TACT SwitchTM
Sharp
Feeling
Soft
Feeling
Snap-in
Type
Surface
Mount Type
Radial
Type
328
Detector
Push
Slide
Rotary
Encoders
Power
Dual-in-line
Package Type
Custom-
Products
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple 0.1 to 0.2φCA(K)or CC(T)at solder joints(copper foil surface). A heat resistive tape
should be used to fix thermocouple.
3. Temperature profile
Soldering Conditions
Condition for Reflow
Available for Surface Mount Type.
260˚C max. 3 sec max.
120secmax.( pre-heating)
3 to 4min.
40s max.
Manual Soldering(Except SKRT Series)
Flux built-up Mounting surface
should not be exposed to fluk
Ambient temperature of the soldered
surface of PC board.
100℃max.
60s max.
260℃max.
5s max.
Preheating temperature
Preheating time
Soldering temperature
Duration of immersion
Items Condition
Condition
2times max.
Number of soldering
Soldering temperature 350℃max.
3s max.
Duration of soldering
60W max.
Capacity of soldering iron
Items
1. Consult with us for availability of TACT SwitchTM washing.
2. Prevent flux penetration from the top side of the TACT SwitchTM.
3. Switch terminals and a PC board should not be coated with flux prior to soldering.
4. The second soldering should be done after the switch is stable with normal temperature.
5. Use the flux with a specific gravity of min 0.81.
(EC-19S-8 by TAMURA Corporation, or equivalents.)
Notes
Conditions for Auto-dip
Available for Snap-in Type and Radial Type
(Except SKHJ, SKHL, SKQJ, SKQK, SKEG series)
1. The above temperature shall be measured of the top of switch. There are cases where the PC board's temperature
greatly differs from that of the switch, depending on the material, size, thickness of PC boards and others. The
above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is
highly recommended.
Notes
TACT SwitchTM