256-301750-18 16x16 Array (256) Ball BGA Adapter Converts from 0.8mm Pitch to 1.00mm Pitch FEATURES: * Correct-A-ChipTM technology solves problems associated with the use of alternate ICs (due to availability, obsolescence, need for better performance, etc.) by eliminating the need for new PCBs. * Alows .8mm Pitch devices to be mounted to PCBs laid out for 1.00mm Pitch devices. GENERAL SPECIFICATIONS: * PCB is FR-4, .040. * Solder Ball is .020" dia Sn/Pb 63/37. * PCB plating is ENIG (Immersion Gold over Electroless Nickel) 3-8 Gold per IPC-4552 over 100 min. Nickel per ASTM-B-733. * Solder mask is black LPI (liquid photo imagable). * Operation Temperature is 221F [105C] continuous. MOUNTING CONSIDERATIONS: * Suggested PCB Pad size = .025 .002 [.635] dia. ALL DIMENSIONS: INCHES [MILLIMETERS] Note: Aries specializes in custom design and production. In addition to the standard products shown on this page, special materials, platings, sizes, and configurations can be furnished, depending on quantities. Aries reserves the right to change product specifications without notice. All tolerances .010 [.25] unless otherwise specified http://www.arieselec.com * info@arieselec.com Frenchtown, NJ USA TEL: (908) 996-6841 FAX: (908) 996-3891 abc 18105 Rev A PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED