REMOTE 16-BIT www.ti.com I2C PCF8575 AND SMBus I/O EXPANDER WITH INTERRUPT OUTPUT SCPS121D - JANUARY 2005 - REVISED APRIL 2007 FEATURES * * * * Capability for Directly Driving LEDs Current Source to VCC for Actively Driving a High at the Output Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 - 2000-V Human-Body Model (A114-A) - 200-V Machine Model (A115-A) - 1000-V Charged-Device Model (C101) RGE PACKAGE (TOP VIEW) 1 24 2 23 3 22 4 21 5 20 6 19 7 18 8 17 9 16 10 15 11 14 12 13 VCC SDA SCL A0 P17 P16 P15 P14 P13 P12 P11 P10 24 23 22 21 20 19 P00 1 18 A0 P01 P03 2 3 17 P17 16 P16 P03 P04 4 5 15 P15 14 P14 P05 6 13 P13 7 8 9 10 11 12 P06 P07 GND P10 P11 INT A1 A2 P00 P01 P02 P03 P04 P05 P06 P07 GND A2 A1 INT VCC DB, DBQ, DGV, DW, OR PW PACKAGE (TOP VIEW) SDA SCL * * * * * Low Standby-Current Consumption of 10 A Max I2C to Parallel-Port Expander Open-Drain Interrupt Output Compatible With Most Microcontrollers 400-kHz Fast I2C Bus Address by Three Hardware Address Pins for Use of up to Eight Devices Latched Outputs With High-Current Drive P12 * DESCRIPTION/ORDERING INFORMATION This 16-bit I/O expander for the two-line bidirectional bus (I2C) is designed for 2.5-V to 5.5-V VCC operation. ORDERING INFORMATION PACKAGE (1) TA -40C to 85C TOP-SIDE MARKING Reel of 2000 PCF8575DBR PF575 QSOP - DBQ Reel of 2500 PCF8575DBQR PCF8575 TVSOP - DGV Reel of 2000 PCF8575DGVR PF575 Tube of 25 PCF8575DW Reel of 2000 PCF8575DWR Tube of 60 PCF8575PW Reel of 1200 PCF8575PWR Reel of 3000 PCF8575RGER SOIC - DW TSSOP - PW QFN - RGE (1) ORDERABLE PART NUMBER SSOP - DB PCF8575 PF575 PF575 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2005-2007, Texas Instruments Incorporated PCF8575 REMOTE 16-BIT I2C AND SMBus I/O EXPANDER WITH INTERRUPT OUTPUT www.ti.com SCPS121D - JANUARY 2005 - REVISED APRIL 2007 DESCRIPTION/ORDERING INFORMATION (CONTINUED) The PCF8575 provides general-purpose remote I/O expansion for most microcontroller families via the I2C interface serial clock (SCL) and serial data (SDA). The device features a 16-bit quasi-bidirectional input/output (I/O) port (P07-P00, P17-P10), including latched outputs with high-current drive capability for directly driving LEDs. Each quasi-bidirectional I/O can be used as an input or output without the use of a data-direction control signal. At power on, the I/Os are high. In this mode, only a current source (IOH) to VCC is active. An additional strong pullup to VCC (IOHT) allows fast-rising edges into heavily loaded outputs. This device turns on when an output is written high and is switched off by the negative edge of SCL. The I/Os should be high before being used as inputs. After power on, as all the I/Os are set high, all of them can be used as inputs. Any change in setting of the I/Os as either input or outputs can be done with the write mode. If a high is applied externally to an I/O that has been written earlier to low, a large current (IOL) will flow to GND. The PCF8575 provides an open-drain interrupt (INT) output, which can be connected to the interrupt input of a microcontroller. An interrupt is generated by any rising or falling edge of the port inputs in the input mode. After time, tiv, the signal INT is valid. Resetting and reactivating the interrupt circuit is achieved when data on the port is changed to the original setting, or data is read from or written to the port that generated the interrupt. Resetting occurs in the read mode at the acknowledge (ACK) bit after the rising edge of the SCL signal or in the write mode at the ACK bit after the falling edge of the SCL signal. Interrupts that occur during the ACK clock pulse can be lost (or be very short), due to the resetting of the interrupt during this pulse. Each change of the I/Os after resetting is detected and is transmitted as INT. Reading from or writing to another device does not affect the interrupt circuit. By sending an interrupt signal on this line, the remote I/O can inform the microcontroller if there is incoming data on its ports, without having to communicate via the I2C bus. Thus, the PCF8575 can remain a simple slave device. Every data transmission to or from the PCF8575 must consist of an even number of bytes. The first data byte in every pair refers to port 0 (P07-P00), and the second data byte in every pair refers to port 1 (P17-P10). To write to the ports (output mode), the master first addresses the slave device, setting the last bit of the byte containing the slave address to logic 0. The PCF8575 acknowledges, and the master sends the first data byte for P07-P00. After the first data byte is acknowledged by the PCF8575, the second data byte (P17-P10) is sent by the master. Once again, the PCF8575 acknowledges the receipt of the data, after which this 16-bit data is presented on the port lines. The number of data bytes that can be sent successively is not limited. After every two bytes, the previous data is overwritten. When the PCF8575 receives the pairs of data bytes, the first byte is referred to as P07-P00 and the second byte as P17-P10. The third byte is referred to as P07-P00, the fourth byte as P17-P10, and so on. Before reading from the PCF8575, all ports desired as input should be set to logic 1. To read from the ports (input mode), the master first addresses the slave device, setting the last bit of the byte containing the slave address to logic 1. The data bytes that follow on the SDA are the values on the ports. If the data on the input port changes faster than the master can read, this data may be lost. When power is applied to VCC, an internal power-on reset holds the PCF8575 in a reset state until VCC has reached VPOR. At that time, the reset condition is released, and the device I2C-bus state machine initializes the bus to its default state. The hardware pins (A0, A1, and A2) are used to program and vary the fixed I2C address and allow up to eight devices to share the same I2C bus or SMBus. The fixed I2C address of the PCF8575 is the same as the PCF8575C, PCF8574, PCA9535, and PCA9555, allowing up to eight of these devices, in any combination, to share the same I2C bus or SMBus. 2 Submit Documentation Feedback REMOTE 16-BIT I2C www.ti.com PCF8575 AND SMBus I/O EXPANDER WITH INTERRUPT OUTPUT SCPS121D - JANUARY 2005 - REVISED APRIL 2007 TERMINAL FUNCTIONS NO. NAME FUNCTION DB, DBQ, DGV, DW, AND PW RGE 1 22 INT Interrupt output. Connect to VCC through a pullup resistor. 2 23 A1 Address input 1. Connect directly to VCC or ground. Pullup resistors are not needed. 3 24 A2 Address input 2. Connect directly to VCC or ground. Pullup resistors are not needed. 4 1 P00 P-port input/output. Push-pull design structure. 5 2 P01 P-port input/output. Push-pull design structure. 6 3 P02 P-port input/output. Push-pull design structure. 7 4 P03 P-port input/output. Push-pull design structure. 8 5 P04 P-port input/output. Push-pull design structure. 9 6 P05 P-port input/output. Push-pull design structure. 10 7 P06 P-port input/output. Push-pull design structure. 11 8 P07 P-port input/output. Push-pull design structure. 12 9 GND Ground 13 10 P10 P-port input/output. Push-pull design structure. 14 11 P11 P-port input/output. Push-pull design structure. 15 12 P12 P-port input/output. Push-pull design structure. 16 13 P13 P-port input/output. Push-pull design structure. 17 14 P14 P-port input/output. Push-pull design structure. 18 15 P15 P-port input/output. Push-pull design structure. 19 16 P16 P-port input/output. Push-pull design structure. 20 17 P17 P-port input/output. Push-pull design structure. 21 18 A0 Address input 0. Connect directly to VCC or ground. Pullup resistors are not needed. 22 19 SCL Serial clock line. Connect to VCC through a pullup resistor 23 20 SDA Serial data line. Connect to VCC through a pullup resistor. 24 21 VCC Supply voltage Submit Documentation Feedback 3 PCF8575 REMOTE 16-BIT I2C AND SMBus I/O EXPANDER WITH INTERRUPT OUTPUT www.ti.com SCPS121D - JANUARY 2005 - REVISED APRIL 2007 LOGIC DIAGRAM (POSITIVE LOGIC) INT A0 A1 A2 SCL SDA PCF8575 1 Interrupt Logic LP Filter 21 2 P07-P00 3 22 23 I2C Bus Control Input Filter Shift Register I/O Port 16 Bits P17-P10 Write Pulse VCC GND Read Pulse 24 12 Power-On Reset SIMPLIFIED SCHEMATIC DIAGRAM OF EACH P-PORT INPUT/OUTPUT VCC Write Pulse IOH 100 A Data From Shift Register IOHT D Q FF P07-P00 CI IOL S Power-On Reset D P17-P10 Q GND FF Read Pulse CI S To Interrupt Logic Data To Shift Register 4 Submit Documentation Feedback REMOTE 16-BIT www.ti.com I2C PCF8575 AND SMBus I/O EXPANDER WITH INTERRUPT OUTPUT SCPS121D - JANUARY 2005 - REVISED APRIL 2007 I2C Interface The bidirectional I2C bus consists of the serial clock (SCL) and serial data (SDA) lines. Both lines must be connected to a positive supply via a pullup resistor when connected to the output stages of a device. Data transfer may be initiated only when the bus is not busy. I2C communication with this device is initiated by a master sending a Start condition, a high-to-low transition on the SDA input/output while the SCL input is high (see Figure 1). After the Start condition, the device address byte is sent, most significant bit (MSB) first, including the data direction bit (R/W). This device does not respond to the general call address. After receiving the valid address byte, this device responds with an ACK, a low on the SDA input/output during the high of the ACK-related clock pulse. The address inputs (A2-A0) of the slave device must not be changed between the Start and Stop conditions. The data byte follows the address ACK. If the R/W bit is high, the data from this device are the values read from the P port. If the R/W bit is low, the data are from the master, to be output to the P port. The data byte is followed by an ACK sent from this device. If other data bytes are sent from the master, following the ACK, they are ignored by this device. Data are output only if complete bytes are received and acknowledged. The output data is valid at time (tpv) after the low-to-high transition of SCL, during the clock cycle for the ACK. On the I2C bus, only one data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the high pulse of the clock period, as changes in the data line at this time are interpreted as control commands (Start or Stop) (see Figure 2). A Stop condition, a low-to-high transition on the SDA input/output while the SCL input is high, is sent by the master (see Figure 1). The number of data bytes transferred between the Start and Stop conditions from transmitter to receiver is not limited. Each byte of eight bits is followed by one ACK bit. The transmitter must release the SDA line before the receiver can send an ACK bit. A slave receiver that is addressed must generate an ACK after the reception of each byte. Also, a master must generate an ACK after the reception of each byte that has been clocked out of the slave transmitter. The device that acknowledges has to pull down the SDA line during the ACK clock pulse so that the SDA line is stable low during the high pulse of the ACK-related clock period (see Figure 3). Setup and hold times must be taken into account. A master receiver must signal an end of data to the transmitter by not generating an acknowledge (NACK) after the last byte that has been clocked out of the slave. This is done by the master receiver by holding the SDA line high. In this event, the transmitter must release the data line to enable the master to generate a Stop condition. SDA SCL S P Start Condition Stop Condition Figure 1. Definition of Start and Stop Conditions Submit Documentation Feedback 5 PCF8575 REMOTE 16-BIT I2C AND SMBus I/O EXPANDER WITH INTERRUPT OUTPUT www.ti.com SCPS121D - JANUARY 2005 - REVISED APRIL 2007 SDA SCL Data Line Stable; Data Valid Change of Data Allowed Figure 2. Bit Transfer Data Output by Transmitter NACK Data Output by Receiver ACK SCL from Master 1 2 8 9 S Clock Pulse for Acknowledgment Start Condition Figure 3. Acknowledgment on I2C Bus Interface Definition BYTE 6 BIT 7 (MSB) 6 5 4 3 2 1 0 (LSB) I2C slave address L H L L A2 A1 A0 R/W P0x I/O data bus P07 P06 P05 P04 P03 P02 P01 P00 P1x I/O data bus P17 P16 P15 P14 P13 P12 P11 P10 Submit Documentation Feedback REMOTE 16-BIT PCF8575 AND SMBus I/O EXPANDER WITH INTERRUPT OUTPUT I2C www.ti.com SCPS121D - JANUARY 2005 - REVISED APRIL 2007 Figure 4 and Figure 5 show the address and timing diagrams for the write and read modes, respectively. Integral Multiples of Two Bytes SCL 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 ACK From Slave Start Condition R/W S 0 1 0 0 1 2 Data to Port 0 A2 A1 A0 0 A 3 4 5 6 7 8 ACK From Slave ACK From Slave Slave Address (PCF8575) SDA 8 P07 P06 Data to Port 1 1 P00 A P17 P10 A P05 Write to Port Data A0 and B0 Valid Data Output Voltage tpv P05 Output Voltage IOH P05 Pullup Output Current IOHT INT tir Figure 4. Write Mode (Output) SCL 1 2 3 4 5 6 7 8 R/W SDA S 0 1 0 0 A2 A1 A0 1 1 2 3 4 5 6 7 1 2 3 4 5 6 7 8 ACK From Master ACK From Slave A 8 P07 P06 P05 P04 P03 P02 P01 P00 A ACK From Master P17 P16 P15 P14 P13 P12 P11 P10 A P07 P06 Read From Port Data Into Port P07 to P00 P17 to P10 P07 to P00 th P17 to P10 tsu INT tiv tir tir A low-to-high transition of SDA while SCL is high is defined as the stop condition (P). The transfer of data can be stopped at any moment by a stop condition. When this occurs, data present at the latest ACK phase is valid (output mode). Input data is lost. Figure 5. Read Mode (Input) Submit Documentation Feedback 7 PCF8575 REMOTE 16-BIT I2C AND SMBus I/O EXPANDER WITH INTERRUPT OUTPUT www.ti.com SCPS121D - JANUARY 2005 - REVISED APRIL 2007 Address Reference INPUTS I2C BUS SLAVE ADDRESS A2 A1 A0 L L L 32 (decimal), 20 (hexadecimal) L L H 33 (decimal), 21 (hexadecimal) L H L 34 (decimal), 22 (hexadecimal) L H H 35 (decimal), 23 (hexadecimal) H L L 36 (decimal), 24 (hexadecimal) H L H 37 (decimal), 25 (hexadecimal) H H L 38 (decimal), 26 (hexadecimal) H H H 39 (decimal), 27 (hexadecimal) Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage range -0.5 6.5 V VI Input voltage range (2) -0.5 VCC + 0.5 V VO Output voltage range (2) -0.5 VCC + 0.5 IIK Input clamp current VI < 0 -20 mA IOK Output clamp current VO < 0 -20 mA IOK Input/output clamp current VO < 0 or VO > VCC -20 mA IOL Continuous output low current VO = 0 to VCC 50 mA IOH Continuous output high current VO = 0 to VCC -4 mA 100 mA Continuous current through VCC or GND JA Package thermal impedance (3) DB package 63 DBQ package 61 DGV package 86 DW package 46 PW package 88 RGE package Tstg (1) (2) (3) Storage temperature range V C/W 53 -65 150 C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions 8 MIN MAX 2.5 5.5 V High-level input voltage 0.7 x VCC VCC + 0.5 V VIL Low-level input voltage -0.5 0.3 x VCC IOH P-port high-level output current -1 mA IOHT P-port transient pullup current -10 mA IOL P-port low-level output current 25 mA TA Operating free-air temperature 85 C VCC Supply voltage VIH -40 Submit Documentation Feedback UNIT V REMOTE 16-BIT I2C www.ti.com PCF8575 AND SMBus I/O EXPANDER WITH INTERRUPT OUTPUT SCPS121D - JANUARY 2005 - REVISED APRIL 2007 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK Input diode clamp voltage TEST CONDITIONS II = -18 mA VPOR Power-on reset voltage (2) VI = VCC or GND, IO = 0 IOH P port VO = GND IOHT P-port transient pullup current High during ACK, VOH = GND SDA VOL = 0.4 V IOL A0, A1, A2 IIHL -1.2 2.5 V to 5.5 V -30 2.5 V -0.5 2.5 V to 5.5 V VOL = 0.4 V SCL, SDA II 2.5 V to 5.5 V P port Operating mode VI = VCC or GND 2.5 V to 5.5 V VI VCC or VI GND 2.5 V to 5.5 V VI = VCC or GND, IO = 0, fscl = 400 kHz VI = VCC or GND, IO = 0, fscl = 0 kHz ICC Supply current increase One input at VCC - 0.6 V, Other inputs at VCC or GND CI SCL VI = VCC or GND Cio (1) (2) SDA VIO = VCC or GND P port MAX 1.2 1.8 UNIT V -300 -1 V A mA 5 15 10 25 mA 1.6 ICC Standby mode TYP (1) 3 VOL = 1 V INT MIN VPOR VOL = 0.4 V P port VCC 5 1 400 5.5 V 100 200 3.6 V 30 75 2.7 V 20 50 5.5 V 2.5 10 3.6 V 2.5 10 2.7 V 2.5 10 2.5 V to 5.5 V 2.5 V to 5.5 V 2.5 V to 5.5 V A A A 200 A 3 7 pF 3 7 4 10 pF All typical values are at nominal supply voltage (2.5-V, 3.3-V, or 5-V VCC) and TA = 25C. The power-on reset circuit resets the I2C bus logic with VCC < VPOR and sets all I/Os to logic high (with current source to VCC). I2C Interface Timing Requirements over recommended operating free-air temperature range (unless otherwise noted) (see Figure 6) MIN MAX UNIT 400 kHz fscl I2C clock frequency tsch I2C clock high time 0.6 tscl I2C 1.3 tsp I2C spike time tsds I2C serial data setup time tsdh I2C ticr I2C input rise time 20 + 0.1Cb (1) 300 ns ticf I2C input fall time 20 + 0.1Cb (1) 300 ns tocf I2C output fall time 300 ns tbuf I2C bus free time between Stop and Start 1.3 s tsts I2C start or repeated Start condition setup 0.6 s tsth I2C start or repeated Start condition hold 0.6 s tsps I2C tvd Valid-data time Cb I2C bus capacitive load (1) clock low time s s 50 100 serial data hold time ns 0 10-pF to 400-pF bus Stop condition setup ns s 0.6 SCL low to SDA output valid ns 1.2 s 400 pF Cb = total bus capacitance of one bus line in pF Submit Documentation Feedback 9 PCF8575 REMOTE 16-BIT I2C AND SMBus I/O EXPANDER WITH INTERRUPT OUTPUT www.ti.com SCPS121D - JANUARY 2005 - REVISED APRIL 2007 Switching Characteristics over recommended operating free-air temperature range, CL 100 pF (unless otherwise noted) (see Figure 7 and Figure 8) PARAMETER FROM (INPUT) TO (OUTPUT) P port INT 4 s MIN MAX UNIT tiv Interrupt valid time tir Interrupt reset delay time SCL INT 4 s tpv Output data valid SCL P port 4 s tsu Input data setup time P port SCL 0 s th Input data hold time P port SCL 4 s 10 Submit Documentation Feedback REMOTE 16-BIT I2C www.ti.com PCF8575 AND SMBus I/O EXPANDER WITH INTERRUPT OUTPUT SCPS121D - JANUARY 2005 - REVISED APRIL 2007 TYPICAL OPERATING CHARACTERISTICS TA = 25C (unless otherwise noted) 60 40 VCC = 3.3 V 20 25 50 75 VCC = 5 V 60 50 40 VCC = 2.5 V 30 VCC = 3.3 V 20 Temperature (5C) 25 TA = -40_C TA = 25_C 10 8 6 4 0 25 50 TA = 85_C 0.1 0.2 0.3 0.4 I/O Sink Current vs Output Low Voltage 35 TA = 25_C 15 10 0.5 0.1 0.2 600 VCC = 5 V, ISINK = 10 mA 400 300 VCC = 2.5 V, ISINK = 10 mA 200 100 40 VCC = 2.5 V, ISINK = 1 mA 0 -50 -25 0 25 VCC = 5 V, ISINK = 1 mA 50 Temperature (5C) 75 100 125 35 ISOURCE (mA) VOL (mV) 45 30 0.3 0.4 0.5 15 TA = 85_C 0.1 0.2 0.3 0.4 0.5 VOL (V) VOL (V) I/O Source Current vs Output High Voltage I/O Source Current vs Output High Voltage VCC = 2.5 V 0.6 45 TA = -40_C 40 35 TA = 25_C 25 20 15 10 TA = 25_C 20 0 0.0 0.6 ISOURCE (mA) I/O Output Low Voltage vs Temperature 25 5 0 0.0 0.6 TA = -40_C 10 TA = 85_C 5 VCC = 5 V 30 TA = -40_C Vol (V) 500 30 Supply Voltage (V) 2 0 0.0 40 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 75 100 125 VCC = 3.3 V 20 ISINK (mA) ISINK (mA) 12 50 I/O Sink Current vs Output Low Voltage VCC = 2.5 V 16 14 60 Temperature (5C) I/O Sink Current vs Output Low Voltage 20 18 70 10 0 -50 -25 100 125 fSCL = 400 kHz 90 All I/Os unloaded 80 20 10 VCC = 2.5 V 0 Supply Current (mA) VCC = 5 V 80 0 -50 -25 100 SCL = VCC 80 All I/Os unloaded 70 ISINK (mA) Supply Current (mA) 100 90 fSCL = 400 kHz All I/Os unloaded Supply Current (mA) 120 Supply Current vs Supply Voltage Standby Supply Current vs Temperature Supply Current vs Temperature TA = 85_C VCC = 3.3 V TA = 25_C TA = -40_C 30 25 20 15 10 TA = 85_C 5 5 0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 VCC - VOH (V) Submit Documentation Feedback VCC - VOH (V) 11 PCF8575 REMOTE 16-BIT I2C AND SMBus I/O EXPANDER WITH INTERRUPT OUTPUT www.ti.com SCPS121D - JANUARY 2005 - REVISED APRIL 2007 I/O Source Current vs Output High Voltage 40 ISOURCE (mA) 35 30 VCC = 5 V 350 TA = -40_C TA = 25_C VCC - VOH (V) 45 I/O High Voltage vs Temperature 25 20 15 TA = 85_C 10 300 VCC = 5 V 250 VCC = 3.3 V 200 150 100 50 5 0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0 -50 -25 0 25 50 75 100 125 Temperature (5C) VCC - VOH (V) 12 VCC = 2.5 V Submit Documentation Feedback REMOTE 16-BIT www.ti.com I2C PCF8575 AND SMBus I/O EXPANDER WITH INTERRUPT OUTPUT SCPS121D - JANUARY 2005 - REVISED APRIL 2007 PARAMETER MEASUREMENT INFORMATION VCC RL = 1 k DUT SDA CL = 50 pF SDA LOAD CONFIGURATION 3 Bytes for Complete Device Programming Stop Condition (P) Start Address Address Condition Bit 7 Bit 6 (S) (MSB) Address Bit 1 tscl R/W Bit 0 (LSB) ACK (A) Data Bit 07 (MSB) Data Bit 10 (LSB) Stop Condition (P) tsch 0.7 x VCC SCL 0.3 x VCC ticr tPHL ticf tbuf tsts tPLH tsp 0.7 x VCC SDA 0.3 x VCC ticr ticf tsth tsdh tsds tsps Repeat Start Condition Start or Repeat Start Condition Stop Condition VOLTAGE WAVEFORMS BYTE DESCRIPTION 1 I2C address 2, 3 P-port data Figure 6. I2C Interface Load Circuit and Voltage Waveforms Submit Documentation Feedback 13 PCF8575 REMOTE 16-BIT I2C AND SMBus I/O EXPANDER WITH INTERRUPT OUTPUT www.ti.com SCPS121D - JANUARY 2005 - REVISED APRIL 2007 PARAMETER MEASUREMENT INFORMATION (continued) VCC RL = 4.7 k INT DUT CL = 100 pF INTERRUPT LOAD CONFIGURATION ACK From Slave Start Condition 16 Bits (2 Data Bytes) From Port R/W Slave Address (PCF8575) S 0 1 0 0 A2 A1 A0 1 A 1 2 3 4 A 5 6 7 8 Data 1 ACK From Slave Data 2 Data From Port A Data 3 1 A tir tir B B INT A tiv tsps A Data Into Port Address Data 1 0.7 x VCC INT 0.3 x VCC SCL Data 2 Data 3 0.7 x VCC R/W tiv A 0.3 x VCC tir 0.7 x VCC Pn 0.7 x VCC INT 0.3 x VCC 0.3 x VCC View A-A View B-B Figure 7. Interrupt Load Circuit and Voltage Waveforms 14 Submit Documentation Feedback P REMOTE 16-BIT I2C www.ti.com PCF8575 AND SMBus I/O EXPANDER WITH INTERRUPT OUTPUT SCPS121D - JANUARY 2005 - REVISED APRIL 2007 PARAMETER MEASUREMENT INFORMATION (continued) VCC VCC RL = 1 k DUT RL = 4.7 k SDA DUT INT DUT CL = 50 pF CL = 100 pF GND CL = 100 pF GND SDA LOAD CONFIGURATION SCL Pn GND INTERRUPT LOAD CONFIGURATION P-PORT LOAD CONFIGURATION 0.7 x VCC P00 A P17 0.3 x VCC Slave ACK III III III III SDA Pn Unstable Data tpv Last Stable Bit Write-Mode Timing (R/W = 0) SCL 0.7 x VCC P00 A tsu P17 0.3 x VCC th 0.7 x VCC Pn 0.3 x VCC Read-Mode Timing (R/W = 1) Figure 8. P-Port Load Circuits and Voltage Waveforms Submit Documentation Feedback 15 PCF8575 REMOTE 16-BIT I2C AND SMBus I/O EXPANDER WITH INTERRUPT OUTPUT SCPS121D - JANUARY 2005 - REVISED APRIL 2007 THERMAL PAD MECHANICAL DATA RGE (S-PQFP-N24) 16 Submit Documentation Feedback www.ti.com PACKAGE OPTION ADDENDUM www.ti.com 24-Jun-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty PCF8575DBQR ACTIVE SSOP/ QSOP DBQ 24 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR PCF8575DBQRE4 ACTIVE SSOP/ QSOP DBQ 24 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR PCF8575DBQRG4 ACTIVE SSOP/ QSOP DBQ 24 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR PCF8575DBR ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8575DBRE4 ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8575DBRG4 ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8575DGVR ACTIVE TVSOP DGV 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8575DGVRE4 ACTIVE TVSOP DGV 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8575DGVRG4 ACTIVE TVSOP DGV 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8575DW ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8575DWG4 ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8575DWR ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8575DWRG4 ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8575PW ACTIVE TSSOP PW 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8575PWE4 ACTIVE TSSOP PW 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8575PWG4 ACTIVE TSSOP PW 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8575PWR ACTIVE TSSOP PW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8575PWRE4 ACTIVE TSSOP PW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8575PWRG4 ACTIVE TSSOP PW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8575RGER ACTIVE VQFN RGE 24 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR PCF8575RGERG4 ACTIVE VQFN RGE 24 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR (1) Lead/Ball Finish MSL Peak Temp (3) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 24-Jun-2009 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 30-Jul-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device PCF8575DBQR Package Package Pins Type Drawing SSOP/ QSOP SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DBQ 24 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 PCF8575DBR SSOP DB 24 2000 330.0 16.4 8.2 8.8 2.5 12.0 16.0 Q1 PCF8575DGVR TVSOP DGV 24 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 PCF8575DWR SOIC DW 24 2000 330.0 24.4 10.75 15.7 2.7 12.0 24.0 Q1 PCF8575PWR TSSOP PW 24 2000 330.0 16.4 6.95 8.3 1.6 8.0 16.0 Q1 PCF8575RGER VQFN RGE 24 3000 330.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 30-Jul-2010 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) PCF8575DBQR SSOP/QSOP DBQ 24 2500 346.0 346.0 33.0 PCF8575DBR SSOP DB 24 2000 346.0 346.0 33.0 PCF8575DGVR TVSOP DGV 24 2000 346.0 346.0 29.0 PCF8575DWR SOIC DW 24 2000 346.0 346.0 41.0 PCF8575PWR TSSOP PW 24 2000 346.0 346.0 33.0 PCF8575RGER VQFN RGE 24 3000 346.0 346.0 29.0 Pack Materials-Page 2 MECHANICAL DATA MPDS006C - FEBRUARY 1996 - REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0-8 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins - MO-153 14/16/20/56 Pins - MO-194 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. 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