TVS Diode Arrays (SPA(R) Diodes) Low Capacitance ESD Protection - SP3423 SP3014 Series SP3423, 0.2pF, +20kV/-10kV Diode Array RoHS Pb GREEN Description The SP3423 integrates 2 channels of low capacitance steering diodes and and an avalanche breakdown diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). The SP3423 can safely absorb repetitive ESD strikes above the maximum contact level specified in IEC 61000-4-2 international standard (8kV contact discharge) without performance degradation. The low off-state capacitance makes it ideal for protecting high-speed signal lines such as USB2.0/3.0 and 10GbE interfaces with an extremely low dynamic resistance to protect the most sensitive, state of the art chipsets against ESD transients. Its flow-through capability makes this SP3423 TVS a PCB layout friendly component and helps reduce stray PCB capacitances. Pinout TOP VIEW Features DFN-6 (1.2x1.0x0.5mm) Functional Block Diagram * ESD, IEC 61000-4-2, 10kV contact, 15kV air * Low leakage current of 0.01A (TYP) at 5V * EFT, IEC 61000-4-4, 80A (tP=5/50ns) * Small DFN-6 footprint (1.2 mm x 1.0 mm x 0.5 mm) * Lightning, 2A (8/20 as defined in IEC 61000-4-5 2nd edition) * Low capacitance of 0.2pF (TYP) per I/O TOP VIEW * AEC-Q101 qualified * Moisture Sensitivity Level(MSL -1) * Halogen free, lead free and RoHS compliant USB 2.0/3.0 Protection Application Example USB Port *Package is shown as transparent USB Controller VBUS D+ Applications D- * LCD/PDP TVs * Digital Cameras * External Storages * Portable Medical * DVD/Blu-ray Players * Automotive Electronics * Set Top Boxes * Wearable Technology * Smartphones * USB 2.0/3.0 * Ultrabooks/Notebooks * Ethernet up to 10GbE SP1003 IC SP3423 SP3014 GND Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. (c)2018 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 09/03/18 SP3014-02UTG TVS Diode Arrays (SPA(R) Diodes) Low Capacitance ESD Protection - SP3423 SP3014 Series Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Current (tp=8/20s) 2 A TOP Operating Temperature -40 to 125 C TSTOR Storage Temperature -55 to 150 C SP3012 CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25C) Parameter Symbol Reverse Standoff Voltage Test Conditions Max Units 5.0 V 0.01 0.5 A IPP=1A, tp=8/20s, Fwd 10.4 13 V IPP=2A, tp=8/20s, Fwd 12.3 15 V VRWM IR = 1A Breakdown Voltage VBR IR = 1mA Reverse Leakage Current ILEAK VR=5V, Any I/O to GND Clamp Voltage1 VC Dynamic Resistance RDYN 2 ESD Withstand Voltage1 Typ 7 8.4 TLP, tp=100ns, I/O to GND VESD CI/O-GND Diode Capacitance Min 0.65 IEC 61000-4-2 (Contact) 10 IEC 61000-4-2 (Air) 15 kV kV 0.2 Reverse Bias=0V, f=3 GHz CI/O-I/O V pF 0.1 Note: 1 Parameter is guaranteed by design and/or component characterization. 2. Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns Clamping voltage vs. IPP for 8/20S waveshape 8/20s Pulse Waveform 14 110% Clamp Voltage (V C) 100% 90% Percent of IPP 80% 70% 60% 50% 40% 30% 12 10 8 6 4 20% 2 10% 0 0% 0.0 5.0 10.0 15.0 Time (s) (c)2018 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 09/03/18 20.0 25.0 30.0 1 1.2 1.4 1.6 1.8 2 Peak Pulse Current -IPP (A) SP3014-02UTG TVS Diode Arrays (SPA(R) Diodes) Low Capacitance ESD Protection - SP3423 SP3014 Series Positive Transmission Line Pulsing (TLP) Plot Negative Transmission Line Pulsing (TLP) Plot 40 0 35 -5 TLP Current (A) TLP Current (A) 30 25 20 15 10 -10 -15 5 0 0 5 10 15 20 25 30 35 TLP Voltage (V) IEC 61000-4-2 +8 kV Contact ESD Clamping Voltage (c)2018 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 09/03/18 -20 -14 -12 -10 -8 -6 -4 -2 0 TLP Voltage (V) IEC 61000-4-2 -8 kV Contact ESD Clamping Voltage SP3014-02UTG TVS Diode Arrays (SPA(R) Diodes) Low Capacitance ESD Protection - SP3423 SP3014 Series Soldering Parameters Pre Heat Pb - Free assembly - Temperature Min (Ts(min)) 150C - Temperature Max (Ts(max)) 200C - Time (min to max) (ts) 60 - 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3C/second max TS(max) to TL - Ramp-up Rate 3C/second max Reflow - Temperature (TL) (Liquidus) 217C - Temperature (tL) 60 - 150 seconds Peak Temperature (TP) 260+0/-5 C Time within 5C of actual peak Temperature (tp) 20 - 40 seconds Ramp-down Rate 6C/second max Time 25C to peak Temperature (TP) 8 minutes Max. Do not exceed 260C Part Numbering System TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 tS time to peak temperature Part Number Package Min. Order Qty. SP3423-02UTG DFN-6L 3000 6 Package U= DFN-6L 02 = 2 channel 5 4 TKD T= Tape & Reel Series Time Ordering Information G= Green Number of Channels Critical Zone TL to TP Ramp-up Part Marking System SP 3423 - xx x T G TVS Diode Arrays (SPA(R) Diodes) tP TP Temperature Reflow Condition 1 2 3 T : Part code K : Assembly code D : Date code Product Characteristics Lead Plating Pre-Plated Frame (DFN) Lead Material Copper Alloy Substrate Material Silicon Body Material Molded Compound Flammability UL Recognized compound meeting flammability rating V-0 (c)2018 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 09/03/18 SP3014-02UTG TVS Diode Arrays (SPA(R) Diodes) Low Capacitance ESD Protection - SP3423 SP3014 Series Package Dimensions --DFN-6L D b 4 DFN6 (1.2x1.0x0.45mm) A L2 6 1 3 Symbol 1 e Bottom View 0.25mm x6 4 0.45mm 0.55mm 1 0.40mm 0.40mm Millimeters Inches Min Nom Max Min Nom Max A 0.40 0.45 0.50 0.016 0.018 0.020 A1 0.00 0.02 0.05 0.000 0.001 0.002 0.125 REF A3 0.45mm 6 1.15mm Top View A3 L1 A1 h E JEDEC MO-229 Side View 0.005 REF b 0.15 0.20 0.25 0.006 0.008 0.010 D 1.10 1.20 1.30 0.043 0.047 0.051 E 0.90 1.00 1.10 0.035 0.039 0.043 0.40 REF e 0.016 BSC L1 0.35 0.45 0.55 0.014 0.018 0.022 L2 0.25 0.35 0.45 0.010 0.014 0.018 0.10 REF h 0.004 REF 3 1.05mm Recommended Soldering Pad Layout Drawing# : U02-A Embossed Carrier Tape & Reel Specification -- DFN-6L Symbol User Feeding Direction ,Ref. ,Ref. Inches Min Max Min Max E 1.65 1.85 0.064 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.076 0.081 D 1.40 1.60 0.055 0.063 D1 0.45 0.55 0.017 0.021 P 3.90 4.10 0.154 0.161 10P0 Pin 1 Location Millimeters 40.0+/-0.20 1.574+/-0.008 W 7.90 8.30 0.311 P0 3.90 4.10 0.154 0.319 0.161 A0 1.15 1.25 0.045 0.049 B0 1.75 1.85 0.069 0.073 K0 0.65 0.75 0.026 0.03 t 0.22 max 0.009 max ,Ref. 8mm TAPE AND REEL Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics. (c)2018 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 09/03/18 SP3014-02UTG