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bq771800
,
bq771801
,
bq771802
bq771803
,
bq771807
,
bq771808
bq771809
,
bq771815
SLUSAX1D – DECEMBER 2012–REVISED NOVEMBER 2014
bq7718xy Overvoltage Protection for 2-Series to 5-Series Cell Li-Ion Batteries
with Internal Delay Timer
1 Features 3 Description
The bq7718xy family of products provides an
1• 2-, 3-, 4-, and 5-Series Cell Overvoltage overvoltage monitor and protector for Li-Ion battery
Protection pack systems. Each cell is monitored independently
• Internal Delay Timer for an overvoltage condition. For quicker production-
• Fixed OVP Threshold line testing, the bq7718xy device provides a
Customer Test Mode (CTM) with greatly reduced
• High-Accuracy Overvoltage Protection: delay time.
± 10 mV In the bq7718xy device, an internal delay timer is
• Low Power Consumption ICC ≈1 µA initiated upon detection of an overvoltage condition
(VCELL(ALL) < VPROTECT)on any cell. Upon expiration of the delay timer, the
• Low Leakage Current Per Cell Input < 100 nA output is triggered into its active state (either high or
• Small Package Footprint low depending on the configuration).
– 8-pin QFN (3.00 mm × 4.00 mm) Device Information Table(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
2 Applications bq771800 QFN (8) 3.00 mm × 4.00 mm
• Protection in Li-Ion Battery Packs in: (1) For all available packages, see the orderable addendum at
– Power Tools the end of the data sheet and the Device Comparison Table.
– UPS Battery Backup
– Light Electric Vehicles (eBike, eScooter, Pedal
Assist Bicycles)
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION
DATA.
bq771800
,
bq771801
,
bq771802
bq771803
,
bq771807
,
bq771808
bq771809
,
bq771815
SLUSAX1D – DECEMBER 2012–REVISED NOVEMBER 2014
www.ti.com
Table of Contents
1 Features.................................................................. 19 Detailed Description............................................ 10
9.1 Overview................................................................. 10
2 Applications ........................................................... 19.2 Functional Block Diagram....................................... 10
3 Description............................................................. 110 Application and Implementation........................ 11
4 Revision History..................................................... 210.1 Application Information.......................................... 11
5 Device Comparison Table..................................... 310.2 Typical Applications .............................................. 12
6 Pin Configuration and Functions......................... 410.3 Customer Test Mode ............................................ 12
6.1 Pin Details................................................................. 411 Device and Documentation Support................. 16
7 Specifications......................................................... 611.1 Related Links ........................................................ 16
7.1 Absolute Maximum Ratings..................................... 611.2 Trademarks........................................................... 16
7.2 Handling Ratings ...................................................... 611.3 Electrostatic Discharge Caution............................ 16
7.3 Recommended Operating Conditions...................... 611.4 Glossary................................................................ 16
7.4 Thermal Information.................................................. 612 Mechanical, Packaging, and Orderable
7.5 DC Characteristics................................................... 7Information........................................................... 16
8 Typical Characteristics.......................................... 9
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (August 2014) to Revision D Page
• Added the bq771815 device to Production Data.................................................................................................................... 3
• Changed the Handling Ratings table ..................................................................................................................................... 6
• Added note to the Application and Implementation section ................................................................................................ 11
Changes from Revision B (October 2013) to Revision C Page
• Changed the data sheet format ............................................................................................................................................. 1
• Added the bq771807 device to Production Data.................................................................................................................... 3
Changes from Revision A (September 2013) to Revision B Page
• Added the bq771809 device to Production Data.................................................................................................................... 3
Changes from Original (December 2012) to Revision A Page
• Added the bq771808 device to Production Data.................................................................................................................... 3
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bq771803
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bq771807
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bq771808
bq771809
,
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SLUSAX1D – DECEMBER 2012–REVISED NOVEMBER 2014
5 Device Comparison Table
Package OV Hysteresis Output Tape and Reel Tape and Reel
TAPart Number Package OVP (V) Output Drive
Designator (V) Delay (Large) (Small)
CMOS Active
bq771800 4.300 0.300 4 s bq771800DPJR bq771800DPJT
High
NCH Active Low,
bq771801 4.275 0.050 3 s bq771801DPJR bq771801DPJT
Open Drain
NCH Active Low,
bq771802 4.225 0.300 1 s bq771802DPJR bq771802DPJT
Open Drain
NCH Active Low,
bq771803 4.275 0.050 1 s bq771803DPJR bq771803DPJT
Open Drain
CMOS Active
bq771804(1) 4.225 0.300 3 s bq771804DPJR bq771804DPJT
High
CMOS Active
bq771805(1) 4.325 0.300 3 s bq771805DPJR bq771805DPJT
High
CMOS Active
bq771806(1) 4.350 0.300 3 s bq771806DPJR bq771806DPJT
High
CMOS Active
bq771807 4.450 0.300 3 s bq771807DPJR bq771807DPJT
High
–40°C to bq771808 4.200 0.050 1 s NCH Active Low bq771808DPJR bq771808DPJT
8-Pin QFN DPJ
110°C CMOS Active
bq771809 4.200 0.050 1 s bq771809DPJR bq771809DPJT
High
CMOS Active
bq771810(1) 4.200 0.250 1 s bq771810DPJR bq771810DPJT
High
CMOS Active
bq771811(1) 4.225 0.050 1 s bq771811DPJR bq771811DPJT
High
CMOS Active
bq771812(1) 4.250 0.050 1 s bq771812DPJR bq771812DPJT
High
CMOS Active
bq771813(1) 4.250 0.050 1 s bq771813DPJR bq771813DPJT
High
CMOS Active
bq771814(1) 3.900 0.300 3 s bq771814DPJR bq771814DPJT
High
bq771815 4.225 0.050 1 s NCH Active Low bq771815DPJR bq771815DPJT
bq771816(1) 4.250 0.050 1 s NCH Active Low bq771816DPJR bq771816DPJT
NCH, Active
bq7718xy(2) 3.850–4.650 0–0.300 1 s bq7718xyDPJR bq7718xyDPJT
Low, Open Drain
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VOV
V
OV–VHYS
Cell Voltage (V)
(V5–V4, V4–V3, V
3–V2, V2–V1, V1–VSS)
OUT (V)tDELAY
1
2
3
4
8
7
6
5
VDD
V5
V4
V3
OUT
VSS
V1
V2
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6 Pin Configuration and Functions
Pin Functions
bq7718xy Pin Name Type I/O Description
1 VDD P Power supply
2 V5 I Sense input for positive voltage of the fifth cell from the bottom of the stack
3 V4 I Sense input for positive voltage of the fourth cell from the bottom of the stack
4 V3 I Sense input for positive voltage of the third cell from the bottom of the stack
5 V2 I Sense input for positive voltage of the second cell from the bottom of the stack
6 V1 I Sense input for positive voltage of the lowest cell in the stack
7 VSS P Electrically connected to IC ground and negative terminal of the lowest cell in the stack
8 OUT O Output drive for overvoltage fault signal
6.1 Pin Details
In the bq7718xy device, each cell is monitored independently. Overvoltage is detected by comparing the actual
cell voltage to a protection voltage reference, VOV. If any cell voltage exceeds the programmed OV value, a timer
circuit is activated. When the timer expires, the OUT pin goes from inactive to active state.
For NCH Open Drain Active Low configurations, the OUT pin pulls down to VSS when active (OV present) and is
high impedance when inactive (no OV).
Figure 1. Timing for Overvoltage Sensing
6.1.1 Sense Positive Input for Vx
This is an input to sense each single battery cell voltage. A series resistor and a capacitor across the cell for
each input is required for noise filtering and stable voltage monitoring.
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SLUSAX1D – DECEMBER 2012–REVISED NOVEMBER 2014
Pin Details (continued)
6.1.2 Output Drive, OUT
This pin serves as the fault signal output, and may be ordered in either active HIGH or LOW options.
6.1.3 Supply Input, VDD
This pin is the unregulated input power source for the IC. A series resistor is connected to limit the current, and a
capacitor is connected to ground for noise filtering.
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SLUSAX1D – DECEMBER 2012–REVISED NOVEMBER 2014
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7 Specifications
7.1 Absolute Maximum Ratings
Over-operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage range VDD–VSS –0.3 30 V
V5–VSS or V4–VSS or
Input voltage range –0.3 30 V
V3–VSS or V2–VSS or V1–VSS
Output voltage range OUT–VSS –0.3 30 V
Continuous total power dissipation, See package dissipation rating.
PTOT
Functional temperature –40 110 °C
Storage temperature range, TSTG –65 150 °C
Lead temperature (soldering, 10 s), 300 °C
TSOLDER
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum–rated conditions for extended periods may affect device reliability.
7.2 Handling Ratings MIN MAX UNIT
TSTG Storage temperature range –65 150 °C
Human body model (HBM) ESD stress voltage(1) –2 2 kV
V(ESD) Electrostatic discharge
Rating Charged device model (CDM) ESD stress voltage(2) –500 500 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
Over-operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
Supply voltage, VDD(1) 3 25 V
Input voltage range V5–V4 or V4–V3 or 0 5 V
V3–V2 or V2–V1 or V1–VSS
Operating ambient temperature range, TA–40 110 °C
(1) See Typical Applications.
7.4 Thermal Information bq7718xy
THERMAL METRIC(1) UNITS
8 PINS
RθJA Junction-to-ambient thermal resistance 56.6
RθJCtop Junction-to-case(top) thermal resistance 56.4
RθJB Junction-to-board thermal resistance 30.6 °C/W
ψJT Junction-to-top characterization parameter 1.0
ψJB Junction-to-board characterization parameter 37.8
RθJCbot Junction-to-case(bottom) thermal resistance 11.3
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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SLUSAX1D – DECEMBER 2012–REVISED NOVEMBER 2014
7.5 DC Characteristics
Typical values stated where TA= 25°C and VDD = 18 V, MIN/MAX values stated where TA= –40°C to 110°C and VDD = 3 V
to 25 V (unless otherwise noted).
SYMBOL PARAMETER CONDITION MIN TYP MAX UNIT
Voltage Protection Threshold VCx
bq771800 4.300 V
bq771801 4.275 V
bq771803 4.275 V
bq771802 4.225 V
bq771804(1) 4.225 V
bq771805(1) 4.325 V
bq771806(1) 4.350 V
bq771807 4.450 V
V(PROTECT) Overvoltage
VOV bq771808 4.200 V
Detection bq771809 4.200 V
bq771810(1) 4.200 V
bq771811(1) 4.225 V
bq771812(1) 4.250 V
bq771813(1) 4.250 V
bq771814(1) 3.900 V
bq771815 4.225 V
bq771816(1) 4.250 V
bq771800 250 300 400 mV
bq771801 0 50 100 V
bq771802 250 300 400 mV
bq771803 0 50 100 V
bq771804(1) 250 300 400 mV
bq771805(1) 250 300 400 mV
bq771806(1) 250 300 400 mV
bq771807 250 300 400 mV
VHYS OV Detection Hysteresis bq771808 0 50 100 V
bq771809 0 50 100 V
bq771810(1) 200 250 250 mV
bq771811(1) 0 50 100 V
bq771812(1) 0 50 100 V
bq771813(1) 0 50 100 V
bq771814(1) 250 300 400 mV
bq771815 0 50 100 V
bq771816(1) 0 50 100 V
VOA OV Detection Accuracy TA= 25°C –10 10 mV
TA= –40°C –40 44 mV
TA= 0°C –20 20 mV
OV Detection Accuracy Across
VOADRIFT Temperature TA= 60°C –24 24 mV
TA= 110°C –54 54 mV
Supply and Leakage Current
(V5–V4) = (V4–V3) = (V3–V2) = (V2–V1) =
ICC Supply Current 1 2 µA
(V1–VSS) = 4.0 V (See Figure 12.)
(V5–V4) = (V4–V3) = (V3–V2) = (V2–V1) =
IIN Input Current at Vx Pins –0.1 0.1 µA
(V1–VSS) = 4.0 V (See Figure 12.)
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DC Characteristics (continued)
Typical values stated where TA= 25°C and VDD = 18 V, MIN/MAX values stated where TA= –40°C to 110°C and VDD = 3 V
to 25 V (unless otherwise noted).
SYMBOL PARAMETER CONDITION MIN TYP MAX UNIT
Output Drive OUT, CMOS Active HIGH Versions Only
(V5–V4), (V4–V3), (V3–V2), (V2–V1), or 6 V
(V1–VSS) > VOV, VDD = 18 V, IOH = 100 µA
If three of four cells are short circuited and
Output Drive Voltage, Active only one cell remains powered and > VOV, VDD – 0.3 V
VOUT1 High VDD = Vx (cell voltage), IOH = 100 µA
(V5–V4), (V4–V3), (V3–V2), (V2–V1), and
(V1–VSS) < VOV, VDD = 18 V, IOL = 100 µA 250 400 mV
measured into pin
(V5–V4), (V4–V3), (V3–V2), (V2–V1), or
OUT Source Current (during
IOUTH1 (V1–VSS) > VOV, VDD = 18 V. OUT = 0 V. 4.5 mA
OV) Measured out of OUT pin
(V5–V4), (V4–V3), (V3–V2), (V2–V1), and
IOUTL1 OUT Sink Current (no OV) (V1–VSS) < VOV, VDD = 18 V, OUT = VDD. 0.5 14 mA
Measured into OUT pin
Output Drive OUT, NCH Open Drain Active LOW Versions Only
(V5–V4), (V4–V3), (V3–V2), (V2–V1), or
Output Drive Voltage, Active
VOUT2 (V1–VSS) > VOV, VDD = 18 V, IOL = 100 µA 250 400 mV
Low measured into OUT pin
(V5–V4), (V4–V3), (V3–V2), (V2–V1), or
IOUTH2 OUT Sink Current (during OV) (V1–VSS) > VOV, VDD = 18 V. OUT = VDD. 0.5 14 mA
Measured into OUT pin
(V5–V4), (V4–V3), (V3–V2), (V2–V1), and
IOUTL2 OUT Source Current (no OV) (V1–VSS) < VOV, VDD = 18 V. OUT = VDD. 100 nA
Measured out of OUT pin
Delay Timer
bq771800 3.2 4 4.8 s
bq771801, bq771807 2.4 3 3.6 s
tDELAY OV Delay Time bq771802, bq771803, bq771815 0.8 1 1.2 s
Preview option only. Contact TI. 4.4 5.5 6.6 s
Fault Detection Delay Time
XCTMDELAY See Customer Test Mode. 15 ms
during Customer Test Mode
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−3.88
−3.86
−3.84
−3.82
−3.80
−3.78
−3.76
−3.74
−3.72
−3.70
−3.68
−50 −25 0 25 50 75 100 125
Temperature (°C)
IOUT (mA)
G005
0
1
2
3
4
5
6
7
8
0 5 10 15 20 25 30
VDD (V)
VOUT (V)
G006
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
−50 −25 0 25 50 75 100 125
Temperature (°C)
IDD (µA)
G003
0.6
0.8
1.0
1.2
1.4
1.6
1.8
−50 −25 0 25 50 75 100 125
Temperature (°C)
ICELL (µA)
G004
4.30
4.31
4.32
4.33
4.34
4.35
4.36
4.37
4.38
4.39
4.40
−50 −25 0 25 50 75 100 125
Temperature (°C)
VOUT (V)
Mean
Min
Max
G001
0.312
0.313
0.314
0.315
0.316
−50 −25 0 25 50 75 100 125
Temperature (°C)
VHYS (V)
G002
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SLUSAX1D – DECEMBER 2012–REVISED NOVEMBER 2014
8 Typical Characteristics
Figure 2. Overvoltage Threshold (OVT) vs. Temperature Figure 3. Hysteresis VHYS vs. Temperature
Figure 4. IDD Current Consumption vs. Figure 5. ICELL vs. Temperature
Temperature at VDD = 16 V at VCELL= 9.2 V
Figure 6. Output Current IOUT vs. Figure 7. VOUT vs. VDD
Temperature
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OUT
V3
V1
V2
VSS
VDD
RVD
CVD
CIN
V
OV
OSC
Delay
Timer
PACK+
Sensing Circuit
PACK–
INT_EN
REG
V4
RIN
V5
RIN
RIN
RIN
RIN
CIN
CIN
CIN
CIN
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9 Detailed Description
9.1 Overview
In the bq7718xy family of devices, each cell is monitored independently and an external delay timer is initiated if
an overvoltage condition is detected on any cell.
For quicker production-line testing, the device provides a Customer Test Mode with greatly reduced delay time.
9.2 Functional Block Diagram
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10 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
10.1 Application Information
In the case of an Open Drain Active Low configuration, an external pull-up resistor is required on the OUT pin.
Changes to the ranges stated in Table 1 will impact the accuracy of the cell measurements.
Figure 8. Application Configuration
Changes to the ranges stated in Table 1 will impact the accuracy of the cell measurements. Figure 8 shows each
external component.
Table 1. Parameters
PARAMETER EXTERNAL COMPONENT MIN NOM MAX UNIT
Voltage monitor filter resistance RIN 900 1000 1100 Ω
Voltage monitor filter capacitance CIN 0.01 0.1 µF
Supply voltage filter resistance RVD 100 1K Ω
Supply voltage filter capacitance CVD 0.1 µF
CD external delay capacitance 0.1 1 µF
OUT Open drain version pull-up resistance 100 kΩ
to PACK+
NOTE
The device is calibrated using an RIN value = 1 kΩ. Using a value other than this
recommended value changes the accuracy of the cell voltage measurements and VOV
trigger level.
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C
IN
R
IN
Cell2
RVD
CVD
Cell1
VDD
V5
V4
V5
OUT
VSS
V1
V2
R
IN C
IN
RIN
Cell 4
Cell 3
Cell 2
RVD
CVD
CIN
Cell 1
VDD
V5
V4
V3
OUT
VSS
V1
V2
CIN
CIN
CIN
RIN
RIN
RIN
Cell3
Cell 2
RVD
CVD
CIN
RIN
Cell1
VDD
V5
V4
V3
OUT
VSS
V1
V2
RIN
RIN
CIN
CIN
bq771800
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10.2 Typical Applications
In these application examples, an external pull-up resistor is required on the OUT pin to configure for an Open
Drain Active Low operation.
Figure 10. 3-Series Cell Configuration with Fixed Delay
Figure 9. 4-Series Cell Configuration
Figure 11. 2-Series Cell Configuration with Internal Fixed Delay
10.3 Customer Test Mode
Customer Test Mode (CTM) helps to reduce test time for checking the overvoltage delay timer parameter once
the circuit is implemented in the battery pack. To enter CTM, VDD should be set to at least 10 V higher than V5
(see Figure 12). The delay timer is greater than 10 ms, but considerably shorter than the timer delay in normal
operation. To exit Customer Test Mode, remove the VDD to a V5 voltage differential of 10 V so that the decrease
in this value automatically causes an exit.
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VOV
V
OV–VHYS
Cell Voltage (V)
(V5–V4, V4–V3, V3–V2, V2–V1, V1–VSS)
OUT (V) > 10 ms
10 V
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Customer Test Mode (continued)
CAUTION
Avoid exceeding any Absolute Maximum Voltages on any pins when placing the part
into Customer Test Mode. Also avoid exceeding Absolute Maximum Voltages for the
individual cell voltages (V5–V4), (V4–V3), (V4–V3), (V3–V2), (V2–V1), and (V1–VSS).
Stressing the pins beyond the rated limits may cause permanent damage to the
device.
Figure 12 shows the timing for the Customer Test Mode.
Figure 12. Timing for Customer Test Mode
Copyright © 2012–2014, Texas Instruments Incorporated Submit Documentation Feedback 13
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Cell5
4
3
2
ICC
IIN
IIN
IIN
IIN
1
IIN
VDD
V5
V4
V3
OUT
VSS
V1
V2
Cell
Cell
Cell
Cell
bq771800
,
bq771801
,
bq771802
bq771803
,
bq771807
,
bq771808
bq771809
,
bq771815
SLUSAX1D – DECEMBER 2012–REVISED NOVEMBER 2014
www.ti.com
Customer Test Mode (continued)
Figure 13 shows the measurement for current consumption for the product for both VDD and Vx.
Figure 13. Configuration for IC Current Consumption Test
14 Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated
Product Folder Links: bq771800 bq771801 bq771802 bq771803 bq771807 bq771808 bq771809 bq771815
−3.88
−3.86
−3.84
−3.82
−3.80
−3.78
−3.76
−3.74
−3.72
−3.70
−3.68
−50 −25 0 25 50 75 100 125
Temperature (°C)
IOUT (mA)
G005
0
1
2
3
4
5
6
7
8
0 5 10 15 20 25 30
VDD (V)
VOUT (V)
G006
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
−50 −25 0 25 50 75 100 125
Temperature (°C)
IDD (µA)
G003
0.6
0.8
1.0
1.2
1.4
1.6
1.8
−50 −25 0 25 50 75 100 125
Temperature (°C)
ICELL (µA)
G004
4.30
4.31
4.32
4.33
4.34
4.35
4.36
4.37
4.38
4.39
4.40
−50 −25 0 25 50 75 100 125
Temperature (°C)
VOUT (V)
Mean
Min
Max
G001
0.312
0.313
0.314
0.315
0.316
−50 −25 0 25 50 75 100 125
Temperature (°C)
VHYS (V)
G002
bq771800
,
bq771801
,
bq771802
bq771803
,
bq771807
,
bq771808
bq771809
,
bq771815
www.ti.com
SLUSAX1D – DECEMBER 2012–REVISED NOVEMBER 2014
Customer Test Mode (continued)
10.3.1 Application Curves
Figure 14. Overvoltage Threshold (OVT) vs. Temperature Figure 15. Hysteresis VHYS vs. Temperature
Figure 16. IDD Current Consumption vs. Figure 17. ICELL vs. Temperature
Temperature at VDD = 16 V at VCELL= 9.2 V
Figure 18. Output Current IOUT vs. Figure 19. VOUT vs. VDD
Temperature
Copyright © 2012–2014, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Links: bq771800 bq771801 bq771802 bq771803 bq771807 bq771808 bq771809 bq771815
bq771800
,
bq771801
,
bq771802
bq771803
,
bq771807
,
bq771808
bq771809
,
bq771815
SLUSAX1D – DECEMBER 2012–REVISED NOVEMBER 2014
www.ti.com
11 Device and Documentation Support
11.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 2. Related Links
TECHNICAL TOOLS & SUPPORT &
PARTS PRODUCT FOLDER SAMPLE & BUY DOCUMENTS SOFTWARE COMMUNITY
bq771800 Click here Click here Click here Click here Click here
bq771801 Click here Click here Click here Click here Click here
bq771802 Click here Click here Click here Click here Click here
bq771803 Click here Click here Click here Click here Click here
bq771807 Click here Click here Click here Click here Click here
bq771808 Click here Click here Click here Click here Click here
bq771809 Click here Click here Click here Click here Click here
bq771815 Click here Click here Click here Click here Click here
11.2 Trademarks
All trademarks are the property of their respective owners.
11.3 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.4 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
16 Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated
Product Folder Links: bq771800 bq771801 bq771802 bq771803 bq771807 bq771808 bq771809 bq771815
PACKAGE OPTION ADDENDUM
www.ti.com 27-Nov-2014
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
BQ771800DPJR ACTIVE WSON DPJ 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 771800
BQ771800DPJT ACTIVE WSON DPJ 8 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 771800
BQ771801DPJR ACTIVE WSON DPJ 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 771801
BQ771801DPJT ACTIVE WSON DPJ 8 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 771801
BQ771802DPJR ACTIVE WSON DPJ 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 771802
BQ771802DPJT ACTIVE WSON DPJ 8 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 771802
BQ771803DPJR ACTIVE WSON DPJ 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 771803
BQ771803DPJT ACTIVE WSON DPJ 8 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 771803
BQ771807DPJR ACTIVE WSON DPJ 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 771807
BQ771807DPJT ACTIVE WSON DPJ 8 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 771807
BQ771808DPJR ACTIVE WSON DPJ 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 771808
BQ771808DPJT ACTIVE WSON DPJ 8 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 771808
BQ771809DPJR ACTIVE WSON DPJ 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 771809
BQ771809DPJT ACTIVE WSON DPJ 8 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 771809
BQ771815DPJR ACTIVE WSON DPJ 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 771815
BQ771815DPJT ACTIVE WSON DPJ 8 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 771815
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
PACKAGE OPTION ADDENDUM
www.ti.com 27-Nov-2014
Addendum-Page 2
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
BQ771800DPJR WSON DPJ 8 3000 330.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2
BQ771800DPJT WSON DPJ 8 250 180.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2
BQ771801DPJR WSON DPJ 8 3000 330.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2
BQ771801DPJT WSON DPJ 8 250 180.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2
BQ771802DPJR WSON DPJ 8 3000 330.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2
BQ771802DPJT WSON DPJ 8 250 180.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2
BQ771803DPJR WSON DPJ 8 3000 330.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2
BQ771803DPJT WSON DPJ 8 250 180.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2
BQ771807DPJR WSON DPJ 8 3000 330.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2
BQ771807DPJT WSON DPJ 8 250 180.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2
BQ771808DPJR WSON DPJ 8 3000 330.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2
BQ771808DPJT WSON DPJ 8 250 180.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2
BQ771809DPJR WSON DPJ 8 3000 330.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2
BQ771809DPJT WSON DPJ 8 250 180.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2
BQ771815DPJR WSON DPJ 8 3000 330.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2
BQ771815DPJT WSON DPJ 8 250 180.0 12.4 3.3 4.3 1.1 8.0 12.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Dec-2014
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
BQ771800DPJR WSON DPJ 8 3000 367.0 367.0 35.0
BQ771800DPJT WSON DPJ 8 250 210.0 185.0 35.0
BQ771801DPJR WSON DPJ 8 3000 367.0 367.0 35.0
BQ771801DPJT WSON DPJ 8 250 210.0 185.0 35.0
BQ771802DPJR WSON DPJ 8 3000 367.0 367.0 35.0
BQ771802DPJT WSON DPJ 8 250 210.0 185.0 35.0
BQ771803DPJR WSON DPJ 8 3000 367.0 367.0 35.0
BQ771803DPJT WSON DPJ 8 250 210.0 185.0 35.0
BQ771807DPJR WSON DPJ 8 3000 367.0 367.0 35.0
BQ771807DPJT WSON DPJ 8 250 210.0 185.0 35.0
BQ771808DPJR WSON DPJ 8 3000 367.0 367.0 35.0
BQ771808DPJT WSON DPJ 8 250 210.0 185.0 35.0
BQ771809DPJR WSON DPJ 8 3000 367.0 367.0 35.0
BQ771809DPJT WSON DPJ 8 250 210.0 185.0 35.0
BQ771815DPJR WSON DPJ 8 3000 367.0 367.0 35.0
BQ771815DPJT WSON DPJ 8 250 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Dec-2014
Pack Materials-Page 2
IMPORTANT NOTICE
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