256-301750-18 - Aries Electronics, Inc.

256-301750-18

16x16 Array (256) Ball BGA Adapter

Converts from 0.8mm Pitch to 1.00mm Pitch

Note: Aries specializes in custom design and production. In addition to the standard

products shown on this page, special materials, platings, sizes, and configurations

can be furnished, depending on quantities. Aries reserves the right to change prod-

uct specifications without notice.

FEATURES:

• Correct-A-Chip™ technology solves problems associat-

ed with the use of alternate ICs (due to availability,

obsolescence, need for better performance, etc.) by

eliminating the need for new PCBs.

• Alows .8mm Pitch devices to be mounted to PCBs laid

out for 1.00mm Pitch devices.

GENERAL SPECIFICATIONS:

• PCB is FR-4, .040.

• Solder Ball is .020” dia Sn/Pb 63/37.

• PCB plating is ENIG (Immersion Gold over Electroless

Nickel) 3-8μ Gold per IPC-4552 over 100μ min. Nickel

per ASTM-B-733.

• Solder mask is black LPI (liquid photo imagable).

• Operation Temperature is 221°F [105°C] continuous.

MOUNTING CONSIDERATIONS:

• Suggested PCB Pad size = .025 ± .002 [.635] dia.

ALL DIMENSIONS: INCHES [MILLIMETERS]

All tolerances ± .010 [.25]

unless otherwise specified

PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED

18105

Rev A

Frenchtown, NJ USA

TEL: (908) 996-6841

FAX: (908) 996-3891

http://www.arieselec.com • info@arieselec.com

abc