Input II-I 0.005 µA RH ≤ 45% 5
Insulation VI-I = 500 Vdc
Leakage Current
Input-Input RI-I 1011 Ω5
Insulation
Leakage Current
Capacitance CI-I 2730 0.03 pF 5
(Input-Input) 2731
0730 0.25
0731
*All typical values at TA = 25˚C, unless otherwise noted.
**The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous
voltage rating. For the continuous voltage rating refer to the IEC/EN/DIN EN 60747-5-2 Insulation Characteristics Table (if applicable), your
equipment level safety specification or Agilent Application Note 1074 entitled "Optocoupler Input-Output Endurance Voltage."
Notes:
1. Pin 5 should be the most negative voltage at the detector side.
2. Each channel.
3. DC CURRENT TRANSFER RATIO (CTR) is defined as the ratio of output collector current, IO, to the forward LED input current, IF, times 100%.
4. Device considered a two-terminal device: pins 1, 2, 3, and 4 shorted together, and pins 5, 6, 7, and 8 shorted together.
5. Measured between pins 1 and 2 shorted together, and pins 3 and 4 shorted together.
6. Common mode transient immunity in a Logic High level is the maximum tolerable (positive) dVCM/dt of the common mode pulse, VCM, to
assure that the output will remain in a Logic High state (i.e., VO > 2.0 V). Common mode transient immunity in a Logic Low level is the
maximum tolerable (negative) dVCM/dt of the common mode pulse, VCM, to assure that the output will remain in a Logic Low state
(i.e., VO < 0.8 V).
7. In applications where dV/dt may exceed 50,000 V/µs (such as static discharge) a series resistor, RCC, should be included to protect the
detector IC from destructively high surge currents. The recommended value is RCC = 110 Ω.
8. Use of a 0.1 µF bypass capacitor connected between pins 5 and 8 adjacent to the device is recommended.
9. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage > 4500 V rms for 1 second (leakage
detection current limit, II-O < 5 µA).
10. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage > 6000 V rms for 1 second (leakage
detection current limit, II-O < 5 µA).
11. Measured between the LED anode and cathode shorted together and pins 5 through 8 shorted together.
12. Derate linearly above 65˚C free-air temperature at a rate of 2.3 mW/˚C for the SO-8 package.
10
Figure 1. Current transfer ratio vs. forward
current.
Figure 2. Output current vs. input diode
forward current.
Figure 3. Input diode forward current vs.
forward voltage.
Figure 4. Forward voltage vs. temperature.
1.6
1.5
1.4
1.3
-60 -20 20 40 100
V
F
– FORWARD VOLTAGE – V
T
A
– TEMPERATURE – °C
60 80
0
-40
1.2
I
F
= 1.6 mA
I
F
– INPUT DIODE FORWARD CURRENT – mA
0.01
0.01 0.1 10
I
O
– OUTPUT CURRENT – mA
0.1
1.0
10
100
T
A
= 25° C
T
A
= 0° C
T
A
= 70° C
T
A
= 85° C
T
A
= -40° C
1
VF – FORWARD VOLTAGE – V
100
10
0.1
0.01
1.1 1.2 1.3 1.4
IF – FORWARD CURRENT – mA
1.61.5
1.0
0.001
1000
–
VF
+
TA = 25°C
TA = 0°C
IF
TA = 85°C
TA = 70°C
TA = -40°C
IF – FORWARD CURRENT – mA
2000
1600
800
400
0.1 1.0
CTR – CURRENT TRANSFER RATIO – %
10
1200
0
VCC = 3.3 V
VO
= 0.4 V
85°C
70°C
25°C
70°C
-40°C
11
Figure 5. Switching test circuit.
Figure 6. Test circuit for transient immunity and typical waveforms.
V
O
PULSE
GEN.
Z = 50 Ω
t = 5 ns
O
r
I MONITOR
F
I
F
0.1 µF
L
R
C
L
= 15 pF*
R
M
0
t
PHL
t
PLH
O
V
I
F
OL
V
50% 50%
3.3 V
3.3 V
7
1
2
3
45
6
8
10% DUTY CYCLE
I/f < 100 µs
(SATURATED
RESPONSE)
t
f
t
r
O
V
(NON-SATURATED
RESPONSE)
3.3 V
90%
10%
90%
10%
* INCLUDES PROBE AND
FIXTURE CAPACITANCE
VO
IF
L
R
A
B
PULSE GEN.
VCM
+
VFF
O
V
OL
V
O
V
0 V 10% 90% 90% 10%
SWITCH AT A: I = 0 mA
F
SWITCH AT B: I = 1.6 mA
F
CM
V
trtf
3.3 V
+3.3 V
–
7
1
2
3
45
6
8RCC (SEE NOTE 6)
10 V tr, tf = 16 ns
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For product information and a complete list of
distributors, please go to our web site.
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Data subject to change.
Copyright © 2004 Agilent Technologies, Inc.
Obsoletes 5989-0298EN
December 20, 2004
5989-2103EN
