MPLAD6.5KP10A(e3) –
MPLAD6.5KP48CA(e3)
Available 6.5 kW, U nidirection al and Bidir e ctional
TVS Protection Device
High-Reliability
screening available
in reference to
MIL-PRF-19500
DESCRIPTION
These 6.5 kW rated transient voltage suppressors (TVS) in a surface mou nt PLAD pac kag e are provided
with design features to minimize thermal resistance and cumulative heating. These devices have the
ability to clamp dangerous high voltage, short term transients such as those produced by directed or
radiated electrostatic discharge phenomena before entering sensitive component regions of a circuit
design. Typical applications include lighting and automotive load dump protection. They are particularly
effective at meeting the multi-stroke lightni ng stan dard RT C A DO-160, section 22 for aircraft design.
This efficient low profile package design is offered in standoff voltage selections (VWM) of 10 volt to 48
volts in either unidir e ctio nal or bidirectional cons tr uc tion . This product addition expands High reliable
PLAD product portfolio. For more information on PLAD products, broad range of TVS devices please
visit our website.
Tested in
accorda nc e with th e
requirements of
AEC-Q101
mini-PLAD
(The cathode is the heatsink
under the body of this device.)
Important: For the latest information, visit our website http://www.microsemi.com.
FEATURES
• Available in both unidirectional and bidir ect ion al con struction (bidirectional with CA suffix).
• High reliability with wafer fabrication and assembly lot traceability.
• All parts surge tested.
• Low profile surface mount package.
• Optional upscreening is available with various screening and conformance inspection options based
on MIL-PRF-19500. Refer to Hi-Rel Non-Hermetic Products brochure on our web site for more
details on the screening options.
• Suppresses transients up to 6,500 W @ 10/1000 μs (see figure 1).
• Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020.
• 3σ lot norm screening performed on standby current (ID).
• RoHS compliant (2002/95/EC) devices available.
• Halogen free (IEC 61249-2-21)
APPLICATIONS / BENEFITS
• Protect ion from swit ching tr an sien ts and indu ced RF.
• Protection from ESD, and EFT per IEC 61000-4-2 and IEC 61000-4-4.
• Secondary lightning protection per IEC 61000-4-5 with 42 ohms source impedan ce:
Class 1,2,3,4,5: MPLAD6.5KP10A to 48CA
• Secondary lightning protection per IEC 61000-4-5 with 12 ohms source impedan ce:
Class 1,2,3,4: MPLAD6.5KP10A to 48CA
• Secondary lightning protection per IEC 61000-4-5 with 2 ohms source impedance:
Class 2,3: MPLAD6.5KP10A to 48CA
Class 4: MPLAD6.5KP10A to 22CA
• Pin injection protection per RTCA/DO-160F for Waveform 4 (6.4/69 μs at 25 ºC)*:
Level 1,2,3,4: MPLAD6.5KP10A to 48CA
Level 5: MPLAD6.5K P10A to 43CA
• Pin injection protection per RTCA/DO-160F for Waveform 5A (40/120 μs at 25 ºC)*:
Level 1 and 2: MPLAD6.5KP10A to 48CA
Level 3: MPLAD6.5KP10A to 36CA
Level 4: MPLAD6.5KP10A to 12CA
• IPP rating of 40. 1 amps to 383 amps.
• VWM rating of 10 volts to 48 volts.
• V(BR)(min) range of 11.1 volts to 53.3 volts.
• VC(MAX) rating of 17 volts to 77.4 volts
*See MicroNote 132 for further temperature derating selection.
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
RF01083, Rev B (24/6/15) ©2015 Microsemi Corporation Page 1 of 6
MPLAD6.5KP10A(e3) –
MPLAD6.5KP48CA(e3)
MAXIMUM RATINGS @ 25 oC unless otherwise specified
Parameters/Test Conditions
Symbol
Value
Unit
Junction and Storage Temperature
TJ and TSTG
-55 to +150
ºC/W
Thermal Resi stan ce Jun cti on-to-Ambient (1)
RӨJA
50
ºC/W
Thermal Resi stan ce Jun cti on-to-Case
RӨJC
1.5
ºC/W
Peak Pulse Power @ 10/1000 µs (2)
PPP
6,500
W
tclamping (0 volts to V(BR) min) Unidirectional
Bidirectional
<100
<5
ps
ns
Forward Clamping Voltage @ 300 Amps (3)
VFS
2.5
V
Forward Surge Current (3)
IFSM
400
A
Solder Temperature @ 10 s
TSP
260
ºC
Rated Average Power dissipation
(5)
TA = 25 °C
TC = 100 °C
PM(AV) 2.5
(1)
33.3
(4)
W
W
Notes: 1 . When mounted on FR4 PC board with recommended mounting pad (see pad layout).
2. Also see figures 1 and 2. With impulse repetition rate (duty factor) of 0.05% or less.
3. At 8.3 ms half-sine wave (unidirectional devices onl y).
4. Case tem perature c ontroll ed on heat sink as specified.
5. See MicroNot e 134 for derati ng PPP when also applying steady-state power.
MECHANICAL and PACKAGING
• CASE: Epoxy, meets UL94V-0.
• TERMINALS: Tin/lead or matte-tin (fully RoHS com pli ant) plating.
• MARKING: Part number.
• DELIVERY option: Tape and reel (13 inch).
• See Package Dimensions on last page.
PART NOMENCLATURE
M PLAD 6.5K P 7.0 CA (e3)
Reliability Level*
M
MA
MX
MXL
*(see Hi-Rel Non-Hermetic
Product Portfolio)
Package Designation
PPP Rating (W)
RoHS Compli ance
e3 = RoHS compliant
Blank = non-RoHS compliant
Polarity
A = Unidirectional
CA = Bidirectional
Reverse Standoff Voltage
Plastic
RF01083, Rev B (24/6/15) ©2015 Microsemi Corporation Page 2 of 6
MPLAD6.5KP10A(e3) –
MPLAD6.5KP48CA(e3)
SYMBOLS & DEFINITIONS
Symbol
Definition
I(BR)
Breakdown Current: The current used for measuring breakdown voltage V(BR).
ID
Standby Current: The current at the rated standoff voltage VWM.
I
PP
Peak Impulse Current: The peak current during the impulse.
V(BR)
Breakdown Voltage: The minimum voltage the device will exhibit at a specified current.
VC
Clamping Voltage: Clamping voltage at I
PP
(peak pulse current) at the specified pulse conditions (typically shown as
maximum value).
VWM
Rated Working Standoff Voltage: The maximum peak voltage that can be applied over the operating temperature
range.
αV(BR)
Temperature Coefficient of Breakdown Voltage: The change in breakdown voltage divided by change in temperature.
ELECTRICAL CHARACTERISTICS @ 25 ºC unless otherwise stated
DEVICE*
REVERSE
STAND-
OFF
VOLTAGE
VWM
BREAKDOWN
VOLTAGE V(BR)
V(BR) @ I(BR)
MAXIMUM
CLAMPING
VOLTAGE
VC @ IPP
MAXIMUM
STANDBY
CURRENT
ID @ VWM
MAXIMUM PEAK
PULSE
CURRENT
(FIG. 2)
IPP
MAXIMUM
TEMPERATURE
COEFFICIENT
OF V(BR)
αV(BR)
Volts
Volts
mA
Volts
µA
Amps
mV/°C
MPLAD6.5KP10A(e3)
10
11.1 - 12.3
5
17.0
15
383
9
MPLAD6.5KP11A(e3)
11
12.2 - 13.5
5
18.2
10
358
10
MPLAD6.5KP12A(e3)
12
13.3 - 14.7
5
19.9
10
327
11
MPLAD6.5KP13A(e3)
13
14.4 - 15.9
5
21.5
10
302
12
MPLAD6.5KP14A(e3)
14
15.6 - 17.2
5
23.2
10
280
13
MPLAD6.5KP15A(e3)
15
16.7 - 18.5
5
24.4
10
267
15
MPLAD6.5KP16A(e3)
16
17.8 - 19.7
5
26.0
10
250
16
MPLAD6.5KP17A(e3)
17
18.9 - 20.9
5
27.6
10
236
18
MPLAD6.5KP18A(e3)
18
20.0 - 22.1
5
29.2
10
223
19
MPLAD6.5KP20A(e3)
20
22.2 - 24.5
5
32.4
10
202
22
MPLAD6.5KP22A(e3)
22
24.4 - 26.9
5
35.5
10
183
24
MPLAD6.5KP24A(e3)
24
26.7 - 29.5
5
38.9
10
167
27
MPLAD6.5KP26A(e3)
26
28.9 - 31.9
5
42.1
10
154
29
MPLAD6.5KP28A(e3)
28
31.1 - 34.4
5
45.5
10
143
30
MPLAD6.5KP30A(e3)
30
33.3 - 36.8
5
48.4
10
135
35
MPLAD6.5KP33A(e3)
33
36.7 - 40.6
5
53.3
10
123
38
MPLAD6.5KP36A(e3)
36
40.0 - 44.2
5
58.1
10
111
40
MPLAD6.5KP40A(e3)
40
44.4 - 49.1
5
64.5
10
101
45
MPLAD6.5KP43A(e3)
43
47.8 - 52.8
5
69.4
10
93
49
MPLAD6.5KP45A(e3)
45
50.0 – 55.3
5
72.7
10
89
51
MPLAD6.5KP48A(e3)
48
53.3 – 58.9
5
77.4
10
85
54
* See part nomenclature for additional screening prefixes.
RF01083, Rev B (24/6/15) ©2015 Microsemi Corporation Page 3 of 6
MPLAD6.5KP10A(e3) –
MPLAD6.5KP48CA(e3)
GRAPHS
tp – Pulse Time – sec
FIGURE 1
Peak Pulse Power vs. Pulse Time
(to 50% of exponentially decaying pulse)
Test waveform parameters: tr = 10 µs, tp = 1000 µs
FIGURE 2
Pulse Waveform
I
PP
Peak Pulse Current - % I
PP
P
PP
– Peak Pulse Power – kW
RF01083, Rev B (24/6/15) ©2015 Microsemi Corporation Page 4 of 6
MPLAD6.5KP10A(e3) –
MPLAD6.5KP48CA(e3)
GRAPHS (continued)
TL Lead Temperature ºC
FIGURE 3
Derating Curve
PPP Peak Pulse Power - % PPP
RF01083, Rev B (24/6/15) ©2015 Microsemi Corporation Page 5 of 6
MPLAD6.5KP10A(e3) –
MPLAD6.5KP48CA(e3)
PACKAGE DIMENSIONS
PAD LAYOUT
Ref.
Dimensions
Inch
Millimeters
Min
Max
Min
Max
A1
0.339
0.355
8.61
9.02
A2
0.279
0.295
7.09
7.49
B
0.119
0.135
3.02
3.43
C
0.438
0.454
11.13
11.53
D
0.094
0.110
2.39
2.79
G
0.064
0.080
1.63
2.03
H
0.024
0.040
0.61
1.02
J
0.008
0.012
0.20
0.30
Ref.
Dimensions
Inch
Millimeters
Typical
Typical
A
0.357
9.08
B
0.117
2.97
C
0.080
2.03
D
0.033
0.84
RF01083, Rev B (24/6/15) ©2015 Microsemi Corporation Page 6 of 6
