2SK2958(L),2SK2958(S)
Silicon N Channel MOS FET
High Speed Power Switching
ADE-208-568B (Z)
3rd. Edition
Jul. 1998
Features
Low on-resistance
RDS(on) = 5.5mtyp.
4V gate drive devices.
High speed switching
Outline
1. Gate
2. Drain
3. Source
4. Drain
123
4
123
4
LDPAK
G
D
S
2SK2958(L),2SK2958(S)
2
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage VDSS 30 V
Gate to source voltage VGSS ±20 V
Drain current ID75 A
Drain peak current ID(pulse)Note1 300 A
Body-drain diode reverse drain current IDR 75 A
Channel dissipation Pch Note2 100 W
Channel temperature Tch 150 °C
Storage temperature Tstg –55 to +150 °C
Note: 1. PW 10µs, duty cycle 1 %
2. Value at Tc = 25°C
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown voltage V(BR)DSS 30——V I
D
= 10mA, VGS = 0
Gate to source breakdown voltage V(BR)GSS ±20——V I
G
= ±100µA, VDS = 0
Zero gate voltege drain current IDSS ——10µAV
DS = 30 V, VGS = 0
Gate to source leak current IGSS ——±10 µAV
GS = ±16V, VDS = 0
Gate to source cutoff voltage VGS(off) 1.0 2.0 V ID = 1mA, VDS = 10V
Static drain to source on state
resistance RDS(on) 5.5 7.0 mID = 40A, VGS = 10V Note3
Static drain to source on state
resistance RDS(on) 9.0 14.0 mID = 40A, VGS = 4V Note3
Forward transfer admittance |yfs|3560—S I
D
= 40A, VDS = 10V Note3
Input capacitance Ciss 4100 pF VDS = 10V
Output capacitance Coss 2700 pF VGS = 0
Reverse transfer capacitance Crss 800 pF f = 1MHz
Turn-on delay time td(on) 45 ns VGS = 10V, ID = 40A
Rise time tr 430 ns RL = 0.25
Turn-off delay time td(off) 460 ns
Fall time tf 440 ns
Body–drain diode forward voltage VDF 1.0 V IF = 75A, VGS = 0
Body–drain diode reverse
recovery time trr 90 ns IF = 75A, VGS = 0
diF/ dt =50A/µs
Note: 3. Pulse test
2SK2958(L),2SK2958(S)
3
Main Characteristics
160
120
80
050 100 150 200 0.1 0.3 1 310 30 100
100
80
60
40
20
0246810
Channel Dissipation Pch (W)
Case Temperature Tc (°C)
Power vs. Temperature Derating
Drain to Source Voltage V (V)
DS
Drain Current I (A)
D
Maximum Safe Operation Area
Drain to Source Voltage V (V)
DS
Drain Current I (A)
D
Typical Output Characteristics
Gate to Source Voltage V (V)
GS
Drain Current I (A)
D
Typical Transfer Characteristics
1000
300
100
30
10
1
0.3
0.1
3
Ta = 25°C
10 µs
100 µs
1 ms
DC Operation
(Tc = 25°C)
Operation in
this area is
limited by R
DS(on)
PW = 10 ms (1 shot)
5 V
4 V 3.5 V
3 V
40
V = 10 V
GS
6 V
2.5 V
100
80
60
40
20
012345
Tc = –25°C
25°C
75°C
V = 10 V
Pulse Test
DS
Pulse Test
2SK2958(L),2SK2958(S)
4
048
12 16 20
20
16
12
8
4
–40 0 40 80 120 160
0
Gate to Source Voltage V (V)
GS
Drain to Source Saturation Voltage vs.
Gate to Source Voltage
V (V)
DS(on)
Drain to Source Saturation Voltage
Drain Current I (A)
D
Drain to Source On State Resistance
R (m )
W
DS(on)
Static Drain to Source on State Resistance
vs. Drain Current
Case Temperature Tc (°C)
Static Drain to Source on State Resistance
Static Drain to Source on State Resistance
vs. Temperature
Drain Current I (A)
D
Forward Transfer Admittance |y | (S)
fs
Forward Transfer Admittance vs.
Drain Current
V = 4 V
GS
10 V
Pulse Test
R (m )
W
DS(on)
0.5
0.4
0.3
0.2
0.1
Pulse Test
I = 50 A
D
20 A
10 A
1 30 1003
50
2
5
1
10 1000300
20
10
V = 4 V
GS
10 V
Pulse Test
10, 20 A
I = 50 A
D
20 A 10 A
50 A
0.1 0.3 1 3 10 30 100
500
100
200
20
50
10
2
5
1
0.5
Tc = –25 °C
75 °C
25 °C
V = 10 V
Pulse Test
DS
2SK2958(L),2SK2958(S)
5
0.1 0.3 1 3 10 30 100 01020304050
3000
100000
10000
30000
50
40
30
20
10
0
20
16
12
8
4
80 160 240 320 400
0
1000
100
200
20
10
0.1 0.2 210 100
1000
500
100
200
20
50
10
di / dt = 50 A / µs
V = 0, Ta = 25 °C
GS
1000
300
20
1
Reverse Drain Current I (A)
DR
Reverse Recovery Time trr (ns)
Body–Drain Diode Reverse
Recovery Time
Capacitance C (pF)
Drain to Source Voltage V (V)
DS
Typical Capacitance vs.
Drain to Source Voltage
Gate Charge Qg (nc)
Drain to Source Voltage V (V)
DS
Gate to Source Voltage V (V)
GS
Dynamic Input Characteristics
Drain Current I (A)
D
Switching Time t (ns)
Switching Characteristics
100
V = 0
f = 1 MHz
GS
Ciss
Coss
Crss
I = 75 A
D
V
GS
V
DS
V = 5 V
10 V
25 V
DD
V = 25 V
10 V
5 V
DD
0.5 5
5
2000
5000
500
50
50
V = 10 V, V = 10 V
PW = 5 µs, duty < 1 %
GS DD
r
t
d(on)
t
d(off)
t
tf
2SK2958(L),2SK2958(S)
6
100
80
60
40
20
00.4 0.8 1.2 1.6 2.0
Source to Drain Voltage V (V)
SD
Reverse Drain Current I (A)
DR
Reverse Drain Current vs.
Source to Drain Voltage
Pulse Test
V = 0, –5 V
GS
5 V
10 V
Pulse Width PW (S)
Normalized Transient Thermal Impedance
s (t)
g
Normalized Transient Thermal Impedance vs. Pulse Width
3
1
0.3
0.1
0.03
0.01
10 µ 100 µ 1 m 10 m 100 m 1 10
DM
P
PW
T
D = PW
T
ch – c(t) = s (t) • ch – c
ch – c = 1.25 °C/W, Tc = 25 °C
q g q
q
Tc = 25°C
D = 1
0.5
0.2
0.1
0.05
0.02
0.01
1shot pulse
2SK2958(L),2SK2958(S)
7
Vin Monitor
D.U.T.
Vin
10 V
RL
V
= 10 V
DD
tr
td(on)
Vin
90% 90%
10%
10%
Vout
td(off)
Vout
Monitor
50W
90%
10%
tf
Switching Time Test Circuit Waveform
2SK2958(L),2SK2958(S)
8
Package Dimensions
Hitachi Code
JEDEC
EIAJ
Mass
(reference value)
LDPAK (L)
1.4 g
10.2 ± 0.3
0.86
0.76 ± 0.1
2.54 ± 0.5
2.54 ± 0.5
+ 0.2
– 0.1
1.2 ± 0.2
4.44 ± 0.2
1.3 ± 0.15
2.59 ± 0.2
0.4 ± 0.1
11.0 ± 0.5
8.6 ± 0.3
10.0
11.3 ± 0.5
+ 0.3
– 0.5
(1.4)
1.27 ± 0.2
As of January, 2001
Unit: mm
2SK2958(L),2SK2958(S)
9
Hitachi Code
JEDEC
EIAJ
Mass
(reference value)
LDPAK (S)-(1)
1.3 g
10.2 ± 0.3
1.27 ± 0.2
(1.5)
(1.4)
8.6 ± 0.3
10.0 + 0.3
– 0.5
4.44 ± 0.21.3 ± 0.15
0.1 + 0.2
– 0.1
0.4 ± 0.1
0.86 + 0.2
– 0.1
2.54 ± 0.5
2.54 ± 0.5
1.2 ± 0.2
3.0+ 0.3
– 0.5
(1.5)
7.8
6.6
2.2
1.7
7.8
7.0
As of January, 2001
Unit: mm
2SK2958(L),2SK2958(S)
10
Hitachi Code
JEDEC
EIAJ
Mass
(reference value)
LDPAK (S)-(2)
1.35 g
10.2 ± 0.3
1.27 ± 0.2
(1.5)
(1.4)
8.6 ± 0.3
10.0 + 0.3
– 0.5
4.44 ± 0.21.3 ± 0.2
0.1 + 0.2
– 0.1
0.4 ± 0.1
0.86 + 0.2
– 0.1
2.54 ± 0.5
2.54 ± 0.5
1.2 ± 0.2
5.0+ 0.3
– 0.5
(1.5)
7.8
6.6
2.2
1.7
7.8
7.0
As of January, 2001
Unit: mm
2SK2958(L),2SK2958(S)
11
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contact Hitachi’s sales office before using the product in an application that demands especially high
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