BM20/BM23 Bluetooth(R) 4.1 Stereo Audio Module Features: Complete, Fully Certified, Embedded 2.4 GHz Bluetooth(R) Version 4.1 Module Bluetooth Classic (BDR/EDR) Bluetooth SIG Certified Onboard embedded Bluetooth Stack Transparent UART mode for seamless serial data over UART interface Easy to configure with Windows GUI or direct by MCU Compact surface mount module: 29 x 15 x 3 2.5 mm Castellated surface mount pads for easy and reliable host PCB mounting Environmentally friendly, RoHS compliant Perfect for Portable Battery Operated Devices Internal Battery Regulator Circuitry Worldwide regulatory certifications Audio-In / Out 2 BM23 support digital audio I S format. BM20 support analog audio output. Operational: Operating voltage: 3.0V to 4.2V Temperature range: 20C to 70C Simple, UART interface Integrated crystal, internal voltage regulator, and matching circuitry Multiple I/O pins for control and status RF/Analog: Frequency: 2.402 to 2.480 GHz Receive Sensitivity: 91 dBm (/4 DQPSK) Power Output: class 2 / +4dBm max. Connection Distance: >10m (free space and no interference) Audio processor Build-in four languages (Chinese/ English/ Spanish/ French) voice prompts and 20 events for each one (This function can be set up in "IS20XXS_UI" tool.) Support SCMS-T Audio Codec 20 bit DAC and 16 bit ADC codec 98dB SNR DAC playback Peripherals Built-in Lithium-ion battery charger (up to 350mA) Integrate 3V, 1.8V configurable switching regulator and LDO Built-in ADC for battery monitor and voltage sense. A line-in port for external audio input Two LED drivers Flexible HCI interface High speed HCI-UART (Universal Asynchronous Receiver Transmitter) interface (up to 921600bps) MAC/Baseband/Higher Layer: Secure AES128 encryption Bluetooth profiles - HFP v1.6 - HSP v1.1 - A2DP v1.2 - AVRCP v1.5 - SPP v1.0 - PBAP v1.0 Antenna: Printed Antenna Compliance: Bluetooth SIG QDID Module certified for the United States (FCC) and Canada (IC), Korea (LCC), Taiwan (NCC), Japan (MIC) and China(SRRC) Support 64 kb/s A-Law or -Law PCM format, or CVSD (Continuous Variable Slope Delta Modulation) for SCO channel operation. Noise suppression Echo suppression SBC and optional AAC decoding Packet loss concealment 2015 Microchip Technology Inc. Preliminary Edition Page 1 Figure 1: General Description: Stereo module is a fully-certified Bluetooth(R) Version 4.1 (BDR/EDR) module for designers who want to add Bluetooth(R) wireless audio and voice applications to their products. This Bluetooth SIG certified module provides a complete wireless solution with Bluetooth stack, integrated antenna, and worldwide radio certifications in a compact 3 surface mount package, 29x15x2.5 mm . 2015 Microchip Technology Inc. Preliminary Edition This stereo module built-in Li-Ion charger and BM23 contain a digital audio interface. It supports HSP, HFP, SPP, A2DP, and AVRCP profiles. Both AAC and SBC codecs are supported for A2DP. Note that the customer must connect their own external analog CODEC/DSP/amplifier and MCU for audio output. Applications: Bluetooth sound bar Bluetooth stereo speaker phone Page 2 Stereo Module Table of Contents 1. DEVICE OVERVIEW .........................................................................................................6 2. APPLICATION INFORMATION .....................................................................................12 3. ELECTRICAL CHARACTERISTICS...............................................................................20 4. PRINTED ANTENNA INFORMATION ..........................................................................25 4.1. MODULE RADIATION PATTERN..............................................................................25 4.2. MODULE PLACEMENT RULE ..................................................................................26 5. REFERENCE CIRCUIT ....................................................................................................27 5.1. BM20 REFERENCE CIRCUIT ................................................................................27 5.2. BM23 REFERENCE CIRCUIT ....................................................................................28 6. MODULE OUTLINE AND REFLOW PROFILE ............................................................29 7. PACKAGING AND STORAGE INFORMATION ..........................................................34 APPENDIX A: CERTIFICATION NOTICES ..........................................................................36 A.1 REGULATORY APPROVAL .......................................................................................36 A.2 United States .................................................................................................................36 A.2.1 LABELING AND USER INFORMATION REQUIREMENTS .............................37 A.2.2 RF EXPOSURE .............................................................................................................38 A.2.3 HELPFUL WEB SITES ...................................................................................................38 A.3 Canada ...........................................................................................................................39 A.3.1 LABELING AND USER INFORMATION REQUIREMENTS .............................................39 A.3.2 RF EXPOSURE.............................................................................................................40 A.3.3 WEB SITES .................................................................................................................40 A.4 Europe ............................................................................................................................40 A.4.1 ABELING AND USER INFORMATION REQUIREMENTS ...............................41 A.4.2 ANTENNA REQUIREMENTS ...............................................................................41 A.4.3 HELPFUL WEB SITES ...........................................................................................42 A.5 Japan ..............................................................................................................................43 A.5.1 LABELING AND USER INFORMATION REQUIREMENTS .............................43 A.5.2 HELPFUL WEB SITES ...........................................................................................44 A.6 Korea ..............................................................................................................................44 A.6.1 LABELING AND USER INFORMATION REQUIREMENTS .............................44 A.6.2 HELPFUL WEB SITES ...........................................................................................44 A.7 Taiwan ............................................................................................................................45 A.7.1 LABELING AND USER INFORMATION REQUIREMENTS .............................45 A.7.2 HELPFUL WEB SITES ...........................................................................................45 2015 Microchip Technology Inc. Preliminary Edition Page 3 Stereo Module A.8 China .............................................................................................................................46 A.8.1 LABELING AND USER INFORMATION REQUIREMENTS .............................46 A.9 Other Regulatory Jurisdictions ..................................................................................46 2015 Microchip Technology Inc. Preliminary Edition Page 4 Stereo Module TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: * Microchip's Worldwide Web site; http://www.microchip.com * Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. Abbreviations List: HFP: Hands-free Profile AVRCP: Audio Video Remote Control Profile A2DP: Advanced Audio Distribution Profile PBAP: Phone Book Access Profile HSP: Headset Profile SPP: Serial Port Profile 2015 Microchip Technology Inc. Preliminary Edition Page 5 Stereo Module 1. DEVICE OVERVIEW The stereo module series include BM20 and BM23. The chip integrates Bluetooth 4.1 radio transceiver, PMU and DSP. Figure 1-1and 1-2 shows the application block diagram. FIGURE 11: BM20 Typical Application The following depicts an example of BM20 module operate as an independent system or connected to an MCU. Audio Output IS2020S 16M Hz Crystal Microphone I2C Aux_In EEPROM IC UART BM20 MCU Option FIGURE 12: BM23 Typical Application The following depicts an example of BM23 module connected to an MCU, external DSP/CODEC. IS2023S 16M Hz Crystal I2S DSP UART MCU Microphone I2C Aux_In EEPROM IC BM23 2015 Microchip Technology Inc. Preliminary Edition Page 6 Stereo Module 1.1. INTERFACE DESCRIPTION BM20 pin diagram is shown in Figure 1-3. The pin descriptions are shown in Table 1-1 FIGURE 1-3: BM20 PIN DIAGRAM TABLE 11: BM20 PIN DESCRIPTION Pin No. Pin type Name 1 I/O P0_0 2 I EAN 3 I P3_0 4 I P2_0 5 I/O P1_5 6 I/O P0_4 7 8 O O SPKR AOHPM 2015 Microchip Technology Inc. Description IO pin, default pull-high input (Note 1) 1. Slide Switch Detector, active low. 2. UART TX_IND, active low. Embedded ROM/External Flash enable H: Embedded; L: External Flash IO pin, default pull-high input (Note 1) Line-in Detector (default), active low. IO pin, default pull-high input System Configuration, H: Application L: Baseband(IBDK Mode) IO pin, default pull-high input (Note 1) 1. NFC detection pin, active low. 2. Out_Ind_0 3. Slide Switch Detector, active low. 4. Buzzer Signal Output IO pin, default pull-high input. (Note 1) 1. NFC detection pin, active low. 2. Out_Ind_0 R-channel analog headphone output Headphone common mode output/sense input. Preliminary Edition Page 7 Stereo Module Pin No. Pin type Name 9 O SPKL L-channel analog headphone output 10 P VDDA Positive power supply/reference voltage for CODEC, no need to add power to this pin. 11 I MIC1_P Mic 1 mono differential analog positive input 12 I MIC1_N Mic 1 mono differential analog negative input 13 P MIC_BIAS 14 I AIR R-channel single-ended analog inputs 15 I AIL L-channel single-ended analog inputs 16 I RST System Reset Pin, Low: reset 17 P VCC_RF 18 I/O P0_1 19 P VDD_IO Power output , no need to add power to this pin 20 P ADAP_IN 5V Power adaptor input 21 P BAT_IN 22 - NC 23 P GND 24 P SYS_PWR System Power Output BAT mode: 3.0~4.2V Adapter mode: 4.0V 25 P BK_OUT 1.8V buck output, no need to add power to this pin 26 I MFB 1. Power key when in off mode 2. UART_RX_IND: MCU use to wakeup BT (Note 1) 27 I LED1 LED Driver 1 28 I LED2 LED Driver 2 29 I P2_4 30 I P0_2 31 I/O P0_3 32 O HCI_TXD HCI-UART TX data 33 I HCI_RXD HCI-UART RX data 34 I P0_5 35 I P2_7 2015 Microchip Technology Inc. Description Electric microphone biasing voltage 1.28V RF LDO output, no need to add power to this pin. IO pin, default pull-high input (Note 1) 1. FWD key when class 2 RF (default), active low. 2. Class1 TX Control signal of external RF T/R switch, active high. 3.0V~4.2V Li-Ion battery input No Connection Ground Pin IO pin, default pull-high input System Configuration, L: Boot Mode with P2_0 low combination IO pin, default pull-high input (Note 1) Play/Pause key (default), active low. IO pin, default pull-high input (Note 1) 1. REV key (default), active low. 2. Buzzer Signal Output 3. Out_Ind_1 4. Class1 RX Control signal of external RF T/R switch, active high. IO pin, default pull-high input (Note 1) Volume down (default), active low. IO pin, default pull-high input (Note 1) Volume up key (default), active low. Preliminary Edition Page 8 Stereo Module Pin No. Pin type Name Description 36 I P2_4 IO pin, default pull-high input System Configuration, L: Boot Mode with P2_0 low combination 37 P GND Ground Pin 38 - NC No Connection 39 - NC No Connection 40 - NC No Connection * I: signal input pin * O: signal output pin * I/O: signal input/output pin * P: power pin Note 1: These button or functions can be setup by "IS20XXS_UI" tool. 2015 Microchip Technology Inc. Preliminary Edition Page 9 Stereo Module BM23 pin diagram is shown in Figure 1-4. The pin descriptions are shown in Table 1-2 FIGURE 1-4: BM23 PIN DIAGRAM TABLE 12: BM23 PIN DESCRIPTION Pin No. Pin Type Name 1 I/O P0_0 2 3 4 5 6 7 I/O I/O I/O I O I/O RFS0 TFS0 SLK0 DR0 DT0 P0_4 8 I EAN 9 I MIC1_P 10 11 12 13 14 I P P I I MIC1_N MIC_BIAS VDDA AIR AIL 2015 Microchip Technology Inc. Description IO pin, default pull-high input (Note 1) UART TX_IND 2 I S interface: DAC Left/Right Clock 2 I S interface: ADC Left/Right Clock 2 I S interface: Bit Clock 2 I S interface: DAC Digital Left/Right Data 2 I S interface: ADC Digital Left/Right Data IO pin, default pull-high input Embedded ROM/External Flash enable High: ROM mode; Low: External Flash mode Mic 1 mono differential analog positive input Mic 1 mono differential analog negative input Power output, microphone biasing voltage Power output, reserve for external cap to fine tune audio frequency response, no need to R-channel add power to this pin Stereo analog line in, Stereo analog line in, L-channel Preliminary Edition Page 10 Stereo Module Pin No. I/O Name Description 15 P GND 16 I RST_N 17 -- NC -- 18 -- NC -- 19 P VDDIO 20 I/O P1_5 IO pin, default pull-high input 21 I/O P0_1 IO pin, default pull-high input 22 P ADAP_IN 23 P BAT_IN 24 -- NC 25 P SYS_PWR System Power Output BAT mode: 3.3~4.2V Adapter mode: 4.0V 26 P BK_OUT Power output, 1v8 pin, no need to add power to this pin 27 P MFB 1. 2. 28 P LED1 LED Driver 1, 4mA max 29 P LED2 LED Driver 2, 4mA max 30 I P2_4 IO pin, default pull-high input System Configuration, L: Boot Mode with P2_0 low combination 31 I/O P0_2 IO pin, default pull-high input 32 I/O P0_3 IO pin, default pull-high input 33 O HCI_TXD HCI-UART TX data 34 I HCI_RXD HCI-UART RX data 35 I/O P0_5 IO pin, default pull-high input 36 I/O P2_7 IO pin, default pull-high input 37 I/O P2_0 IO pin, default pull-high input 38 I/O P3_0 IO pin, default pull-high input Ground System Reset Pin, active when rising edge. Power output, VDDIO pin, no need to add power to this pin 5V power adaptor input 3.3~4.2V Li-ion battery input -- Power key when in off mode UART_RX_IND: MCU use to wakeup BT 39 I P2_0 IO pin, default pull-high input System Configuration, H: Application L: Baseband(IBDK Mode) 40 P GND Ground. 41 -- NC -- 42 -- NC -- 43 -- NC -- * I: signal input pin * O: signal output pin * I/O: signal input/output pin * P: power pin Note 1: These button or functions can be setup by "IS20XXS_UI" tool. 2015 Microchip Technology Inc. Preliminary Edition Page 11 Stereo Module 2. APPLICATION INFORMATION 2.1. OPERATION WITH EXTERNAL MCU Stereo module support UART command set to make an external MCU to control module. Here is the connection interface between BMXX and MCU. FIGURE 2-1: INTERFACE BETWEEN MCU AND BMXX MODULE MCU_ WAKEUP UART_RX MCU UART_TX P0_0 UART interface UART interface BT_ WAKEUP HCI_TXD BMXX HCI_RXD MFB MCU can control module by UART interface and wakeup module by PWR pin. Stereo module provide wakeup MCU function by connect to P0_0 pin of module. "UART Command Set" document provide all function which module support and UI tool will help you to set up your system support UART command. For more detail description, please reference "UART_CommandSet_v154" document and "IS20XXS_UI" tool. 2015 Microchip Technology Inc. Preliminary Edition Page 12 Stereo Module Here are some suggestions of UART control signal timing sequence: FIGURE 2-2: POWER ON/OFF SEQUENCE 2015 Microchip Technology Inc. Preliminary Edition Page 13 Stereo Module FIGURE 2-3: TIMING SEQUENCE OF RX INDICATION AFTER POWER ON FIGURE 2-4: TIMING SEQUENCE OF POWER OFF 2015 Microchip Technology Inc. Preliminary Edition Page 14 Stereo Module FIGURE 2-5: TIMING SEQUENCE OF POWER ON (NACK) FIGURE 2-6: RESET TIMING SEQUENCE IF MODULE HANGS UP 2015 Microchip Technology Inc. Preliminary Edition Page 15 Stereo Module FIGURE 2-7: TIMING SEQUENCE OF POWER DROP PROTECTION Power BAT_IN +4V 2.9V ~ RST_N from Reset IC If BT's BAT use adaptor translates voltage by LDO, we recommend use "Reset IC" to avoid power off suddenly. Rest IC spec output pin must be "Open Drain"delay time 10ms Recommend part: TCM809SVNB713 or G691L263T73 2015 Microchip Technology Inc. Preliminary Edition Page 16 Stereo Module 2.2. I2S Signal Application for BM23 2 BM23 support I S digital audio signal interface to connect your external CODEC/DSP. It provide 8k 2 Hz, 44.1k Hz and 48k Hz sampling rate; it also support 16 bits and 24bits data format. The I S setting can be set up by UI and DSP tools. . The external CODEC/DSP needs to be connected to SLK0, RFS0, TFS0, DR0, and DT0 (pins 4, 2, 3, 2 5, and 6 respectively). The I S signal connection between BM23 and external DSP as below: FIGURE 2-9: MASTER MODE REFERENCE CONNECTION BCLK SCLK0 RFS0 DACLRC EXTERNAL DSP/CODEC TFS0 ADCDAT DR0 DACDAT DT0 BM23 FIGURE 2-10: SLAVE MODE REFERENCE CONNECTION BCLK SCLK0 RFS0 DACLRC (*1) EXTERNAL DSP/CODEC ADCDAT (*2) DACDAT TFS0 BM23 DR0 DT0 Note 1: For 002 version chip or module, system should connect line 1 in slave mode figure. And, system not support ADC signal from external DSP/CODEC. Note 2: For other version chip or module, system should connect line 2 in slave mode figure. About "Mast" or "Slave" mode setting, you can use "DSP Configuration Tool" to set up system. 2015 Microchip Technology Inc. Preliminary Edition Page 17 Stereo Module The clock and data timing as below: 2 FIGURE 2-11: TIMING FOR I S MODES (both master and slave) 1/fs SCLKn Left Channel RFSn/TFSn DRn/DTn Bn-1 Bn-2 Right Channel B1 B0 Bn-1 Bn-2 B1 B0 Word Length FIGURE 2-12: TIMING FOR PCM MODES (both master and slave) 1/fs SCLK0 RFS0/TFS0 Left Channel DR0/DT0 Right Channel B1 B0 Bn-1 Bn-2 Bn-1 Bn-2 B1 B0 Word Length 2.3. RESET (RST_N) RST is module reset pin which is active LOW. To reset the module, the RST_N must hold LOW for at least 63ns. 2.4. STATUS LED (LED1, LED2) The status LED provide below status indication: Standby Inquiry Link Link Back Low Battery Page Battery Charging Each status indication LED flashing sequence and brightness is configurable by UI tool. 2015 Microchip Technology Inc. Preliminary Edition Page 18 Stereo Module 2.5. EXTERNAL CONFIGURATION Stereo module can be configured and firmware programmed using an external configuration and programming tool available from Microchip. Figure 27 shows the configuration and firmware programming interface on BM23. It is recommended to include a pin header on the main PCB for development. Configuration and firmware programming modes are entered accordingly to the system configuration I/O pins as shown in Table 2-1. Pin P20, P24 and EAN pin have internal pullup. FIGURE 2-13: EXTERNAL PROGRAMMING HEADER CONNECTIONS (Here is the interface connect example of the BM23) TABLE 2-1: SYSTEM CONFIGURATION SETTINGS P20 P24 EAN Operational Mode High High High APP mode (Normal operation) High Low High Test mode (Write EEPROM) Low Low High Write Flash (Firmware programming if flash build-in in chip) 2015 Microchip Technology Inc. Preliminary Edition Page 19 Stereo Module 3. ELECTRICAL CHARACTERISTICS Table 3-1: ABSOLUTE MAXIMUM SPECIFICATION Symbol BAT_IN ADAP_IN TSTORE TOPERATION Parameter Input voltage for battery Input voltage for adaptor Storage temperature Operation temperature Min 0 0 -65 -20 Max 4.3 7.0 +150 +70 Unit V V C C Table 3-2: RECOMMENDED OPERATING CONDITION Symbol BAT_IN ADAP_IN TOPERATION Parameter Input voltage for battery Input voltage for adaptor Operation temperature Min 3 4.5 -20 Typical 3.7 5 +25 Max 4.2 5.5 +70 Unit V V C Note: Absolute and Recommended operating condition tables reflect typical usage for device. TABLE 3-3: I/O AND RESET LEVEL Parameter I/O Supply Voltage (VDD_IO) I/O Voltage Levels VIL input logic levels low VIH input logic levels high VOL output logic levels low VOH output logic levels high RESET VTH,RES threshold voltage Min. 2.7 Typ. 3.0 0.3 2.0 Max. 3.3 Units V 0.8 3.6 0.4 V V V V 2.4 1.6 V Note: (1) VDD_IO voltage is programmable by EEPROM parameters. (2) These parameters are characterized but not tested in manufacturing. 2015 Microchip Technology Inc. Preliminary Edition Page 20 Stereo Module Table 3-4: BATTERY CHARGER Parameter Min Typical Max Unit ADAP_IN Input Voltage 4.5 5.0 5.5 V 3 4.5 mA 170 200 240 mA 160 180 240 mA 330 350 420 mA 180 220 270 mA Supply current to charger only Maximum Battery Fast Charge Current Note: ENX2=0 Maximum Battery Fast Charge Current Note: ENX2=1 Headroom > 0.7V (ADAP_IN=5V) Headroom = 0.3V (ADAP_IN=4.5V) Headroom > 0.7V (ADAP_IN=5V) Headroom = 0.3V (ADAP_IN=4.5V) Trickle Charge Voltage Threshold 3 V Battery Charge Termination Current, (% of Fast Charge Current) 10 % Note: (1) Headroom = VADAP_IN - VBAT (2) ENX2 is not allowed to be enabled when VADAP_IN - VBAT > 2V (3) These parameters are characterized but not tested in manufacturing. Table 3-5: LED DRIVER Parameter Open-drain Voltage Programmable Current Range Intensity Control Current Step Power Down Open-drain Current Shutdown Current Min Typical 0 Max Unit 3.6 5.25 V mA step mA A A 16 0.35 1 1 Note: (1) Test condition: SAR_VDD=1.8V, temperature=25 C. (2) These parameters are characterized but not tested in manufacturing. 2015 Microchip Technology Inc. Preliminary Edition Page 21 Stereo Module Table 3-6: AUDIO CODEC ANALOGUE TO DIGITAL CONVERTER T= 25oC, Vdd=3.0V, 1KHz sine wave input, Bandwidth = 20Hz~20KHz Parameter (Condition) Min. Resolution Output Sample Rate Signal to Noise Ratio Note: 1 (SNR @MIC or Line-in mode) Digital Gain Digital Gain Resolution Typ. 8 Max. Unit 16 48 Bits KHz 88 -54 MIC Boost Gain dB 2~6 4.85 dB dB 20 dB Analog Gain 60 Analog Gain Resolution 2.0 Input full-scale at maximum gain (differential) 4 Input full-scale at minimum gain (differential) 800 3dB bandwidth Microphone mode (input impedance) THD+N (microphone input) @30mVrms input 20 24 0.02 dB dB mV rms mV rms KHz K % Note: (1) fin=1KHz, B/W=20~20KHz, A-weighted, THD+N < 1%, 150mVpp input (2) These parameters are characterized but not tested in manufacturing. 2015 Microchip Technology Inc. Preliminary Edition Page 22 Stereo Module Table 3-7: AUDIO CODEC DIGITAL TO ANALOGUE CONVERTER T= 25oC, Vdd=3.0V, 1KHz sine wave input, Bandwidth = 20Hz~20KHz Parameter (Condition) Min. Over-sampling rate Resolution Output Sample Rate Signal to Noise Ratio Note: 1 (SNR @cap-less mode) for 48kHz Signal to Noise Ratio Note: 1 (SNR @single-end mode) for 48kHz Digital Gain Typ. Max. Unit 20 48 fs Bits KHz 128 16 8 96 dB 98 dB -54 Digital Gain Resolution 4.85 dB 2~6 Analog Gain dB -28 Analog Gain Resolution 3 dB 1 dB Output Voltage Full-scale Swing (AVDD=2.8V) Note:3 742.5 mV rms Maximum Output Power (16 load) 34.5 mW Maximum Output Power (32 load) 17.2 mW Allowed Load Resistive Capacitive 8 16 THD+N (16 load) Signal to Noise Ratio (SNR @ 16load) O.C. 500 pF 0.05 % 96 dB Note: (1) fin=1KHz, B/W=20~20KHz, A-weighted, THD+N < 0.01%, 0dBFS signal, Load=100K (2) These parameters are characterized but not tested in manufacturing. (3) Vdd, AVDD are generated by internal LDO Table 3-8: TRANSMITTER SECTION FOR BDR AND EDR Parameter Maximum RF transmit power(BM20) Maximum RF transmit power(BM23) EDR/BDR Relative transmit power Min Typ Max 2 -4 -1.2 Bluetooth specification Unit -6 to 4 dBm -6 to 4 1 -4 to 1 dB Note: The RF Transmit power is calibrated during production using MP Tool software and MT8852 Bluetooth Test equipment. Test condition: VCC_RF= 1.28V, temperature=25 C. 2015 Microchip Technology Inc. Preliminary Edition Page 23 Stereo Module Table 3-9: RECEIVER SECTION FOR BDR AND EDR Modulation Sensitivity at 0.1% BER Sensitivity at 0.01% BER Min Typ Max Bluetooth specification Unit GFSK -90 -70 dBm /4 DQPSK -91 -70 dBm 8DPSK -82 -70 dBm Note: (1) Test condition: VCC_RF= 1.28V, temperature=25 C. (2) These parameters are characterized but not tested in manufacturing. Table 3-10: SYSTEM CURRENT CONSUMPTION OF ANALOG AUDIO OUTPUT System Status System Off Mode Typ. Max. Unit 2 5 uA Standby Mode 0.8 mA Linked Mode 0.4 mA SCO Link 7.8 mA A2DP Link (V p-p=200mV; 1k tone signal) 10.7 mA Note: Use BM20 EVB as test platform. Test condition: BAT_IN= 3.8V, link with HTC EYE cell phone; distance between cell phone and EVB: 30cm. 2 Table 3-11: SYSTEM CURRENT CONSUMPTION OF DIGITAL AUDIO OUTPUT(I S) System Status System Off Mode Typ. Max. Unit 2 5 uA Standby Mode 0.4 mA Linked Mode 0.4 mA SCO Link 9.3 mA 11.7 mA A2DP Link (1k tone signal) Note: Use BM23 EVB as test platform Test condition: BAT_IN= 3.8V, link with HTC M8 cell phone; distance between cell phone and EVB: 30cm; 2 I S signal link with YAMAHA YDA174 EVB 2015 Microchip Technology Inc. Preliminary Edition Page 24 Stereo Module 4. PRINTED ANTENNA INFORMATION 4.1. MODULE RADIATION PATTERN The stereo module contains a PCB printed antenna. The PCB printed antenna radiation pattern is shown in Figure 4-2. FIGURE 4-1: ANTENNA KEEP OUT AREA EXAMPLES FIGURE 4-2: ANTENNA 3D RADIATION PATTERN @2441 MHz 2015 Microchip Technology Inc. Preliminary Edition Page 25 Stereo Module 4.2. MODULE PLACEMENT RULE On the main PCB, the areas under the antenna should not contain any top, inner layer, or bottom copper as shown in Figure 41. A lowimpedance ground plane will ensure the best radio performance (best range, lowest noise). The ground plane can be extended beyond the minimum recommended as need for the main PCB EMC noise reduction. For the best range performance, keep all external metal away from the ceramic chip antenna at least 15 mm. Here are some examples of good and poor placement on a carrier board with GND plane. FIGURE 4-3: MODULE PLACEMENT EXAMPLES Poor Case Good Case Acceptable Case Worse Case System GND Plane FIGURE 4-4: GND PLANE ON MAIN APPLICATION BOARD 2015 Microchip Technology Inc. Preliminary Edition Page 26 VBUS DD+ ID GND 3 5 4 2 1 3 1 4 2 10 1 1 P3_0 C15 0.1u/16V AOHPM 2 1 1 R7 0 R6 0 MIC_N1 MIC_P1 1 C13 2.2u/6.3V SPKR SPKL JP5 JP 1x2 1 2 2 2 2 R75 1K Li Battery Connector LINE_R LINE_L R4 2K C14 1u/16V C10 1u/16V 2 C93 NP-0603 R3 1K P3 USBM3121-051-1-BN-R 1 5V 2 3 4 C18 5 10u/16V TSH-3865D P2 P1 PJ-2001-5K 3 5 4 2 1 AIR AIL C19 10u/16V BAT_IN R8 NP-0603 C17 1u/16V C16 1u/16V R5 NP-0603 MIC_BIAS C72 2.2u/6.3V C9 1u/16V MFB 3 JP6 JP 1x1 1 1 C26 1u/10V LED-HR 2 LED2 Q3 STS2301 2 LED-B 2 LED1 1 2 3 4 5 6 7 8 9 10 MIC_P1 11 MIC_N1 12 MIC_BIAS13 14 AIR P0_0 EAN P3_0 P2_0 AMP_EN NFC SPKR AOHPM SPKL 2 P0_0 EAN P3_0 P2_0 P1_5 P0_4 SPKR AOHPM SPKL VDDA MIC1_P MIC1_N MIC_BIAS AIR ANT1 ANT2 ANT3 R12 100K R10 100K LED2 1 LED1 1 AIL RST_N P7 PJ-2001-5K LINE INPUT MIC1 7 8 6 9 P0_1 1 38 39 40 37 36 35 34 33 32 31 30 29 28 27 26 25 24 1 STS2306 Q4 SLIDE_SW 1 2 SYS_PWR P2_4 P2_7 P0_5 HCI_RXD HCI_TXD P0_3 P0_2 P2_4 LED2 LED1 MFB 3 1 2 VDD_IO SYS_PWR P0_0 2 R13 10K SW8 SW-1BIT Slide Switch Circuit SYS_PWR GND P2_4 P2_7 P0_5 HCI_RXD HCI_TXD P0_3 P0_2 P2_4 LED2 LED1 MFB BK_OUT SYS_PWR ON 2 1 AIL RST VCC_RF P0_1 VDD_IO ADAP_IN BAT_IN NC GND 15 16 17 18 19 20 21 22 23 UART_RXD UART_TXD RESET_n Audio AMP Enable MFB/RX_IND TX_IND HCI_RXD HCI_TXD RST_N AMP_EN MFB P0_0 UART CONTROL (by MCU) SW-TACT 1 2 C11 15p/50V 1 2 3 4 5 6 7 8 JP2 SW5 FWD 1 3 1 3 C12 15p/50V P2_7 C8 15p/50V P0_1 MMBT3904 Q1 DP1 DP-4 RST_N Thursday , April 16, 2015 Date: Sheet 1 of Hsinchu City 30078, Taiwan TEL. 886-3-5778385 MAIN CIRCUIT Title JP3 JP 1x8 1 2 3 4 5 6 7 8 1 Rev 1.1 P/N XXXX 5F, No.5, Industry E. Rd. VII, Hsinchu Science Park, P2_4 HCI_RXD HCI_TXD EAN BM20 Reference Circuit 5V BAT_IN P2_0 RESERVE For BLUETOOTH DEBUG SW-TACT SW7 Size B Board Name JP 1x8 2 4 2 4 VOL+ 3 SW6 4 R2 2K 1 Backup Plug-In Reset Circuit SW-TACT P0_5 C7 15p/50V P0_3 C4 15p/50V P0_2 5V C3 1u/16V 4 3 SW2 SW-TACT 2 1 VOL- 1 2 R1 1K/1% MFB SYS_PWR SW-TACT 3 4 SW4 REV 1 2 SW-TACT 3 4 SW3 PLAY/PAUSE 2 SW1 SW-TACT 4 1 RESET BUTTON 2 3 1 3 1 2 MFB 1 2 C92 NP-0603 D Stereo Jack G Preliminary Edition S 2015 Microchip Technology Inc. VDD_IO 5V BAT_IN 2 PCB1 BM20 Stereo Module 5. REFERENCE CIRCUIT 5.1. BM20 REFERENCE CIRCUIT Page 27 LED2 2 RED 1 LED1 2 TP4 TP-4 RST_N BLUE MIC_BIAS P2 DC-JACK 3 2 1 C20 0.1u/16V C18 1u/16V ADAP_IN DC POWER SOURCE C7 4.7u/10V C5 10u/16V MIC_BIAS CODEC_VO P0_0 RFS0 TFS0 SLK0 DR0 DT0 P0_4 EAN MIC1_P MIC1_N MIC_BIAS VDDA AIR AIL GND LED2 LED-HR 1 LED1 LED-B 1 LED TP2 TP-4 BAT_IN ADAP_IN SYS_PWR P2_4 LED2 LED1 MFB HCI_RXD HCI_TXD P2_0 P3_0 C13 0.1u/16V SYS_PWR 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 4 JP4 SJP 1x2 3 C16 0.1u/16V C17 1u/16V BAT_IN BATTERY CONNECTOR GND P2_0 P3_0 P2_0 P2_7 P0_5 HCI_RXD HCI_TXD P0_3 P0_2 P2_4 LED2 LED1 MFB BK_OUT RST NC NC VDD_IO P1_5 P0_1 ADAP_IN BAT_IN AMB_DET SYS_PWR 16 17 18 19 20 21 22 23 24 25 1 P0_0 2 RFS0 3 TFS0 4 SLK0 5 DR0 6 DT0 7 P0_4 8 EAN MIC_P1 9 10 MIC_N1 11 12 13 AIR 14 AIL 15 1 PCB1 FP-BM23 2 1 1 D2 SPE0572 P1 PJ-3894D-S125 4 2 1 3 R8 1 2K 2 C1 2.2u/6.3V R6 1K 1 2 1 2 C3 P3_0 C11 0.1u/16V SPE0572 D3 SPE0572 D1 1 1 R11 1K R10 1K 2 2 JP1 JP 1x8 1 2 3 4 5 6 7 8 R12 10K R9 10K C10 10u/16V C12 470p/50V C8 470p/50V C9 10u/16V 0.047u/25V MIC_N1 0.047u/25V MIC_P1 MIC_BIAS C2 2.2u/6.3V 2 2 2 2 2 33 33 33 33 33 C4 220p/50V C6 R7 1K RFS0 1 TFS0 1 SLK0 1 DR0 1 DT0 1 R2 R3 R1 R5 R4 STEREO AUX LINE INPUT *P30 Low Active Line In Detect TP3 TP-4 TP1 TP-4 MIC INPUT Receive frame synchronization Transmit frame synchronization Serial clock Serial data receive Serial data transmit 2 1 2 1 2 1 1 2 1 Preliminary Edition 2 2015 Microchip Technology Inc. 1 I2S INTERFACE 1 2 DP1 DP-4 HCI_RXD HCI_TXD RST_N AMP_EN MFB P0_0 BAT_IN P2_4 System Configuration Sheet 2 Reference Circuit of BM23 Friday , March 13, 2015 Date: of Hsinchu City 30078, Taiwan TEL. 886-3-5778385 Reference Circuit of BM23 Title Size B JP2 JP 1x8 1 2 3 4 5 6 7 8 2 Rev 1.0 P/N XXXX 5F, No.5, Industry E. Rd. VII, Hsinchu Science Park, EAN System Configuration MFB PWR/MFB/UART_RX_IND P3_0 LINE IN Detection P2_0 System Configuration AIL P0_4 Audio AMP Enable(ROM) AIR Board Name JP3 JP 1x8 1 2 3 4 5 6 7 8 GPIO Description P2_4 HCI_RXD HCI_TXD EAN P0_0 UART_TX_IND(Flash) ADAP_IN P2_0 RESERVE For BLUETOOTH DEBUG P0_4 UART_RXD UART_TXD RESET_n Audio AMP Enable MFB/RX_IND TX_IND UART CONTROL (by MCU) Stereo Module 5.2. BM23 REFERENCE CIRCUIT Page 28 Stereo Module 6. MODULE OUTLINE AND REFLOW PROFILE 6.1. MODULE DIMENSION AND PCB FOOT PRINT FIGURE 6-1: BM20 Outline Dimension PCB dimension: X : 15.0 mm Y : 29.0 mm Tolerances: 0.25 mm 2015 Microchip Technology Inc. Preliminary Edition Page 29 Stereo Module FIGURE 6-2: BM23 Outline Dimension PCB dimension: X : 15.0 mm Y : 29.0 mm Tolerances: 0.25 mm 2015 Microchip Technology Inc. Preliminary Edition Page 30 Stereo Module FIGURE 6-3: BM20 PCB FOOT PRINT Note: The "Keep Out Area" is reserved for RF performance check. 2015 Microchip Technology Inc. Preliminary Edition Page 31 Stereo Module FIGURE 6-4: BM23 PCB FOOT PRINT Note: The "Keep Out Area" is reserved for RF performance check. 2015 Microchip Technology Inc. Preliminary Edition Page 32 Stereo Module 6.2 REFLOW PROFILE FIGURE 6-5: REFLOW PROFILE peak: 260 +5/-0 Slope: 1~2/sec max. (217 to peak) Ramp down rate : Max. 3/sec. 217 Preheat: 150~200 20~40 sec. 60 ~ 180 sec. 60 ~150sec Time (sec) 25 Soldering Recommendations Stereo module was assembled using standard leadfree reflow profile IPC/JEDEC JSTD020. The module can be soldered to the main PCB using standard leaded and leadfree solder reflow profiles. To avoid damaging of the module, the recommendations are listed as follows: * * * * * * Refer to Microchip Technology Application Note AN233 Solder Reflow Recommendation (DS00233) for the soldering reflow recommendations Do not exceed peak temperature (TP) of 250 degree C Refer to the solder paste data sheet for specific reflow profile recommendations Use noclean flux solder paste Do not wash as moisture can be trapped under the shield Use only one flow. If the PCB requires multiple flows, apply the module on the final flow. 2015 Microchip Technology Inc. Preliminary Edition Page 33 Stereo Module 7. PACKAGING AND STORAGE INFORMATION The module is packaged into trays (see following page) of sixty three (63) modules in a 7 x 9 format. These trays are then sealed into bags. Ten sealed bags are then placed in a box of 630 pieces with a 3 dimension of 36 * 16 * 9.5 cm . The shelf life of each module in a sealed bag is 12 months at <40C and <90% relative humidity. After a bag is opened, devices that will be subjected to reflow solder or other high temperature processes must be mounted within 168 hours (7 days) at factory conditions of <30C and <60% relative humidity. 7.1. ORDERING INFORMATION 2015 Microchip Technology Inc. Preliminary Edition Page 34 Stereo Module TABLE 7-1: Module Ordering Information Part Number Description BM20SPKS1NBC Bluetooth 4.1 BDR/EDR, Class 2 Surface Mount module with integrated antenna and shield BM23SPKS1NB9 Bluetooth 4.1 BDR/EDR, Class 2 Surface Mount module with integrated antenna and shield Note: The module can only be purchased through a Microchip representative. Go to http://www.microchip.com/ for current pricing and a list of distributors carrying Microchip products. 2015 Microchip Technology Inc. Preliminary Edition Page 35 Stereo Module APPENDIX A: CERTIFICATION NOTICES BM20 module (BM20SPKS1NBC) has received the regulatory approval for the following: BT SIG/QDID: 58996 United States: FCC ID: A8TBM20SPKXYNBZ Canada o IC ID: 12246A-BM20SPKS1 o HVIN: BM20SPKS1 Europe/CE Japan/MIC: 202-SMD048 Korea/KCC: MSIP-CRM-mcp-BM20SPKS1NBC Taiwan/NCC No.: CCAN15LP0460T2 China/SRRC: CMIIT ID: 2015DJ7134 BM23 module (BM23SPKS1NB9) has received the regulatory approval for the following: BT SIG/QDID: 58996 United States/ FCC ID: A8TBM23SPKXYC2A Canada o IC ID: 12246A-BM23SPKXYC2 o HVIN: BM23SPKXY Europe/CE Japan/MIC: 202-SMC067 Korea/KCC: MSIP-CRM-S9S-BM23SPKXY Taiwan o NCC No.: CCAL15LP0270T3 o M/N: BM23SPK China/SRRC: CMIIT ID: 2016DJ3553 A.1 REGULATORY APPROVAL This section outlines the regulatory information for the BM20/BM23 module for the following countries: United States Canada Europe Japan Korea Taiwan China Other Regulatory Jurisdictions A.2 United States The BM20/BM23 module has received Federal Communications Commission (FCC) CFR47 Telecommunications, Part 15 Subpart C "Intentional Radiators" modular approval in accordance with Part 15.212 Modular Transmitter approval. Modular approval allows the end user to integrate the BM20/BM23 module into a finished product without obtaining subsequent and separate FCC approvals for intentional radiation, provided no changes or modifications are made to the module circuitry. Changes or modifications could void the user's authority to operate the equipment. The end user must comply with all of the 2015 Microchip Technology Inc. Preliminary Edition Page 36 Stereo Module instructions provided by the Grantee, which indicate installation and/or operating conditions necessary for compliance. The finished product is required to comply with all applicable FCC equipment authorizations regulations, requirements and equipment functions not associated with the transmitter module portion. For example, compliance must be demonstrated to regulations for other transmitter components within the host product; to requirements for unintentional radiators (Part 15 Subpart B "Unintentional Radiators"), such as digital devices, computer peripherals, radio receivers, etc.; and to additional authorization requirements for the non transmitter functions on the transmitter module (i.e., Verification, or Declaration of Conformity) (e.g., transmitter modules may also contain digital logic functions) as appropriate. A.2.1 LABELING AND USER INFORMATION REQUIREMENTS The BM20/BM23 module has been labeled with its own FCC ID number, and if the FCC ID is not visible when the module is installed inside another device, then the outside of the finished product into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording as follows: For BM20 Module: Contains Transmitter Module FCC ID: A8TBM20SPKXYNBZ or Contains FCC ID: A8TBM20SPKXYNBZ This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation For BM23 Module: Contains Transmitter Module FCC ID: A8TBM23SPKXYC2A or Contains FCC ID: A8TBM23SPKXYC2A This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation A user's manual for the finished product should include the following statement: 2015 Microchip Technology Inc. Preliminary Edition Page 37 Stereo Module This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: * Reorient or relocate the receiving antenna. * Increase the separation between the equipment and receiver. * Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. * Consult the dealer or an experienced radio/TV technician for help. Additional information on labeling and user information requirements for Part 15 devices can be found in KDB Publication 784748 available at the FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB) http://apps.fcc.gov/oetcf/kdb/index.cfm. A.2.2 RF EXPOSURE All transmitters regulated by FCC must comply with RF exposure requirements. KDB 447498 General RF Exposure Guidance provides guidance in determining whether proposed or existing transmitting facilities, operations or devices comply with limits for human exposure to Radio Frequency (RF) fields adopted by the Federal Communications Commission (FCC). From the FCC Grant: Output power listed is conducted. This grant is valid only when the module is sold to OEM integrators and must be installed by the OEM or OEM integrators. This transmitter is restricted for use with the specific antenna(s) tested in this application for Certification and must not be colocated or operating in conjunction with any other antenna or transmitters within a host device, except in accordance with FCC multitransmitter product procedures. A.2.3 HELPFUL WEB SITES Federal Communications Commission (FCC): http://www.fcc.gov FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB): http://apps.fcc.gov/oetcf/kdb/index.cfm 2015 Microchip Technology Inc. Preliminary Edition Page 38 Stereo Module A.3 Canada The BM20/BM23 module has been certified for use in Canada under Industry Canada (IC) Radio Standards Specification (RSS) RSS-247 and RSS-Gen. Modular approval permits the installation of a module in a host device without the need to recertify the device. A.3.1 LABELING AND USER INFORMATION REQUIREMENTS Labeling Requirements for the Host Device (from Section 3.1, RSS-Gen, Issue 4, November 2014): The host device shall be properly labeled to identify the module within the host device. The Industry Canada certification label of a module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labeled to display the Industry Canada certification number of the module, preceded by the words "Contains transmitter module", or the word "Contains", or similar wording expressing the same meaning, as follows: For BM20 Module: Contains transmitter module IC: 12246A-BM20SPKS1 For BM23 Module: Contains transmitter module IC: 12246A-BM23SPKXYC2 User Manual Notice for License-Exempt Radio Apparatus (from Section 8.4, RSS-Gen, Issue 4, November 2014): User manuals for license-exempt radio apparatus shall contain the following or equivalent notice in a conspicuous location in the user manual or alternatively on the device or both: This device complies with Industry Canada licenseexempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le present appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisee aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioelectrique subi, meme si le brouillage est susceptible d'en compromettre le fonctionnement. Transmitter Antenna (from Section 7.1.2 RSSGen, Issue 3, December 2010): User manuals for transmitters shall display the following notice in a conspicuous location: 2015 Microchip Technology Inc. Preliminary Edition Page 39 Stereo Module Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. Conformement a la reglementation d'Industrie Canada, le present emetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inferieur) approuve pour l'emetteur par Industrie Canada. Dans le but de reduire les risques de brouillage radioelectrique a l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnee equivalente (p.i.r.e.) ne depasse pas l'intensite necessaire a l'etablissement d'une communication satisfaisante. The above notice may be affixed to the device instead of displayed in the user manual. A.3.2 RF EXPOSURE All transmitters regulated by IC must comply with RF exposure requirements listed in RSS102 Radio Frequency (RF) Exposure Compliance of Radio communication Apparatus (All Frequency Bands). A.3.3 WEB SITES Industry Canada: http://www.ic.gc.ca/ A.4 Europe The BM20/BM23 module is an R&TTE Directive assessed radio module that is CE marked and has been manufactured and tested with the intention of being integrated into a final product. The BM20/BM23 module has been tested to R&TTE Directive 1999/5/EC Essential Requirements for Health and Safety (Article (3.1(a)), Electromagnetic Compatibility (EMC) (Article 3.1(b)), and Radio (Article 3.2) and are summarized in Table A1/Table A-2: European Compliance Testing. A Notified Body Opinion has also been issued. The R&TTE Compliance Association provides guidance on modular devices in document Technical Guidance Note 01 available at http://www.rtteca.com/html/download_area.htm. Note: To maintain conformance to the testing listed in Table A1/ Table A-2: European Compliance Testing, the module shall be installed in accordance with the installation instructions in this data sheet and shall not be modified. When integrating a radio module into a completed product the integrator becomes the manufacturerof the final product and is therefore responsible for demonstrating compliance of the final product with the essential requirements of the R&TTE Directive. 2015 Microchip Technology Inc. Preliminary Edition Page 40 Stereo Module A.4.1 ABELING AND USER INFORMATION REQUIREMENTS The label on the final product which contains the BM23 module must follow CE marking requirements. The R&TTE Compliance Association Technical Guidance Note 01 provides guidance on final product CE marking. A.4.2 ANTENNA REQUIREMENTS From R&TTE Compliance Association document Technical Guidance Note 01: Provided the integrator installing an assessed radio module with an integral or specific antenna and installed in conformance with the radio module manufacturer's installation instructions requires no further evaluation under Article 3.2 of the R&TTE Directive and does not require further involvement of an R&TTE Directive Notified Body for the final product. [Section 2.2.4] The European Compliance Testing listed in Table A1 and Table A-2 was performed using the integral PCB antenna. TABLE A1: EUROPEAN COMPLIANCE TESTING (BM20) Certification Standards Article Laboratory EN 60950-1:2006 / A11:2009 / Safety A1:2010 / A12:2011 / A2:2013 (3.1(a)) EN 300 328 V1.9.1 / EN Health 62479:2010 TUV Rheinland, EN 301 489-1 V1.9.2 Taiwan EMC (3.1(b)) EN 301 489-17 V2.2.1 Radio EN 300 328 V1.9.1 (3.2) Report Number 10050720 002 10050932 002 10050691 002 10050932 002 Notified Body Opinion 10048933 001 TABLE A2: EUROPEAN COMPLIANCE TESTING (BM23) Certification Standards Article Safety EN 60950-1:2006 / A11:2009 / A1:2010 / A12:2011 Health EN 300 328 V1.9.1 / EN 62479:2010 EMC EN 301 489-1 V1.9.2 EN 301 489-17 V2.2.1 Radio EN 300 328 V1.9.1 Laboratory Report Number 10047732 001 (3.1(a)) 10048076 001 & 10048076 002 TUV Rheinland, Taiwan (3.1(b)) (3.2) Notified Body Opinion 2015 Microchip Technology Inc. 10047659 001 10048076 001 & 10048076 002 10048934 001 Preliminary Edition Page 41 Stereo Module A.4.3 HELPFUL WEB SITES A document that can be used as a starting point in understanding the use of Short Range Devices (SRD) in Europe is the European Radio Communications Committee (ERC) Recommendation 70-03 E, which can be downloaded from the European Radio Communications Office (ERO) at: http://www.ero.dk/. Additional helpful web sites are: * Radio and Telecommunications Terminal Equipment (R&TTE): http://ec.europa.eu/enterprise/rtte/index_en.htm * European Conference of Postal and Telecommunications Administrations (CEPT): http://www.cept.org * European Telecommunications Standards Institute (ETSI): http://www.etsi.org * European Radio Communications Office (ERO): http://www.ero.dk * The Radio and Telecommunications Terminal Equipment Compliance Association (R&TTE CA): http://www.rtteca.com/ 2015 Microchip Technology Inc. Preliminary Edition Page 42 Stereo Module A.5 Japan The BM20/BM23 module has received type certification and is labeled with its own technical conformity mark and certification number as required to conform to the technical standards regulated by the Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of Japan. Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. Additional testing may be required: * * If the host product is subject to electrical appliance safety (for example, powered from an AC mains), the host product may require Product Safety Electrical Appliance and Material (PSE) testing. The integrator should contact their conformance laboratory to determine if this testing is required. There is an voluntary Electromagnetic Compatibility (EMC) test for the host product administered by VCCI: http://www.vcci.jp/vcci_e/index.html A.5.1 LABELING AND USER INFORMATION REQUIREMENTS The label on the final product which contains the BM20/BM23 module must follow Japan marking requirements. The integrator of the module should refer to the labeling requirements for Japan available at the Ministry of Internal Affairs and Communications (MIC) website. The BM20/BM23 module is labeled with its own technical conformity mark and certification number. The final product in which this module is being used must have a label referring to the type certified module inside: For BM20 Module: Contains transmitter module with certificate number: For BM23 Module: Contains transmitter module with certificate number: 2015 Microchip Technology Inc. Preliminary Edition Page 43 Stereo Module A.5.2 HELPFUL WEB SITES Ministry of Internal Affairs and Communications (MIC): http://www.tele.soumu.go.jp/e/index.htm Association of Radio Industries and Businesses (ARIB): http://www.arib.or.jp/english/ A.6 Korea The BM20/ BM23 module has received certification of conformity in accordance with the Radio Waves Act. Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. A.6.1 LABELING AND USER INFORMATION REQUIREMENTS The label on the final product which contains the BM20/ BM23 module must follow KC marking requirements. The integrator of the module should refer to the labeling requirements for Korea available on the Korea Communications Commission (KCC) website. The BM20/ BM23 module is labeled with its own KC mark. The final product requires the KC mark and certificate number of the module: For BM20 Module: MSIP-CRM-mcp-BM20SPKS1NBC For BM23 Module: MSIP-CRM-S9S-BM23SPKXY A.6.2 HELPFUL WEB SITES Korea Communications Commission (KCC): http://www.kcc.go.kr National Radio Research Agency (RRA): http://rra.go.kr 2015 Microchip Technology Inc. Preliminary Edition Page 44 Stereo Module A.7 Taiwan The BM20/BM23 module has received compliance approval in accordance with the Telecommunications Act. Customers seeking to use the compliance approval in their product should contact Microchip Technology sales or distribution partners to obtain a Letter of Authority. Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. A.7.1 LABELING AND USER INFORMATION REQUIREMENTS The BM20/BM23 module is labeled with its own NCC mark and certificate number as below: For BM20 Module: CCAN15LP0460T2 For BM23 Module: CCAL15LP0270T3 The user's manual should contain below warning (for RF device) in traditional Chinese: ! A.7.2 HELPFUL WEB SITES National Communications Commission (NCC): http://www.ncc.gov.tw 2015 Microchip Technology Inc. Preliminary Edition Page 45 Stereo Module A.8 China The BM20 module has received certification of conformity in accordance with the China MIIT Notice 2014-01 of State Radio Regulation Committee (SRRC) certification scheme. Integration of this module into a final product does not require additional radio certification, provided installation instructions are followed and no modifications of the module are allowed. The BM23 module has received certification of conformity in accordance with the China MIIT Notice 2014-01 of State Radio Regulation Committee (SRRC) certification scheme. Integration of this module into a final product does not require additional radio certification, provided installation instructions are followed and no modifications of the module are allowed. A.8.1 LABELING AND USER INFORMATION REQUIREMENTS The BM20 module is labeled with its own CMIIT ID as follows: CMIIT ID: 2015DJ7134 When Host system is using an approved Full Modular Approval (FMA) radio: The host should bear a label containing the statement "This device contains SRRC approved Radio module CMIIT ID XXXXYYZZZZ". The BM23 module is labeled with its own CMIIT ID as follows: CMIIT ID: 2016DJ3553 When Host system is using an approved Full Modular Approval (FMA) radio: The host should bear a label containing the statement "This device contains SRRC approved Radio module CMIIT ID XXXXYYZZZZ". A.9 Other Regulatory Jurisdictions Should other regulatory jurisdiction certification be required by the customer, or the customer need to recertify the module for other reasons, contact Microchip for the required utilities and documentation. 2015 Microchip Technology Inc. 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