SSM3J15FV,L3F(T - TOSHIBA - Datasheet.Live

SSM3J15FV

2017-10-11

Toshiba Electronic Devices & Storage Corporation

TOSHIBA Field Effect Transistor Silicon P Channel MOS T ype

SSM3J15FV

High-Speed Switching Applications

Analog Switch Applications

• Optimum for high-density mounting in small packages

• Low on-resistance : RDS(ON) = 12 Ω (max) (@VGS = −4 V)

: RDS(ON) = 32 Ω (max) (@VGS = −2.5 V)

Absolute Maximum Ratings (Ta = 25°C)

Characteristics Symbol Rating Unit

Drain-Source voltage VDSS −30 V

Gate-Source voltage VGSS ±20 V

Drain current DC ID −100 mA

Pulse IDP −200

Power dissipation (Ta = 25°C) PD (Note 1) 150 mW

Channel temperature Tch 150 °C

Storage temperature range Tstg −55 to 150 °C

Note: Using continuously under heavy loads (e.g. the application of high

temperature/current/ voltage and the s ignifica nt change in tem perature,

etc.) may caus e this product to decrease in the reliability signific antly

even if the ope r ating conditions (i.e. operating

temperature/current/ voltage, etc.) are within t he absolute maximum

ratings.

Please design the appropriate reliability upon r ev i ewing the Toshiba

Semiconductor Reliability Handbook (“ H andling Preca utions”/ “ D er ating

Concept and Methods”) and individual rel iability data (i.e. reliability test

report and estimated failure rate, etc ).

Note 1: Mounted on FR4 board

(25.4 mm × 25.4 mm × 1.6 mm, Cu Pad: 0.585 mm2)

Marking Equivalent Circuit (top view)

Handling Precaution

When handlin g individual devices ( which are not yet m ounted on a circui t board), be sure that the environment is protec ted

against electrostatic el ec tricity. O per ators should wear anti-stat ic clothing, and containers and other objects that come into direct

contact with d evices should be made of anti -static materials.

Unit: mm

JEDEC ―

JEITA ―

TOSHIBA 2-1L1B

Weight: 1.5 mg (typ.)

0.5mm

0.45mm

0.4mm

D Q

1 2

Start of commer cial production

2003-

VESM

1.GATE

2.SOURCE

3.DRAIN

1.2±0.05

0.32±0.05

0.4

0.22±0.05

0.8±0.05

1.2±0.05

0.13±0.05

0.5±0.05

SSM3J15FV

2017-10-11

Toshiba Electronic Devices & Storage Corporation

Electrical Characteristics (Ta = 25°C)

Characteristic Symbol Test Condition MIN TYP. MAX UNIT

Gate leakage current IGSS VGS = ±16 V, VDS = 0 V ― ― ±1 μA

Drain-Source breakdown voltage V (BR) DSS ID = − 0.1 mA, VGS = 0 V −30 ― ― V

Drain cut-off current IDSS VDS = − 30 V, VGS = 0 V ― ― −1 μA

Gate threshold voltage Vth VDS = − 3 V, ID = − 0.1 mA −1.1 ― −1.7 V

Forward transfer admittance |Yfs| VDS = − 3 V, ID = − 10 mA (Note 2) 20 ― ― mS

Drain-Source on-resistance RDS (ON) ID = − 10 mA, VGS = − 4 V (Note 2) ― 8 12 Ω

ID = − 1 mA, VGS = − 2.5 V (Note 2)

― 14 32

Input capacitance Ciss

VDS = − 3 V, VGS = 0 V, f = 1 MHz

― 9.1 ― pF

Reverse transfer capacitance Crss ― 3.5 ― pF

Output capacitance Coss ― 8.6 ― pF

Switching time Turn-on time ton VDD = − 5 V, ID = − 10 mA,

VGS = 0 to −5 V

―

Turn-off time toff

―

175

―

Note 2: Pulse Test

Switching Time Test Circuit

Precaution

Vth can be expressed as the vol tage between gate and source when the low operating current value is ID =

-100 μA for this produc t. For normal switc hi ng operation, VGS (on) requires a higher voltage than Vth and VGS

(off) requires a lower voltage than Vth.

(The relationship can be establis hed as follows: VGS (off) < Vth < VGS (on) )

Please take this into consideration when using the device.

VDD = −5 V

Duty ≤ 1%

VIN: tr, tf < 5 ns

(Zout = 50 Ω)

Common Source

Ta = 25°C

−5V 10 μs VDD

OUT

50 Ω

ton

10%

90%

−5 V

0 V

90%

10%

toff

tr tf

VDS (ON)

VDD

(b) VIN

(a) Test circuit

SSM3J15FV

2017-10-11

Toshiba Electronic Devices & Storage Corporation

Drain-Source on resistance RDS(ON) (Ω)

ID - VDS

-50

-100

-150

-200

-250

0 -0.5 -1 -1.5 -2

Drain-Source Voltage VDS(V)

Drain Current ID(mA)

Common Source

Ta=25°C

Pulse Test

VGS=-2.3V

-2.5

-2.7

-3.0

-3.3

-4

-5

-10 -7

ID - VGS

-0.01

-0.1

-1

-10

-100

-1000

0 -1 -2 -3 -4 -5

Gate-Source Voltage VGS(V)

Drain Current ID(mA)

Common Source

VDS=-3V

Pulse Test

Ta=100°C

RDS(ON) - ID

-1 -10 -100 -1000

Drain Current ID(mA)

VGS=-2.5V

-4V

RDS(ON) - VGS

0 -2 -4 -6 -8 -10

Gate-Source Voltage VGS (V)

Common Source

ID= -1mA

Pulse Test

RDS(ON) - Ta

-25 0 25 50 75 100 125 150

Common Source

Pulse Test

VGS=-2.5V,ID=-1mA

-4V,-10mA

Vth - Ta

-0.2

-0.4

-0.6

-0.8

-1

-1.2

-1.4

-1.6

-1.8

-2

-25 0 25 50 75 100 125 150

Gate threshold voltage Vth(V)

Common Source

VDS=-3V

ID=-0.1mA

25°C

-25°C

Common Source

Ta=25°C

Pulse Test

Ta=100°C 25°C

-25°C

Ambient temperature Ta(°C) Ambient temperature Ta(°C)

Drain-Source on resistance RDS(ON) (Ω)

SSM3J15FV

2017-10-11

Toshiba Electronic Devices & Storage Corporation

|Yfs| - ID

100

1000

-1 -10 -100 -1000

Drain current ID (mA)

Forward transfer admittance |Yfs| (mS)

Common Source

VDS= -3V

Ta=25°C

Pulse Test

IDR - VDS

100

150

200

250

0 0.2 0.4 0.6 0.8 1 1.2 1.4

Drain-Source voltage VDS (V)

Drain reveres current IDR (mA)

Common Source

VGS=0V

Ta=25°C

Pulse Test

C - VDS

100

-0.1 -1 -10 -100

Drain-Source voltage VDS (V)

Capacitance C (pF)

Common Source

VGS=0V

f=1MHz

Ta=25°C

Ciss

Coss

Crss

t - ID

100

1000

10000

-0.1 -1 -10 -100

Drain Current ID (mA)

Switching Time t (ns)

Common Source

VDD= -5V

VGS=0 to -5V

Ta=25°C

toff

ton

PD - Ta

100

150

200

250

0 20 40 60 80 100 120 140 160

Mounted on FR4 board

(25.4mm×25.4mm×1.6 mm, Cu Pad:0.585mm2 )

Power dissipation PD (mW)

Ambient temperature Ta(°C)

SSM3J15FV

2017-10-11

Toshiba Electronic Devices & Storage Corporation

RESTRICTIONS ON PRODUCT USE

Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as “TOSHIBA”.

Hardware, software and systems described in this document are collectively referred to as “Product”.

• TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.

• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's

written permission, reproduction is permissible only if reproduction is without alteration/omission.

• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for

complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize

risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property,

including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their

own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without

limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in

the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for.

Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the

appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information

contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and

PRODUCT DESIGN OR APPLICATIONS.

• PRODUCT IS NEITHER INTENDED NOR WA RRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY

HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF

HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for

specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities,

equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic

signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to

electric power, and equipment used in finance-related fields. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO

LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales representative.

• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.

• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable

laws or regulations.

• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any

infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any

intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.

• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR

PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,

INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING

WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2)

DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR

INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE,

ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the

design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass

destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations

including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export

and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and

regulations.

• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Pl ease

use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without

limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT O F

NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.