www.osram-os.com Produktdatenblatt | Version 1.1 SFH 4256 SFH 4256 SIDELED (R) High Power Infrared Emitter (850 nm) Applications ----Measurement Levelling ----Electronic Equipment ----Industrial Automation (Machine controls, Light barriers, Vision controls) Features: ----Package: clear epoxy ----Qualifications: The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualification for Automotive Grade Discrete Semiconductors. ----ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) ----Short switching times Ordering Information Type Radiant intensity 1) IF = 70 mA; tp = 20 ms Ie SFH 4256 10 ... 20.0 mW/sr SFH 4256-R 6.3 ... 32.0 mW/sr 1 Version 1.4 | 2018-06-26 Radiant intensity 1) typ. IF = 70 mA; tp = 20 ms Ie Ordering Code 13 mW/sr Q65111A3182 13 mW/sr Q65111A9682 SFH 4256 Maximum Ratings TA = 25 C Parameter Symbol Operating temperature Top min. max. -40 C 100 C Storage temperature Tstg min. max. -40 C 100 C Reverse voltage 2) VR max. 12 V Forward current IF max. 70 mA Surge current tp 100 s; D = 0 IFSM max. 0.7 A Power consumption Ptot max. 140 mW ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) VESD max. 2 kV 2 Version 1.4 | 2018-06-26 Values SFH 4256 Characteristics IF = 70 mA; tp = 20 ms; TA = 25 C Parameter Symbol Peak wavelength peak typ. 860 nm Centroid wavelength centroid typ. 850 nm Spectral bandwidth at 50% Irel,max typ. 30 nm Half angle typ. 60 Dimensions of active chip area LxW typ. 0.2 x 0.2 mm x mm Rise time (10% / 90%) RL = 50 tr typ. 12 ns Fall time (10% / 90%) RL = 50 tf typ. 12 ns Forward voltage VF typ. max. 1.6 V 2V Forward voltage IF = 500 mA; tp = 100 s VF typ. max. 2.4 V 3V Reverse current 2) VR = 5 V IR max. typ. 10 A 0.01 A Total radiant flux 3) e typ. 40 mW Radiant intensity 1) IF = 500 mA; tp = 25 s Ie typ. 80 mW/sr Temperature coefficient of brightness TCI typ. -0.5 % / K Temperature coefficient of voltage TCV typ. -0.7 mV / K TC typ. 0.3 nm / K RthJA max. 500 K / W RthJS max. 280 K / W Temperature coefficient of wavelength Thermal resistance junction ambient real 4) Thermal resistance junction solder point real 5) 3 Version 1.4 | 2018-06-26 Values SFH 4256 Brightness Groups TA = 25 C Group Radiant intensity IF = 70 mA; tp = 20 ms min. Ie Radiant intensity IF = 70 mA; tp = 20 ms max. Ie Q 6.3 mW/sr 12.5 mW/sr R 10.0 mW/sr 20.0 mW/sr S 16.0 mW/sr 32.0 mW/sr Only one group in one packing unit (variation lower 2:1) Relative Spectral Emission 6), 7) Irel = f (); IF = 70 mA; tp = 20 ms OHF04132 100 I rel % 80 60 40 20 0 700 750 800 850 nm 950 4 Version 1.4 | 2018-06-26 SFH 4256 Radiation Characteristics 6), 7) Irel = f () 40 30 20 10 0 50 OHL01660 1.0 0.8 0.6 60 0.4 70 0.2 80 0 90 100 1.0 0.8 Forward current 0.6 OHF03826 100 A 5 20 40 10-3 10-2 5 5 1.5 2 2.5 V 3 VF 5 Version 1.4 | 2018-06-26 6), 7) 5 5 1 120 100 5 0.5 100 OHF04406 101 10-1 0 80 Ie/Ie(70mA) = f (IF); single pulse; tp = 25 s 10-2 10-4 60 Ie I e (70 mA) 10-1 0 Relative Radiant Intensity 6), 7) IF = f (VF); single pulse; tp = 100 s IF 0.4 10-3 0 10 5 10 1 5 10 2 mA IF 10 3 SFH 4256 Max. Permissible Forward Current Permissible Pulse Handling Capability IF,max = f (TA); RthJA = 500 K / W IF = f (tp); duty cycle D = parameter; TA = 25C IF OHF03732 80 mA IF 70 60 0.7 A 0.6 0.5 50 0.4 40 0.3 30 0.2 20 0 20 40 80 60 100 C 120 Permissible Pulse Handling Capability IF = f (tp); duty cycle D = parameter; TA = 85C IF 0.6 OHF03824 t tP D = TP 0.5 0.4 0.3 0.2 0.1 IF T D= 0.005 0.01 0.02 0.05 0.1 0.2 0.3 0.5 1 IF T D= 0.005 0.01 0.02 0.05 0.1 0.2 0.3 0.5 1 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 tp 6 Version 1.4 | 2018-06-26 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 tp TA 0.7 A t D = TP 0.1 10 0 OHF03733 tP SFH 4256 Dimensional Drawing 8) Approximate Weight: 76.0 mg Package marking: Cathode 7 Version 1.4 | 2018-06-26 SFH 4256 Recommended Solder Pad 8) Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E OHA04525 300 C T 250 Tp 245 C 240 C tP 217 C 200 150 tL tS 100 50 25 C 0 0 50 100 150 200 250 s 300 t 8 Version 1.4 | 2018-06-26 SFH 4256 Profile Feature Symbol Pb-Free (SnAgCu) Assembly Minimum Recommendation Ramp-up rate to preheat*) 25 C to 150 C tS Time tS TSmin to TSmax 60 Ramp-up rate to peak*) TSmax to TP Maximum 2 3 100 120 2 3 Unit K/s s K/s Liquidus temperature TL 217 Time above liquidus temperature tL 80 100 s Peak temperature TP 245 250 C Time within 5 C of the specified peak temperature TP - 5 K tP 20 30 3 4 10 Ramp-down rate* TP to 100 C C 480 Time 25 C to TP All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range Taping 8) 4 (0.157) 4.25 (0.167) 9 Version 1.4 | 2018-06-26 8 (0.315) 12 (0.472) 1.75 (0.069) Cathode/Collector Marking 5.5 (0.217) 2 (0.079) 3.95 (0.156) 1.5 (0.059) OHAY2273 s K/s s SFH 4256 Tape and Reel 9) W1 D0 P0 A N F W E 13.0 0.25 P2 Label P1 Direction of unreeling Direction of unreeling W2 Leader: min. 400 mm * Trailer: min. 160 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D OHAY0324 Reel dimensions [mm] A W Nmin W1 W2 max Pieces per PU 330 mm 12 + 0.3 / - 0.1 60 12.4 + 2 18.4 2000 10 Version 1.4 | 2018-06-26 SFH 4256 Barcode-Product-Label (BPL) Dry Packing Process and Materials 8) Moisture-sensitive label or print Barcode label L VE LE see lab e If nk, bla cod bar hu ve y el . H) (R dit mi e ed ag % . RH /60 C rar ck rel 30 N s VE RS inf pa % ainITI TO of to ak 90 d ntNSUC < ns (pe or TIO d , cte itio an bje ing U g coSEND C nd 5 C su ss CO Ais baRE co ce y 40 be TU MI CThIS C < ll pro tor SE ati _ < ). urs urs Ho de urs Ho co 72 Ho urs te 48 e Ho 24 6 da e tim e th tim or ). 23 tim e at t wi nt l wi or fac C Flo s tim at or ca at re. Flo tha ale el d or nth nti Flo du uiv if: rea es l 4 5 Flo mo lab ce ide eq low g, l ve vic 5a is or be 24 de tin en pro ve l 6 Le de , e te co g: , un wh Le ve l ke r se da ba ed low ure Le ve mo % ba e ba al d ure Le ist en ref e e 10 for tim se ist ure ale op se for > , Mo se 3 ure is or . , se is ha Mo istist nk be g nk -03 rd Mo in n Flo r-p RH g, bla Mo ba TD po If blathi life s % kin Ca (if ar t. wi J-S 10 ba tor thi, va p. elf Ye ar ks _ < e icat me , C 1 tem ted Ye ee urs Sh ter at ed low uir > 1 W Ho un Af Ind no uir DE 1. dy d e 4 ref 8 y is req JE 2. bo e Mo ore tim req 16 : C/ e es dit2b a) St tim or is IP mior ed vic tim e b) g e or Hu en Flo tim or De 2a kin nc te Flo op a) or 3. b) baere Flo da e l 1 2 Flo If al ref tim ve l 4. se d l 2a ve Le 3 g an ve l Le Ba te ure Le ve ure ist Le Da ure ist Mo ist ure Mo Mo ist Mo MO TO OP M RA OS Humidity indicator Barcode label Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. Do not eat. Comparator check dot WET If wet, examine units, if necessary bake units 15% If wet, examine units, if necessary bake units 10% 5% If wet, parts still adequately dry. change desiccant Humidity Indicator MIL-I-8835 Desiccant AM OSR OHA00539 Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033. 11 Version 1.4 | 2018-06-26 SFH 4256 Transportation Packing and Materials 8) DE R 18 -1 -1 +Q P OU P: 44 01 C: 99 8 D/ 20 00 (9 D) 210 021 : 34 O H 12 (Q )Q TY : S S em R ic AM o nd O uc p to to H rs NO TC BA 3G 5 14 2 (6 P) NO : 12 T 11 00 LO (1 T) NO : OD M Y DE -1 18 P -1 + Q R G RO UP : (G ) 44 01 D/ C: (9 D) 0 AM 00 TY :2 )Q O SR 34 NO : (X ) PR O D 5 14 2 110 0 (Q A R ic NO : O S em S (1 T) LO T NO (6 P) : 12 3G BA TC H H 12 o M n O d u p ct to o rs M Muster u L lt S iT Y O T6 P 76 L E Bi D Bi n1 Bi n2 : P- n3 : Q 1: -1 20 M -2 2 L 0 Te 2a 22 m 3 24 0 p ST Ad 26 0 C R C R0 ditio 0 C R PA 77 na RT l TE CK VA XT R: (X ) PR < 8 2199 2100 GR L el at (G ) M u L lt S iT Y O T67 P L 6 Muster E V LE see . lab e H) nk, cod (R bla r If ty ba . idi RH m hu 0% e /6 ive d C re ag lat ra ck re 30 _ < inf pa % k s of to 90 ea ur s d ). < ns (p or d Ho ururs s , de cteg itio Ho an bje co C 72 sin nd Ho ur 5 te 48 C su es e Ho co 24 6 da 40 be oc ry tim e e C th r pr ll tim cto ). 23 oo r wi nt tim e l wi fa r C Fl oo tim s at at ale e. at ica Fl th oo r th ur el nt Fl oo on es uiv if: read ed l 4 5 Fl , lab m ide eq low oc ve l vic is ingen de be 24 de or l 5a6 pr Le ve nt wh e te co , w, g: ve l Le ke r re ou% se da ed ba flo ba Le ve tu re m ba e al d Le r en re re e re 10 ois tu tim se fo tu re ale op se fo > , M ois r se 3 is , is ha se M ois tu nk be oo . 03 nk rd g M ois in r-p bla in Fl RH g, DM ba Ca po If blath % kin life is (if . ar ST p. wi 10 baator et Jelf r th va Ye ar ks s m _ < m ed 1 Ye ee ur d, C iredic t Sh te w, te at nt > 1 W Ho Af flody qu In no ire DE 1. e ou 4 8 re ed re ty is qu JE 2. bo M or tim e e 16 re C/ : es idi 2b r a) St tim mor is IP e ed r oo vic tim b) g e r Hu Fl oo en tim De 2a kin nc te Fl oo r a) op re 3. b) Fl oo da ba e fe l 1 Fl If al re tim ve l 2 4. se d l 2a3 Le ve g an ve l Le re Ba te Le ve tu re Le Da ois tu re tu re M ois M ois tu M ois M Nns IVEORS ai IT ntNS CT TIO DU U g EcoSE ON A ba IC UR M CThisSTSE OI M TO OP M Y Barcode label E Bi D n1 Bi Bi n2 : Pn3 : Q- 1: 1- 20 M 20 2 L Te 2a 22 m 3 24 0 p ST Ad 26 0 C R 0 C R0 dit ion C R PA 77 al RT CK TE VA XT R: Barcode label Packing Sealing label Dimensions of transportation box in mm Width Length Height 349 5 mm 349 5 mm 33 5 mm 12 Version 1.4 | 2018-06-26 OHA02044 SFH 4256 Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the LED specified in this data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoyance, visual impairment, and even accidents, depending on the situation. For further application related informations please visit www.osram-os.com/appnotes 13 Version 1.4 | 2018-06-26 SFH 4256 Disclaimer Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version in the OSRAM OS Webside. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Product safety devices/applications or medical devices/applications OSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. In case Buyer - or Customer supplied by Buyer- considers using OSRAM OS components in product safety devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordinate the customer-specific request between OSRAM OS and Buyer and/or Customer. 14 Version 1.4 | 2018-06-26 SFH 4256 Glossary 1) Radiant intensity: Measured at a solid angle of = 0.01 sr 2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse operation is not allowed. 3) Total radiant flux: Measured with integrating sphere. 4) Thermal resistance: junction ambient, mounted on PCboard (FR4), padsize 16 mm each 5) Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g. metal block) 6) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 7) Testing temperature: TA = 25C 8) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with 0.1 and dimensions are specified in mm. 9) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm. 15 Version 1.4 | 2018-06-26 SFH 4256 Published by OSRAM Opto Semiconductors GmbH Leibnizstrae 4, D-93055 Regensburg www.osram-os.com (c) All Rights Reserved. 16 Version 1.4 | 2018-06-26