© Semiconductor Components Industries, LLC, 2014
August, 2018 − Rev. 13 1Publication Order Number:
MM5Z2V4ST1/D
MM5ZxxxST1G Series,
SZMM5ZxxxST1G Series
Zener Voltage Regulators
500 mW SOD−523 Surface Mount
This series of Zener diodes is packaged in a SOD−523 surface
mount package. They are designed to provide voltage regulation
protection and are especially attractive in situations where space is at a
premium. They are well suited for applications such as cellular
phones, hand held portables, and high density PC boards.
Specification Features
•Standard Zener Breakdown Voltage Range −2.4 V to 18 V
•Steady State Power Rating of 500 mW
•Small Body Outline Dimensions:
0.047″ x 0.032″ (1.20 mm x 0.80 mm)
•Low Body Height: 0.028″ (0.7 mm)
•ESD Rating of Class 3 (> 16 kV) per Human Body Model
•Tight Tolerance VZ
•SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
•These Devices are Pb−Free and are RoHS Compliant*
Mechanical Characteristics
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94, V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
MAXIMUM RATINGS
Rating Symbol Max Unit
Total Device Dissipation FR−4 Board,
(Note 1) @ TA = 25°C
Derate above 25°C
PD500
4.0 mW
mW/°C
Thermal Resistance from
Junction−to−Ambient (Note 1) RqJA 250 °C/W
Operating Junction and Storage
Temperature Range TJ, Tstg −65 to
+150 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be af fected.
1. FR−4 printed circuit board, single−sided copper, mounting pad 1 cm2.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Device Package Shipping†
ORDERING INFORMATION
1
Cathode 2
Anode
See specific marking information in the device marking
column of the Electrical Characteristics table on page 2 o
f
this data sheet.
DEVICE MARKING INFORMATION
www.onsemi.com
SOD−523
CASE 502
STYLE 1
MARKING DIAGRAM
XX = Specific Device Code
M Date Code*
G= Pb−Free Package
XX MG
G
12
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
MM5ZxxxST1G SOD−523
(Pb−Free) 3,000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer t o our Tape and Reel Packaging Specification
s
Brochure, BRD8011/D.
SOD−523
(Pb−Free)
SZMM5ZxxxST1G 3,000 /
Tape & Reel
SOD−523
(Pb−Free)
MM5ZxxxST5G 8,000 /
Tape & Reel
SOD−523
(Pb−Free)
SZMM5ZxxxST5G 8,000 /
Tape & Reel
MM5ZxxxST1G Series, SZMM5ZxxxST1G Series
www.onsemi.com
2
ELECTRICAL CHARACTERISTICS
(TA = 25°C unless otherwise noted,
VF = 0.9 V Max. @ IF = 10 mA for all types)
Symbol Parameter
VZReverse Zener Voltage @ IZT
IZT Reverse Current
ZZT Maximum Zener Impedance @ IZT
IZK Reverse Current
ZZK Maximum Zener Impedance @ IZK
IRReverse Leakage Current @ VR
VRReverse Voltage
IFForward Current
VFForward Voltage @ IF
QVZMaximum Temperature Coefficient of VZ
CMax. Capacitance @VR = 0 and f = 1 MHz
IF
V
I
IR
IZT
VR
VZVF
Figure 1. Zener Voltage Regulator
ELECTRICAL CHARACTERISTICS (VF = 0.9 Max @ IF = 10 mA for all types)
Device* Device
Marking
Test
Curren
t
Izt mA
Zener Voltage
VZ ZZK IZ
= 1.0
mA W
Max
ZZT
IZ = IZT
@ 10%
Mod W
Max
Max
IR @ VR dVZ/dt (mV/k)
@ IZT1 = 5 mA C pF Max @
VR = 0
f = 1 MHz
Min Max mAV Min Max
MM5Z2V4ST1G/T5G T2 5.0 2.43 2.63 1000 100 120 1.0 −3.5 0 450
MM5Z2V7ST1G T3 5.0 2.67 2.91 1000 100 100 1.0 −3.5 0 450
MM5Z3V3ST1G T5 5.0 3.32 3.53 1000 95 5.0 1.0 −3.5 0 450
MM5Z3V6ST1G T6 5.0 3.60 3.85 1000 90 5.0 1.0 −3.5 0 450
MM5Z3V9ST1G T7 5.0 3.89 4.16 1000 90 3.0 1.0 −3.5 −2.5 450
MM5Z4V3ST1G T8 5.0 4.17 4.43 1000 90 3.0 1.0 −3.5 0 450
MM5Z4V7ST1G/T5G T9 5.0 4.55 4.75 800 80 3.0 2.0 −3.5 0.2 260
MM5Z5V1ST1G/T5G TA 5.0 4.98 5.2 500 60 2.0 2.0 −2.7 1.2 225
MM5Z5V6ST1G/T5G TC 5.0 5.49 5.73 200 40 1.0 2.0 −2.0 2.5 200
MM5Z6V2ST1G/T5G TE 5.0 6.06 6.33 100 10 3.0 4.0 0.4 3.7 185
MM5Z6V8ST1G/T5G TF 5.0 6.65 6.93 160 15 2.0 4.0 1.2 4.5 155
MM5Z7V5ST1G TG 5.0 7.28 7.6 160 15 1.0 5.0 2.5 5.3 140
MM5Z8V2ST1G/T5G TH 5.0 8.02 8.36 160 15 0.7 5.0 3.2 6.2 135
MM5Z9V1ST1G/T5G TK 5.0 8.85 9.23 160 15 0.5 6.0 3.8 7.0 130
MM5Z12VST1G TN 5.0 11.74 12.24 80 25 0.1 8.0 6.0 10 130
MM5Z16VST1G TU 5.0 15.85 16.51 80 40 0.05 11.2 10.4 14 105
MM5Z18VST1G TW 5.0 17.56 18.35 80 45 0.05 12.6 12.4 16 100
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
*Includes SZ-prefix devices where applicable.
MM5ZxxxST1G Series, SZMM5ZxxxST1G Series
www.onsemi.com
4
PACKAGE DIMENSIONS
SOD−523
CASE 502
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO-
TRUSIONS, OR GATE BURRS.
E
D−X−
−Y−
b
2X
M
0.08 X Y
A
H
c
DIM MIN NOM MAX
MILLIMETERS
D1.10 1.20 1.30
E0.70 0.80 0.90
A0.50 0.60 0.70
b0.25 0.30 0.35
c0.07 0.14 0.20
L0.30 REF
H1.50 1.60 1.70
12
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
E
E
RECOMMENDED
TOP VIEW
SIDE VIEW
2X
BOTTOM VIEW
L2
L
2X
2X
0.48 0.40
2X
1.80
DIMENSION: MILLIMETERS
PACKAGE
OUTLINE
L2 0.15 0.20 0.25
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
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