©2003 Fairchild Semiconductor Corporation MMSZ4692, Rev. A
MMSZ4702
Absolute Maximum Ratings (note 1) TA=25°C unless otherwise noted
Note 1: These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
Note 2: Voltage change is equal to the difference between VZ at 100µA and VZ at 10µA.
Electrical Characteristics TA=25°C unless otherwise noted
Symbol Parameter Value Units
TSTG Storage Temperature -55 ~ 150 °C
TJMaximum Junction Temperature -55 ~ 150 °C
PDTotal Power Dissipation at 25°C
Derate above 25°C500
6.7 mW
mW/°C
RQJA Thermal Resistance Junction to Ambient 340 °C/W
RQJL Thermal Resistance Junction to Lead 150 °C/W
VZMaximum Voltage Change (Note 2) 150 mV
Lead Solder Temperature (Max 10 second duration) 260 °C
Nominal Zener Volt age (VZ) at 50µA 15.0 V
Symbol Characteristics Test Conditions Min. Max. Units
VZZener Voltage IZT = 5 0 µA D.C 14.25 15.75 V
IRReverse Leakage VR = 11.4V 50 nA
VFForward Voltage IF = 10mA 900 mV
VZDelta Zener Voltage (Note 2) IZT = 100µA to 10µA 150 mV
2
1
Top Mark: DM
1: Cathode
2: Anode
MMSZ4702
General Description
Half watt, General purpose, Medium Current Surface
Mount Zener in the SOD-123 package. The SOD-123
package has the same footprint as the glass mini-melf (LL-
34) package & provides a convenient alternative to the
leadless package.
Features
Compact surface mount with same footprint as mini-melf
500mW rating on FR-4 or FR-5 board.
Class 3 ESD rating (>16kV) per Human Body Model
Ordering
7 inch reel (178mm); 8mm Tape; 3,000 units per reel.
©2003 Fairchild Semiconductor Corporation MMSZ4692, Rev. A
MMSZ4702
MIN MAX MIN MAX
DIM (mils) (mils) (mm) (mm)
A 55 71 1.400 1.800
B 100 112 2.550 2.850
C 34.6 46 0.880 1.180
D 141.7 153.5 3.600 3.900
E ---- ---- ------- -------
F 21.5 27.5 0.546 0.70
G 0.5 4 0.0135 0.1015
H 12.7 ---- 0.322 -------
I 3.7 7.7 0.095 0.195
C
A
A
I
D
F
B
H
21
SOD-123 LAND PADS
0.91 mm
36 mils
1.2 2 mm
48 mils
0.91 mm
36 mils
4.19 mm
165 mils
2.36 mm
93 mils
SOD-123 PACKAGE
PACKAGE CODE = (D6)
Fairchild Semiconductor's Criteria
G
Actual Size
Corrected March 11, 1998
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PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY
ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT
CONVEY ANY LICENSE UNDER ITS P ATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
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As used herein:
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systems which, (a) are intended for surgical implant into
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failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT ST A TUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information
Preliminary
No Identification Needed
Obsolete
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
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