AU2PD, AU2PG, AU2PJ
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Revision: 30-Jan-2019 1Document Number: 89336
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Ultrafast Avalanche Surface Mount Rectifiers
DESIGN SUPPORT TOOLS
FEATURES
Very low profile - typical height of 1.1 mm
Ideal for automated placement
Glass passivated pellet chip junction
Fast reverse recovery time
Controlled avalanche characteristics
Low leakage current
High forward surge capability
Meets MSL level 1, per J-STD-020, LF maximum peak
of 260 °C
AEC-Q101 qualified available
- Automotive ordering code: base P/NHM3
Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
TYPICAL APPLICATIONS
For use in lighting, high frequency rectification and
freewheeling application in switching mode converters and
inverters for consumer, computer, automotive, and
telecommunication.
MECHANICAL DATA
Case: SMPC (TO-277A)
Molding compound meets UL 94 V-0 flammability rating
Base P/N-M3 - halogen-free, RoHS-compliant, and
commercial grade
Base P/NHM3_X - halogen-free, RoHS-compliant and
AEC-Q101 qualified
(“_X” denotes revision code e.g. A, B,.....)
Terminals: matte tin plated leads, solderable per
J-STD-002 and JESD 22-B102
M3 suffix meets JESD 201 class 2 whisker test, HM3 suffix
meets JESD 201 class 2 whisker test
Notes
(1) Mounted on 10 mm x 10 mm pad areas, 1 oz. FR4 PCB
(2) Free air, mounted on recommended pad area
PRIMARY CHARACTERISTICS
IF(AV) 2.0 A
VRRM 200 V, 400 V, 600 V
IFSM 30 A
trr 75 ns
EAS 20 mJ
VF at IF = 2.0 A 1.13 V
TJ max. 175 °C
Package SMPC (TO-277A)
Circuit configuration Single
K
2
1
SMPC (TO-277A)
eSMP® Series
Anode 1
Anode 2
Cathode
K
click logo to get started
Available
Models
Available
MAXIMUM RATINGS (TA = 25 °C unless otherwise noted)
PARAMETER SYMBOL AU2PD AU2PG AU2PJ UNIT
Device marking code AU2D AU2G AU2J
Maximum repetitive peak reverse voltage VRRM 200 400 600 V
Maximum DC forward current (fig. 1) IF (1) 2.0 A
IF (2) 1.6
Peak forward surge current 10 ms single half sine-wave
superimposed on rated load IFSM 30 A
Non-repetitive avalanche energy at TJ = 25 °C IAS = 2.5 A max. EAS
20 mJ
IAS = 1.0 A typ. 30
Operating junction and storage temperature range TJ, TSTG -55 to +175 °C
AU2PD, AU2PG, AU2PJ
www.vishay.com Vishay General Semiconductor
Revision: 30-Jan-2019 2Document Number: 89336
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Notes
(1) Pulse test: 300 μs pulse width, 1 % duty cycle
(2) Pulse test: Pulse width 40 ms
Notes
(1) Free air, mounted on recommended PCB 1 oz. pad are; thermal resistance RJA - junction to ambient
(2) Units mounted on PCB with 10 mm x 10 mm copper pad areas; RJM - junction to mount
Note
(1) AEC-Q101 qualified
ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER TEST CONDITIONS SYMBOL TYP. MAX. UNIT
Instantaneous forward voltage IF = 2.0 A TA = 25 °C VF (1) 1.48 1.9 V
TA = 125 °C 1.13 1.4
Reverse current Rated VR
TA = 25 °C IR (2) 0.3 10 μA
TA = 125 °C 41 250
Maximum reverse recovery time IF = 0.5 A, IR = 1.0 A,
Irr = 0.25 A trr 66 75 ns
Typical junction capacitance per diode Rated VR = 4.0 V, 1 MHz CJ42 - pF
THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER SYMBOL AU2PD AU2PG AU2PJ UNIT
Typical thermal resistance RJA (1) 85 °C/W
RJM (2) 5
ORDERING INFORMATION (Example)
PREFERRED P/N UNIT WEIGHT (g) PREFERRED PACKAGE CODE BASE QUANTITY DELIVERY MODE
AU2PJ-M3/86A 0.10 86A 1500 7" diameter plastic tape and reel
AU2PJ-M3/87A 0.10 87A 6500 13" diameter plastic tape and reel
AU2PJHM3_A/H (1) 0.10 H 1500 7" diameter plastic tape and reel
AU2PJHM3_A/I (1) 0.10 I 6500 13" diameter plastic tape and reel
AU2PD, AU2PG, AU2PJ
www.vishay.com Vishay General Semiconductor
Revision: 30-Jan-2019 3Document Number: 89336
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise noted)
Fig. 1 - Maximum Forward Current Derating Curve
Fig. 2 - Average Power Loss Characteristics
Fig. 3 - Typical Instantaneous Forward Characteristics
Fig. 4 - Typical Reverse Leakage Characteristics
Fig. 5 - Typical Junction Capacitance
Fig. 6 - Typical Transient Thermal Impedance
T
M
- Mount Temperature (°C)
DC Forward Current (A)
0
0.2
0.4
0.6
0.8
1.0
1.2
2.4
0 25 50 75 100 125 150 175
TM = 162 °C
TA = 25 °C
TM Measured
at the Cathode Band Terminal
1.4
1.6
1.8
2.0
2.2
Average Forward Current (A)
Average Power Loss (W)
0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2
0 0.4 0.8 1.2 1.6 2.0 2.4
D = 0.1
D = 0.2
D = 0.3
D = 0.5 D = 0.8
D = 1.0
D = t
p
/T t
p
T
Instantaneous Forward Voltage (V)
Instantaneous Forward Current (A)
0.1
1
10
100
0.2 2.2 3.0
TA = 125 °C
TA = 75 °C
TA = 175 °C
TA = 25 °C
0.6 1.0 1.4 1.8 2.6
Percent of Rated Peak Reverse Voltage (%)
Instantaneous Reverse Current (μA)
0.01
0.1
1
10
100
1000
10 20 30 40 50 60 70 80 90 100
TA = 125 °C
TA = 25 °C
TA = 75 °C
TA = 175 °C
Reverse Voltage (V)
Junction Capacitance (pF)
10
100
0.1 1 10 100
TJ = 25 °C
f = 1.0 MHz
Vsig = 50 mVp-p
t - Pulse Duration (s)
Transient Thermal Impedance (°C/W)
1
10
100
0.01 0.1 1 10 100
Junction-to-Ambient
AU2PD, AU2PG, AU2PJ
www.vishay.com Vishay General Semiconductor
Revision: 30-Jan-2019 4Document Number: 89336
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PACKAGE OUTLINE DIMENSIONS in inches (millimeters)
Conform to JEDEC® TO-277A
SMPC (TO-277A)
0.016 (0.40)
0.006 (0.15)
0.047 (1.20)
0.039 (1.00)
0.146 (3.70)
0.134 (3.40)
0.087 (2.20)
0.075 (1.90)
0.189 (4.80)
0.173 (4.40)
0.049 (1.24)
0.037 (0.94)
0.053 (1.35)
0.041 (1.05)
0.030 (0.75) NOM.
0.084 (2.13) NOM.
0.155 (3.94)
NOM.
Mounting Pad Layout
0.268
(6.80)
0.186 (4.72)
MIN.
0.050 (1.27)
MIN.
0.041
(1.04)
0.055 (1.40)
MIN.
0.189 (4.80)
MIN.
0.187 (4.75)
0.175 (4.45)
0.262 (6.65)
0.250 (6.35)
0.242 (6.15)
0.238 (6.05)
0.171 (4.35)
0.167 (4.25)
K
2
1
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Revision: 01-Jan-2019 1Document Number: 91000
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