2015 Microchip Technology Inc.
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Preliminary Edition
BM20/BM23
Bluetooth® 4.1 Stereo Audio Module
Features:
Complete, Fully Certified, Embedded
2.4 GHz
Bluetooth® Version 4.1
Module
Bluetooth Classic (BDR/EDR)
Bluetooth SIG Certified
Onboard embedded Bluetooth Stack
Transparent UART mode for seamless serial
data over
UART interface
Easy to configure with Windows GUI or direct
by MCU
Compact surface mount module: 29 x 15 x
2.5 mm3
Castellated surface mount pads for easy
and reliable
host PCB mounting
Environmentally friendly, RoHS compliant
Perfect for Portable Battery Operated
Devices
Internal Battery Regulator Circuitry
Worldwide regulatory certifications
Audio-In / Out
BM23 support digital audio I2S format.
BM20 support analog audio output.
Operational:
Operating voltage: 3.0V to 4.2V
Temperature range: ‐20C to 70°C
Simple, UART interface
Integrated crystal, internal voltage
regulator, and
matching circuitry
Multiple I/O pins for control and status
RF/Analog:
Frequency: 2.402 to 2.480 GHz
Receive Sensitivity: ‐91 dBm (π/4
DQPSK)
Power Output: class 2 / +4dBm max.
Connection Distance: >10m
(free space and no interference)
Audio processor
Support 64 kb/s A-Law or -Law PCM format, or
CVSD (Continuous Variable Slope Delta
Modulation) for SCO channel operation.
Noise suppression
Echo suppression
SBC and optional AAC decoding
Packet loss concealment
Build-in four languages (Chinese/ English/ Spanish/
French) voice prompts and 20 events for each one
(This function can be set up in “IS20XXS_UI” tool.)
Support SCMS-T
Audio Codec
20 bit DAC and 16 bit ADC codec
98dB SNR DAC playback
Peripherals
Built-in Lithium-ion battery charger (up to 350mA)
Integrate 3V, 1.8V configurable switching regulator and
LDO
Built-in ADC for battery monitor and voltage sense.
A line-in port for external audio input
Two LED drivers
Flexible HCI interface
High speed HCI-UART (Universal Asynchronous
Receiver Transmitter) interface (up to 921600bps)
MAC/Baseband/Higher Layer:
Secure AES128 encryption
Bluetooth profiles
- HFP v1.6
- HSP v1.1
- A2DP v1.2
- AVRCP v1.5
- SPP v1.0
- PBAP v1.0
Antenna:
Printed Antenna
Compliance:
Bluetooth SIG QDID
Module certified for the United States (FCC) and
Canada (IC), Korea (LCC), Taiwan (NCC), Japan
(MIC) and China(SRRC)
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Figure 1:
General Description:
Stereo module is a fully-certified
Bluetooth® Version 4.1 (BDR/EDR) module
for designers who want to add Bluetooth®
wireless audio and voice applications to their
products.
This Bluetooth SIG certified module
provides a complete wireless solution with
Bluetooth stack, integrated antenna, and
worldwide radio certifications in a compact
surface mount package, 29x15x2.5 mm3.
This stereo module built-in Li-Ion charger
and BM23 contain a digital audio interface. It
supports HSP, HFP, SPP, A2DP, and
AVRCP profiles. Both AAC and SBC codecs
are supported for A2DP. Note that the
customer must connect their own external
analog CODEC/DSP/amplifier and MCU for
audio output.
Applications:
Bluetooth sound bar
Bluetooth stereo speaker phone
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Table of Contents
1. DEVICE OVERVIEW ......................................................................................................... 6
2. APPLICATION INFORMATION ..................................................................................... 12
3. ELECTRICAL CHARACTERISTICS ............................................................................... 20
4. PRINTED ANTENNA INFORMATION .......................................................................... 25
4.1. MODULE RADIATION PATTERN .............................................................................. 25
4.2. MODULE PLACEMENT RULE .................................................................................. 26
5. REFERENCE CIRCUIT .................................................................................................... 27
5.1. BM20 REFERENCE CIRCUIT ................................................................................ 27
5.2. BM23 REFERENCE CIRCUIT .................................................................................... 28
6. MODULE OUTLINE AND REFLOW PROFILE ............................................................ 29
7. PACKAGING AND STORAGE INFORMATION .......................................................... 34
APPENDIX A: CERTIFICATION NOTICES .......................................................................... 36
A.1 REGULATORY APPROVAL ....................................................................................... 36
A.2 United States ................................................................................................................. 36
A.2.1 LABELING AND USER INFORMATION REQUIREMENTS ............................. 37
A.2.2 RF EXPOSURE ............................................................................................................. 38
A.2.3 HELPFUL WEB SITES ................................................................................................... 38
A.3 Canada ........................................................................................................................... 39
A.3.1 LABELING AND USER INFORMATION REQUIREMENTS ............................................. 39
A.3.2 RF EXPOSURE ............................................................................................................. 40
A.3.3 WEB SITES ................................................................................................................. 40
A.4 Europe ............................................................................................................................ 40
A.4.1 ABELING AND USER INFORMATION REQUIREMENTS ............................... 41
A.4.2 ANTENNA REQUIREMENTS ............................................................................... 41
A.4.3 HELPFUL WEB SITES ........................................................................................... 42
A.5 Japan .............................................................................................................................. 43
A.5.1 LABELING AND USER INFORMATION REQUIREMENTS ............................. 43
A.5.2 HELPFUL WEB SITES ........................................................................................... 44
A.6 Korea .............................................................................................................................. 44
A.6.1 LABELING AND USER INFORMATION REQUIREMENTS ............................. 44
A.6.2 HELPFUL WEB SITES ........................................................................................... 44
A.7 Taiwan ............................................................................................................................ 45
A.7.1 LABELING AND USER INFORMATION REQUIREMENTS ............................. 45
A.7.2 HELPFUL WEB SITES ........................................................................................... 45
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A.8 China ............................................................................................................................. 46
A.8.1 LABELING AND USER INFORMATION REQUIREMENTS ............................. 46
A.9 Other Regulatory Jurisdictions .................................................................................. 46
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TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your
Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications
will be refined and
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If you have any questions or comments regarding this publication, please contact the Marketing Communications
Department via
E-mail at docerrors@microchip.com. We welcome your feedback.
Most Current Data Sheet
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http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for
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To determine if an errata sheet exists for a particular device, please check with one of the following:
•
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Abbreviations List:
HFP: Hands-free Profile
AVRCP: Audio Video Remote Control Profile
A2DP: Advanced Audio Distribution Profile
PBAP: Phone Book Access Profile
HSP: Headset Profile
SPP: Serial Port Profile
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1. DEVICE OVERVIEW
The stereo module series include BM20 and BM23. The chip integrates Bluetooth 4.1 radio
transceiver, PMU and DSP. Figure 1-1and 1-2 shows the application block diagram.
FIGURE 1‐1: BM20 Typical Application
The following depicts an example of BM20 module operate as an independent system or connected
to an MCU.
FIGURE 1‐2: BM23 Typical Application
The following depicts an example of BM23 module connected to an MCU, external DSP/CODEC.
MCU
EEPROM
IC
IS2020S 16M Hz
Crystal
I2C
UART
BM20 Option
Microphone
Aux_In
Audio Output
MCU
EEPROM
IC
IS2023S 16M Hz
Crystal
I2C
UART
BM23
Microphone
Aux_In
DSPI2S
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1.1. INTERFACE DESCRIPTION
BM20 pin diagram is shown in Figure 1-3.
The pin descriptions are shown in Table 1-1
FIGURE 1-3: BM20 PIN DIAGRAM
TABLE 1‐1: BM20 PIN DESCRIPTION
Pin No.
Name
Description
1
I/O
P0_0
IO pin, default pull-high input (Note 1)
1. Slide Switch Detector, active low.
2. UART TX_IND, active low.
2
I
EAN
Embedded ROM/External Flash enable
H: Embedded; L: External Flash
3
I
P3_0
IO pin, default pull-high input (Note 1)
Line-in Detector (default), active low.
4
I
P2_0
IO pin, default pull-high input
System Configuration,
H: Application L: Baseband(IBDK Mode)
5
I/O
P1_5
IO pin, default pull-high input (Note 1)
1. NFC detection pin, active low.
2. Out_Ind_0
3. Slide Switch Detector, active low.
4. Buzzer Signal Output
6
I/O
P0_4
IO pin, default pull-high input. (Note 1)
1. NFC detection pin, active low.
2. Out_Ind_0
7
O
SPKR
R-channel analog headphone output
8
O
AOHPM
Headphone common mode output/sense input.
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Pin No.
Name
Description
9
O
SPKL
L-channel analog headphone output
10
P
VDDA
Positive power supply/reference voltage for CODEC, no need to add power
to this pin.
11
I
MIC1_P
Mic 1 mono differential analog positive input
12
I
MIC1_N
Mic 1 mono differential analog negative input
13
P
MIC_BIAS
Electric microphone biasing voltage
14
I
AIR
R-channel single-ended analog inputs
15
I
AIL
L-channel single-ended analog inputs
16
I
RST
System Reset Pin, Low: reset
17
P
VCC_RF
1.28V RF LDO output, no need to add power to this pin.
18
I/O
P0_1
IO pin, default pull-high input (Note 1)
1. FWD key when class 2 RF (default), active low.
2. Class1 TX Control signal of external RF T/R switch, active high.
19
P
VDD_IO
Power output , no need to add power to this pin
20
P
ADAP_IN
5V Power adaptor input
21
P
BAT_IN
3.0V~4.2V Li-Ion battery input
22
-
NC
No Connection
23
P
GND
Ground Pin
24
P
SYS_PWR
System Power Output
BAT mode: 3.0~4.2V
Adapter mode: 4.0V
25
P
BK_OUT
1.8V buck output, no need to add power to this pin
26
I
MFB
1. Power key when in off mode
2. UART_RX_IND: MCU use to wakeup BT (Note 1)
27
I
LED1
LED Driver 1
28
I
LED2
LED Driver 2
29
I
P2_4
IO pin, default pull-high input
System Configuration,
L: Boot Mode with P2_0 low combination
30
I
P0_2
IO pin, default pull-high input (Note 1)
Play/Pause key (default), active low.
31
I/O
P0_3
IO pin, default pull-high input (Note 1)
1. REV key (default), active low.
2. Buzzer Signal Output
3. Out_Ind_1
4. Class1 RX Control signal of external RF T/R switch, active high.
32
O
HCI_TXD
HCI-UART TX data
33
I
HCI_RXD
HCI-UART RX data
34
I
P0_5
IO pin, default pull-high input (Note 1)
Volume down (default), active low.
35
I
P2_7
IO pin, default pull-high input (Note 1)
Volume up key (default), active low.
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Pin No.
Name
Description
36
I
P2_4
IO pin, default pull-high input
System Configuration,
L: Boot Mode with P2_0 low combination
37
P
GND
Ground Pin
38
-
NC
No Connection
39
-
NC
No Connection
40
-
NC
No Connection
* I: signal input pin
* O: signal output pin
* I/O: signal input/output pin
* P: power pin
Note 1: These button or functions can be setup by “IS20XXS_UI” tool.
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BM23 pin diagram is shown in Figure 1-4.
The pin descriptions are shown in Table 1-2
FIGURE 1-4: BM23 PIN DIAGRAM
TABLE 1‐2: BM23 PIN DESCRIPTION
Pin No.
Pin Type
Name
Description
1
I/O
P0_0
IO pin, default pull-high input (Note 1)
UART TX_IND
2
I/O
RFS0
I2S interface: DAC Left/Right Clock
3
I/O
TFS0
I2S interface: ADC Left/Right Clock
4
I/O
SLK0
I2S interface: Bit Clock
5
I
DR0
I2S interface: DAC Digital Left/Right Data
6
O
DT0
I2S interface: ADC Digital Left/Right Data
7
I/O
P0_4
IO pin, default pull-high input
8
I
EAN
Embedded ROM/External Flash enable
High: ROM mode;
Low: External Flash mode
9
I
MIC1_P
Mic 1 mono differential analog positive input
10
I
MIC1_N
Mic 1 mono differential analog negative input
11
P
MIC_BIAS
Power output, microphone biasing voltage
12
P
VDDA
Power output, reserve for external cap to fine tune audio frequency
response, no need to add power to this pin
13
I
AIR
Stereo analog line in, R-channel
14
I
AIL
Stereo analog line in, L-channel
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Pin No.
Name
Description
15
P
GND
Ground
16
I
RST_N
System Reset Pin, active when rising edge.
17
--
NC
--
18
--
NC
--
19
P
VDDIO
Power output, VDDIO pin, no need to add power to this pin
20
I/O
P1_5
IO pin, default pull-high input
21
I/O
P0_1
IO pin, default pull-high input
22
P
ADAP_IN
5V power adaptor input
23
P
BAT_IN
3.3~4.2V Li-ion battery input
24
--
NC
--
25
P
SYS_PWR
System Power Output
BAT mode: 3.3~4.2V
Adapter mode: 4.0V
26
P
BK_OUT
Power output, 1v8 pin, no need to add power to this pin
27
P
MFB
1. Power key when in off mode
2. UART_RX_IND: MCU use to wakeup BT
28
P
LED1
LED Driver 1, 4mA max
29
P
LED2
LED Driver 2, 4mA max
30
I
P2_4
IO pin, default pull-high input
System Configuration,
L: Boot Mode with P2_0 low combination
31
I/O
P0_2
IO pin, default pull-high input
32
I/O
P0_3
IO pin, default pull-high input
33
O
HCI_TXD
HCI-UART TX data
34
I
HCI_RXD
HCI-UART RX data
35
I/O
P0_5
IO pin, default pull-high input
36
I/O
P2_7
IO pin, default pull-high input
37
I/O
P2_0
IO pin, default pull-high input
38
I/O
P3_0
IO pin, default pull-high input
39
I
P2_0
IO pin, default pull-high input
System Configuration,
H: Application L: Baseband(IBDK Mode)
40
P
GND
Ground.
41
--
NC
--
42
--
NC
--
43
--
NC
--
* I: signal input pin
* O: signal output pin
* I/O: signal input/output pin
* P: power pin
Note 1: These button or functions can be setup by “IS20XXS_UI” tool.
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2. APPLICATION INFORMATION
2.1. OPERATION WITH EXTERNAL MCU
Stereo module support UART command set to make an external MCU to control module.
Here is the connection interface between BMXX and MCU.
FIGURE 2-1: INTERFACE BETWEEN MCU AND BMXX MODULE
MCU can control module by UART interface and wakeup module by PWR pin. Stereo module
provide wakeup MCU function by connect to P0_0 pin of module.
“UART Command Set” document provide all function which module support and UI tool will help
you to set up your system support UART command.
For more detail description, please reference “UART_CommandSet_v154” document and
“IS20XXS_UI” tool.
BMXX
HCI_TXD
HCI_RXD
MFB
P0_0
MCU
UART_TX
UART_RX
MCU_
WAKEUP
BT_
WAKEUP
UART interface
UART interface
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Here are some suggestions of UART control signal timing sequence:
FIGURE 2-2: POWER ON/OFF SEQUENCE
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FIGURE 2-3: TIMING SEQUENCE OF RX INDICATION AFTER POWER ON
FIGURE 2-4: TIMING SEQUENCE OF POWER OFF
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FIGURE 2-5: TIMING SEQUENCE OF POWER ON (NACK)
FIGURE 2-6: RESET TIMING SEQUENCE IF MODULE HANGS UP
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FIGURE 2-7: TIMING SEQUENCE OF POWER DROP PROTECTION
BAT_IN +4V
RST_N from Reset IC
If BT’s BAT use adaptor translates voltage by LDO, we recommend use “Reset IC” to avoid power
off suddenly. Rest IC spec output pin must be “Open Drain”、delay time ≦ 10ms
Recommend part: TCM809SVNB713 or G691L263T73
Power
2.9V ~
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2.2. I2S Signal Application for BM23
BM23 support I2S digital audio signal interface to connect your external CODEC/DSP. It provide 8k
Hz, 44.1k Hz and 48k Hz sampling rate; it also support 16 bits and 24bits data format. The I2S setting
can be set up by UI and DSP tools.
.
The external CODEC/DSP needs to be connected to SLK0, RFS0, TFS0, DR0, and DT0 (pins 4, 2, 3,
5, and 6 respectively). The I2S signal connection between BM23 and external DSP as below:
FIGURE 2-9: MASTER MODE REFERENCE CONNECTION
FIGURE 2-10: SLAVE MODE REFERENCE CONNECTION
Note 1: For 002 version chip or module, system should connect line 1 in slave mode figure.
And, system not support ADC signal from external DSP/CODEC.
Note 2: For other version chip or module, system should connect line 2 in slave mode figure.
About “Mast” or “Slave” mode setting, you can use “DSP Configuration Tool” to set up system.
BM23
RFS0
TFS0
DR0
SCLK0
DACLRC
BCLK
ADCDAT
DACDAT DT0
EXTERNAL
DSP/CODEC
BM23
RFS0
TFS0
DR0
SCLK0
DACLRC
BCLK
ADCDAT
DACDAT DT0
EXTERNAL
DSP/CODEC
(*1)
(*2)
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The clock and data timing as below:
FIGURE 2-11: TIMING FOR I2S MODES (both master and slave)
FIGURE 2-12: TIMING FOR PCM MODES (both master and slave)
2.3. RESET (RST_N)
RST is module reset pin which is active LOW. To reset the module, the RST_N must hold LOW for at
least 63ns.
2.4. STATUS LED (LED1, LED2)
The status LED provide below status indication:
Standby
Inquiry
Link
Link Back
Low Battery
Page
Battery Charging
Each status indication LED flashing sequence and brightness is configurable by UI tool.
Bn-1
RFSn/TFSn
SCLKn
DRn/DTn Bn-2 B1B0Bn-1 Bn-2 B1B0
Left Channel Right Channel
1/fs
Word Length
Bn-1
RFS0/TFS0
SCLK0
DR0/DT0 Bn-2 B1B0Bn-1 Bn-2 B1B0
Left Channel
1/fs
Word Length
Right Channel
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2.5. EXTERNAL CONFIGURATION
Stereo module can be configured and firmware programmed using an external configuration and
programming tool available from Microchip. Figure 2‐7 shows the configuration and firmware
programming interface on BM23. It is recommended to include a pin header on the main PCB for
development.
Configuration and firmware programming modes are entered accordingly to the system
configuration I/O pins as shown in Table 2-1. Pin P20, P24
and EAN pin
have internal pull‐up.
FIGURE 2-13: EXTERNAL PROGRAMMING HEADER CONNECTIONS
(Here is the interface connect example of the BM23)
TABLE 2-1: SYSTEM CONFIGURATION SETTINGS
P20
P24
EAN
Operational Mode
High
High
High
APP mode (Normal operation)
Low
High
High
Test mode (Write EEPROM)
Low
Low
High
Write Flash (Firmware programming if flash build-in in chip)
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3. ELECTRICAL CHARACTERISTICS
Table 3-1: ABSOLUTE MAXIMUM SPECIFICATION
Symbol
Parameter
Min
Max
Unit
BAT_IN
Input voltage for battery
0
4.3
V
ADAP_IN
Input voltage for adaptor
0
7.0
V
TSTORE
Storage temperature
-65
+150
ºC
TOPERATION
Operation temperature
-20
+70
ºC
Table 3-2: RECOMMENDED OPERATING CONDITION
Symbol
Parameter
Min
Typical
Max
Unit
BAT_IN
Input voltage for battery
3
3.7
4.2
V
ADAP_IN
Input voltage for adaptor
4.5
5
5.5
V
TOPERATION
Operation temperature
-20
+25
+70
ºC
Note:
Absolute and Recommended operating condition tables reflect typical usage for device.
TABLE 3-3: I/O AND RESET LEVEL
Parameter
Min.
Typ.
Max.
Units
I/O Supply Voltage (VDD_IO)
2.7
3.0
3.3
V
I/O Voltage Levels
VIL input logic levels low
‐0.3
0.8
V
VIH input logic levels high
2.0
3.6
V
VOL output logic levels low
0.4
V
VOH output logic levels high
2.4
V
RESET
VTH,RES threshold voltage
1.6
V
Note:
(1) VDD_IO voltage is programmable by EEPROM parameters.
(2) These parameters are characterized but not tested in manufacturing.
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Table 3-4: BATTERY CHARGER
Parameter
Min
Typical
Max
Unit
ADAP_IN Input Voltage
4.5
5.0
5.5
V
Supply current to charger only
3
4.5
mA
Maximum Battery
Fast Charge Current
Note: ENX2=0
Headroom > 0.7V
(ADAP_IN=5V)
170
200
240
mA
Headroom = 0.3V
(ADAP_IN=4.5V)
160
180
240
mA
Maximum Battery
Fast Charge Current
Note: ENX2=1
Headroom > 0.7V
(ADAP_IN=5V)
330
350
420
mA
Headroom = 0.3V
(ADAP_IN=4.5V)
180
220
270
mA
Trickle Charge Voltage Threshold
3
V
Battery Charge Termination Current,
(% of Fast Charge Current)
10
%
Note:
(1) Headroom = VADAP_IN – VBAT
(2) ENX2 is not allowed to be enabled when VADAP_IN – VBAT > 2V
(3) These parameters are characterized but not tested in manufacturing.
Table 3-5: LED DRIVER
Parameter
Min
Typical
Max
Unit
Open-drain Voltage
3.6
V
Programmable Current Range
0
5.25
mA
Intensity Control
16
step
Current Step
0.35
mA
Power Down Open-drain Current
1
μA
Shutdown Current
1
μA
Note:
(1) Test condition: SAR_VDD=1.8V, temperature=25 ºC.
(2) These parameters are characterized but not tested in manufacturing.
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Table 3-6: AUDIO CODEC ANALOGUE TO DIGITAL CONVERTER
T= 25oC, Vdd=3.0V, 1KHz sine wave input, Bandwidth = 20Hz~20KHz
Parameter (Condition)
Min.
Typ.
Max.
Unit
Resolution
16
Bits
Output Sample Rate
8
48
KHz
Signal to Noise Ratio Note: 1
(SNR @MIC or Line-in mode)
88
dB
Digital Gain
-54
4.85
dB
Digital Gain Resolution
2~6
dB
MIC Boost Gain
20
dB
Analog Gain
60
dB
Analog Gain Resolution
2.0
dB
Input full-scale at maximum gain (differential)
4
mV
rms
Input full-scale at minimum gain (differential)
800
mV
rms
3dB bandwidth
20
KHz
Microphone mode (input impedance)
24
KΩ
THD+N (microphone input) @30mVrms input
0.02
%
Note:
(1) fin=1KHz, B/W=20~20KHz, A-weighted, THD+N < 1%, 150mVpp input
(2) These parameters are characterized but not tested in manufacturing.
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Table 3-7: AUDIO CODEC DIGITAL TO ANALOGUE CONVERTER
T= 25oC, Vdd=3.0V, 1KHz sine wave input, Bandwidth = 20Hz~20KHz
Parameter (Condition)
Min.
Typ.
Max.
Unit
Over-sampling rate
128
fs
Resolution
16
20
Bits
Output Sample Rate
8
48
KHz
Signal to Noise Ratio Note: 1
(SNR @cap-less mode) for 48kHz
96
dB
Signal to Noise Ratio Note: 1
(SNR @single-end mode) for 48kHz
98
dB
Digital Gain
-54
4.85
dB
Digital Gain Resolution
2~6
dB
Analog Gain
-28
3
dB
Analog Gain Resolution
1
dB
Output Voltage Full-scale Swing (AVDD=2.8V) Note:3
742.5
mV rms
Maximum Output Power (16Ω load)
34.5
mW
Maximum Output Power (32Ω load)
17.2
mW
Allowed Load
Resistive
8
16
O.C.
Ω
Capacitive
500
pF
THD+N (16Ω load)
0.05
%
Signal to Noise Ratio (SNR @ 16Ωload)
96
dB
Note:
(1) fin=1KHz, B/W=20~20KHz, A-weighted, THD+N < 0.01%, 0dBFS signal, Load=100KΩ
(2) These parameters are characterized but not tested in manufacturing.
(3) Vdd, AVDD are generated by internal LDO
Table 3-8: TRANSMITTER SECTION FOR BDR AND EDR
Parameter
Min
Typ
Max
Bluetooth
specification
Unit
Maximum RF transmit
power(BM20)
-6 to 4
dBm
Maximum RF transmit
power(BM23)
2
-6 to 4
EDR/BDR
Relative transmit power
-4
-1.2
1
-4 to 1
dB
Note:
The RF Transmit power is calibrated during production using MP Tool software and MT8852 Bluetooth Test
equipment.
Test condition: VCC_RF= 1.28V, temperature=25 ºC.
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Table 3-9: RECEIVER SECTION FOR BDR AND EDR
Modulation
Min
Typ
Max
Bluetooth
specification
Unit
Sensitivity at
0.1% BER
GFSK
-90
≤-70
dBm
Sensitivity at
0.01% BER
π/4 DQPSK
-91
≤-70
dBm
8DPSK
-82
≤-70
dBm
Note:
(1) Test condition: VCC_RF= 1.28V, temperature=25 ºC.
(2) These parameters are characterized but not tested in manufacturing.
Table 3-10: SYSTEM CURRENT CONSUMPTION OF ANALOG AUDIO OUTPUT
System Status
Typ.
Max.
Unit
System Off Mode
2
5
uA
Standby Mode
0.8
mA
Linked Mode
0.4
mA
SCO Link
7.8
mA
A2DP Link (V p-p=200mV; 1k tone signal)
10.7
mA
Note: Use BM20 EVB as test platform.
Test condition: BAT_IN= 3.8V, link with HTC EYE cell phone; distance between cell phone and EVB: 30cm.
Table 3-11: SYSTEM CURRENT CONSUMPTION OF DIGITAL AUDIO OUTPUT(I2S)
System Status
Typ.
Max.
Unit
System Off Mode
2
5
uA
Standby Mode
0.4
mA
Linked Mode
0.4
mA
SCO Link
9.3
mA
A2DP Link (1k tone signal)
11.7
mA
Note: Use BM23 EVB as test platform
Test condition: BAT_IN= 3.8V, link with HTC M8 cell phone; distance between cell phone and EVB: 30cm;
I2S signal link with YAMAHA YDA174 EVB
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4. PRINTED ANTENNA INFORMATION
4.1. MODULE RADIATION PATTERN
The stereo module contains a PCB printed antenna. The PCB printed antenna radiation pattern is
shown in Figure 4-2.
FIGURE 4-1: ANTENNA KEEP OUT AREA EXAMPLES
FIGURE 4-2: ANTENNA 3D RADIATION PATTERN @2441 MHz
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4.2. MODULE PLACEMENT RULE
On the main PCB, the areas under the antenna should not
contain any top, inner layer, or
bottom copper as shown in Figure 4‐1. A low‐impedance ground plane
will ensure the best radio
performance (best range, lowest noise). The ground plane can be
extended beyond the minimum
recommended as need for the main PCB EMC noise reduction. For the best
range performance,
keep all external metal away from the ceramic chip antenna at least 15 mm.
Here are some examples of good and poor placement on a carrier board with GND plane.
FIGURE 4-3: MODULE PLACEMENT EXAMPLES
FIGURE 4-4: GND PLANE ON MAIN APPLICATION BOARD
System GND Plane
Worse Case
Poor Case Good Case
Acceptable Case
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MIC1
Board Name
Size Title Rev
Date: Sheet of
P/N
MAIN CIRCUIT 1.1
BM20 Reference Circuit
B
1 1Thursday, April 16, 2015
XXXX
5F, No.5, Industry E. Rd. VII, Hsinchu Science Park,
Hsinchu City 30078, Taiwan
TEL. 886-3-5778385
AMP_EN
JP2
JP 1x8
1
2
3
4
5
6
7
8
RST_N
HCI_TXD
HCI_RXD
TX_IND
Audio AMP Enable
P0_0
MFB
UART_TXD
UART CONTROL
(by MCU)
UART_RXD
RESET_n
MFB/RX_IND
BAT_IN
C19
10u/16VJP5
JP 1x2
1
2
Li Battery
Connector
BAT_IN
JP3
JP 1x8
1
2
3
4
5
6
7
8
RESERVE For
BLUETOOTH DEBUG
HCI_TXD
HCI_RXD
EAN
P2_4
P2_0
SW1
SW-TACT
1 2
3 4
MFB
HCI_TXD
HCI_RXD
EAN
P2_0
P2_4
PCB1
BM20
ANT1
38
ANT2
39
ANT3
40
P0_0
1
EAN
2
P3_0
3
P2_0
4
P1_5
5
P0_4
6
SPKR
7
AOHPM
8
SPKL
9
VDDA
10
MIC1_P
11
MIC1_N
12
MIC_BIAS
13
AIR
14
GND
23 NC
22 BAT_IN
21 ADAP_IN
20 VDD_IO
19 P0_1
18 VCC_RF
17 RST
16 AIL
15
GND 37
P2_4 36
P2_7 35
P0_5 34
HCI_RXD 33
HCI_TXD 32
P0_3 31
P0_2 30
P2_4 29
LED2 28
LED1 27
MFB 26
BK_OUT 25
SYS_PWR 24
5V
MFB
SYS_PWR
R1
1K/1%
12
5V
VDD_IO
C26
1u/10V
P0_0
Q4
STS2306
3
1
2
R10
100K
1 2
R12
100K
12
R13
10K
1 2
Slide Switch Circuit
SYS_PWR
SLIDE_SW
G D
S
Q3
STS2301
1
3
2
MFB
ON
SW8
SW-1BIT
1 2
RESET
BUTTON
SW2
SW-TACT
1 2
3 4 DP1
DP-4
21
RST_N
C3
1u/16V
5V
Q1
MMBT3904
3
2
1
R2
2K
12
C93
NP-0603
C92
NP-0603
5V
C18
10u/16V
LINE_R
P3_0
LINE
INPUT
LINE_L
P2
TSH-3865D
4
3
2
10
1
C15
0.1u/16V
R7
0
1 2
R6
0
1 2
R5
NP-0603
R8
NP-0603
C17
1u/16V
C16
1u/16V
AIL
AIR
VBUS
D-
D+
ID
GND
P3
USBM3121-051-1-BN-R
1
2
3
4
5
6
78
9
P0_3
VOL+
FWD P0_1
C8
15p/50V
SW5
SW-TACT
12
34
C12
15p/50V
P2_7
SW7
SW-TACT
12
34
AOHPM
P0_2
C4
15p/50V
PLAY/PAUSE
SPKR
SW3
SW-TACT
12
34
VOL-
REV
SPKL
P7
PJ-2001-5K
1
2
3
4
5
C7
15p/50V
SW4
SW-TACT
12
34
C11
15p/50V
Stereo
Jack
P0_5
SW6
SW-TACT
12
34
LED2
LED1 LED1LED-B 12
LED2LED-HR 12 SYS_PWR
Backup Plug-In Reset Circuit
JP6
JP 1x1 1NFC
C9
1u/16V
MIC_BIAS
MIC_N1
MIC_P1
AOHPM
AMP_EN
P3_0
AIR
P0_0
SPKL
SPKR
P0_1
RST_N
AIL
VDD_IO
BAT_IN
MIC_BIAS
C13
2.2u/6.3VR3
1K
1 2
R75
1K
1 2
C72
2.2u/6.3V
MIC_P1
MIC_N1
P0_5
C10
1u/16V
R4
2K
1 2
MFB
P2_4
P2_7
C14
1u/16V
SYS_PWR
P0_2
LED2
LED1
P1
PJ-2001-5K
1
2
3
4
5
P0_3
5. REFERENCE CIRCUIT
5.1. BM20 REFERENCE CIRCUIT
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SLK0
DR0
ADAP_IN
C20
0.1u/16V
DT0
EAN
P0_0
System Configuration
LINE IN Detection
P2_0
P2_4
PWR/MFB/UART_RX_IND
System Configuration
System Configuration
P3_0
GPIO Description
MFB
Receive frame synchronization
Transmit frame synchronization
BAT_IN
P0_4
Serial clock
P1
PJ-3894D-S125
2
3
4
1
AIL
AIR
D2
SPE0572
21
STEREO AUX LINE INPUT
*P30 Low Active
Line In Detect
Serial data receive
D1
SPE0572
21
D3
SPE0572
21
BAT_IN
P3_0
C8
470p/50V
C12
470p/50V
C11
0.1u/16V
C9
10u/16V
C10
10u/16V
R9
10K
12
R12
10K
12
R10
1K
1 2
R11
1K
1 2
Serial data transmit
ADAP_IN
AMP_EN
JP2
JP 1x8
1
2
3
4
5
6
7
8
HCI_TXD
HCI_RXD
C17
1u/16V
DR0
SLK0
R2 33
1 2
TFS0
RFS0
DT0 RST_N
C18
1u/16V
MIC_BIAS MIC_N1
MIC_P1
RFS0
DP1 DP-4
21
P0_0
C5
10u/16V
CODEC_VO
Audio AMP Enable
P2 DC-JACK
1
2
3
I2S INTERFACE
MIC_N1
MIC_P1
P0_4
C1
2.2u/6.3V R7 1K
1 2
R6 1K
1 2
C2
2.2u/6.3V
C4
220p/50V
R8 2K
1 2
MIC_BIAS
BATTERY CONNECTOR
MFB
JP3
JP 1x8
1
2
3
4
5
6
7
8
P0_0
DC POWER SOURCE
C16
0.1u/16V
UART_TX_IND(Flash)
TP1
TP-4 1
LED
TX_IND
C3 0.047u/25V
TP3
TP-4 1
C7
4.7u/10V
MIC_BIAS
C6 0.047u/25V
JP1
JP 1x8
1
2
3
4
5
6
7
8
MIC INPUT
SYS_PWR
RST_N
ADAP_IN
R3 33
1 2
R1 33
1 2
R5 33
1 2
R4 33
1 2
MFB/RX_IND
RESET_n
JP4 SJP 1x2
2
1
34
UART_RXD
UART CONTROL
(by MCU)
PCB1
FP-BM23
P0_0
1
RFS0
2
TFS0
3
SLK0
4
DR0
5
DT0
6
P0_4
7
EAN
8
MIC1_P
9
MIC1_N
10
MIC_BIAS
11
VDDA
12
AIR
13
AIL
14
GND
15
SYS_PWR
25 AMB_DET
24 BAT_IN
23 ADAP_IN
22 P0_1
21 P1_5
20 VDD_IO
19 NC
18 NC
17 RST
16
GND 40
P2_0 39
P3_0 38
P2_0 37
P2_7 36
P0_5 35
HCI_RXD 34
HCI_TXD 33
P0_3 32
P0_2 31
P2_4 30
LED2 29
LED1 28
MFB 27
BK_OUT 26 MFB
P2_0
P3_0
HCI_TXD
HCI_RXD
P2_4
LED2
LED1
TP2
TP-4
1
BAT_IN
RESERVE For
BLUETOOTH DEBUG
LED2 C13
0.1u/16V
RED
BLUE LED1 LED-B
12
LED2 LED-HR
12
SYS_PWR
Board Name
Size Title Rev
Date: Sheet of
P/N
Reference Circuit of BM23 1.0
Reference Circuit of BM23
B
2 2Friday , March 13, 2015
XXXX
5F, No.5, Industry E. Rd. VII, Hsinchu Science Park,
Hsinchu City 30078, Taiwan
TEL. 886-3-5778385
LED1
UART_TXD
EAN
P2_0
P2_4
HCI_RXD
EAN
P0_4
HCI_TXD
TP4
TP-4 1
Audio AMP Enable(ROM)
AIR
AIL
TFS0
5.2. BM23 REFERENCE CIRCUIT
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6. MODULE OUTLINE AND REFLOW PROFILE
6.1. MODULE DIMENSION AND PCB FOOT PRINT
FIGURE 6-1: BM20 Outline Dimension
PCB dimension:
X : 15.0 mm
Y : 29.0 mm
Tolerances: 0.25 mm
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FIGURE 6-2: BM23 Outline Dimension
PCB dimension:
X : 15.0 mm
Y : 29.0 mm
Tolerances: 0.25 mm
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FIGURE 6-3: BM20 PCB FOOT PRINT
Note: The “Keep Out Area” is reserved for RF performance check.
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FIGURE 6-4: BM23 PCB FOOT PRINT
Note: The “Keep Out Area” is reserved for RF performance check.
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6.2 REFLOW PROFILE
FIGURE 6-5: REFLOW PROFILE
Soldering Recommendations
Stereo module was assembled using standard lead‐free reflow profile IPC/JEDEC J‐STD‐020.
The
module can be soldered to the main PCB using standard leaded and lead‐free solder reflow
profiles.
To avoid damaging of the module, the recommendations are listed as follows:
•
Refer to Microchip Technology Application Note AN233 Solder Reflow
Recommendation (DS00233)
for the
soldering reflow recommendations
•
Do not exceed peak temperature (TP) of 250 degree C
•
Refer to the solder paste data sheet for specific reflow profile recommendations
•
Use no‐clean flux solder paste
•
Do not wash as moisture can be trapped under the shield
•
Use only one flow. If the PCB requires multiple flows, apply the module on the final flow.
Slope: 1~2℃/sec max.
(217℃ to peak)
Ramp down rate :
Max. 3℃/sec.
Preheat: 150~200℃
25℃
217℃
peak: 260 +5/-0℃
60 ~ 180 sec.
60 ~150sec
20~40 sec.
Time (sec)
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7. PACKAGING AND STORAGE INFORMATION
The module is packaged into trays (see following page) of sixty three (63) modules in a 7 x 9 format.
These trays are then sealed into bags. Ten sealed bags are then placed in a box of 630 pieces with a
dimension of 36 * 16 * 9.5 cm3.
The shelf life of each module in a sealed bag is 12 months at <40°C and <90% relative humidity.
After a bag is opened, devices that will be subjected to reflow solder or other high temperature
processes must be mounted within 168 hours (7 days) at factory conditions of <30°C and <60% relative
humidity.
7.1. ORDERING INFORMATION
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TABLE 7-1: Module Ordering Information
Part Number
Description
BM20SPKS1NBC
Bluetooth 4.1 BDR/EDR, Class 2 Surface Mount module
with integrated antenna and shield
BM23SPKS1NB9
Bluetooth 4.1 BDR/EDR, Class 2 Surface Mount module
with integrated antenna and shield
Note: The module can only be purchased through a Microchip representative.
Go to http://www.microchip.com/ for current pricing and a list of distributors carrying
Microchip products.
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APPENDIX A: CERTIFICATION NOTICES
BM20 module (BM20SPKS1NBC) has received the regulatory approval for the following:
BT SIG/QDID: 58996
United States: FCC ID: A8TBM20SPKXYNBZ
Canada
o IC ID: 12246A-BM20SPKS1
o HVIN: BM20SPKS1
Europe/CE
Japan/MIC: 202-SMD048
Korea/KCC: MSIP-CRM-mcp-BM20SPKS1NBC
Taiwan/NCC No.: CCAN15LP0460T2
China/SRRC: CMIIT ID: 2015DJ7134
BM23 module (BM23SPKS1NB9) has received the regulatory approval for the following:
BT SIG/QDID: 58996
United States/ FCC ID: A8TBM23SPKXYC2A
Canada
o IC ID: 12246A-BM23SPKXYC2
o HVIN: BM23SPKXY
Europe/CE
Japan/MIC: 202-SMC067
Korea/KCC: MSIP-CRM-S9S-BM23SPKXY
Taiwan
o NCC No.: CCAL15LP0270T3
o M/N: BM23SPK
China/SRRC: CMIIT ID: 2016DJ3553
A.1 REGULATORY APPROVAL
This section outlines the regulatory information for the BM20/BM23 module for the following
countries:
United States
Canada
Europe
Japan
Korea
Taiwan
China
Other Regulatory Jurisdictions
A.2 United States
The BM20/BM23 module has received Federal Communications Commission (FCC)
CFR47 Telecommunications, Part 15 Subpart C "Intentional Radiators" modular approval in
accordance with Part 15.212 Modular Transmitter approval. Modular approval allows the
end user to integrate the BM20/BM23 module into a finished product without obtaining
subsequent and separate FCC approvals for intentional radiation, provided no changes or
modifications are made to the module circuitry. Changes or modifications could void the
user's authority to operate the equipment. The end user must comply with
all of the
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instructions provided by the Grantee, which indicate installation and/or operating conditions
necessary for compliance.
The finished product is required to comply with all applicable FCC equipment
authorizations regulations,
requirements and equipment functions not associated with the
transmitter module portion. For
example, compliance must be demonstrated to regulations
for other transmitter components within the
host product; to requirements for unintentional
radiators (Part 15 Subpart B “Unintentional Radiators”),
such as digital devices, computer
peripherals, radio receivers, etc.; and to additional authorization
requirements for the non‐
transmitter functions on the transmitter module (i.e., Verification, or
Declaration of
Conformity) (e.g., transmitter modules may also contain digital logic functions) as
appropriate.
A.2.1 LABELING AND USER INFORMATION REQUIREMENTS
The BM20/BM23 module has been labeled with its own FCC ID number, and if the FCC ID is
not visible when
the module is installed inside another device, then the outside of the
finished product into which the
module is installed must also display a label referring to the
enclosed module. This exterior label can use
wording as follows:
For BM20 Module:
Contains Transmitter Module FCC ID:
A8TBM20SPKXYNBZ
or
Contains FCC ID:
A8TBM20SPKXYNBZ
This device complies with Part 15 of the FCC Rules. Operation
is subject to the
following two conditions: (1) this device may
not cause harmful interference,
and (2) this device must accept
any interference received, including
interference that may
cause undesired operation
For BM23 Module:
Contains Transmitter Module FCC ID:
A8TBM23SPKXYC2A
or
Contains FCC ID:
A8TBM23SPKXYC2A
This device complies with Part 15 of the FCC Rules. Operation
is subject to the
following two conditions: (1) this device may
not cause harmful interference,
and (2) this device must accept
any interference received, including
interference that may
cause undesired operation
A user’s manual for the finished product should include the following statement:
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This equipment has been tested and found to comply with the limits for a
Class B digital
device, pursuant to part 15 of the FCC Rules. These limits are
designed to provide
reasonable protection against harmful interference in a
residential installation. This
equipment generates, uses and can radiate radio
frequency energy, and if not installed
and used in accordance with the
instructions, may cause harmful interference to radio
communications.
However, there is no guarantee that interference will not occur in a
particular
installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off
and on, the
user is encouraged to try to correct the interference by one or
more of the following
measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from
that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
Additional information on labeling and user information requirements for Part 15 devices can be
found
in KDB Publication 784748 available at the FCC Office of Engineering and Technology (OET)
Laboratory
Division Knowledge Database (KDB) http://apps.fcc.gov/oetcf/kdb/index.cfm.
A.2.2 RF EXPOSURE
All transmitters regulated by FCC must comply with RF exposure requirements. KDB 447498
General RF
Exposure Guidance provides guidance in determining whether proposed or existing
transmitting
facilities, operations or devices comply with limits for human exposure to Radio
Frequency (RF) fields
adopted by the Federal Communications Commission (FCC).
From the FCC Grant: Output power listed is conducted. This grant is valid only when the module is
sold
to OEM integrators and must be installed by the OEM or OEM integrators. This transmitter is
restricted
for use with the specific antenna(s) tested in this application for Certification and must
not be co‐located
or operating in conjunction with any other antenna or transmitters within a host
device, except in
accordance with FCC multi‐transmitter product procedures.
A.2.3 HELPFUL WEB SITES
Federal Communications Commission (FCC): http://www.fcc.gov
FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB):
http://apps.fcc.gov/oetcf/kdb/index.cfm
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A.3 Canada
The BM20/BM23 module has been certified for use in Canada under Industry Canada (IC) Radio
Standards Specification (RSS) RSS-247 and RSS-Gen. Modular approval permits the installation of a
module in a host device without the need to recertify the device.
A.3.1 LABELING AND USER INFORMATION REQUIREMENTS
Labeling Requirements for the Host Device (from Section 3.1, RSS-Gen, Issue 4, November 2014):
The host device shall be properly labeled to identify the module within the host device.
The Industry Canada certification label of a module shall be clearly visible at all times when installed in
the host device, otherwise the host device must be labeled to display the Industry Canada certification
number of the module, preceded by the words "Contains transmitter module", or the word
"Contains", or similar wording expressing the same meaning, as follows:
For BM20 Module:
Contains transmitter module IC: 12246A-BM20SPKS1
For BM23 Module:
Contains transmitter module IC: 12246A-BM23SPKXYC2
User Manual Notice for License-Exempt Radio Apparatus (from Section 8.4, RSS-Gen, Issue 4,
November 2014): User manuals for license-exempt radio apparatus shall contain the following or
equivalent notice in a conspicuous location in the user manual or alternatively on the device or
both:
This device complies with Industry Canada license‐exempt RSS standard(s). Operation is
subject to the following two conditions: (1) this device may not cause interference, and
(2) this device must accept any interference, including interference that may cause
undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils
radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1)
l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter
tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en
compromettre le fonctionnement.
Transmitter Antenna (from Section 7.1.2 RSS‐Gen, Issue 3, December 2010): User
manuals for
transmitters shall display the following notice in a conspicuous location:
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Under Industry Canada regulations, this radio transmitter may only operate
using an
antenna of a type and maximum (or lesser) gain approved for the
transmitter by
Industry Canada. To reduce potential radio interference to
other users, the antenna
type and its gain should be so chosen that the
equivalent isotropically radiated power
(e.i.r.p.) is not more than that
necessary for successful communication.
Conformément à la réglementation d'Industrie Canada, le présent émetteur
radio peut
fonctionner avec une antenne d'un type et d'un gain maximal (ou
inférieur) approuvé
pour l'émetteur par Industrie Canada. Dans le but de
réduire les risques de brouillage
radioélectrique à l'intention des autres
utilisateurs, il faut choisir le type d'antenne et
son gain de sorte que la
puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse
pas l'intensité
nécessaire à l'établissement d'une communication satisfaisante.
The above notice may be affixed to the device instead of displayed in the user manual.
A.3.2 RF EXPOSURE
All transmitters regulated by IC must comply with RF exposure requirements listed in RSS‐102 ‐ Radio
Frequency (RF) Exposure Compliance of Radio communication Apparatus (All Frequency Bands).
A.3.3 WEB SITES
Industry Canada: http://www.ic.gc.ca/
A.4 Europe
The BM20/BM23 module is an R&TTE Directive assessed radio module that is CE
marked and has
been manufactured and tested with the intention of being integrated
into a final product.
The BM20/BM23 module has been tested to R&TTE Directive 1999/5/EC Essential
Requirements for Health and
Safety (Article (3.1(a)), Electromagnetic Compatibility (EMC)
(Article 3.1(b)), and Radio (Article 3.2) and
are summarized in Table A‐1/Table A-2:
European Compliance Testing. A Notified Body Opinion has also been
issued.
The R&TTE Compliance Association provides guidance on modular devices in
document Technical
Guidance Note 01 available at
http://www.rtteca.com/html/download_area.htm.
Note: To maintain conformance to the testing listed in Table A‐1/ Table A-2: European
Compliance Testing, the module shall be installed in accordance with the installation instructions
in this data sheet and shall
not be modified.
When integrating a radio module into a completed product the integrator becomes the
manufacturerof the final product and is therefore responsible for demonstrating
compliance of the final product
with the essential requirements of the R&TTE Directive.
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A.4.1 ABELING AND USER INFORMATION REQUIREMENTS
The label on the final product which contains the BM23 module must follow CE
marking requirements.
The R&TTE Compliance Association Technical Guidance Note 01
provides guidance on final product CE
marking.
A.4.2 ANTENNA REQUIREMENTS
From R&TTE Compliance Association document Technical Guidance Note 01:
Provided the integrator installing an assessed radio module with an integral or specific
antenna
and installed in conformance with the radio module manufacturer’s installation
instructions
requires no further evaluation under Article 3.2 of the R&TTE Directive and
does not require
further involvement of an R&TTE Directive Notified Body for the final
product. [Section 2.2.4]
The European Compliance Testing listed in Table A‐1 and Table A-2 was performed
using the integral PCB antenna.
TABLE A‐1: EUROPEAN COMPLIANCE TESTING (BM20)
Certification
Standards
Article
Laboratory
Report Number
Safety
EN 60950-1:2006 / A11:2009 /
A1:2010 / A12:2011 / A2:2013
(3.1(a))
TUV Rheinland,
Taiwan
10050720 002
Health
EN 300 328 V1.9.1 / EN
62479:2010
10050932 002
EMC
EN 301 489-1 V1.9.2
(3.1(b))
10050691 002
EN 301 489-17 V2.2.1
Radio
EN 300 328 V1.9.1
(3.2)
10050932 002
Notified Body
Opinion
10048933 001
TABLE A‐2: EUROPEAN COMPLIANCE TESTING (BM23)
Certification
Standards
Article
Laboratory
Report Number
Safety
EN 60950-1:2006 / A11:2009 /
A1:2010 / A12:2011
(3.1(a))
TUV Rheinland,
Taiwan
10047732 001
Health
EN 300 328 V1.9.1 / EN
62479:2010
10048076 001 &
10048076 002
EMC
EN 301 489-1 V1.9.2
(3.1(b))
10047659 001
EN 301 489-17 V2.2.1
Radio
EN 300 328 V1.9.1
(3.2)
10048076 001 &
10048076 002
Notified Body
Opinion
10048934 001
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A.4.3 HELPFUL WEB SITES
A document that can be used as a starting point in understanding the use of Short Range
Devices (SRD)
in Europe is the European Radio Communications Committee (ERC)
Recommendation 70-03 E, which can
be downloaded from the European Radio
Communications Office (ERO) at: http://www.ero.dk/.
Additional helpful web sites are:
• Radio and Telecommunications Terminal Equipment (R&TTE):
http://ec.europa.eu/enterprise/rtte/index_en.htm
• European Conference of Postal and Telecommunications Administrations (CEPT):
http://www.cept.org
• European Telecommunications Standards Institute (ETSI):
http://www.etsi.org
• European Radio Communications Office (ERO):
http://www.ero.dk
• The Radio and Telecommunications Terminal Equipment Compliance Association
(R&TTE CA):
http://www.rtteca.com/
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A.5 Japan
The BM20/BM23 module has received type certification and is labeled with its own
technical
conformity mark and certification number as required to conform to the technical
standards regulated
by the Ministry of Internal Affairs and Communications (MIC) of
Japan pursuant to the Radio Act of
Japan.
Integration of this module into a final product does not require additional radio certification
provided
installation instructions are followed and no modifications of the module are
allowed. Additional testing
may be required:
• If the host product is subject to electrical appliance safety (for example, powered
from an AC
mains), the host product may require Product Safety Electrical
Appliance and Material (PSE)
testing. The integrator should contact their
conformance laboratory to determine if this testing
is required.
• There is an voluntary Electromagnetic Compatibility (EMC) test for the
host product
administered by VCCI: http://www.vcci.jp/vcci_e/index.html
A.5.1 LABELING AND USER INFORMATION REQUIREMENTS
The label on the final product which contains the BM20/BM23 module must follow
Japan marking
requirements. The integrator of the module should refer to the
labeling requirements for Japan
available at the Ministry of Internal Affairs and
Communications (MIC) website.
The BM20/BM23 module is labeled with its own technical conformity mark and certification
number. The final
product in which this module is being used must have a label referring to
the type certified module
inside:
For BM20 Module:
Contains transmitter module with certificate number:
For BM23 Module:
Contains transmitter module with certificate number:
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A.5.2 HELPFUL WEB SITES
Ministry of Internal Affairs and Communications (MIC):
http://www.tele.soumu.go.jp/e/index.htm
Association of Radio Industries and Businesses
(ARIB): http://www.arib.or.jp/english/
A.6 Korea
The BM20/ BM23 module has received certification of conformity in accordance with the
Radio
Waves Act. Integration of this module into a final product does not require additional
radio certification
provided installation instructions are followed and no modifications of the
module are allowed.
A.6.1 LABELING AND USER INFORMATION REQUIREMENTS
The label on the final product which contains the BM20/ BM23 module must follow KC
marking requirements.
The integrator of the module should refer to the labeling requirements for Korea available on
the Korea Communications Commission (KCC) website.
The BM20/ BM23 module is labeled with its own KC mark. The final product requires the
KC mark and
certificate number of the module:
For BM20 Module:
For BM23 Module:
A.6.2 HELPFUL WEB SITES
Korea Communications Commission (KCC): http://www.kcc.go.kr
National Radio Research
Agency (RRA): http://rra.go.kr
MSIP-CRM-mcp-BM20SPKS1NBC
MSIP-CRM-S9S-BM23SPKXY
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A.7 Taiwan
The BM20/BM23 module has received compliance approval in accordance with the
Telecommunications Act. Customers seeking to use the compliance approval in their product
should
contact Microchip Technology sales or distribution partners to obtain a Letter of
Authority.
Integration of this module into a final product does not require additional radio certification
provided installation instructions are followed and no modifications of the module are
allowed.
A.7.1 LABELING AND USER INFORMATION REQUIREMENTS
The BM20/BM23 module is labeled with its own NCC mark and certificate number as below:
For BM20 Module:
For BM23 Module:
The user’s manual should contain below warning (for RF device) in traditional Chinese:
注意 !
依據
低功率電波輻射性電機管理辦法
第十二條
經型式認證合格之低功率射頻電機，非經許可，
公司
、商號或使用者均不得擅自變更頻率、加大功率或變更原設計
之
特性及功能。
第十四條
低功率射頻電機之使用不得影響飛航安全及干擾合法通信；
經發現有干擾現象時，應立
即停用，並改善至無干擾時方得繼續使用。
前項合法通信，指依電信規定作業之無線電信。
低
功率射頻電機須忍受合法通信或工業、科學及醫療用電波輻射性
電機設備之干擾。
A.7.2 HELPFUL WEB SITES
National Communications Commission (NCC): http://www.ncc.gov.tw
CCAN15LP0460T2
CCAL15LP0270T3
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A.8 China
The BM20 module has received certification of conformity in accordance with the China MIIT
Notice 2014-01 of State Radio Regulation Committee (SRRC) certification scheme.
Integration of this module into a final product does not require additional radio certification,
provided installation instructions are followed and no modifications of the module are allowed.
The BM23 module has received certification of conformity in accordance with the China MIIT
Notice 2014-01 of State Radio Regulation Committee (SRRC) certification scheme.
Integration of this module into a final product does not require additional radio certification,
provided installation instructions are followed and no modifications of the module are allowed.
A.8.1 LABELING AND USER INFORMATION REQUIREMENTS
The BM20 module is labeled with its own CMIIT ID as follows:
When Host system is using an approved Full Modular Approval (FMA) radio: The host should
bear a label containing the statement “This device contains SRRC approved Radio module
CMIIT ID XXXXYYZZZZ”.
The BM23 module is labeled with its own CMIIT ID as follows:
When Host system is using an approved Full Modular Approval (FMA) radio: The host
should bear a label containing the statement “This device contains SRRC approved
Radio module CMIIT ID XXXXYYZZZZ”.
A.9 Other Regulatory Jurisdictions
Should other regulatory jurisdiction certification be required by the customer, or
the customer need to recertify the module for other reasons, contact Microchip
for the required utilities and documentation.
CMIIT ID: 2015DJ7134
CMIIT ID: 2016DJ3553
Worldwide Sales and Service
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China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
ASIA/PACIFIC
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Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
India - Pune
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Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
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Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
EUROPE
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Dusseldorf
Tel: 49-2129-3766400
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Pforzheim
Tel: 49-7231-424750
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Venice
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
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Poland - Warsaw
Tel: 48-22-3325737
Spain - Madrid
Tel: 34-91-708-08-90
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Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
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