IL711/IL712/IL721
IsoLoop is a registered trademark of NVE Corporation.
*U.S. Patent numbers 5,831,426; 6,300,617 and others.
REV. V
NVE Corporation 11409 Valley View Road, Eden Prairie, MN 55344-3617 Phone: (952) 829-9217 Fax: (952) 829-9189 www.IsoLoop.com ©NVE Corporation
High Speed/High Temperature Dual Digital Isolators
Functional Diagrams
IL711
IL712
IN
1
IN
2
OUT
1
OUT
2
OUT
1
IN
2
OUT
2
IN
1
IL721
IN
1
OUT
2
IN
2
OUT
1
Features
• +5 V/+3.3 V CMOS / TTL Compatible
• High Speed: 150 Mbps Typical (S-Series)
• High Temperature: −40°C to +125°C (T-Series)
• 2500 VRMS Isolation (1 min.)
• 300 ps Typical Pulse Width Distortion (S-Series)
• 100 ps Typical Pulse Jitter
• 4 ns Typical Propagation Delay Skew
• 10 ns Typical Propagation Delay
• 30 kV/μs Typical Common Mode Transient Immunity
• Low EMC Footprint
• 2 ns Channel-to-Channel Skew
• 8-pin MSOP, SOIC, and PDIP Packages
• UL1577 and IEC 61010-2001 Approved
Applications
• PROFIBUS
• DeviceNet
• CAN
• RS-485 and RS-422
• Board-to-Board Communication
• Peripheral Interfaces
• Logic Level Shifting
Description
NVE’s IL700 family of high-speed digital isolators are CMOS devices
manufactured with NVE’s patented* IsoLoop® spintronic Giant
Magnetoresistive (GMR) technology. The IL711S and IL712S are the
world’s fastest two-channel isolators, with a 150 Mbps typical data rate for
both channels.
The symmetric magnetic coupling barrier provides a typical propagation
delay of only 10 ns and a pulse width distortion as low as 300 ps (0.3 ns),
achieving the best specifications of any isolator. Typical transient immunity
of 30 kV/µs is unsurpassed.
The IL711 has two transmit channels; the IL712 and IL721 have one
transmit and one receive channel. The IL712 and IL721 operate full duplex,
making them ideal for many fieldbus applications, including PROFIBUS,
DeviceNet, and CAN. The IL721 has channels reversed to better suit certain
board layouts.
The IL711 and IL712 are available in 8-pin MSOP, SOIC, and PDIP
packages. The IL721 is available in an 8-pin SOIC package. Standard and
S-Grade parts are specified over a temperature range of −40°C to +100°C;
T-Grade parts have a maximum operating temperature of +125°C.
IL711/IL712/IL721
2
Absolute Maximum Ratings
Parameters Symbol Min. Typ. Max. Units Test Conditions
Storage Temperature TS −55 150 °C
Ambient Operating Temperature(1)
IL711T/ IL712T/IL721T TA −55 125
135 °C
Supply Voltage VDD1, VDD2 −0.5 7 V
Input Voltage VI −0.5 VDD + 0.5 V
Output Voltage VO −0.5 VDD + 0.5 V
Output Current Drive IO 10 mA
Lead Solder Temperature 260 °C 10 sec.
ESD 2 kV HBM
Recommended Operating Conditions
Parameters Symbol Min. Typ. Max. Units Test Conditions
Ambient Operating Temperature
IL711/IL712 and IL711S/IL712S
IL711T/IL712T/IL721T TA
−40
−40
100
125
°C
°C
Supply Voltage VDD1, VDD2 3.0 5.5 V
Logic High Input Voltage VIH 2.4 VDD V
Logic Low Input Voltage VIL 0 0.8 V
Input Signal Rise and Fall Times tIR, tIF 1 μs
Insulation Specifications
Parameters Symbol Min. Typ. Max. Units Test Conditions
Creepage Distance
MSOP 3.01 mm
SOIC 4.03 mm
PDIP 7.04 mm
Leakage Current(5) 0.2 μA 240 VRMS, 60 Hz
Barrier Impedance(5) >1014||3 Ω || pF
Package Characteristics
Parameters Symbol Min. Typ. Max. Units Test Conditions
Capacitance (Input–Output)(5) C
I–O 2 pF f = 1 MHz
Thermal Resistance
MSOP θJC 168 °C/W
SOIC θJC 144 °C/W
PDIP θJC 54 °C/W
Thermocouple at center
underside of package
Package Power Dissipation PPD 150 mW f = 1 MHz, VDD = 5 V
Safety and Approvals
IEC61010-1
TUV Certificate Numbers: N1502812, N1502812-101
Classification as Reinforced Insulation
Model Package
Pollution
Degree Material
Group Max. Working
Voltage
IL711-1; IL712-1 MSOP II III 150 VRMS
IL711-2; IL712-2 PDIP II III 300 VRMS
IL711-3; IL712-3; IL721-3 SOIC II III 150 VRMS
UL 1577
Component Recognition Program File Number: E207481
Rated 2500VRMS for 1 minute
Soldering Profile
Per JEDEC J-STD-020C, MSL=2
IL711/IL712/IL721
3
IL711 Pin Connections
1 VDD1 Supply voltage
2 IN1 Data in, channel 1
3 IN2 Data in, channel 2
4 GND1 Ground return for VDD1
5 GND2 Ground return for VDD2
6 OUT2 Data out, channel 2
7 OUT1 Data out, channel 1
8 VDD2 Supply voltage
1
2
3
45
6
7
8
IN
1
IN
2
V
DD1
GND
1
OUT
2
OUT
1
V
DD2
GND
2
IL711
IL712 Pin Connections
1 VDD1 Supply voltage
2 IN1 Data in, channel 1
3 OUT2 Data out, channel 2
4 GND1 Ground return for VDD1
5 GND2 Ground return for VDD2
6 IN2 Data in, channel 2
7 OUT1 Data out, channel 1
8 VDD2 Supply voltage
IN
1
IN
2
V
DD1
GND
1
OUT
2
OUT
1
V
DD2
GND
2
IL712
IL721 Pin Connections
1 VDD1 Supply voltage
2 OUT1 Data out, channel 1
3 IN2 Data in, channel 2
4 GND1 Ground return for VDD1
5 GND2 Ground return for VDD2
6 OUT2 Data out, channel 2
7 IN1 Data in, channel 1
8 VDD2 Supply voltage
OUT
1
OUT
2
V
DD1
GND
1
IN
2
IN
1
V
DD2
GND
2
IL721
Timing Diagram
Legend
tPLH Propagation Delay , Low to High
tPHL Propagation Delay , High to Low
tPW Minimum Pulse Width
tR Rise Time
tF Fall Time
IL711/IL712/IL721
4
3.3 Volt Electrical Specifications
Electrical specifications are Tmin to Tmax unless otherwise stated.
Parameters Symbol Min. Typ. Max. Units Test Conditions
DC Specifications
Input Quiescent Supply Current
IL711 8 10 μA
IL712/IL721 IDD1 1.5 2 mA
Output Quiescent Supply Current
IL711 3.3 4 mA
IL712/IL721 IDD2 1.5 2 mA
Logic Input Current II −10 10 μA
VDD – 0.1 VDD I
O = −20 μA, VI = VIH
Logic High Output Voltage VOH 0.8 x VDD 0.9 x VDD V IO = −4 mA, VI = VIH
0 0.1 IO = 20 μA, VI = VIL
Logic Low Output Voltage VOL 0.5 0.8 V IO = 4 mA, VI = VIL
Switching Specifications
Maximum Data Ra t e
IL711/IL712/IL721
IL711S/IL712S
IL711T/IL712T/IL721T
100
100
130
110
110
140
Mbps
Mbps
Mbps
CL = 15 pF
CL = 15 pF
CL = 15 pF
Pulse Width(7) PW 10 7.5 ns 50% Points, VO
Propagation Delay Input to Output
(High to Low) tPHL 12 18 ns CL = 15 pF
Propagation Delay Input to Output
(Low to High) tPLH 12 18 ns CL = 15 pF
Pulse Width Distortion(2)
IL711/IL712/IL721
IL711S/IL712S
IL711T/IL712T/IL721T
PWD
2
2
1
3
3
3
ns
ns
ns
CL = 15 pF
CL = 15 pF
CL = 15 pF
Propagation Delay Skew(3) t
PSK 4 6 ns CL = 15 pF
Output Rise Time (10%–90%) tR 2 4 ns CL = 15 pF
Output Fall Time (10%–90%) tF 2 4 ns CL = 15 pF
Common Mode Transient Immunity
(Output Logic High or Logic Low)(4) |CMH|,|CML| 20 30 kV/μs VCM = 300 V
Channel-to-Channel Skew tCSK 2 3 ns CL = 15 pF
Dynamic Power Consumption(6) 140 240 μA/MHz per channel
Magnetic Field Immunity(8) (VDD2= 3V, 3V<VDD1<5.5V)
Power Frequency Magnetic Immunity HPF 1000 1500 A/m 50Hz/60Hz
Pulse Magnetic Field Immunity HPM 1800 2000 A/m tp = 8µs
Damped Oscillatory Magnetic Field HOSC 1800 2000 A/m 0.1Hz – 1MHz
Cross-axis Immunity Multiplier(9) K
X 2.5
IL711/IL712/IL721
5
5 Volt Electrical Specifications
Electrical specifications are Tmin to Tmax unless otherwise stated.
Parameters Symbol Min. Typ. Max. Units Test Conditions
DC Specifications
Input Quiescent Supply Current
IL711 10 15 μA
IL712/IL721 IDD1 2.5 3 mA
Output Quiescent Supply Current
IL711 5 6 mA
IL712/IL721 IDD2 2.5 3 mA
Logic Input Current II −10 10 μA
VDD − 0.1 VDD I
O = −20 μA, VI = VIH
Logic High Output Voltage VOH 0.8 x VDD 0.9 x VDD V IO = −4 mA, VI = VIH
0 0.1 IO = 20 μA, VI = VIL
Logic Low Output Voltage VOL 0.5 0.8 V IO = 4 mA, VI = VIL
Switching Specifications
Maximum Data Ra t e
IL711/IL712/IL721
IL711S/IL712S
IL711T/IL712T/IL721T
100
100
130
110
110
150
Mbps
Mbps
Mbps
CL = 15 pF
CL = 15 pF
CL = 15 pF
Pulse Width(7) PW 10 7.5 ns 50% Points, VO
Propagation Delay Input to Output
(High to Low) tPHL 10 15 ns CL = 15 pF
Propagation Delay Input to Output
(Low to High) tPLH 10 15 ns CL = 15 pF
Pulse Width Distortion(2)
IL711/IL712/IL721
IL711S/IL712S
IL711T/IL712T/IL721T
PWD
2
2
0.3
3
3
3
ns
ns
ns
CL = 15 pF
CL = 15 pF
CL = 15 pF
Pulse Jitter(10) t
J 100 ps CL = 15 pF
Propagation Delay Skew(3) t
PSK 4 6 ns CL = 15 pF
Output Rise Time (10%–90%) tR 1 3 ns CL = 15 pF
Output Fall Time (10%–90%) tF 1 3 ns CL = 15 pF
Common Mode Transient Immunity
(Output Logic High or Logic Low)(4) |CMH|,|CML| 20 30 kV/μs Vcm = 300 V
Channel to Channel Skew tCSK 2 3 ns CL = 15 pF
Dynamic Power Consumption(6) 200 340 μA/MHz per channel
Magnetic Field Immunity(8) (VDD2= 5V, 3V<VDD1<5.5V)
Power Frequency Magnetic Immunity HPF 2800 3500 A/m 50Hz/60Hz
Pulse Magnetic Field Immunity HPM 4000 4500 A/m tp = 8µs
Damped Oscillatory Magnetic Field HOSC 4000 4500 A/m 0.1Hz – 1MHz
Cross-axis Immunity Multiplier(9) K
X 2.5
Notes (apply to both 3.3 V and 5 V specifications):
1. Absolute maximum ambient operating temperature means the device will not be damaged if operated under these conditions. It does not
guarantee performance.
2. PWD is defined as |tPHL − tPLH|. %PWD is equal to PWD divided by pulse width.
3. tPSK is the magnitude of the worst-case difference in tPHL and/or tPLH between devices at 25°C.
4. CMH is the maximum common mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD2. CML is the maximum
common mode input voltage that can be sustained while maintaining VO < 0.8 V. The common mode voltage slew rates apply to both rising
and falling common mode voltage edges.
5. Device is considered a two terminal device: pins 1–4 shorted and pins 5–8 shorted.
6. Dynamic power consumption is calculated per channel and is supplied by the channel’s input side power supply.
7. Minimum pulse width is the minimum value at which specified PWD is guaranteed.
8. The relevant test and measurement methods are given in the Electromagnetic Compatibility section on p. 6.
9. External magnetic field immunity is improved by this factor if the field direction is “end-to-end” rather than to “pin-to-pi n” (see diagram on p. 6).
10. 64k-bit pseudo-random binary signal (PRBS) NRZ bit pattern with no m ore than five consecutive 1s or 0s; 800 ps transition t ime.
IL711/IL712/IL721
6
80 ns
Application Information
Electrostatic Discharge Sensitivity
This product has been tested for electrostatic sensitivity to the
limits stated in the specifications. However, NVE recommends that
all integrated circuits be handled with appropriate care to avoid
damage. Damage caused by inappropriate handling or storage could
range from performance degradation to complete failure.
Electromagnetic Compatibility
IsoLoop Isolators have the lowest EMC footprint of any isolation
technology. IsoLoop Isolators’ Wheatstone bridge configuration
and differential magnetic field signaling ensure excellent EMC
performance against all relevant standards.
These isolators are fully compliant with generic EMC standards
EN50081, EN50082-1 and the umbrella line-voltage standard for
Information Technology Equipment (ITE) EN61000. NVE has
completed compliance tests in the categories below:
EN50081-1
Residential, Commercial & Light Industrial
Methods EN55022, EN55014
EN50082-2: Industrial Environment
Methods EN61000-4-2 (ESD), EN61000-4-3 (Electromagnetic
Field Immunity), EN61000-4-4 (Electrical Transient Immunity),
EN61000-4-6 (RFI Immunity), EN61000-4-8 (Power Frequency
Magnetic Field Immunity), EN61000-4-9 (Pulsed Magnetic
Field), EN61000-4-10 (Damped Oscillatory Magnetic Field)
ENV50204
Radiated Field from Digital Telephones (Immunity Test)
Immunity to external magnetic fields is even higher if the field
direction is “end-to-end” rather than to “pin-to-pin” as shown in the
diagram below:
Cross-axis Field Direction
Dynamic Power Consumption
IsoLoop Isolators achieve their low power consumption from the
way they transmit data across the isolation barrier. By detecting the
edge transitions of the input logic signal and converting these to
narrow current pulses, a magnetic field is created around the GMR
Wheatstone bridge. Depending on the direction of the magnetic
field, the bridge causes the output comparator to switch following
the input logic signal. Since the current pulses are narrow, about
2.5 ns, the power consumption is independent of mark-to-space
ratio and solely dependent on frequency. This has obvious
advantages over optocouplers, which have power consumption
heavily dependent on mark-to-space ratio.
Power Supply Decoupling
Both power supplies to these devices should be decoupled with
low-ESR 47 nF ceramic capacitors. Ground planes for both GND1
and GND2 are highly recommended for data rates above 10 Mbps.
Capacitors must be located as close as possible to the VDD pins.
Signal Status on Start-up and Shut Down
To minimize power dissipation, input signals are differentiated and
then latched on the output side of the isolation barrier to reconstruct
the signal. This could result in an ambiguous output state
depending on power up, shutdown and power loss sequencing.
Unless the circuit connected to the isolator performs its own power-
on reset (POR), the designer should consider including an
initialization signal in the start-up circuit. Initialization consists of
toggling the input either high then low, or low then high.
In CAN applications, the IL712 or IL721 should be used with CAN
transceivers with Dominant Timeout functions for seamless POR.
Most CAN transceiver manufacturers offer Dominant
Timeout options. Examples include NXP’s TJA 1050 and
TJA 1040 transceivers.
Data Transmission Rates
The reliability of a transmission system is directly related to the
accuracy and quality of the transmitted digital information. For a
digital system, those parameters which determine the limits of the
data transmission are pulse width distortion and propagation delay
skew.
Propagation delay is the time taken for the signal to travel through
the device. This is usually different when sending a low-to-high
than when sending a high-to-low signal. This difference, or error, is
called pulse width distortion (PWD) and is usually in nanoseconds.
It may also be expressed as a percentage:
PWD% = Maximum Pulse Width Distortion (ns) x 100%
Signal Pulse Width (ns)
For example, with data rates of 12.5 Mbps:
PWD% = 3 ns x 100% = 3.75%
This figure is almost three times better than any available
optocoupler with the same temperature range, and two times better
than any optocoupler regardless of published temperature range.
IsoLoop isolators exceed the 10% maximum PWD recommended
by PROFIBUS, and will run to nearly 35 Mb within the 10% limit.
Propagation delay skew is the signal propagation difference
between two or more channels. This becomes significant in clocked
systems because it is undesirable for the clock pulse to arrive
before the data has settled. Short propagation delay skew is
therefore especially critical in high data rate parallel systems for
establishing and maintaining accuracy and repeatability. Worst-
case channel-to-channel skew in an IL700 Isolator is only 3 ns,
which is ten times better than any optocoupler. IL700 Isolators
have a maximum propagation delay skew of 6 ns, which is five
times better than any optocoupler.
IL711/IL712/IL721
7
Illustrative Applications
Isolated CAN
IL712/IL721
TxD
RxD
CANH
CANL
Tx0
Rx0
TJA1050
ADR 0...7, CS
XTAL1
XTAL2
SJA1000
7
6
2
1
4
3
In today’s CAN networks, node-to-node isolation is increasingly recommended by designers to reduce EMI susceptibility, especially in high-
speed applications and in hybrid and electrical vehicle networks, where the 12 V battery has been replaced with one of several hundred volts.
Operator and equipment safety becomes critical when a high voltage source, such as the battery, needs to be connected to diagnosis systems
during routine maintenance procedures. In the application shown above, the microcontroller is isolated from the CAN transceiver by an IL712 or
IL721, allowing higher speed and more reliable bus operation by eliminating ground loops and reducing susceptibility to noise and EMI events.
The best-in-class 10 ns typical IL712/IL721 propagation delay minimizes CAN loop delay and maximizes data rate over any given bus length.
The simple circuit works with any CAN transceiver with a TxD dominant timeout, which includes all of the current-generation transceivers.
Isolated PROFIBUS / RS-485
Isolation
Boundary
IL710
IL711
ISL8485
5
6
7
8
4
3
2
1
1
2
3
4
8
7
6
5
1
5
6
7
2
8
3
4
NVE offers a unique line of PROFIBUS / RS-485 transceivers, but IL700 high-speed digital signal isolators can also be used as part of multi-chip
designs with non-isolated PROFIBUS transceivers.
RS-485 Truth Table
D DE A B R
1 0 Z Z X
0 0 Z Z X
1 1 1 0 1
0 1 0 1 0
IL711/IL712/IL721
8
Package Drawings, Dimensions and Specifications
8-pin MSOP
0.114 (2.90)
0.114 (2.90)
0.016 (0.40)
0.005 (0.13)
0.009 (0.23)
0.027 (0.70)
0.010 (0.25)
0.020 (0.50) 0.002 (0.05)
0.043 (1.10)
0.032 (0.80)
0.006 (0.15)
0.016 (0.40)
0.032 (0.80)
0.189 (4.80)
0.197 (5.00)
0.122 (3.10)
0.122 (3.10)
6˚
0˚
Pin spacing is a BASIC
dimension; tolerances
do not accumulate
NOTE:
8-pin SOIC Package
0.013 (0.33)
0.020 (0.50)
0.189 (4.8)
0.197 (5.0)
0.150 (3.8)
0.157 (4.0)
Dimensions in inches (mm)
3
2
1
0.228 (5.8)
0.244 (6.2)
0.008 (0.19)
0.010 (0.25)
0.010 (0.25)
0.020 (0.50)
x45º
0º
8º
0.016 (0.40)
0.050 (1.27)
0.040 (1.0)
0.060 (1.5)
0.054 (1.37)
0.069 (1.75)
0.004 (0.10)
0.010 (0.25)
Pin spacing is a BASIC
dimension; tolerances
do not accumulate
NOTE:
8-pin PDIP
0.36 (9.0)
0.40 (10.2) Pin spacing is a BASIC
dimension; tolerances
do not accumulate
NOTE:
0.24 (6.1)
0.26 (6.6)
0.29 (6.4)
0.31 (7.9)
0.30 (7.6)
0.37 (9.4)
0.008 (0.2)
0.015 (0.4)
0.030 (0.76)
0.045 (1.14) 0.015 (0.38)
0.023 (0.58) 0.045 (1.14)
0.065 (1.65)
0.09 (2.3)
0.11 (2.8)
0.015 (0.38)
0.035 (0.89)
0.12 (3.05)
0.15 (3.81)
IL711/IL712/IL721
9
Ordering Information and Valid Part Numbers
IL 711 T - 3 E TR13
Bulk Packaging
Blank = Tube
TR7 = 7'' Tape and Reel
TR13 = 13'' Tape and Reel
Package
Blank= 80/20 T in/Lead Plating
E = RoHS Compliant
Package T ype
-1 = MSOP
-2 = PDIP
-3 = 0.15'' 8-pin SOIC
Grade
Blank = Standard
T = High Temperature
S = High Speed
Base Part Number
711 = 2 Drive Channels
712 = 1 Drive Channel
1 Receive Channel
721 = 1 Drive Channel
1 Receive Channel
(reverse pinout)
Product Family
IL = Isolators
Valid Part Numbers
IL711-1
IL711-1E
IL711S-1
IL711S-1E
IL711T-1
IL711T-1E
IL711-2
IL711-2E
IL711T-2
IL711T-2E
IL711-3
IL711S-3
IL711T-3
IL711-3E
IL711S-3E
IL711T-3E
All MSOP and SOIC parts are available
on tape and reel.
IL712-1
IL712-1E
IL712S-1
IL712S-1E
IL712T-1
IL712T-1E
IL712-2
IL712-2E
IL712T-2
IL712T-2E
IL712-3
IL712S-3
IL712T-3
IL712-3E
IL712S-3E
IL712T-3E
IL721-3
IL721T-3
IL721-3E
IL721T-3E
RoHS
COMPLIANT
IL711/IL712/IL721
10
ISB-DS-001-IL711/12-V
January 2010 Changes
• Added IL721 configuration.
ISB-DS-001-IL711/12-U
Changes
• Added CAN application diagram (p. 7).
ISB-DS-001-IL711/12-T Changes
• Added typical jitter specification at 5V.
ISB-DS-001-IL711/12-S Changes
• Added EMC details.
ISB-DS-001-IL711/12-R Changes
• IEC 61010 approval for MSOP versions.
ISB-DS-001-IL711/12-Q Changes
• Added magnetic field immunity and electromagnetic compatibility
specifications.
ISB-DS-001-IL711/12-P Changes
• Correct SOIC package drawing.
ISB-DS-001-IL711/12-O
Changes
• Note on all package drawings that pin-spacing tolerances are non-accumulating;
change MSOP pin-spacing dimensions and tolerance accordingly.
ISB-DS-001-IL711/12-N
Changes
• Changed lower limit of length on PDIP package drawing.
• Tightened pin-spacing tolerance on MSOP package drawing.
ISB-DS-001-IL711/12-M
Changes
• Changed ordering information to reflect that devices are now fully RoHS
compliant with no exemptions.
ISB-DS-001-IL711/12-L
Changes
• Eliminated solderin g profile chart
ISB-DS-001-IL711/12-K Changes
• Added RS-485 application circuit
ISB-DS-001-IL711/12-J
Changes
• MSOP packages, S- and T-Grades added
• Order information updated
ISB-DS-001-IL711/12-I
Changes
Added MSOP Specifications
Updated IEC and UL Approval Numbers
IL711/IL712/IL721
11
About NVE
An ISO 9001 Certified Company
NVE Corporation manufactures innovative products based on unique spintronic Giant Magnetoresistive (GMR) technology.
Products include Magnetic Field Sensors, Magnetic Field Gradient Sensors (Gradiometers), Digital Magnetic Field Sensors,
Digital Signal Isolators, and Isolated Bus Transceivers.
NVE pioneered spintronics and in 1994 introduced the world’s first products using GMR material, a line of ultra-precise magnetic
sensors for position, magnetic media, gear speed and current sensing.
NVE Corporation
11409 Valley View Road
Eden Prairie, MN 55344-3617 USA
Telephone: (952) 829-9217
Fax: (952) 829-9189
Internet: www.nve.com
e-mail: isoinfo@nve.com
The information provided by NVE Corporation is believed to be accurate. However, no responsibility is assumed by NVE
Corporation for its use, nor for any infringement of patents, nor rights or licenses granted to third parties, which may result from
its use. No license is granted by implication, or otherwise, under any patent or patent rights of NVE Corporation. NVE
Corporation does not authorize, nor warrant, any NVE Corporation product for use in life support devices or systems or other
critical applications, without the express written approval of the President of NVE Corporation.
Specifications shown are subject to change without notice.
ISB-DS-001-IL711/12-V
January 2010
