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FEATURES APPLICATIONS
DESCRIPTION
ABSOLUTE MAXIMUM RATINGS
(1)
RI-STU-251B
SCBS852 – MARCH 2001
SERIES 2000 READER S251B
•Access Control•Best in Class Performance Through PatentedHDX Technology
•Vehicle Identification
•Container Tracking•Automatic Antenna Tuning
•Asset Management•High Power Output
•Waste Management•Proven in Harsh Industrial Environments•Easy to Install and Use
The Texas Instruments’ low-frequency (LF) reader provides all the functionality required to communicate withTexas Instruments 134.2 kHz LF transponders which are available in a variety of form factors. The RI-STU-251BReader/Writer is capable driving a variety of antennas with inductance ranges from 26.0µH to 27.9µH includingTI standard antennas RI-ANT-G01E, RI-ANT-G02E, RI-ANT-G04E gate antennas as well as RI-ANT-S01C andRI-ANT-S02C stick antennas. The RI-STU-251B includes an automatic antenna resonance tuning feature whichfurther reduces the need for maintenance and simplifies installation. It also supports both RS232 and RS422/485interface standards.
The RI-STU-251B is well suited for usage in a broad range of applications including, but not limited to, accesscontrol, vehicle identification, container tracking, asset management and waste management applications.
The Series 2000 Reader S251B provides all RF and Control Functions to communicate with 134.2 kHzHDX/FSK transponders. It sends an energizing signal to the transponder, modulates the RF signal to send datato the transponder, decodes and checks the received transponder data and transmits it via a standard serialinterface (RS232, RS422/485). The reader includes a Dynamic Auto Tuning (DAT) function that automaticallytunes a standard antenna to resonance and keeps it tuned during operation.
over operating free-air temperature range (unless otherwise noted)
RI-STU-251B UNIT
Operating Temperature –20 to +70 (depending on power consumption) °CStorage Temperature –40 to +85 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under Recommended OperatingConditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.TIRIS is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2001, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
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RECOMMENDED OPERATING CONDITIONS
OPERATING CHARACTERISTICS
RI-STU-251B
SCBS852 – MARCH 2001
over operating free-air temperature range (unless otherwise noted)
RI-STU-251B
Power Supply 10 to 24 Vdc, regulated
over operating free-air temperature range (unless otherwise noted)
PART NUMBERPARAMETER UNITRI-STU-251B
Relative Humidity <97% non-condensing, IEC 68-2-30 Test Db, 21 cyclesRF Transmit Frequency 134.2 kHz64 kByte EPROM for FirmwareMemory 1kBit EEPROM for Configuration32 kByte RAM for DataData Storage 909 ID Codes (each 64bit)Communications Interface RS232, RS422/485System Architecture Point-to-point and point-to-multipointCommunications Parameters 600 - 57600 baud, 7/8 data bits, even/odd parityCommunications Protocol ASCII with Xon/Xoff handshake, TIRIS™ Bus ProtocolInputs/Outputs 8 configurable digital I/Os, 2 open collector outputsAntenna Tuning Range 26 to 27.9 µH (Dynamic Auto Tuning)Antenna Resonance Voltage Max. 380 VpeakTransponder Types 134.2 kHz HDX/FSKDimensions (L ×W×H) (200 mm ×120mm ×120 mm) ±1.5 mmWeight 900 gMounting DIN rail TS35
2
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PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
RI-STU-251B-01 OBSOLETE 1 TBD Call TI Call TI
RI-STU-251B-30 ACTIVE 0 1 TBD Call TI Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 28-May-2009
Addendum-Page 1
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