VSM Series (0805, 1206, 1506, 2010, 2512)
Vishay Foil Resistors
Foil Wrap Around Surface Mount Chip Resistor with
TCR of ± 2 ppm/°C and Load Life Stability of ± 0.01 % (100 ppm)
www.vishay.com For any questions, contact: foil@vishay.com Document Number: 63070
1Revision: 17-Jan-07
IMPROVED PRODUCT
Any value at any tolerance within resistance range
INTRODUCTION
Bulk Metal® Foil (BMF) Technology out-performs all other
resistor technologies available today for applications that
require high precision and high stability.
This technology has been invented, patented and pioneered
by Vishay. Products based on this technology are the most
suitable for a wide range of applications.
BMF technology allows to produce customer oriented
products designed to satisfy challenging and specific
technical requirements.
The BMF provides an inherently low and predictable
Temperature Coefficient of Resistance (TCR) and excellent
load life stability for high precision analog applications.
Model VSM offers low TCR, excellent load life stability, tight
tolerance, excellent shelf life stability, low thermal EMF, low
current noise and low voltage coefficient, all in the same
resistor.
The VSM has a full wrap around termination which ensures
safe handling during the manufacturing process, as well as
providing stability during multiple thermal cyclings.
Our Application Engineering Department is available to
advise and make recommendations. For non-standard
technical requirements and special applications, please
contact us using the e-mail address in the footer below.
Note
1. For Tighter performances, please contact Vishay Application
Engineering using the e-mail addresses in the footer below.
FEATURES
•Temperature Coefficient of Resistance (TCR):
± 2.0 ppm/°C typical (- 55 °C to + 125 °C,
+ 25 °C Ref.) (see Table 1)
•Power Rating: to 400 mW at + 70 °C
•
Tolerance: to
±
0.01 %
•Load Life Stability: to ± 0.01 % at 70 °C,
2000 hours at rated power
•Resistance Range: 10 Ω to 150 kΩ (for higher and lower
values, please contact us)
•Electrostatic Discharge (ESD) above 25 000 Volts
•Short Time Overload: ≤ ± 0.01 %
•
Rise Time: 1 ns without ringing
•Current Noise: - 40 dB
•Thermal EMF: < 0.05 µV/°C
•Voltage Coefficient < 0.1 ppm/V
•Non Inductive: < 0.08 µH
•Non Inductive, Non Capacitive Design
•Non Hot Spot Design
•Terminal Finishes Available:
Lead (Pb)-free
Tin/Lead Alloy
•Matched sets are available per request
•For better performances please review VSMP and VFCP
Series datasheets
APPLICATIONS
•Automatic Test Equipment (ATE)
•High Precision Instrumentation
•Laboratory, Industrial and Medical
•Audio
•EB Applications (electron beam scanning and recording
equipment, electron microscopes)
•Military and Space
•Airborne
•Down Hole instrumentation
•Communication
* Pb containing terminations are not RoHS compliant, exemptions may apply
TABLE 1 - TOLERANCE AND TCR VS
RESISTANCE VALUE
1)
(- 55 °C to + 125 °C, + 25 °C Ref.)
RESISTANCE
VALUE
(Ω)
TOLERANCE
(%)
TYPICAL TCR AND
MAX. SPREAD
(ppm/°C)
250 to 150K ± 0.01 ± 2 ± 2
100 to < 250 ± 0.02 ± 2 ± 3
50 to < 100 ± 0.05 ± 2 ± 3
25 to < 50 ± 0.1 ± 2 ± 4
10 to < 25 ± 0.25 ± 2 ± 6
Top View
FIGURE 1 - TRIMMING TO VALUES
(Conceptual Illustration)
Available
Pb-free
RoHS*
COMPLIANT
Mutual Inductance
Reduction due
to Change in
Current Direction
Current Path
Before Trimming
Trimming Process
Removes this Material
from Shorting Strip Area
Changing Current Path
and Increasing
Resistance
NOTE: Foil shown in black, etched spaces in white
Current Path
After Trimming
Interloop Capacitance
Reduction in Series