IL711/IL712/IL721 High Speed/High Temperature Dual Digital Isolators Features Functional Diagrams IN1 OUT1 IN2 OUT2 IL711 IN1 OUT1 OUT2 IN2 IN1 IN2 +5 V/+3.3 V CMOS / TTL Compatible High Speed: 150 Mbps Typical (S-Series) High Temperature: -40C to +125C (T-Series) 2500 VRMS Isolation (1 min.) 300 ps Typical Pulse Width Distortion (S-Series) 100 ps Typical Pulse Jitter 4 ns Typical Propagation Delay Skew 10 ns Typical Propagation Delay 30 kV/s Typical Common Mode Transient Immunity Low EMC Footprint 2 ns Channel-to-Channel Skew 8-pin MSOP, SOIC, and PDIP Packages UL1577 and IEC 61010-2001 Approved Applications IL712 OUT1 * * * * * * * * * * * * * OUT2 IL721 * * * * * * PROFIBUS DeviceNet CAN RS-485 and RS-422 Board-to-Board Communication Peripheral Interfaces * Logic Level Shifting Description NVE's IL700 family of high-speed digital isolators are CMOS devices manufactured with NVE's patented* IsoLoop(R) spintronic Giant Magnetoresistive (GMR) technology. The IL711S and IL712S are the world's fastest two-channel isolators, with a 150 Mbps typical data rate for both channels. The symmetric magnetic coupling barrier provides a typical propagation delay of only 10 ns and a pulse width distortion as low as 300 ps (0.3 ns), achieving the best specifications of any isolator. Typical transient immunity of 30 kV/s is unsurpassed. The IL711 has two transmit channels; the IL712 and IL721 have one transmit and one receive channel. The IL712 and IL721 operate full duplex, making them ideal for many fieldbus applications, including PROFIBUS, DeviceNet, and CAN. The IL721 has channels reversed to better suit certain board layouts. The IL711 and IL712 are available in 8-pin MSOP, SOIC, and PDIP packages. The IL721 is available in an 8-pin SOIC package. Standard and S-Grade parts are specified over a temperature range of -40C to +100C; T-Grade parts have a maximum operating temperature of +125C. IsoLoop is a registered trademark of NVE Corporation. *U.S. Patent numbers 5,831,426; 6,300,617 and others. NVE Corporation 11409 Valley View Road, Eden Prairie, MN 55344-3617 REV. V Phone: (952) 829-9217 Fax: (952) 829-9189 www.IsoLoop.com (c)NVE Corporation IL711/IL712/IL721 Absolute Maximum Ratings Parameters Storage Temperature Ambient Operating Temperature(1) IL711T/ IL712T/IL721T Supply Voltage Input Voltage Output Voltage Output Current Drive Lead Solder Temperature ESD Symbol TS Min. -55 TA -55 VDD1, VDD2 VI VO IO -0.5 -0.5 -0.5 Typ. Max. 150 125 135 7 VDD + 0.5 VDD + 0.5 10 260 Units C Max. Units 100 125 5.5 VDD 0.8 1 C C V V V s Max. Units 2 Test Conditions C V V V mA C kV 10 sec. HBM Recommended Operating Conditions Parameters Ambient Operating Temperature IL711/IL712 and IL711S/IL712S IL711T/IL712T/IL721T Supply Voltage Logic High Input Voltage Logic Low Input Voltage Input Signal Rise and Fall Times Symbol Min. TA -40 -40 3.0 2.4 0 VDD1, VDD2 VIH VIL tIR, tIF Typ. Test Conditions Insulation Specifications Parameters Creepage Distance MSOP SOIC PDIP Leakage Current(5) Barrier Impedance(5) Symbol Min. Typ. 3.01 4.03 7.04 mm mm mm A || pF 0.2 >1014||3 Test Conditions 240 VRMS, 60 Hz Package Characteristics Parameters Capacitance (Input-Output)(5) Thermal Resistance MSOP SOIC PDIP Package Power Dissipation Symbol CI-O Min. Typ. 2 JC JC JC Max. 168 144 54 150 PPD Units pF C/W C/W C/W mW Test Conditions f = 1 MHz Thermocouple at center underside of package f = 1 MHz, VDD = 5 V Safety and Approvals IEC61010-1 TUV Certificate Numbers: N1502812, N1502812-101 Classification as Reinforced Insulation Model IL711-1; IL712-1 IL711-2; IL712-2 IL711-3; IL712-3; IL721-3 Package MSOP PDIP SOIC UL 1577 Component Recognition Program File Number: E207481 Rated 2500VRMS for 1 minute Soldering Profile Per JEDEC J-STD-020C, MSL=2 2 Pollution Degree II II II Material Group III III III Max. Working Voltage 150 VRMS 300 VRMS 150 VRMS IL711/IL712/IL721 IL711 Pin Connections 1 2 3 4 5 6 7 8 VDD1 IN1 IN2 GND1 GND2 OUT2 OUT1 VDD2 Supply voltage Data in, channel 1 Data in, channel 2 Ground return for VDD1 Ground return for VDD2 Data out, channel 2 Data out, channel 1 Supply voltage VDD1 8 VDD2 1 IN1 2 7 OUT1 IN2 3 6 OUT2 GND1 4 5 GND2 IL711 IL712 Pin Connections 1 2 3 4 5 6 7 8 VDD1 IN1 OUT2 GND1 GND2 IN2 OUT1 VDD2 Supply voltage Data in, channel 1 Data out, channel 2 Ground return for VDD1 Ground return for VDD2 Data in, channel 2 Data out, channel 1 Supply voltage VDD1 VDD2 IN1 OUT1 OUT2 IN2 GND1 GND2 IL712 IL721 Pin Connections 1 2 3 4 5 6 7 8 VDD1 OUT1 IN2 GND1 GND2 OUT2 IN1 VDD2 Supply voltage Data out, channel 1 Data in, channel 2 Ground return for VDD1 Ground return for VDD2 Data out, channel 2 Data in, channel 1 Supply voltage VDD1 VDD2 OUT1 IN1 IN2 OUT2 GND1 GND2 IL721 Timing Diagram Legend tPLH tPHL tPW tR tF 3 Propagation Delay, Low to High Propagation Delay, High to Low Minimum Pulse Width Rise Time Fall Time IL711/IL712/IL721 3.3 Volt Electrical Specifications Electrical specifications are Tmin to Tmax unless otherwise stated. Parameters Symbol Min. Typ. Max. DC Specifications Input Quiescent Supply Current IL711 8 10 IDD1 IL712/IL721 1.5 2 Output Quiescent Supply Current IL711 3.3 4 IDD2 IL712/IL721 1.5 2 Logic Input Current II -10 10 VDD - 0.1 VDD Logic High Output Voltage VOH 0.9 x VDD 0.8 x VDD 0 0.1 Logic Low Output Voltage VOL 0.5 0.8 Switching Specifications Maximum Data Rate IL711/IL712/IL721 100 110 IL711S/IL712S 100 110 IL711T/IL712T/IL721T 130 140 Pulse Width(7) PW 10 7.5 Propagation Delay Input to Output tPHL 12 18 (High to Low) Propagation Delay Input to Output 12 18 tPLH (Low to High) Pulse Width Distortion(2) 2 3 IL711/IL712/IL721 2 3 IL711S/IL712S PWD 1 3 IL711T/IL712T/IL721T Propagation Delay Skew(3) tPSK 4 6 Output Rise Time (10%-90%) tR 2 4 Output Fall Time (10%-90%) tF 2 4 Common Mode Transient Immunity |CM |,|CM | 20 30 H L (Output Logic High or Logic Low)(4) Channel-to-Channel Skew tCSK 2 3 Dynamic Power Consumption(6) 140 240 Magnetic Field Immunity(8) (VDD2= 3V, 3V<VDD1<5.5V) Power Frequency Magnetic Immunity HPF 1000 1500 Pulse Magnetic Field Immunity HPM 1800 2000 Damped Oscillatory Magnetic Field HOSC 1800 2000 Cross-axis Immunity Multiplier(9) KX 2.5 4 Units Test Conditions A mA mA mA A V V Mbps Mbps Mbps ns IO = -20 A, VI = VIH IO = -4 mA, VI = VIH IO = 20 A, VI = VIL IO = 4 mA, VI = VIL CL = 15 pF CL = 15 pF CL = 15 pF 50% Points, VO ns CL = 15 pF ns CL = 15 pF ns ns ns ns ns ns CL = 15 pF CL = 15 pF CL = 15 pF CL = 15 pF CL = 15 pF CL = 15 pF kV/s VCM = 300 V ns A/MHz CL = 15 pF per channel A/m A/m A/m 50Hz/60Hz tp = 8s 0.1Hz - 1MHz IL711/IL712/IL721 5 Volt Electrical Specifications Electrical specifications are Tmin to Tmax unless otherwise stated. Parameters Symbol Min. Typ. Max. DC Specifications Input Quiescent Supply Current IL711 10 15 IDD1 IL712/IL721 2.5 3 Output Quiescent Supply Current IL711 5 6 IDD2 IL712/IL721 2.5 3 Logic Input Current II -10 10 VDD - 0.1 VDD Logic High Output Voltage VOH 0.9 x VDD 0.8 x VDD 0 0.1 Logic Low Output Voltage VOL 0.5 0.8 Switching Specifications Maximum Data Rate IL711/IL712/IL721 100 110 IL711S/IL712S 100 110 IL711T/IL712T/IL721T 130 150 Pulse Width(7) PW 10 7.5 Propagation Delay Input to Output tPHL 10 15 (High to Low) Propagation Delay Input to Output 10 15 tPLH (Low to High) (2) Pulse Width Distortion IL711/IL712/IL721 2 3 IL711S/IL712S PWD 2 3 IL711T/IL712T/IL721T 0.3 3 Pulse Jitter(10) tJ 100 Propagation Delay Skew(3) tPSK 4 6 Output Rise Time (10%-90%) tR 1 3 Output Fall Time (10%-90%) tF 1 3 Common Mode Transient Immunity |,|CM | 20 30 |CM H L (Output Logic High or Logic Low)(4) Channel to Channel Skew tCSK 2 3 Dynamic Power Consumption(6) 200 340 Magnetic Field Immunity(8) (VDD2= 5V, 3V<VDD1<5.5V) Power Frequency Magnetic Immunity HPF 2800 3500 Pulse Magnetic Field Immunity HPM 4000 4500 Damped Oscillatory Magnetic Field HOSC 4000 4500 Cross-axis Immunity Multiplier(9) KX 2.5 Units Test Conditions A mA mA mA A V V Mbps Mbps Mbps ns IO = -20 A, VI = VIH IO = -4 mA, VI = VIH IO = 20 A, VI = VIL IO = 4 mA, VI = VIL CL = 15 pF CL = 15 pF CL = 15 pF 50% Points, VO ns CL = 15 pF ns CL = 15 pF ns ns ns ps ns ns ns CL = 15 pF CL = 15 pF CL = 15 pF CL = 15 pF CL = 15 pF CL = 15 pF CL = 15 pF kV/s Vcm = 300 V ns A/MHz CL = 15 pF per channel A/m A/m A/m 50Hz/60Hz tp = 8s 0.1Hz - 1MHz Notes (apply to both 3.3 V and 5 V specifications): 1. Absolute maximum ambient operating temperature means the device will not be damaged if operated under these conditions. It does not guarantee performance. 2. PWD is defined as |tPHL - tPLH|. %PWD is equal to PWD divided by pulse width. 3. tPSK is the magnitude of the worst-case difference in tPHL and/or tPLH between devices at 25C. 4. CMH is the maximum common mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD2. CML is the maximum common mode input voltage that can be sustained while maintaining VO < 0.8 V. The common mode voltage slew rates apply to both rising and falling common mode voltage edges. 5. Device is considered a two terminal device: pins 1-4 shorted and pins 5-8 shorted. 6. Dynamic power consumption is calculated per channel and is supplied by the channel's input side power supply. 7. Minimum pulse width is the minimum value at which specified PWD is guaranteed. 8. The relevant test and measurement methods are given in the Electromagnetic Compatibility section on p. 6. 9. External magnetic field immunity is improved by this factor if the field direction is "end-to-end" rather than to "pin-to-pin" (see diagram on p. 6). 10. 64k-bit pseudo-random binary signal (PRBS) NRZ bit pattern with no more than five consecutive 1s or 0s; 800 ps transition time. 5 IL711/IL712/IL721 Application Information Electrostatic Discharge Sensitivity Power Supply Decoupling This product has been tested for electrostatic sensitivity to the limits stated in the specifications. However, NVE recommends that all integrated circuits be handled with appropriate care to avoid damage. Damage caused by inappropriate handling or storage could range from performance degradation to complete failure. Both power supplies to these devices should be decoupled with low-ESR 47 nF ceramic capacitors. Ground planes for both GND1 and GND2 are highly recommended for data rates above 10 Mbps. Capacitors must be located as close as possible to the VDD pins. Signal Status on Start-up and Shut Down Electromagnetic Compatibility To minimize power dissipation, input signals are differentiated and then latched on the output side of the isolation barrier to reconstruct the signal. This could result in an ambiguous output state depending on power up, shutdown and power loss sequencing. Unless the circuit connected to the isolator performs its own poweron reset (POR), the designer should consider including an initialization signal in the start-up circuit. Initialization consists of toggling the input either high then low, or low then high. In CAN applications, the IL712 or IL721 should be used with CAN transceivers with Dominant Timeout functions for seamless POR. IsoLoop Isolators have the lowest EMC footprint of any isolation technology. IsoLoop Isolators' Wheatstone bridge configuration and differential magnetic field signaling ensure excellent EMC performance against all relevant standards. These isolators are fully compliant with generic EMC standards EN50081, EN50082-1 and the umbrella line-voltage standard for Information Technology Equipment (ITE) EN61000. NVE has completed compliance tests in the categories below: Most CAN transceiver manufacturers offer Dominant Timeout options. Examples include NXP's TJA 1050 and TJA 1040 transceivers. EN50081-1 Residential, Commercial & Light Industrial Methods EN55022, EN55014 EN50082-2: Industrial Environment Methods EN61000-4-2 (ESD), EN61000-4-3 (Electromagnetic Field Immunity), EN61000-4-4 (Electrical Transient Immunity), EN61000-4-6 (RFI Immunity), EN61000-4-8 (Power Frequency Magnetic Field Immunity), EN61000-4-9 (Pulsed Magnetic Field), EN61000-4-10 (Damped Oscillatory Magnetic Field) ENV50204 Radiated Field from Digital Telephones (Immunity Test) Data Transmission Rates The reliability of a transmission system is directly related to the accuracy and quality of the transmitted digital information. For a digital system, those parameters which determine the limits of the data transmission are pulse width distortion and propagation delay skew. Propagation delay is the time taken for the signal to travel through the device. This is usually different when sending a low-to-high than when sending a high-to-low signal. This difference, or error, is called pulse width distortion (PWD) and is usually in nanoseconds. It may also be expressed as a percentage: Immunity to external magnetic fields is even higher if the field direction is "end-to-end" rather than to "pin-to-pin" as shown in the diagram below: PWD% = Maximum Pulse Width Distortion (ns) Signal Pulse Width (ns) x 100% For example, with data rates of 12.5 Mbps: PWD% = 3 ns x 100% = 3.75% 80 ns Cross-axis Field Direction This figure is almost three times better than any available optocoupler with the same temperature range, and two times better than any optocoupler regardless of published temperature range. IsoLoop isolators exceed the 10% maximum PWD recommended by PROFIBUS, and will run to nearly 35 Mb within the 10% limit. Dynamic Power Consumption IsoLoop Isolators achieve their low power consumption from the way they transmit data across the isolation barrier. By detecting the edge transitions of the input logic signal and converting these to narrow current pulses, a magnetic field is created around the GMR Wheatstone bridge. Depending on the direction of the magnetic field, the bridge causes the output comparator to switch following the input logic signal. Since the current pulses are narrow, about 2.5 ns, the power consumption is independent of mark-to-space ratio and solely dependent on frequency. This has obvious advantages over optocouplers, which have power consumption heavily dependent on mark-to-space ratio. Propagation delay skew is the signal propagation difference between two or more channels. This becomes significant in clocked systems because it is undesirable for the clock pulse to arrive before the data has settled. Short propagation delay skew is therefore especially critical in high data rate parallel systems for establishing and maintaining accuracy and repeatability. Worstcase channel-to-channel skew in an IL700 Isolator is only 3 ns, which is ten times better than any optocoupler. IL700 Isolators have a maximum propagation delay skew of 6 ns, which is five times better than any optocoupler. 6 IL711/IL712/IL721 Illustrative Applications Isolated CAN 3 ADR 0...7, CS Tx0 TxD 1 XTAL1 Rx0 RxD 4 7 CANH 6 CANL XTAL2 TJA1050 IL712/IL721 2 SJA1000 In today's CAN networks, node-to-node isolation is increasingly recommended by designers to reduce EMI susceptibility, especially in highspeed applications and in hybrid and electrical vehicle networks, where the 12 V battery has been replaced with one of several hundred volts. Operator and equipment safety becomes critical when a high voltage source, such as the battery, needs to be connected to diagnosis systems during routine maintenance procedures. In the application shown above, the microcontroller is isolated from the CAN transceiver by an IL712 or IL721, allowing higher speed and more reliable bus operation by eliminating ground loops and reducing susceptibility to noise and EMI events. The best-in-class 10 ns typical IL712/IL721 propagation delay minimizes CAN loop delay and maximizes data rate over any given bus length. The simple circuit works with any CAN transceiver with a TxD dominant timeout, which includes all of the current-generation transceivers. Isolated PROFIBUS / RS-485 Isolation Boundary 1 8 2 7 3 6 4 5 IL711 4 A Z Z 1 0 B Z Z 0 1 R X X 1 0 3 5 4 6 3 7 2 1 8 1 2 IL710 RS-485 Truth Table D DE 1 0 0 0 1 1 0 1 8 6 7 5 ISL8485 NVE offers a unique line of PROFIBUS / RS-485 transceivers, but IL700 high-speed digital signal isolators can also be used as part of multi-chip designs with non-isolated PROFIBUS transceivers. 7 IL711/IL712/IL721 Package Drawings, Dimensions and Specifications 8-pin MSOP 0.114 (2.90) 0 0.122 (3.10) 6 0.016 (0.40) 0.027 (0.70) 0.032 (0.80) 0.043 (1.10) 0.114 (2.90) 0.189 (4.80) 0.197 (5.00) 0.122 (3.10) 0.002 (0.05) 0.006 (0.15) 0.020 (0.50) 0.032 (0.80) NOTE: Pin spacing is a BASIC dimension; tolerances do not accumulate 0.005 (0.13) 0.009 (0.23) 0.010 (0.25) 0.016 (0.40) 8-pin SOIC Package Dimensions in inches (mm) 0.189 (4.8) 0 0.197 (5.0) 8 0.016 (0.40) 0.050 (1.27) 0.054 (1.37) 0.228 (5.8) 0.150 (3.8) 0.069 (1.75) 0.244 (6.2) 0.157 (4.0) 0.010 (0.25) 0.004 (0.10) 0.020 (0.50) 0.010 (0.25) 0.040 (1.0) 1 2 x45 3 0.060 (1.5) NOTE: Pin spacing is a BASIC dimension; tolerances do not accumulate 0.008 (0.19) 0.013 (0.33) 0.010 (0.25) 0.020 (0.50) 8-pin PDIP 0.29 (6.4) 0.31 (7.9) 0.12 (3.05) 0.24 (6.1) 0.15 (3.81) 0.26 (6.6) 0.008 (0.2) 0.015 (0.4) 0.015 (0.38) 0.035 (0.89) 0.36 (9.0) 0.40 (10.2) 0.030 (0.76) 0.30 (7.6) 0.09 (2.3) 0.045 (1.14) 0.37 (9.4) 0.11 (2.8) 0.015 (0.38) 0.023 (0.58) 0.045 (1.14) 0.065 (1.65) 8 NOTE: Pin spacing is a BASIC dimension; tolerances do not accumulate IL711/IL712/IL721 Ordering Information and Valid Part Numbers IL 711 T - 3 E TR13 Valid Part Numbers Bulk Packaging Blank = Tube TR7 = 7'' Tape and Reel TR13 = 13'' Tape and Reel Package Blank = 80/20 Tin/Lead Plating E = RoHS Compliant Package Type -1 = MSOP -2 = PDIP -3 = 0.15'' 8-pin SOIC Grade Blank = Standard T = High Temperature S = High Speed Base Part Number 711 = 2 Drive Channels 712 = 1 Drive Channel 1 Receive Channel 721 = 1 Drive Channel 1 Receive Channel (reverse pinout) IL711-1 IL711-1E IL711S-1 IL711S-1E IL711T-1 IL711T-1E IL712-1 IL712-1E IL712S-1 IL712S-1E IL712T-1 IL712T-1E IL711-2 IL711-2E IL711T-2 IL711T-2E IL712-2 IL712-2E IL712T-2 IL712T-2E IL711-3 IL711S-3 IL711T-3 IL711-3E IL711S-3E IL711T-3E IL712-3 IL712S-3 IL712T-3 IL712-3E IL712S-3E IL712T-3E IL721-3 IL721T-3 IL721-3E IL721T-3E All MSOP and SOIC parts are available on tape and reel. Product Family IL = Isolators RoHS COMPLIANT 9 IL711/IL712/IL721 ISB-DS-001-IL711/12-V January 2010 Changes * Added IL721 configuration. ISB-DS-001-IL711/12-U Changes * Added CAN application diagram (p. 7). ISB-DS-001-IL711/12-T Changes * Added typical jitter specification at 5V. ISB-DS-001-IL711/12-S Changes * Added EMC details. ISB-DS-001-IL711/12-R Changes * IEC 61010 approval for MSOP versions. ISB-DS-001-IL711/12-Q Changes * Added magnetic field immunity and electromagnetic compatibility specifications. ISB-DS-001-IL711/12-P Changes * Correct SOIC package drawing. ISB-DS-001-IL711/12-O Changes * Note on all package drawings that pin-spacing tolerances are non-accumulating; change MSOP pin-spacing dimensions and tolerance accordingly. ISB-DS-001-IL711/12-N Changes * Changed lower limit of length on PDIP package drawing. * Tightened pin-spacing tolerance on MSOP package drawing. ISB-DS-001-IL711/12-M Changes * Changed ordering information to reflect that devices are now fully RoHS compliant with no exemptions. ISB-DS-001-IL711/12-L Changes * Eliminated soldering profile chart ISB-DS-001-IL711/12-K Changes * Added RS-485 application circuit ISB-DS-001-IL711/12-J Changes * MSOP packages, S- and T-Grades added * ISB-DS-001-IL711/12-I Order information updated Changes Added MSOP Specifications Updated IEC and UL Approval Numbers 10 IL711/IL712/IL721 About NVE An ISO 9001 Certified Company NVE Corporation manufactures innovative products based on unique spintronic Giant Magnetoresistive (GMR) technology. Products include Magnetic Field Sensors, Magnetic Field Gradient Sensors (Gradiometers), Digital Magnetic Field Sensors, Digital Signal Isolators, and Isolated Bus Transceivers. NVE pioneered spintronics and in 1994 introduced the world's first products using GMR material, a line of ultra-precise magnetic sensors for position, magnetic media, gear speed and current sensing. NVE Corporation 11409 Valley View Road Eden Prairie, MN 55344-3617 USA Telephone: (952) 829-9217 Fax: (952) 829-9189 Internet: www.nve.com e-mail: isoinfo@nve.com The information provided by NVE Corporation is believed to be accurate. However, no responsibility is assumed by NVE Corporation for its use, nor for any infringement of patents, nor rights or licenses granted to third parties, which may result from its use. No license is granted by implication, or otherwise, under any patent or patent rights of NVE Corporation. NVE Corporation does not authorize, nor warrant, any NVE Corporation product for use in life support devices or systems or other critical applications, without the express written approval of the President of NVE Corporation. Specifications shown are subject to change without notice. ISB-DS-001-IL711/12-V January 2010 11