1. General description
The 74HC139-Q100; 74HCT139-Q100 decodes two binary weighted address inputs
(nA0, nA1) to four mutually exclusive outputs (nY0 to nY3). Each decoder features an
enable inpu t (nE). When nE is HIGH all output s are forced HIGH. T he enable input ca n be
used as the data input for a 1-to-4 demultiplexer application. Inputs include clamp diodes
that enable the use of current limiting resistors to interface inputs to voltages in excess of
VCC.
This product has been qualified to the Automotive Electronics Council (AEC) standard
Q100 (Grade 1) and is suitable for use in automotive applications.
2. Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from 40 C to +85 C and from 40 C to +125 C
Input levels:
For 74HC139-Q100: CMOS level
For 74HCT139-Q100: TTL level
Demultiplexing capability
2 independent 2-to-4 decoders
Multifunction capability
Suitable for memory decoding, data routing or code conversion
Complies with JEDEC standard no. 7A
Active LOW mutually exclusive outputs
ESD protection:
MIL-STD-883, method 3015 exceeds 2000 V
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 )
Multiple package options
74HC139-Q100; 74HCT139-Q100
Dual 2-to-4 line decoder/demultiplexer
Rev. 1 — 19 June 2014 Product data sheet
74HC_HCT139_Q100 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 19 June 2014 2 of 18
NXP Semiconductors 74HC139-Q100; 74HCT139-Q100
Dual 2-to-4 line decoder/demultiplexer
3. Ordering information
4. Functional diagram
Table 1. Ordering information
Type number Package
Tempe rature range Name Description Version
74HC139D-Q100 40 Cto+125C SO16 plastic small outline package; 16 leads;
body width 3.9 mm SOT109-1
74 HCT139D-Q100
74HC139DB-Q100 40 Cto+125C SSOP16 plastic shrink small outline package; 16 leads;
body width 5.3 mm SOT338-1
74HCT139DB-Q100
74HC139PW-Q100 40 Cto+125C TSSOP16 plastic thin shrink small outline package;
16 leads; body width 4.4 mm SOT403-1
74HCT139PW-Q100
Fig 1. Logic symbol Fig 2. Functional diagram
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74HC_HCT139_Q100 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 19 June 2014 3 of 18
NXP Semiconductors 74HC139-Q100; 74HCT139-Q100
Dual 2-to-4 line decoder/demultiplexer
a. b.
Fig 3. IEC Logic symbol
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Fig 4. Logic diagram (one de co de r/demultiplexer)
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74HC_HCT139_Q100 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 19 June 2014 4 of 18
NXP Semiconductors 74HC139-Q100; 74HCT139-Q100
Dual 2-to-4 line decoder/demultiplexer
5. Pinning information
5.1 Pinning
5.2 Pin description
6. Functional description
[1] H = HIGH voltage level; L = LOW voltage level; X = don’t care.
Fig 5. Pin configuratio n SO16, SSOP16 and TSSOP16
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Table 2. Pin description
Symbol Pin Description
1E, 2E 1, 15 enable input (active LOW)
1A0, 1A1 2, 3 address input
1Y0, 1Y1, 1Y2, 1Y3 4, 5, 6, 7 output (active LOW)
GND 8 ground (0 V)
2Y0, 2Y1, 2Y2, 2Y3 12, 11, 10, 9 output (active LOW)
2A0, 2A1 14, 13 address input
VCC 16 positive supply voltage
Table 3. Function table[1]
Control Input Output
nE nA1 nA0 nY3nY2nY1nY0
H X X HHHH
L L L HHHL
L L H HHLH
LHLHLHH
LHHLHHH
74HC_HCT139_Q100 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 19 June 2014 5 of 18
NXP Semiconductors 74HC139-Q100; 74HCT139-Q100
Dual 2-to-4 line decoder/demultiplexer
7. Limiting values
[1] For SO16 package: Ptot derates linearly with 8 mW/K above 70 C.
[2] For SSOP16 and TSSOP16 packages: Ptot derates linearly with 5.5 mW/K above 60 C.
8. Recommended operating conditions
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions Min Max Unit
VCC supply voltage 0.5 +7 V
IIK input clamping current VI < 0.5 V or VI>V
CC +0.5 V - 20 mA
IOK output clamping current VO<0.5 V or VO>V
CC +0.5V - 20 mA
IOoutput curren t VO = 0.5 V to (VCC +0.5V) - 25 mA
ICC supply current - 50 mA
IGND ground current 50 - mA
Tstg storage temperature 65 +150 C
Ptot total power dissipation
SO16 package [1] - 500 mW
SSOP16 package [2] - 500 mW
TSSOP16 package [2] - 500 mW
Table 5. Recommended operating con ditions
Voltages are referenced to GND (ground = 0 V)
Symbol Parameter Conditions 74HC139-Q100 74HCT139-Q100 Unit
Min Typ Max Min Typ Max
VCC supply voltage 2.0 5.0 6.0 4.5 5.0 5.5 V
VIinput voltage 0 - VCC 0- V
CC V
VOoutput voltage 0 - VCC 0- V
CC V
Tamb ambient temperature 40 +25 +125 40 +25 +125 C
t/V input transition rise and fall rate VCC = 2.0 V - - 625 - - - ns/V
VCC = 4.5 V - 1.67 139 - 1.67 1 39 ns/V
VCC = 6.0 V--83---ns/V
74HC_HCT139_Q100 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 19 June 2014 6 of 18
NXP Semiconductors 74HC139-Q100; 74HCT139-Q100
Dual 2-to-4 line decoder/demultiplexer
9. Static characteristics
Table 6. Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions Tamb Unit
25 C40 C to +85 C40 C to +125 C
Min Typ Max Min Max Min Max
74HC139-Q100
VIH HIGH-level
input voltage VCC = 2.0 V 1.5 1.2 - 1.5 - 1.5 - V
VCC = 4.5 V 3.15 2.4 - 3.15 - 3.15 - V
VCC = 6.0 V 4.2 3.2 - 4.2 - 4.2 - V
VIL LOW-level
input voltage VCC = 2.0 V - 0.8 0.5 - 0.5 - 0.5 V
VCC = 4.5 V - 2.1 1.35 - 1.35 - 1.35 V
VCC = 6.0 V - 2.8 1.8 - 1.8 - 1.8 V
VOH HIGH-level
output voltage VI=V
IH or VIL
IO=20 A; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V
IO=20 A; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V
IO=20 A; VCC = 6.0 V 5.9 6.0 - 5.9 - 5.9 - V
IO=4.0 mA; VCC = 4.5 V 3.98 4.32 - 3.84 - 3.7 - V
IO=5.2 mA; VCC = 6.0 V 5.48 5.81 - 5.34 - 5.2 - V
VOL LOW-level
output voltage VI=V
IH or VIL
IO=20A; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V
IO=20A; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V
IO=20A; VCC = 6.0 V - 0 0.1 - 0.1 - 0.1 V
IO= 4.0 mA; VCC = 4.5 V - 0.15 0.26 - 0.33 - 0.4 V
IO= 5.2 mA; VCC = 6.0 V - 0.16 0.26 - 0.33 - 0.4 V
IIinput leakage
current VI=V
CC or GND;
VCC =6.0V --0.1 - 1.0 - 1.0 A
IOZ OFF-state
output current VI=V
IH or VIL;
VO=V
CC or GND;
VCC =6.0V
--0.5 - 5.0 - 10.0 A
ICC supply current VI=V
CC or GND; IO=0A;
VCC =6.0V - - 8.0 - 80 - 160 A
CIinput
capacitance -3.5- - - - -pF
74HC_HCT139_Q100 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 19 June 2014 7 of 18
NXP Semiconductors 74HC139-Q100; 74HCT139-Q100
Dual 2-to-4 line decoder/demultiplexer
74HCT139-Q100
VIH HIGH-level
input voltage VCC = 4.5 V to 5.5 V 2.0 1.6 - 2.0 - 2.0 - V
VIL LOW-level
input voltage VCC = 4.5 V to 5.5 V - 1.2 0.8 - 0.8 - 0.8 V
VOH HIGH-level
output voltage VI=V
IH or VIL; VCC =4.5V
IO=20 A 4.4 4.5 - 4.4 - 4.4 - V
IO=4 mA 3.98 4.32 - 3.84 - 3.7 - V
VOL LOW-level
output voltage VI=V
IH or VIL; VCC =4.5V
IO=20A - 0 0.1 - 0.1 - 0.1 V
IO= 4.0 mA - 0.15 0.26 - 0.33 - 0.4 V
IIinput leakage
current VI=V
CC or GND;
VCC =5.5V --0.1 - 1.0 - 1.0 A
IOZ OFF-state
output current per input pin; VI=V
IH or VIL;
VO=V
CC or GND;
other inputs at VCC or GND;
VCC =5.5V; I
O=0A
--0.5 - 5.0 - 10 A
ICC supply current VI=V
CC or GND; IO=0A;
VCC =5.5V - - 8.0 - 80 - 160 A
ICC additional
supply current VI=V
CC 2.1 V;
other inputs at VCC or GND;
VCC = 4.5 V to 5.5 V;
IO=0A
per input pin; 1An inputs - 7 0 252 - 315 - 343 A
per input pin; 2An inputs - 7 0 252 - 315 - 343 A
per input pi n; nE inputs - 135 486 - 607.5 - 661.5 A
CIinput
capacitance -3.5- - - - -pF
Table 6. Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions Tamb Unit
25 C40 C to +85 C40 C to +125 C
Min Typ Max Min Max Min Max
74HC_HCT139_Q100 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 19 June 2014 8 of 18
NXP Semiconductors 74HC139-Q100; 74HCT139-Q100
Dual 2-to-4 line decoder/demultiplexer
10. Dynamic characteristics
Table 7. Dy namic characteristics
Vo ltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 8.
Symbol Parameter Conditions Tamb Unit
25 C40 C to +85 C40 C to +125 C
Min Typ Max Min Max Min Max
74HC139-Q100
tpd propagation
delay nAn to nYn; see Figure 6 [1]
VCC = 2.0 V - 39 145 - 180 - 220 ns
VCC = 4.5 V - 14 29 - 36 - 44 ns
VCC = 5.0 V; CL=15pF - 11 - - - - - ns
VCC = 6.0 V - 11 25 - 31 - 38 ns
nE to nYn; see Figure 7 [1]
VCC = 2.0 V - 33 135 - 170 - 205 ns
VCC = 4.5 V - 12 27 - 34 - 41 ns
VCC = 5.0 V; CL=15pF - 10 - - - - - ns
VCC = 6.0 V - 10 23 - 29 - 35 ns
tttransition
time nYn; see Figure 6 and
Figure 7 [2]
VCC = 2.0 V - 19 75 - 95 - 110 ns
VCC = 4.5 V - 7 15 - 19 - 22 ns
VCC = 6.0 V - 6 13 - 16 - 19 ns
CPD power
dissipation
capacitance
CL= 50 pF; f = 1 MHz;
VI=GNDtoV
CC
[3] -42- - - - -pF
74HCT139-Q100
tpd propagation
delay nAn to nYn; see Figure 6 [1]
VCC = 4.5 V - 16 34 - 43 - 51 ns
VCC = 5.0 V; CL=15pF - 13 - - - - - ns
nE to nYn; see Figure 7 [1]
VCC = 4.5 V - 16 34 - 43 - 51 ns
VCC = 5.0 V; CL=15pF - 13 - - - - - ns
tttransition
time nYn; see Figure 6 and
Figure 7 [2]
VCC = 4.5 V - 7 15 - 19 - 22 ns
74HC_HCT139_Q100 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 19 June 2014 9 of 18
NXP Semiconductors 74HC139-Q100; 74HCT139-Q100
Dual 2-to-4 line decoder/demultiplexer
[1] tpd is the same as tPLH and tPHL.
[2] tt is the same as tTHL and tTLH.
[3] CPD is used to determine the dynamic power dissipation (PD in W).
PD=C
PD VCC2fiN+(CLVCC2fo) where:
fi = input fr equency in MHz;
fo= output frequency in MHz;
CL= output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
(CLVCC2fo) = sum of outputs.
11. Waveforms
CPD power
dissipation
capacitance
CL= 50 pF; f = 1 MHz;
VI=GNDtoV
CC 1.5 V [3] -44- - - - -pF
Table 7. Dy namic characteristics …continued
Vo ltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 8.
Symbol Parameter Conditions Tamb Unit
25 C40 C to +85 C40 C to +125 C
Min Typ Max Min Max Min Max
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 6. Propagation delay input (nAn) to output (nYn) and transition time output (nYn)
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74HC_HCT139_Q100 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 19 June 2014 10 of 18
NXP Semiconductors 74HC139-Q100; 74HCT139-Q100
Dual 2-to-4 line decoder/demultiplexer
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 7. Prop agation delay enable input (nE) to output (nYn) and transition time output (nYn)
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Table 8. Measurement points
Type Input Output
VMVM
74HC139-Q100 0.5VCC 0.5VCC
74HCT139-Q100 1.3 V 1.3 V
74HC_HCT139_Q100 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 19 June 2014 11 of 18
NXP Semiconductors 74HC139-Q100; 74HCT139-Q100
Dual 2-to-4 line decoder/demultiplexer
Test data is given in Table 9.
Definitions test circuit:
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
CL = Load capacitance including jig and probe capacitance.
RL = Load resistance.
S1 = Test selection switch.
Fig 8. Test circuit for measuring switching times
9
0
9
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:
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Table 9. Test data
Type Input Load S1 position
VItr, tfCLRLtPHL, tPLH tPZH, tPHZ tPZL, tPLZ
74HC139-Q100 VCC 6ns 15pF, 50 pF 1 kopen GND VCC
74HCT139-Q100 3 V 6 ns 15 pF, 50 pF 1 kopen GND VCC
74HC_HCT139_Q100 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 19 June 2014 12 of 18
NXP Semiconductors 74HC139-Q100; 74HCT139-Q100
Dual 2-to-4 line decoder/demultiplexer
12. Package outline
Fig 9. Package outline SOT109-1 (SO16)
74HC_HCT139_Q100 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 19 June 2014 13 of 18
NXP Semiconductors 74HC139-Q100; 74HCT139-Q100
Dual 2-to-4 line decoder/demultiplexer
Fig 10. Package outline SOT338-1 (SSOP16)
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74HC_HCT139_Q100 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 19 June 2014 14 of 18
NXP Semiconductors 74HC139-Q100; 74HCT139-Q100
Dual 2-to-4 line decoder/demultiplexer
Fig 11. Package outline SOT403-1 (TSSOP16)
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74HC_HCT139_Q100 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 19 June 2014 15 of 18
NXP Semiconductors 74HC139-Q100; 74HCT139-Q100
Dual 2-to-4 line decoder/demultiplexer
13. Abbreviations
14. Revision history
Table 10. Abbreviations
Acronym Description
CMOS Complementary Metal-Oxide Semiconductor
DUT Device Under Test
ESD ElectroStatic Discharge
HBM Human Body Model
MIL Military
MM Machine Model
Table 11. Revision history
Document ID Release date Data sheet status Change notice Supersedes
74HC_HCT139_Q100 v.1 20140619 Product data sheet - -
74HC_HCT139_Q100 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 19 June 2014 16 of 18
NXP Semiconductors 74HC139-Q100; 74HCT139-Q100
Dual 2-to-4 line decoder/demultiplexer
15. Legal information
15.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall pre vail.
Product specificatio n — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond those described in the
Product data sheet.
15.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Se miconductors takes no
responsibility for the content in this document if provided by an inf ormation
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect , incidental,
punitive, special or consequ ential damages (including - wit hout limitatio n - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconduct ors’ aggregate and cumulati ve liability toward s
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless ot herwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, lif e-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in perso nal injury, death or severe propert y or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconducto rs products in such equipment or
applications an d ther efo re su ch inclusi on a nd/or use is at the cu stome r's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty tha t such application s will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applicati ons or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suit able and fit for the custome r’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for th e customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanent ly and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
agreement is concluded only the ter ms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly object s to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] dat a sheet Production This document contains the product specification.
74HC_HCT139_Q100 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 19 June 2014 17 of 18
NXP Semiconductors 74HC139-Q100; 74HCT139-Q100
Dual 2-to-4 line decoder/demultiplexer
No offer to sell or license — Nothing in this document may be interpret ed or
construed as an of fer to sell product s that is op en for accept ance or the grant ,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
15.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respect i ve ow ners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors 74HC139-Q100; 74HCT139-Q100
Dual 2-to-4 line decoder/demultiplexer
© NXP Semiconductors N.V. 2014. All rights reserved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 19 June 2014
Document identi fier: 74HC_HCT139_Q100
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
17. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
5 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
6 Functional description . . . . . . . . . . . . . . . . . . . 4
7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
8 Recommended operating conditions. . . . . . . . 5
9 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
10 Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12
13 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 15
14 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 15
15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16
15.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16
15.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
15.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 16
15.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17
16 Contact information. . . . . . . . . . . . . . . . . . . . . 17
17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
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