DATASHEET
REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM IDT1338
IDT™
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General Description
The IDT1338 is a serial real-time clock (RTC) device that
consumes ultra-low power and provides a full binary-coded
decimal (BCD) clock/calendar with 56 bytes of battery
backed Non-Volatile Static RAM. The clock/calendar
provides seconds, minutes, hours, day, date, month, and
year information. The clock operates in either the 24-hour
or 12-hour format with AM/PM indicator. The end of the
month date is automatically adjusted for months with fewer
than 31 days, including corrections for leap year. Access to
the clock/calendar registers is provided by an I2C interface
capable of operating in fast I2C mode. Built-in Power-sense
circuitry detects power failures and automatically switches
to the backup supply, maintaining time and date operation.
Applications
Telecom (Routers, Switches, Servers)
Handheld (GPS, Point of Sale POS terminals)
Consumer Electronics (Set-Top Box, Digital Recording,
Network Applications, Digital photo frames)
Office (Fax/Printers, Copiers)
Medical (Glucometer, Medicine Dispensers)
Others (Thermostats, Vending Machines, Modems, Utility
Meters)
Features
Real-Time Clock (RTC) counts seconds, minutes, hours,
day, date, month, and year with leap-year compensation
valid up to 2100
56-Byte battery-backed Non Volatile RAM for data
storage
Fast mode I2C Serial interface
Automatic power-fail detect and switch circuitry
Programmable square-wave output
Packaged in 8-pin MSOP, 8-pin SOIC, or 16-pin SOIC
(surface-mount package with an integrated crystal)
Industrial temperature range (-40°C to +85°C)
Block Diagram
VCC
GND
VBAT
SCL
SDA
Crystal inside package
for 16-pin SOIC ONLY
X1
X2
1 Hz/4.096 kHz/
8.192 kHz/32.768 kHz
SQW/OUT
Power
Control
I2C
Interface
32.768 kHz
Oscillator and
Divider
Control
Logic
MUX/
Buffer
Clock, Calendar
Counter
56 Byte
RAM
1 Byte
Control
7 Bytes
Buffer
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Pin Assignment (8-pin MSOP/8-pin SOIC) Pin Assignment (16-pin SOIC)
Pin Descriptions
X1
SCL
SQW/OUT
GND
VCC1
2
3
4
8
7
6
5SDA
X2
VBAT
IDT
1338
16
1
15
2
14
3
13
4
5
6
7
89
10
12
11
SCL
VCC
NC
NC
NC
NC
NC NC
NC
NC
NC
NC
SDA
GND
SQW/OUT
VBAT
IDT
1338C
Pin
Number Pin
Name Pin Description/Function
8MSOP,
8SOIC
16SOIC
1 X1 Connections for standard 32.768 kHz quartz crystal. The internal oscillator circuitry is designed
for operation with a crystal having a specified load capacitance (CL) of 12.5 pF. An external
32.768 kHz oscillator can also drive the IDT1338. In this configuration, the X1 pin is connected to
the external oscillator signal and the X2 pin is left floating.
2—X2
314V
BAT Backup Supply Input for Lithium Coin Cell or Other Energy Source. Battery voltage must be held
between the minimum and maximum limits for proper operation. Diodes placed in series
between the backup source and the VBAT pin may prevent proper operation. If a backup supply is
not required, VBAT must be connected to ground.
4 15 GND Connect to ground.
5 16 SDA Serial data input/output. SDA is the input/output pin for the I2C serial interface. It is an open-drain
output and requires an external pull-up resistor (2 Kohm typical).
6 1 SCL Serial clock input. SCL is used to synchronize data movement on the serial interface. It is an
open-drain output and requires an external pull-up resistor (2 Kohm typical)
7 2 SQW/OUT Square-Wave/Output driver. When enabled and the SQWE bit set to 1, the SQW/OUT pin
outputs one of four square-wave frequencies (1 Hz, 4 kHz, 8 kHz, 32 kHz). It is an open drain
output and requires an external pull-up resistor (10K ohm typical). Operates when the device is
powered with VCC or VBAT
.
83V
CC Device power supply. When voltage is applied within specified limits, the device is fully
accessible by I2C and data can be written and read.
4 - 13 NC No connect. These pins are unused and must be connected to ground for proper operation.
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Typical Operating Circuit
Detailed Description
The following sections discuss in detail the Oscillator block,
Power Control block, Clock/Calendar Register Block and
Serial I2C block.
Oscillator Block
Selection of the right crystal, correct load capacitance and
careful PCB layout are important for a stable crystal
oscillator. Due to the optimization for the lowest possible
current in the design for these oscillators, losses caused by
parasitic currents can have a significant impact on the
overall oscillator performance. Extra care needs to be taken
to maintain a certain quality and cleanliness of the PCB.
Crystal Selection
The key parameters when selecting a 32 kHz crystal to work
with IDT1338 RTC are:
Recommended Load Capacitance
Crystal Effective Series Resistance (ESR)
Frequency Tolerance
Effective Load Capacitance
Please see diagram below for effective load capacitance
calculation. The effective load capacitance (CL) should
match the recommended load capacitance of the crystal in
order for the crystal to oscillate at its specified parallel
resonant frequency with 0ppm frequency error.
In the above figure, X1 and X2 are the crystal pins of our
device. Cin1 and Cin2 are the internal capacitors which
include the X1 and X2 pin capacitance. Cex1 and Cex2 are
the external capacitors that are needed to tune the crystal
frequency. Ct1 and Ct2 are the PCB trace capacitances
between the crystal and the device pins. CS is the shunt
capacitance of the crystal (as specified in the crystal
manufacturer's datasheet or measured using a network
analyzer).
Note: IDT1338CSRI integrates a standard 32.768 kHz
crystal in the package and contributes an additional
frequency error of 10ppm at nominal VCC (+3.3 V) and
TA=+25°C.
CPU
X1 X2 VCC
SQW/OUT
VBAT
GND
SDA
SCL
CRYSTAL
IDT1338
+
-
VCC
2k
2k
VCC
VCC
10k
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ESR (Effective Series Resistance)
Choose the crystal with lower ESR. A low ESR helps the
crystal to start up and stabilize to the correct output
frequency faster compared to high ESR crystals.
Frequency Tolerance
The frequency tolerance for 32 KHz crystals should be
specified at nominal temperature (+25°C) on the crystal
manufacturer datasheet. The crystals used with IDT1338
typically have a frequency tolerance of +/-20ppm at +25°C.
Specifications for a typical 32kHz crystal used with our
device are shown in the table below.
PCB Design Consideration
Signal traces between IDT device pins and the crystal
must be kept as short as possible. This minimizes
parasitic capacitance and sensitivity to crosstalk and
EMI. Note that the trace capacitances play a role in the
effective crystal load capacitance calculation.
Data lines and frequently switching signal lines should be
routed as far away from the crystal connections as
possible. Crosstalk from these signals may disturb the
oscillator signal.
Reduce the parasitic capacitance between X1 and X2
signals by routing them as far apart as possible.
The oscillation loop current flows between the crystal and
the load capacitors. This signal path (crystal to CL1 to
CL2 to crystal) should be kept as short as possible and
ideally be symmetric. The ground connections for both
capacitors should be as close together as possible.
Never route the ground connection between the
capacitors all around the crystal, because this long
ground trace is sensitive to crosstalk and EMI.
To reduce the radiation / coupling from oscillator circuit,
an isolated ground island on the GND layer could be
made. This ground island can be connected at one point
to the GND layer. This helps to keep noise generated by
the oscillator circuit locally on this separated island. The
ground connections for the load capacitors and the
oscillator should be connected to this island.
PCB Layout
PCB Assembly, Soldering and Cleaning
Board-assembly production process and assembly quality
can affect the performance of the 32 KHz oscillator.
Depending on the flux material used, the soldering process
can leave critical residues on the PCB surface. High
humidity and fast temperature cycles that cause humidity
condensation on the printed circuit board can create
process residuals. These process residuals cause the
insulation of the sensitive oscillator signal lines towards
each other and neighboring signals on the PCB to decrease.
High humidity can lead to moisture condensation on the
surface of the PCB and, together with process residuals,
reduce the surface resistivity of the board. Flux residuals on
the board can cause leakage current paths, especially in
humid environments. Thorough PCB cleaning is therefore
highly recommended in order to achieve maximum
performance by removing flux residuals from the board after
assembly. In general, reduction of losses in the oscillator
circuit leads to better safety margin and reliability.
Parameter Symbol Min Typ Max Units
Nominal Freq. fO32.768 kHz
Series Resistance ESR 50 k
Load Capacitance CL12.5 pF
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Power Control
A precise, temperature-compensated voltage reference and
a comparator circuit provides power-control function that
monitors the VCC level. The device is fully accessible and
data can be written and read when VCC is greater than VPF
.
However, when VCC falls below VPF
, the internal clock
registers are blocked from any access. If VPF is less than
VBAT
, the device power is switched from VCC to VBAT when
VCC drops below VPF
. If VPF is greater than VBAT
, the device
power is switched from VCC to VBAT when VCC drops below
VBAT
. The registers are maintained from the VBAT source
until VCC is returned to nominal levels (Table 1). After VCC
returns above VPF
, read and write access is allowed after
tREC (see the “Power-Up/Down Timing” diagram).
Table 1. Power Control
Power-up/down Timing
Table 2. Power-up/down Characteristics
Ambient Temperature -40 to +85°C
Note: This delay applies only if the oscillator is running. If the oscillator is disabled or stopped, no power-up delay
occurs.
Supply Condition Read/Write
Access
Powered
By
VCC < VPF
, VCC < VBAT No VBAT
VCC < VPF
, VCC > VBAT No VCC
VCC > VPF
, VCC < VBAT Ye s V CC
VCC > VPF
, VCC > VBAT Ye s V CC
Parameter Symbol Conditions Min. Typ. Max. Units
Recovery at Power-up tREC (see note below) 2 ms
VCC Fall Time; VPF(MAX) to VPF(MIN) tVCCF 300 µs
VCC Rise Time; VPF(MIN) to VPF(MAX) tVCCR s
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RTC and RAM Address Map
The address map for the RTC and RAM registers shown in Table 3. The RTC registers and control register are located in
address locations 00H to 07H The RAM registers are located in address locations 08H to 3FH. During a multibyte access,
when the register pointer reaches 3FH (the end of RAM space) it wraps around to location 00H (the beginning of the clock
space). On an I2C START, STOP, or register pointer incrementing to location 00H, the current time and date is transferred to
a second set of registers. The time and date in the secondary registers are read in a multibyte data transfer, while the clock
continues to run. This eliminates the need to re-read the registers in case of an update of the main registers during a read.
Table 3. RTC and RAM Address Map
Note: Bits listed as “0” should always be written and read as 0.
Clock and Calendar
Table 3 shows the address map of the RTC registers. The
time and date information is obtained by reading the
appropriate register bytes. The time and calendar are set or
initialized by writing the appropriate register bytes. The
contents of the time and calendar registers are in the BCD
format. Bit 7 of Register 0 is the clock halt (CH) bit. When
this bit is set to 1, the oscillator is disabled. When cleared to
0, the oscillator is enabled. The clock can be halted
whenever the timekeeping functions are not required, which
decreases VBAT current.
The day-of-week register increments at midnight. Values
that correspond to the day of week are user-defined but
must be sequential (i.e., if 1 equals Sunday, then 2 equals
Monday, and so on). Illogical time and date entries result in
undefined operation.
When reading or writing the time and date registers,
secondary (user) buffers are used to prevent errors when
the internal registers update. When reading the time and
date registers, the user buffers are synchronized to the
internal registers on any start or stop, and when the address
pointer rolls over to zero. The countdown chain is reset
whenever the seconds register is written. Write transfers
occurs on the acknowledge pulse from the device. To avoid
rollover issues, once the countdown chain is reset, the
remaining time and date registers must be written within one
second. If enabled, the 1 Hz square-wave output transitions
high 500 ms after the seconds data transfer, provided the
oscillator is already running.
Note that the initial power-on state of all registers,
unless otherwise specified, is not defined. Therefore, it
is important to enable the oscillator (CH = 0) during
initial configuration.
The IDT1338 runs in either 12-hour or 24-hour mode. Bit 6
of the hours register is defined as the 12-hour or 24-hour
mode-select bit. When high, the 12-hour mode is selected.
In the 12-hour mode, bit 5 is the AM/PM bit, with logic high
Address Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Function Range
00H CH 10 seconds Seconds Seconds 00 - 59
01H 0 10 minutes Minutes Minutes 00 - 59
02H 0 12/24
AM/PM
10 hour Hour Hours
1 - 12
+ AM/PM
00 - 23
10 hour
03H00000 Day Day 1 - 7
04H 0 0 10 date Date Date 01 - 31
05H 0 0 0 10 month Month Month 01 - 12
06H 10 year Year Year 00 - 99
07H OUT 0 OSF SQWE 0 0 RS1 RS0 Control
08H -
3FH
RAM 56 x 8 00H - FFH
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being PM. In the 24-hour mode, bit 5 is the second 10-hour
bit (20–23 hours). If the 12/24-hour mode select is changed,
the hours register must be re-initialized to the new format.
On an I2C START, the current time is transferred to a second
set of registers. The time information is read from these
secondary registers, while the clock continues to run. This
eliminates the need to re-read the registers in case of an
update of the main registers during a read.
Table 4. Control Register (07H)
The control register controls the operation of the SQW/OUT pin and provides oscillator status.
Bit 7: Output Control (OUT). Controls the output level of the SQW/OUT pin when the square-wave output is disabled. If SQWE
= 0, the logic level on the SQW/OUT pin is 1 if OUT = 1; it is 0 if OUT = 0.
Bit 5: Oscillator Stop Flag (OSF). A logic 1 in this bit indicates that the oscillator has stopped or was stopped for some time
period and can be used to judge the validity of the clock and calendar data. This bit is edge triggered, and is set to logic 1 when
the internal circuitry senses the oscillator has transitioned from a normal run state to a STOP condition. The following are
examples of conditions that may cause the OSF bit to be set:
1) The first time power is applied.
2) The voltage present on VCC and VBAT are insufficient to support oscillation.
3) The CH bit is set to 1, disabling the oscillator.
4) External influences on the crystal (i.e., noise, leakage, etc.).
This bit remains at logic 1 until written to logic 0. This bit can only be written to logic 0. Attempting to write OSF to logic 1 leaves
the value unchanged.
Bit 4: Square-Wave Enable (SQWE). When set to logic 1, this bit enables the oscillator output to operate with either VCC or
VBAT applied. The frequency of the square-wave output depends upon the value of the RS0 and RS1 bits.
Bits 1 and 0: Rate Select (RS1 and RS0). These bits control the frequency of the square-wave output when the square-wave
output has been enabled. The table below lists the square-wave frequencies that can be selected with the RS bits.
Table 5. Square Wave Output
Bit #Bit 7Bit 6Bit 5Bit 4Bit 3Bit 2Bit 1Bit 0
Name OUT 0 OSF SQWE 0 0 RS1 RS0
POR10110011
OUT RS1 RS0 SQW Output SQWE
X00 1 Hz 1
X 0 1 4.096 kHz 1
X 1 0 8.192 kHz 1
X 1 1 32.768 kHz 1
0XX 0 0
1XX 1 0
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I2C Serial Data Bus
The IDT1338 supports the I2C bus protocol. A device that
sends data onto the bus is defined as a transmitter and a
device receiving data as a receiver. The device that controls
the message is called a master. The devices that are
controlled by the master are referred to as slaves. The bus
must be controlled by a master device that generates the
serial clock (SCL), controls the bus access, and generates
the START and STOP conditions. The IDT1338 operates as
a slave on the I2C bus. Within the bus specifications, a
standard mode (100 kHz maximum clock rate) and a fast
mode (400 kHz maximum clock rate) are defined. The
IDT1338 works in both modes. Connections to the bus are
made via the open-drain I/O lines SDA and SCL.
The following bus protocol has been defined (see the “Data
Transfer on I2C Serial Bus” figure):
Data transfer may be initiated only when the bus is not
busy.
During data transfer, the data line must remain stable
whenever the clock line is HIGH. Changes in the data line
while the clock line is HIGH are interpreted as control
signals.
Accordingly, the following bus conditions have been defined:
Bus not busy: Both data and clock lines remain HIGH.
Start data transfer: A change in the state of the data line,
from HIGH to LOW, while the clock is HIGH, defines a
START condition.
Stop data transfer: A change in the state of the data line,
from LOW to HIGH, while the clock line is HIGH, defines the
STOP condition.
Data valid: The state of the data line represents valid data
when, after a START condition, the data line is stable for the
duration of the HIGH period of the clock signal. The data on
the line must be changed during the LOW period of the clock
signal. There is one clock pulse per bit of data.
Each data transfer is initiated with a START condition and
terminated with a STOP condition. The number of data
bytes transferred between START and STOP conditions is
not limited, and is determined by the master device. The
information is transferred byte-wise and each receiver
acknowledges with a ninth bit.
Acknowledge: Each receiving device, when addressed, is
obliged to generate an acknowledge after the reception of
each byte. The master device must generate an extra clock
pulse that is associated with this acknowledge bit.
A device that acknowledges must pull down the SDA line
during the acknowledge clock pulse in such a way that the
SDA line is stable LOW during the HIGH period of the
acknowledge related clock pulse. Of course, setup and hold
times must be taken into account. A master must signal an
end of data to the slave by not generating an acknowledge
bit on the last byte that has been clocked out of the slave. In
this case, the slave must leave the data line HIGH to enable
the master to generate the STOP condition.
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Data Transfer on I2C Serial Bus
Depending upon the state of the R/W bit, two types of data
transfer are possible:
1) Data transfer from a master transmitter to a slave
receiver. The first byte transmitted by the master is the
slave address. Next follows a number of data bytes. The
slave returns an acknowledge bit after each received byte.
Data is transferred with the most significant bit (MSB) first.
2) Data transfer from a slave transmitter to a master
receiver. The first byte (the slave address) is transmitted by
the master. The slave then returns an acknowledge bit. This
is followed by the slave transmitting a number of data bytes.
The master returns an acknowledge bit after all received
bytes other than the last byte. At the end of the last received
byte, a “not acknowledge” is returned. The master device
generates all of the serial clock pulses and the START and
STOP conditions. A transfer is ended with a STOP condition
or with a repeated START condition. Since a repeated
START condition is also the beginning of the next serial
transfer, the bus is not released. Data is transferred with the
most significant bit (MSB) first.
The IDT1338 can operate in the following two modes:
1) Slave Receiver Mode (Write Mode): Serial data and
clock are received through SDA and SCL. After each byte is
received an acknowledge bit is transmitted. START and
STOP conditions are recognized as the beginning and end
of a serial transfer. Address recognition is performed by
hardware after reception of the slave address and direction
bit (see the “Data Write–Slave Receiver Mode” figure). The
slave address byte is the first byte received after the START
condition is generated by the master. The slave address
byte contains the 7-bit IDT1338 address, which is 1101000,
followed by the direction bit (R/W), which is 0 for a write.
After receiving and decoding the slave address byte the
slave outputs an acknowledge on the SDA line. After the
IDT1338 acknowledges the slave address + write bit, the
master transmits a register address to the IDT1338. This
sets the register pointer on the IDT1338, with the IDT1338
acknowledging the transfer. The master may then transmit
zero or more bytes of data, with the IDT1338 acknowledging
each byte received. The address pointer increments after
each data byte is transferred. The master generates a STOP
condition to terminate the data write.
2) Slave Transmitter Mode (Read Mode): The first byte is
received and handled as in the slave receiver mode.
However, in this mode, the direction bit indicates that the
transfer direction is reversed. Serial data is transmitted on
SDA by the IDT1338 while the serial clock is input on SCL.
START and STOP conditions are recognized as the
beginning and end of a serial transfer (see the “Data
Read–Slave Transmitter Mode” figure). The slave address
byte is the first byte received after the START condition is
generated by the master. The slave address byte contains
the 7-bit IDT1338 address, which is 1101000, followed by
the direction bit (R/W), which is 1 for a read. After receiving
and decoding the slave address byte the slave outputs an
acknowledge on the SDA line. The IDT1338 then begins to
transmit data starting with the register address pointed to by
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the register pointer. If the register pointer is not written to
before the initiation of a read mode the first address that is
read is the last one stored in the register pointer. The
address pointer is incremented after each byte is
transferred. The IDT1338 must receive a “not acknowledge”
to end a read.
Data Write – Slave Receiver Mode
Data Read (from current Pointer location) – Slave Transmitter Mode
Data Read (Write Pointer, then Read) – Slave Receive and Transmit
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Handling, PCB Layout, and Assembly
The IDT1338 package contains a quartz tuning-fork crystal. Pick-and-place equipment may be used, but precautions should
be taken to ensure that excessive shocks are avioded. Ultarsonic cleaning equipment should be avioded to prevent damage
to the crystal.
Avoid running signal traces under the package, unless a ground plane is placed between the package and the signal line.
All NC (no connect) pins must be connected to ground.
Moisture-sensitive packages are shipped from the factory dry-packed. Handling instructions listed on the package label must
be followed to prevent damage during reflow. Refer to the IPC/JEDEC J-STD-020 standard for moisture-sensitive device
(MSD) classifications.
Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the IDT1338. These ratings, which are
standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these
or any other conditions above those indicated in the operational sections of the specifications is not implied.
Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical
parameters are guaranteed only over the recommended operating temperature range.
Recommended DC Operating Conditions
(VCC = VCC(MIN) to VCC(MAX), TA = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = 3.3 V,
TA = +25°C, unless otherwise noted.) (Note 1)
Item Rating
Voltage Range on Any Pin Relative to Ground -0.3 V to +6.0 V
Storage Temperature -55 to +125°C
Soldering Temperature 260°C
Parameter Symbol Min. Typ. Max. Units
Ambient Operating Temperature TA -40 +85 °C
VBAT Input Voltage, Note 2 VBAT 1.3 3.0 3.7
Pull-up Resistor Voltage (SQW/OUT), Note 2 VPU 5.5 V
Logic 1, Note 2 VIH 0.7VCC VCC + 0.3 V
Logic 0, Note 2 VIL -0.3 +0.3VCC V
Supply Voltage
IDT1338-18 VCC
VPF 1.8 5.5 V
IDT1338-31 VPF 3.3 5.5
Power Fail Voltage
IDT1338-18 VPF
1.40 1.62 1.71 V
IDT1338-31 2.45 2.7 2.97
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DC Electrical Characteristics
(VCC = VCC(MIN) to VCC(MAX), TA = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = 3.3 V,
TA = +25°C, unless otherwise noted.) (Note 1)
DC Electrical Characteristics
(VCC = 0V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at VBAT = 3.0 V, TA = +25°C, unless
otherwise noted.) (Note 1)
Parameter Symbol Conditions Min. Typ. Max. Units
Input Leakage ILI Note 3 1 µA
I/O Leakage ILO Note 4 1 µA
SDA Logic 0 Output IOLSDA
VCC > 2 V; VOL = 0.4 V 3.0 mA
VCC < 2 V; VOL = 0.2VCC 3.0
SQW/OUT Logic 0 Output IOLSQW
VCC > 2 V; VOL = 0.4 V 3.0 mA
1.71 V < VCC < 2 V;
VOL = 0.2VCC
3.0 mA
1.3 V < VCC < 1.71 V;
VOL = 0.2VCC
250 µA
Active Supply Current (Note 5) ICCA
IDT1338-18 75 150
µA
IDT1338-31; VCC < 3.63 V 120 200
IDT1338-31; 3.63 V < VCC <
5.5 V
325
Standby Current (Note 6) ICCS
IDT1338-18 60 100
µA
IDT1338-31; VCC < 3.63 V 85 125
IDT1338-31; 3.63 V < VCC <
5.5 V
200
VBAT Leakage Current (VCC Active) IBATLKG 25 100 nA
Parameter Symbol Conditions Min. Typ. Max. Units
VBAT Current (OSC ON); VBAT =3.7 V,
SQW/OUT OFF
IBATOSC1 Note 7 800 1200 nA
VBAT Current (OSC ON); VBAT =3.7 V,
SQW/OUT ON
IBATOSC2 Note 7 1025 1400 nA
VBAT Data-Retention Current
(OSC OFF); VBAT =3.7 V
IBATDAT Note 7 10 100 nA
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AC Electrical Characteristics
(VCC = VCC(MIN) to VCC(MAX), TA = -40°C to +85°C) (Note 1)
WARNING: Negative undershoots below 0.3 V while the device is in battery-backed mode may cause loss
of data.
Note 1: Limits at -40°C are guaranteed by design and are not production tested.
Note 2: All voltages referenced to ground.
Note 3: SCL only.
Note 4: SDA and SQW/OUT.
Note 5: ICCA—SCL clocking at max frequency = 400 kHz.
Note 6: Specified with the I2C bus inactive.
Parameter Symbol Conditions Min. Typ. Max. Units
SCL Clock Frequency fSCL Fast Mode 100 400 kHz
Standard Mode 0 100
Bus Free Time Between a STOP and
START Condition
tBUF Fast Mode 1.3 µs
Standard Mode 4.7
Hold Time (Repeated) START
Condition, Note 8
tHD:STA Fast Mode 0.6 µs
Standard Mode 4.0
Low Period of SCL Clock tLOW Fast Mode 1.3 µs
Standard Mode 4.7
High Period of SCL Clock tHIGH Fast Mode 0.6 µs
Standard Mode 4.0
Setup Time for a Repeated START
Condition
tSU:STA Fast Mode 0.6 µs
Standard Mode 4.7
Data Hold Time (Notes 9, 10) tHD:DAT Fast Mode 0 0.9 µs
Standard Mode 0
Data Setup Time (Note 11) tSU:DAT Fast Mode 100 ns
Standard Mode 250
Rise Time of Both SDA and SCL
Signals (Note 12)
tRFast Mode 20 + 0.1CB300 ns
Standard Mode 20 + 0.1CB1000
Fall Time of Both SDA and SCL Signals
(Note 12)
tFFast Mode 20 + 0.1CB300 ns
Standard Mode 20 + 0.1CB300
Setup Time for STOP Condition tSU:STO Fast Mode 0.6 µs
Standard Mode 4.0
Capacitive Load for Each Bus Line
(Note 12)
CB400 pF
I/O Capacitance (SDA, SCL) CI/O Note 13 10 pF
Oscillator Stop Flag (OSF) Delay tOSF Note 14 100 ms
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REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM RTC
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Note 7: Measured with a 32.768 kHz crystal on X1 and X2.
Note 8: After this period, the first clock pulse is generated.
Note 9: A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIHMIN of
the SCL signal) to bridge the undefined region of the falling edge of SCL.
Note 10: The maximum tHD:DAT need only be met if the device does not stretch the LOW period (tLOW) of the SCL
signal.
Note 11: A fast-mode device can be used in a standard-mode system, but the requirement tSU:DAT > to 250 ns must
then be met. This is automatically the case if the device does not stretch the LOW period of the SCL signal. If such
a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line tR(MAX) +
tSU:DAT = 1000 + 250 = 1250 ns before the SCL line is released.
Note 12: CB—total capacitance of one bus line in pF.
Note 13: Guaranteed by design. Not production tested.
Note 14: The parameter tOSF is the period of time the oscillator must be stopped for the OSF flag to be set over the
voltage range of 0.0V < VCC < VCCMAX and 1.3 V < VBACKUP < 3.7 V.
Timing Diagram
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Typical Operating Characteristics
IBAT vs VBAT
(IDT1338-31)
494
534
574
614
654
694
734
1.3 1.8 2.3 2.8 3.3
VBat (V)
Supply current (nA)
SQWE=1
SQWE=0
Icc vs Vcc
(IDT1338-31)
0
5
10
15
20
25
2.73.23.74.24.75.2
Vcc (V)
Supply Current (uA)
SCL=400kHz
SCL=0Hz
IBAT vs Temperature
400
500
600
700
800
-40-20 0 20406080
Temperature (C)
IBAT (nA)
SQWE=1
SQWE=0
Oscillator Frequency vs Supply Voltage
32767.750000
32767.800000
32767.850000
32767.900000
32767.950000
2.7 3.2 3.7 4.2 4.7 5.2
Oscillator Supply Voltage (V)
Frequency (Hz)
Freq
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Thermal Characteristics for 8MSOP
Thermal Characteristics for 8SOIC
Thermal Characteristics for 16SOIC
Parameter Symbol Conditions Min. Typ. Max. Units
Thermal Resistance Junction to
Ambient
θJA Still air 95 °C/W
Thermal Resistance Junction to Case θJC 48 °C/W
Parameter Symbol Conditions Min. Typ. Max. Units
Thermal Resistance Junction to
Ambient
θJA Still air 150 °C/W
θJA 1 m/s air flow 140 °C/W
θJA 3 m/s air flow 120 °C/W
Thermal Resistance Junction to Case θJC 40 °C/W
Parameter Symbol Conditions Min. Typ. Max. Units
Thermal Resistance Junction to
Ambient
θJA Still air 120 °C/W
θJA 1 m/s air flow 115 °C/W
θJA 3 m/s air flow 105 °C/W
Thermal Resistance Junction to Case θJC 58 °C/W
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Marking Diagram (8 MSOP)
Marking Diagram (8 SOIC)
Notes:
1. ‘#’ is the lot number.
2. ‘$’ is the assembly mark code.
3. YYWW is the last two digits of the year and week that the
part was assembled.
4. “G” denotes RoHS compliant package.
5. “I” denotes industrial grade.
6. Bottom marking: country of origin if not USA.
Marking Diagram (16 SOIC)
38GI
YWW$
IDT1338-31DVGI
18GI
YWW$
IDT1338-18DVGI
IDT1338
-31DCGI
#YYWW$
14
58
IDT1338-31DCGI
IDT1339
-18DCGI
#YYWW$
14
58
IDT1338-18DCGI
18
916
IDT
1338C-31
SRI
#YYWW**$
IDT1338C-31SRI
18
916
IDT
1338C-18
SRI
#YYWW**$
IDT1338C-18SRI
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Package Outline and Package Dimensions (8-pin SOIC, 150 Mil. Body)
Package dimensions are kept current with JEDEC Publication No. 95
INDEX
AREA
1 2
8
D
E
SEATING
PLANE
A1
A
e
- C -
B
.10 (.004) C
C
L
H
h x 45
Millimeters Inches
Symbol Min Max Min Max
A 1.35 1.75 .0532 .0688
A1 0.10 0.25 .0040 .0098
B 0.330.51.013.020
C 0.19 0.25 .0075 .0098
D 4.80 5.00 .1890 .1968
E 3.80 4.00 .1497 .1574
e 1.27 BASIC 0.050 BASIC
H 5.80 6.20 .2284 .2440
h 0.250.50.010.020
L 0.401.27.016.050
α0°8°0°8°
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Package Outline and Package Dimensions (8-pin MSOP, 3.00 mm Body)
Package dimensions are kept current with JEDEC Publication No. 95
INDEX
AREA
1 2
8
D
E1 E
SEATING
PLANE
A
1
A
A
2
e
- C -
b
aaa C
c
L
*For reference only. Controlling dimensions in mm.
Millimeters Inches*
Symbol Min Max Min Max
A--1.10--0.043
A1 0 0.15 0 0.006
A2 0.79 0.97 0.031 0.038
b 0.22 0.38 0.008 0.015
C 0.08 0.23 0.003 0.009
D 3.00 BASIC 0.118 BASIC
E 4.90 BASIC 0.193 BASIC
E1 3.00 BASIC 0.118 BASIC
e 0.65 Basic 0.0256 Basic
L 0.40 0.80 0.016 0.032
α0°8°0°8°
aaa - 0.10 - 0.004
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Package Outline and Package Dimensions (16-pin SOIC, 300 mil Body)
Package dimensions are kept current with JEDEC Publication No. 95
INDEX
AREA
1 2
16
D
E1 E
SEATING
PLANE
A
1
A
A
2
e
- C -
b
aaa C
c
L
*For reference only. Controlling dimensions in mm.
Millimeters Inches*
Symbol Min Max Min Max
A -- 2.65 -- 0.104
A1 0.10 -- 0.0040 --
A2 2.05 2.55 0.081 0.100
b 0.33 0.51 0.013 0.020
c 0.18 0.32 0.007 0.013
D 10.10 10.50 0.397 0.413
E 10.00 10.65 0.394 0.419
E1 7.40 7.60 0.291 0.299
e 1.27 Basic 0.050 Basic
L 0.40 1.27 0.016 0.050
α0°8°0°8°
aaa - 0.10 - 0.004
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Ordering Information
The IDT1338 packages are RoHS compliant. Packages without the integrated crystal are Pb-free; packages that include the
integrated crystal (as designated with a “C” before the dash number) may include lead that is exempt under RoHS
requirements. The lead finish is JESD91 category e3.
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes
no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No
other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications
such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not
recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT
does not authorize or warrant any IDT product for use in life support devices or critical medical instruments.
Part / Order Number Marking Shipping Packaging Package Temperature
1338-18DVGI
see page 17
Tubes 8-pin MSOP -40 to +85° C
1338-18DVGI8 Tape and Reel 8-pin MSOP -40 to +85° C
1338-18DCGI Tubes 8-pin SOIC -40 to +85° C
1338-18DCGI8 Tape and Reel 8-pin SOIC -40 to +85° C
1338C-18SRI Tubes 16-pin SOIC -40 to +85° C
1338C-18SRI8 Tape and Reel 16-pin SOIC -40 to +85° C
1338-31DVGI Tubes 8-pin MSOP -40 to +85° C
1338-31DVGI8 Tape and Reel 8-pin MSOP -40 to +85° C
1338-31DCGI Tubes 8-pin SOIC -40 to +85° C
1338-31DCGI8 Tape and Reel 8-pin SOIC -40 to +85° C
1338C-31SRI Tubes 16-pin SOIC -40 to +85° C
1338C-31SRI8 Tape and Reel 16-pin SOIC -40 to +85° C
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Revision History
Rev. Originator Date Description of Change
A J. Sarma 01/29/08 New device. Preliminary release.
B J.Sarma 03/28/08 Added new note to Part Ordering information pertaining to RoHS compliance and Pb-free devices.
C J.Sarma 04/03/04 combined -3 and -33 parts to -31
D J.Sarma 05/19/08 The part number for 16pin RoHS complaint part has now changed from IDT1338C-31SOGI to
IDT1338C-31SRI and the IDT1338C-18SOGI changed to IDT1338C-18SRI
E J.Sarma 10/29/08
F J.Sarma 11/10/08 Updated Block Diagram; Typical Operating Characteristics charts.
G J.Sarma 11/13/08 Updated graphs in “Typical Operating Characteristics; added “Typical Operating Circuit” diagram
H J.Sarma 11/18/08 Updated graphs in “Typical Operating Characteristics; updated Block Diagram; added “Battery
Backed” to device title.
I J.Sarma 12/02/08 Updated Typical Operating Characteristics graphs; added marking diagrams.
J 11/10/09 Added “Handling, PCB Layout, and Assembly” section.
© 2006 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT and the IDT logo are trademarks of Integrated Device
Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be trademarks or registered
trademarks used to identify products or services of their respective owners.
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www.idt.com
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800-345-7015
408-284-8200
Fax: 408-284-2775
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www.idt.com/go/clockhelp
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IDT1338
REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM RTC