MIL-PRF-19500/398L
w/AMENDMENT 1
4
3.5 Radiation hardness assurance (RHA). Radiation hardness assurance requirements and test levels shall be as
defined in MIL-PRF-19500.
3.6 Electrical performance characteristics. Unless otherwise specified, the electrical performance characteristics
are as specified in 1.3, 1.4, and table I herein.
3.7 Marking.
3.7.1 Through hole mount packages. Marking shall be in accordance with Error! Reference source not found..
3.7.2 Surface mount packages. Marking shall be in accordance with Error! Reference source not found.. The
marking on the UB package shall consist of an abbreviated part number, the date code, and the manufacturer’s
symbol and logo. The prefixes JAN, JANTX, JANTXV and JANS can be abbreviated as J, JX, JV, and JS
respectively. The “2N” prefix and the “UB” suffix can also be omitted. The radiation hardened designator shall
immediately precede (or replace) the device “2N” identifier (depending upon degree of abbreviation required).
3.8 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and
shall be free from other defects that will affect life, serviceability, or appearance.
4. VERIFICATION
4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:
a. Qualification inspection (see 4.2).
b. Screening (see 4.3).
c. Conformance inspection (see 4.4 and tables I and II).
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500 and as specified
herein.
4.2.1 JANHC and JANKC qualification. JANHC and JANKC qualification inspection shall be in accordance with
MIL-PRF-19500.
4.2.2 Group E qualification. Group E inspection shall be performed for qualification or re-qualification only. In
case qualification was awarded to a prior revision of the specification sheet that did not request the performance of
table III tests, the tests specified in table III herein that were not performed in the prior revision shall be performed on
the first inspection lot of this revision to maintain qualification.
* 4.2.2.1 Group E thermal response. With extremely small junction devices such as this one, a true thermal
impedance cannot be measured, only calculated. While “thermal response” has been substituted for “thermal
impedance” herein, the terms, units, and procedures are essentially unchanged. Each supplier shall submit a thermal
response (ZθJX) histogram of the entire qualification lot. The histogram data shall be taken prior to the removal of
devices that are atypical for thermal response. Thermal response curves (from ZθJX test pulse time to RθJX minimum
steady-state time) of the best device in the qual lot and the worst device in the qual lot (that meets the supplier
proposed screening limit), or from the thermal grouping, shall be submitted. The optimal test conditions and proposed
initial thermal response screening limit shall be provided in the qualification report. Data indicating how the optimal
test conditions were derived for ZθJX shall also be submitted. The proposed maximum thermal response ZθJX
screening limit shall be submitted. The qualifying activity may approve a different ZθJX limit for conformance
inspection end-point measurements as applicable. Equivalent data, procedures, or statistical process control plans
may be used for part, or all, of the above requirements. The approved thermal response conditions and limit for ZθJX
shall be used by the supplier in screening and table I, subgroup 2. The approved thermal resistance conditions for
RθJX shall be used by the supplier for conformance inspection. For product families with similar thermal
characteristics based on the same physical and thermal die, package, and construction combination (thermal
grouping), the supplier may use the same thermal response curves.