Product Folder Sample & Buy Technical Documents Tools & Software Support & Community bq771800, bq771801, bq771802 bq771803, bq771807, bq771808 bq771809, bq771815 SLUSAX1D - DECEMBER 2012 - REVISED NOVEMBER 2014 bq7718xy Overvoltage Protection for 2-Series to 5-Series Cell Li-Ion Batteries with Internal Delay Timer 1 Features 3 Description * The bq7718xy family of products provides an overvoltage monitor and protector for Li-Ion battery pack systems. Each cell is monitored independently for an overvoltage condition. For quicker productionline testing, the bq7718xy device provides a Customer Test Mode (CTM) with greatly reduced delay time. 1 * * * * * * 2-, 3-, 4-, and 5-Series Cell Overvoltage Protection Internal Delay Timer Fixed OVP Threshold High-Accuracy Overvoltage Protection: 10 mV Low Power Consumption ICC 1 A (VCELL(ALL) < VPROTECT) Low Leakage Current Per Cell Input < 100 nA Small Package Footprint - 8-pin QFN (3.00 mm x 4.00 mm) 2 Applications * Protection in Li-Ion Battery Packs in: - Power Tools - UPS Battery Backup - Light Electric Vehicles (eBike, eScooter, Pedal Assist Bicycles) In the bq7718xy device, an internal delay timer is initiated upon detection of an overvoltage condition on any cell. Upon expiration of the delay timer, the output is triggered into its active state (either high or low depending on the configuration). Device Information Table(1) PART NUMBER PACKAGE BODY SIZE (NOM) bq771800 QFN (8) 3.00 mm x 4.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet and the Device Comparison Table. 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA. bq771800, bq771801, bq771802 bq771803, bq771807, bq771808 bq771809, bq771815 SLUSAX1D - DECEMBER 2012 - REVISED NOVEMBER 2014 www.ti.com Table of Contents 1 2 3 4 5 6 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device Comparison Table..................................... Pin Configuration and Functions ......................... 6.1 Pin Details ................................................................. 4 10.1 Application Information.......................................... 11 10.2 Typical Applications .............................................. 12 10.3 Customer Test Mode ............................................ 12 7 Specifications......................................................... 6 11 Device and Documentation Support ................. 16 7.1 Absolute Maximum Ratings ..................................... 7.2 Handling Ratings ...................................................... 7.3 Recommended Operating Conditions...................... 7.4 Thermal Information .................................................. 7.5 DC Characteristics ................................................... 8 1 1 1 2 3 4 6 6 6 6 7 Typical Characteristics.......................................... 9 9 Detailed Description ............................................ 10 9.1 Overview ................................................................. 10 9.2 Functional Block Diagram ....................................... 10 10 Application and Implementation........................ 11 11.1 11.2 11.3 11.4 Related Links ........................................................ Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 16 16 16 16 12 Mechanical, Packaging, and Orderable Information ........................................................... 16 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision C (August 2014) to Revision D Page * Added the bq771815 device to Production Data.................................................................................................................... 3 * Changed the Handling Ratings table ..................................................................................................................................... 6 * Added note to the Application and Implementation section ................................................................................................ 11 Changes from Revision B (October 2013) to Revision C Page * Changed the data sheet format ............................................................................................................................................. 1 * Added the bq771807 device to Production Data.................................................................................................................... 3 Changes from Revision A (September 2013) to Revision B * Page Added the bq771809 device to Production Data.................................................................................................................... 3 Changes from Original (December 2012) to Revision A * 2 Page Added the bq771808 device to Production Data.................................................................................................................... 3 Submit Documentation Feedback Copyright (c) 2012-2014, Texas Instruments Incorporated Product Folder Links: bq771800 bq771801 bq771802 bq771803 bq771807 bq771808 bq771809 bq771815 bq771800, bq771801, bq771802 bq771803, bq771807, bq771808 bq771809, bq771815 www.ti.com 5 SLUSAX1D - DECEMBER 2012 - REVISED NOVEMBER 2014 Device Comparison Table TA -40C to 110C OVP (V) OV Hysteresis (V) Output Delay Output Drive Tape and Reel (Large) Tape and Reel (Small) bq771800 4.300 0.300 4s CMOS Active High bq771800DPJR bq771800DPJT bq771801 4.275 0.050 3s NCH Active Low, Open Drain bq771801DPJR bq771801DPJT bq771802 4.225 0.300 1s NCH Active Low, Open Drain bq771802DPJR bq771802DPJT bq771803 4.275 0.050 1s NCH Active Low, Open Drain bq771803DPJR bq771803DPJT bq771804 (1) 4.225 0.300 3s CMOS Active High bq771804DPJR bq771804DPJT bq771805 (1) 4.325 0.300 3s CMOS Active High bq771805DPJR bq771805DPJT bq771806 (1) 4.350 0.300 3s CMOS Active High bq771806DPJR bq771806DPJT bq771807 4.450 0.300 3s CMOS Active High bq771807DPJR bq771807DPJT 4.200 0.050 1s NCH Active Low bq771808DPJR bq771808DPJT bq771809DPJR bq771809DPJT Part Number bq771808 Package 8-Pin QFN Package Designator DPJ bq771809 4.200 0.050 1s CMOS Active High bq771810 (1) 4.200 0.250 1s CMOS Active High bq771810DPJR bq771810DPJT bq771811 (1) 4.225 0.050 1s CMOS Active High bq771811DPJR bq771811DPJT bq771812 (1) 4.250 0.050 1s CMOS Active High bq771812DPJR bq771812DPJT bq771813 (1) 4.250 0.050 1s CMOS Active High bq771813DPJR bq771813DPJT bq771814 (1) 3.900 0.300 3s CMOS Active High bq771814DPJR bq771814DPJT bq771815 4.225 0.050 1s NCH Active Low bq771815DPJR bq771815DPJT bq771816 (1) 4.250 0.050 1s NCH Active Low bq771816DPJR bq771816DPJT 1s NCH, Active Low, Open Drain bq7718xyDPJR bq7718xyDPJT bq7718xy (2) (1) (2) 3.850-4.650 0-0.300 Product Preview only. Future option, contact TI. Copyright (c) 2012-2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: bq771800 bq771801 bq771802 bq771803 bq771807 bq771808 bq771809 bq771815 3 bq771800, bq771801, bq771802 bq771803, bq771807, bq771808 bq771809, bq771815 SLUSAX1D - DECEMBER 2012 - REVISED NOVEMBER 2014 www.ti.com 6 Pin Configuration and Functions VDD 1 8 OUT V5 2 7 VSS V4 3 6 V1 V3 4 5 V2 Pin Functions bq7718xy Pin Name Type I/O 1 VDD P Power supply Description 2 V5 I Sense input for positive voltage of the fifth cell from the bottom of the stack 3 V4 I Sense input for positive voltage of the fourth cell from the bottom of the stack 4 V3 I Sense input for positive voltage of the third cell from the bottom of the stack 5 V2 I Sense input for positive voltage of the second cell from the bottom of the stack 6 V1 I Sense input for positive voltage of the lowest cell in the stack 7 VSS P Electrically connected to IC ground and negative terminal of the lowest cell in the stack 8 OUT O Output drive for overvoltage fault signal 6.1 Pin Details In the bq7718xy device, each cell is monitored independently. Overvoltage is detected by comparing the actual cell voltage to a protection voltage reference, VOV. If any cell voltage exceeds the programmed OV value, a timer circuit is activated. When the timer expires, the OUT pin goes from inactive to active state. Cell Voltage (V) (V5-V4, V4-V3, V 3-V2, V2-V1, V1-VSS) For NCH Open Drain Active Low configurations, the OUT pin pulls down to VSS when active (OV present) and is high impedance when inactive (no OV). VOV VOV -VHYS tDELAY OUT (V) Figure 1. Timing for Overvoltage Sensing 6.1.1 Sense Positive Input for Vx This is an input to sense each single battery cell voltage. A series resistor and a capacitor across the cell for each input is required for noise filtering and stable voltage monitoring. 4 Submit Documentation Feedback Copyright (c) 2012-2014, Texas Instruments Incorporated Product Folder Links: bq771800 bq771801 bq771802 bq771803 bq771807 bq771808 bq771809 bq771815 bq771800, bq771801, bq771802 bq771803, bq771807, bq771808 bq771809, bq771815 www.ti.com SLUSAX1D - DECEMBER 2012 - REVISED NOVEMBER 2014 Pin Details (continued) 6.1.2 Output Drive, OUT This pin serves as the fault signal output, and may be ordered in either active HIGH or LOW options. 6.1.3 Supply Input, VDD This pin is the unregulated input power source for the IC. A series resistor is connected to limit the current, and a capacitor is connected to ground for noise filtering. Copyright (c) 2012-2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: bq771800 bq771801 bq771802 bq771803 bq771807 bq771808 bq771809 bq771815 5 bq771800, bq771801, bq771802 bq771803, bq771807, bq771808 bq771809, bq771815 SLUSAX1D - DECEMBER 2012 - REVISED NOVEMBER 2014 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings Over-operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage range VDD-VSS -0.3 30 V Input voltage range V5-VSS or V4-VSS or V3-VSS or V2-VSS or V1-VSS -0.3 30 V Output voltage range OUT-VSS -0.3 30 V Continuous total power dissipation, PTOT See package dissipation rating. Functional temperature -40 110 C Storage temperature range, TSTG -65 150 C Lead temperature (soldering, 10 s), TSOLDER 300 (1) C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 Handling Ratings TSTG V(ESD) Rating (1) (2) Storage temperature range Electrostatic discharge Human body model (HBM) ESD stress voltage (1) Charged device model (CDM) ESD stress voltage (2) MIN MAX -65 150 UNIT C -2 2 kV -500 500 V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions Over-operating free-air temperature range (unless otherwise noted) Supply voltage, VDD (1) Input voltage range V5-V4 or V4-V3 or V3-V2 or V2-V1 or V1-VSS Operating ambient temperature range, TA (1) MIN MAX UNIT 3 25 V 0 5 V -40 110 C See Typical Applications. 7.4 Thermal Information THERMAL METRIC (1) bq7718xy 8 PINS RJA Junction-to-ambient thermal resistance 56.6 RJCtop Junction-to-case(top) thermal resistance 56.4 RJB Junction-to-board thermal resistance 30.6 JT Junction-to-top characterization parameter 1.0 JB Junction-to-board characterization parameter 37.8 RJCbot Junction-to-case(bottom) thermal resistance 11.3 (1) 6 UNITS C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright (c) 2012-2014, Texas Instruments Incorporated Product Folder Links: bq771800 bq771801 bq771802 bq771803 bq771807 bq771808 bq771809 bq771815 bq771800, bq771801, bq771802 bq771803, bq771807, bq771808 bq771809, bq771815 www.ti.com 7.5 SLUSAX1D - DECEMBER 2012 - REVISED NOVEMBER 2014 DC Characteristics Typical values stated where TA = 25C and VDD = 18 V, MIN/MAX values stated where TA = -40C to 110C and VDD = 3 V to 25 V (unless otherwise noted). SYMBOL PARAMETER CONDITION MIN TYP MAX UNIT Voltage Protection Threshold VCx bq771800 4.300 V bq771801 4.275 V bq771803 4.275 V bq771802 4.225 V (1) 4.225 V bq771805 (1) 4.325 V bq771806 (1) 4.350 V bq771807 4.450 V bq771808 4.200 V bq771809 4.200 V (1) 4.200 V bq771811 (1) 4.225 V bq771812 (1) 4.250 V bq771813 (1) 4.250 V (1) bq771804 V(PROTECT) Overvoltage Detection VOV bq771810 bq771814 VHYS OV Detection Hysteresis 3.900 V bq771815 4.225 V bq771816 (1) 4.250 V bq771800 250 300 400 bq771801 0 50 100 V bq771802 250 300 400 mV bq771803 0 50 100 V bq771804 (1) 250 300 400 mV bq771805 (1) 250 300 400 mV bq771806 (1) 250 300 400 mV bq771807 250 300 400 mV bq771808 0 50 100 V bq771809 0 50 100 V bq771810 OV Detection Accuracy VOADRIFT OV Detection Accuracy Across Temperature (1) 200 250 250 mV bq771811 (1) 0 50 100 V bq771812 (1) 0 50 100 V bq771813 VOA mV (1) 0 50 100 V bq771814 (1) 250 300 400 mV bq771815 0 50 100 V bq771816 (1) 0 50 100 V TA = 25C -10 10 mV TA = -40C -40 44 mV TA = 0C -20 20 mV TA = 60C -24 24 mV TA = 110C -54 54 mV 2 A 0.1 A Supply and Leakage Current ICC Supply Current (V5-V4) = (V4-V3) = (V3-V2) = (V2-V1) = (V1-VSS) = 4.0 V (See Figure 12.) IIN Input Current at Vx Pins (V5-V4) = (V4-V3) = (V3-V2) = (V2-V1) = (V1-VSS) = 4.0 V (See Figure 12.) (1) 1 -0.1 Product Preview only. Copyright (c) 2012-2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: bq771800 bq771801 bq771802 bq771803 bq771807 bq771808 bq771809 bq771815 7 bq771800, bq771801, bq771802 bq771803, bq771807, bq771808 bq771809, bq771815 SLUSAX1D - DECEMBER 2012 - REVISED NOVEMBER 2014 www.ti.com DC Characteristics (continued) Typical values stated where TA = 25C and VDD = 18 V, MIN/MAX values stated where TA = -40C to 110C and VDD = 3 V to 25 V (unless otherwise noted). SYMBOL PARAMETER CONDITION MIN (V5-V4), (V4-V3), (V3-V2), (V2-V1), or (V1-VSS) > VOV, VDD = 18 V, IOH = 100 A 6 TYP MAX UNIT Output Drive OUT, CMOS Active HIGH Versions Only Output Drive Voltage, Active High VOUT1 If three of four cells are short circuited and only one cell remains powered and > VOV, VDD = Vx (cell voltage), IOH = 100 A V VDD - 0.3 (V5-V4), (V4-V3), (V3-V2), (V2-V1), and (V1-VSS) < VOV, VDD = 18 V, IOL = 100 A measured into pin IOUTH1 OUT Source Current (during OV) (V5-V4), (V4-V3), (V3-V2), (V2-V1), or (V1-VSS) > VOV, VDD = 18 V. OUT = 0 V. Measured out of OUT pin IOUTL1 OUT Sink Current (no OV) (V5-V4), (V4-V3), (V3-V2), (V2-V1), and (V1-VSS) < VOV, VDD = 18 V, OUT = VDD. Measured into OUT pin 250 0.5 V 400 mV 4.5 mA 14 mA 400 mV 14 mA 100 nA Output Drive OUT, NCH Open Drain Active LOW Versions Only VOUT2 Output Drive Voltage, Active Low (V5-V4), (V4-V3), (V3-V2), (V2-V1), or (V1-VSS) > VOV, VDD = 18 V, IOL = 100 A measured into OUT pin IOUTH2 OUT Sink Current (during OV) (V5-V4), (V4-V3), (V3-V2), (V2-V1), or (V1-VSS) > VOV, VDD = 18 V. OUT = VDD. Measured into OUT pin IOUTL2 OUT Source Current (no OV) (V5-V4), (V4-V3), (V3-V2), (V2-V1), and (V1-VSS) < VOV, VDD = 18 V. OUT = VDD. Measured out of OUT pin 250 0.5 Delay Timer tDELAY OV Delay Time XCTMDELAY 8 Fault Detection Delay Time during Customer Test Mode Submit Documentation Feedback bq771800 3.2 4 4.8 s bq771801, bq771807 2.4 3 3.6 s bq771802, bq771803, bq771815 0.8 1 1.2 s Preview option only. Contact TI. 4.4 5.5 6.6 s See Customer Test Mode. 15 ms Copyright (c) 2012-2014, Texas Instruments Incorporated Product Folder Links: bq771800 bq771801 bq771802 bq771803 bq771807 bq771808 bq771809 bq771815 bq771800, bq771801, bq771802 bq771803, bq771807, bq771808 bq771809, bq771815 www.ti.com SLUSAX1D - DECEMBER 2012 - REVISED NOVEMBER 2014 8 Typical Characteristics 4.40 4.39 4.38 0.316 Mean Min Max 0.315 4.36 VHYS (V) VOUT (V) 4.37 4.35 4.34 4.33 0.314 0.313 4.32 4.31 4.30 -50 -25 0 25 50 Temperature (C) 75 100 125 0.312 -50 -25 0 G001 Figure 2. Overvoltage Threshold (OVT) vs. Temperature 25 50 Temperature (C) 75 100 125 G002 Figure 3. Hysteresis VHYS vs. Temperature 1.8 1.6 1.5 1.6 1.4 1.4 1.2 ICELL (A) IDD (A) 1.3 1.1 1.0 1.2 1.0 0.9 0.8 0.8 0.7 0.6 -50 -25 0 25 50 Temperature (C) 75 100 125 0.6 -50 Figure 4. IDD Current Consumption vs. Temperature at VDD = 16 V 8 -3.70 7 -3.72 25 50 Temperature (C) 75 100 125 G004 6 -3.74 -3.76 VOUT (V) IOUT (mA) 0 Figure 5. ICELL vs. Temperature at VCELL= 9.2 V -3.68 -3.78 -3.80 -3.82 5 4 3 2 -3.84 1 -3.86 -3.88 -50 -25 G003 -25 0 25 50 Temperature (C) 75 Figure 6. Output Current IOUT vs. Temperature Copyright (c) 2012-2014, Texas Instruments Incorporated 100 125 G005 0 0 5 10 15 VDD (V) 20 25 30 G006 Figure 7. VOUT vs. VDD Submit Documentation Feedback Product Folder Links: bq771800 bq771801 bq771802 bq771803 bq771807 bq771808 bq771809 bq771815 9 bq771800, bq771801, bq771802 bq771803, bq771807, bq771808 bq771809, bq771815 SLUSAX1D - DECEMBER 2012 - REVISED NOVEMBER 2014 www.ti.com 9 Detailed Description 9.1 Overview In the bq7718xy family of devices, each cell is monitored independently and an external delay timer is initiated if an overvoltage condition is detected on any cell. For quicker production-line testing, the device provides a Customer Test Mode with greatly reduced delay time. 9.2 Functional Block Diagram PACK+ RVD C VD VDD RIN V5 CIN RIN CIN RIN V3 CIN RIN V2 Sensing Circuit V4 REG INT_EN VOV Delay Timer OUT CIN RIN V1 OSC CIN VSS PACK- 10 Submit Documentation Feedback Copyright (c) 2012-2014, Texas Instruments Incorporated Product Folder Links: bq771800 bq771801 bq771802 bq771803 bq771807 bq771808 bq771809 bq771815 bq771800, bq771801, bq771802 bq771803, bq771807, bq771808 bq771809, bq771815 www.ti.com SLUSAX1D - DECEMBER 2012 - REVISED NOVEMBER 2014 10 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 10.1 Application Information In the case of an Open Drain Active Low configuration, an external pull-up resistor is required on the OUT pin. Changes to the ranges stated in Table 1 will impact the accuracy of the cell measurements. C VD VDD OUT V5 VSS V4 V1 V3 V2 RVD Cell5 R IN Cell4 R IN Cell3 CIN CIN R IN CIN Cell2 R IN CIN Cell1 R IN CIN Figure 8. Application Configuration Changes to the ranges stated in Table 1 will impact the accuracy of the cell measurements. Figure 8 shows each external component. Table 1. Parameters PARAMETER EXTERNAL COMPONENT MIN NOM MAX Voltage monitor filter resistance RIN 900 1000 1100 UNIT Voltage monitor filter capacitance CIN 0.01 0.1 F Supply voltage filter resistance RVD 100 Supply voltage filter capacitance CVD 1K 0.1 CD external delay capacitance 0.1 OUT Open drain version pull-up resistance to PACK+ 100 F 1 F k NOTE The device is calibrated using an RIN value = 1 k. Using a value other than this recommended value changes the accuracy of the cell voltage measurements and VOV trigger level. Copyright (c) 2012-2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: bq771800 bq771801 bq771802 bq771803 bq771807 bq771808 bq771809 bq771815 11 bq771800, bq771801, bq771802 bq771803, bq771807, bq771808 bq771809, bq771815 SLUSAX1D - DECEMBER 2012 - REVISED NOVEMBER 2014 www.ti.com 10.2 Typical Applications In these application examples, an external pull-up resistor is required on the OUT pin to configure for an Open Drain Active Low operation. C VD C VD VDD OUT VSS V5 VSS V4 V1 V4 V1 V3 V2 V3 V2 VDD OUT V5 RVD R VD Cell 4 RIN CIN RIN RIN CIN Cell3 RIN CIN Cell2 RIN CIN Cell1 Cell 3 Cell 2 Cell 1 CIN RIN RIN CIN CIN Figure 10. 3-Series Cell Configuration with Fixed Delay Figure 9. 4-Series Cell Configuration C VD VDD OUT V5 VSS V4 V1 V5 V2 RVD Cell2 RIN CIN RIN CIN Cell1 Figure 11. 2-Series Cell Configuration with Internal Fixed Delay 10.3 Customer Test Mode Customer Test Mode (CTM) helps to reduce test time for checking the overvoltage delay timer parameter once the circuit is implemented in the battery pack. To enter CTM, VDD should be set to at least 10 V higher than V5 (see Figure 12). The delay timer is greater than 10 ms, but considerably shorter than the timer delay in normal operation. To exit Customer Test Mode, remove the VDD to a V5 voltage differential of 10 V so that the decrease in this value automatically causes an exit. 12 Submit Documentation Feedback Copyright (c) 2012-2014, Texas Instruments Incorporated Product Folder Links: bq771800 bq771801 bq771802 bq771803 bq771807 bq771808 bq771809 bq771815 bq771800, bq771801, bq771802 bq771803, bq771807, bq771808 bq771809, bq771815 www.ti.com SLUSAX1D - DECEMBER 2012 - REVISED NOVEMBER 2014 Customer Test Mode (continued) CAUTION Avoid exceeding any Absolute Maximum Voltages on any pins when placing the part into Customer Test Mode. Also avoid exceeding Absolute Maximum Voltages for the individual cell voltages (V5-V4), (V4-V3), (V4-V3), (V3-V2), (V2-V1), and (V1-VSS). Stressing the pins beyond the rated limits may cause permanent damage to the device. Figure 12 shows the timing for the Customer Test Mode. Cell Voltage (V) (V5-V4, V4-V3, V3-V2, V2-V1, V1-VSS) 10 V VOV VOV - VHYS > 10 ms OUT (V) Figure 12. Timing for Customer Test Mode Copyright (c) 2012-2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: bq771800 bq771801 bq771802 bq771803 bq771807 bq771808 bq771809 bq771815 13 bq771800, bq771801, bq771802 bq771803, bq771807, bq771808 bq771809, bq771815 SLUSAX1D - DECEMBER 2012 - REVISED NOVEMBER 2014 www.ti.com Customer Test Mode (continued) Figure 13 shows the measurement for current consumption for the product for both VDD and Vx. VDD OUT V5 VSS I IN V4 V1 I IN V3 V2 ICC I IN Cell5 Cell 4 Cell 3 I IN Cell 2 IIN Cell 1 Figure 13. Configuration for IC Current Consumption Test 14 Submit Documentation Feedback Copyright (c) 2012-2014, Texas Instruments Incorporated Product Folder Links: bq771800 bq771801 bq771802 bq771803 bq771807 bq771808 bq771809 bq771815 bq771800, bq771801, bq771802 bq771803, bq771807, bq771808 bq771809, bq771815 www.ti.com SLUSAX1D - DECEMBER 2012 - REVISED NOVEMBER 2014 Customer Test Mode (continued) 10.3.1 Application Curves 4.40 4.39 4.38 0.316 Mean Min Max 0.315 4.36 VHYS (V) VOUT (V) 4.37 4.35 4.34 4.33 0.314 0.313 4.32 4.31 4.30 -50 -25 0 25 50 Temperature (C) 75 100 125 0.312 -50 -25 0 G001 Figure 14. Overvoltage Threshold (OVT) vs. Temperature 25 50 Temperature (C) 75 100 125 G002 Figure 15. Hysteresis VHYS vs. Temperature 1.6 1.8 1.5 1.6 1.4 1.4 1.2 ICELL (A) IDD (A) 1.3 1.1 1.0 1.2 1.0 0.9 0.8 0.8 0.7 0.6 -50 -25 0 25 50 Temperature (C) 75 100 125 0.6 -50 Figure 16. IDD Current Consumption vs. Temperature at VDD = 16 V 8 -3.70 7 -3.72 25 50 Temperature (C) 75 100 125 G004 6 -3.74 -3.76 VOUT (V) IOUT (mA) 0 Figure 17. ICELL vs. Temperature at VCELL= 9.2 V -3.68 -3.78 -3.80 -3.82 5 4 3 2 -3.84 1 -3.86 -3.88 -50 -25 G003 -25 0 25 50 Temperature (C) 75 100 Figure 18. Output Current IOUT vs. Temperature Copyright (c) 2012-2014, Texas Instruments Incorporated 125 G005 0 0 5 10 15 VDD (V) 20 25 30 G006 Figure 19. VOUT vs. VDD Submit Documentation Feedback Product Folder Links: bq771800 bq771801 bq771802 bq771803 bq771807 bq771808 bq771809 bq771815 15 bq771800, bq771801, bq771802 bq771803, bq771807, bq771808 bq771809, bq771815 SLUSAX1D - DECEMBER 2012 - REVISED NOVEMBER 2014 www.ti.com 11 Device and Documentation Support 11.1 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 2. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY bq771800 Click here Click here Click here Click here Click here bq771801 Click here Click here Click here Click here Click here bq771802 Click here Click here Click here Click here Click here bq771803 Click here Click here Click here Click here Click here bq771807 Click here Click here Click here Click here Click here bq771808 Click here Click here Click here Click here Click here bq771809 Click here Click here Click here Click here Click here bq771815 Click here Click here Click here Click here Click here 11.2 Trademarks All trademarks are the property of their respective owners. 11.3 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 11.4 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 16 Submit Documentation Feedback Copyright (c) 2012-2014, Texas Instruments Incorporated Product Folder Links: bq771800 bq771801 bq771802 bq771803 bq771807 bq771808 bq771809 bq771815 PACKAGE OPTION ADDENDUM www.ti.com 27-Nov-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) BQ771800DPJR ACTIVE WSON DPJ 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 771800 BQ771800DPJT ACTIVE WSON DPJ 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 771800 BQ771801DPJR ACTIVE WSON DPJ 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 771801 BQ771801DPJT ACTIVE WSON DPJ 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 771801 BQ771802DPJR ACTIVE WSON DPJ 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 771802 BQ771802DPJT ACTIVE WSON DPJ 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 771802 BQ771803DPJR ACTIVE WSON DPJ 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 771803 BQ771803DPJT ACTIVE WSON DPJ 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 771803 BQ771807DPJR ACTIVE WSON DPJ 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 771807 BQ771807DPJT ACTIVE WSON DPJ 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 771807 BQ771808DPJR ACTIVE WSON DPJ 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 771808 BQ771808DPJT ACTIVE WSON DPJ 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 771808 BQ771809DPJR ACTIVE WSON DPJ 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 771809 BQ771809DPJT ACTIVE WSON DPJ 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 771809 BQ771815DPJR ACTIVE WSON DPJ 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 771815 BQ771815DPJT ACTIVE WSON DPJ 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 771815 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 27-Nov-2014 LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Dec-2014 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing BQ771800DPJR WSON DPJ 8 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3000 330.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2 BQ771800DPJT WSON DPJ 8 250 180.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2 BQ771801DPJR WSON DPJ 8 3000 330.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2 BQ771801DPJT WSON DPJ 8 250 180.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2 BQ771802DPJR WSON DPJ 8 3000 330.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2 BQ771802DPJT WSON DPJ 8 250 180.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2 BQ771803DPJR WSON DPJ 8 3000 330.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2 BQ771803DPJT WSON DPJ 8 250 180.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2 BQ771807DPJR WSON DPJ 8 3000 330.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2 BQ771807DPJT WSON DPJ 8 250 180.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2 BQ771808DPJR WSON DPJ 8 3000 330.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2 BQ771808DPJT WSON DPJ 8 250 180.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2 BQ771809DPJR WSON DPJ 8 3000 330.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2 BQ771809DPJT WSON DPJ 8 250 180.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2 BQ771815DPJR WSON DPJ 8 3000 330.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2 BQ771815DPJT WSON DPJ 8 250 180.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Dec-2014 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) BQ771800DPJR WSON DPJ 8 3000 367.0 367.0 35.0 BQ771800DPJT WSON DPJ 8 250 210.0 185.0 35.0 BQ771801DPJR WSON DPJ 8 3000 367.0 367.0 35.0 BQ771801DPJT WSON DPJ 8 250 210.0 185.0 35.0 BQ771802DPJR WSON DPJ 8 3000 367.0 367.0 35.0 BQ771802DPJT WSON DPJ 8 250 210.0 185.0 35.0 BQ771803DPJR WSON DPJ 8 3000 367.0 367.0 35.0 BQ771803DPJT WSON DPJ 8 250 210.0 185.0 35.0 BQ771807DPJR WSON DPJ 8 3000 367.0 367.0 35.0 BQ771807DPJT WSON DPJ 8 250 210.0 185.0 35.0 BQ771808DPJR WSON DPJ 8 3000 367.0 367.0 35.0 BQ771808DPJT WSON DPJ 8 250 210.0 185.0 35.0 BQ771809DPJR WSON DPJ 8 3000 367.0 367.0 35.0 BQ771809DPJT WSON DPJ 8 250 210.0 185.0 35.0 BQ771815DPJR WSON DPJ 8 3000 367.0 367.0 35.0 BQ771815DPJT WSON DPJ 8 250 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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