CY74FCT162652ATPVC - Texas Instruments

16-Bit Registered Transceivers

CY74FCT16652T

CY74FCT162652T

Data sheet acquired from Cypress Semiconductor Corporation.

Data sheet modiﬁed to remove devices not offered.

SCCS061B - July 1994 - Revised September 2001

1CY74FCT162652T

Features

•I

off supports partial-power-down mode operation

• Edge-rate control circuitry for signiﬁcantly improved

noise characteristics

• Typical output skew < 250 ps

• ESD > 2000V

• TSSOP (19.6-mil pitch) and SSOP (25-mil pitch)

packages

• Industrial temperature range of −40˚C to +85˚C

•V

CC = 5V ± 10%

CY74FCT16652T Features:

• 64 mA sink current, 32 mA source current

• Typical VOLP (ground bounce) <1.0V at VCC = 5V,

TA = 25˚C

CY74FCT162652T Features:

• Balanced 24 mA output drivers

• Reduced system switching noise

• Typical VOLP (ground bounce) <0.6V at VCC = 5V,

TA= 25˚C

Functional Description

These 16-bit, high-speed, low-power, registered transceivers

that are organized as two independent 8-bit bus transceivers

with three-state D-type registers and control circuitry arranged

for multiplexed transmission of data directly from the input bus

orfromtheinternal storageregisters.OEABandOEBAcontrol

pinsare provided to controlthe transceiverfunctions.SAB and

SBA control pins are provided to select either real-time or

stored data transfer.

Data on the A or B data bus, or both, can be stored in the

internal D ﬂip-ﬂops by LOW-to-HIGH transitions at the

appropriate clock pins (CLKAB or CLKBA), regardless of the

select or enable control pins. When SAB and SBA are in the

real-time transfer mode, it is also possible to store data without

using the internal D-type ﬂip-ﬂops by simultaneously enabling

OEAB and OEBA. In this conﬁguration, each output reinforces

its input. Thus, when all other data sources to the two sets of

bus lines are at high impedance, each set of bus lines will

remain at its last state.

This device is fully speciﬁed for partial-power-down

applications using Ioff. The Ioff circuitry disables the outputs,

preventing damaging current backﬂow through the device

when it is powered down.

The CY74FCT16652T is ideally suited for driving

high-capacitance loads and low-impedance backplanes.

The CY74FCT162652T has 24-mA balanced output drivers

with current-limiting resistors in the outputs. This reduces the

need for external terminating resistors and provides for

minimal undershoot and reduced ground bounce. The

CY74FCT162652T is ideal for driving transmission lines.

TO7 OTHER CHANNELS

1OEAB

1A1

1OEBA

1CLKBA

1CLKAB

1SBA

B REG

AREG

1B1

1SAB

FCT16652-1

2OEAB

2SAB

2OEBA

2CLKBA

2CLKAB

2SBA

2B1

2A1

BREG

AREG

TO 7 OTHER CHANNELS FCT16652-2

Logic Block Diagrams

CY74FCT16652T

CY74FCT162652T

Pin Configuration

SSOP/TSSOP

Top View

FCT16652–1

GND

1OEAB

1CLKAB

1SAB

1A1

1A2

1CLKBA

1SBA

1B1

1OEBA

GND

VCC

1A3

VCC

GND

1A4

1A5

1A6

1A7

1A8

2A1

2A2

2A3

2A4

GND

2A5

2A6

VCC

2A7

2A8

2SAB

2CLKAB

GND

2OEAB

1B2

1B3

1B4

1B5

1B6

1B7

1B8

2B1

2B2

2B3

GND

2B4

2B5

2B6

VCC

2B7

2B8

GND

2SBA

2CLKBA

2OEBA

FCT16652-3

Pin Description

Name Description

A Data Register A Inputs

Data Register B Outputs

B Data Register B Inputs

Data Register A Outputs

CLKAB, CLKBA Clock Pulse Inputs

SAB, SBA Output Data Source Select Inputs

OEAB, OEBA Output Enable Inputs

CY74FCT16652T

CY74FCT162652T

Function Table[1]

Inputs Data I/O[2]

Operation or FunctionOEAB OEBA CLKAB CLKBA SAB SBA A B

HH or L H or L X

XInput Input Isolation

Store A and B Data

HH or L X

X[3] X

XInput

Input Unspeciﬁed[2]

Output Store A, Hold B

Store A in Both Registers

LH or L X

X[3] Unspeciﬁed[2] Input

Input Hold A, Store B

Store B in both Registers

H or L

Output Input Real Time B Data to A Bus

Stored B Data to A Bus

H or L

Input Output Real Time A Data to B Bus

Stored A Data to B Bus

H L H or L H or L H H Output Output Stored A Data to B Bus and

Stored B Data to A Bus

Notes:

1. H = HIGH Voltage Level

L = LOW Voltage Level

X = Don’t Care

=LOW-to-HIGH Transition

2. The data output functions may be enabled or disabled by various signals at the OEAB or OEBA inputs. Data input functions are always enabled, i.e., data at

the bus pins will be stored on every LOW-to-HIGH transition on the clock inputs.

3. Select control=L; clocks can occur simultaneously.

Select control=H; clocks must be staggered to load both registers.

CY74FCT16652T

CY74FCT162652T

Maximum Ratings[4]

(Above which the useful life may be impaired. For user guide-

lines, not tested.)

Storage Temperature .....................Com’l −55°C to +125°C

Ambient Temperature with

Power Applied.................................Com’l −55°C to +125°C

DC Input Voltage .................................................−0.5V to +7.0V

DC Output Voltage ..............................................−0.5V to +7.0V

DC Output Current

(Maximum Sink Current/Pin)...........................−60 to +120 mA

Power Dissipation..........................................................1.0W

Static Discharge Voltage............................................>2001V

(per MIL-STD-883, Method 3015)

Note:

4. Stresses greater than those listed under Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of

the device at these or any other conditions above those indicated in the operational sections of this speciﬁcation is not implied. Exposure to absolute maximum

rating conditions for extended periods may affect reliability.

BUS BBUS A

OEAB

LOEBA

LCLKAB

XSAB

BUS BBUS A

OEAB

OEBA

CLKAB

SAB

SBA

BUS BBUS A

OEAB

HOEBA

LSAB

LSBA

BUS ABUS A

OEAB

HOEBA

LSAB

HSBA

Real-Time Transfer

BusB to BusA Real-Time Transfer

BusA to BusB

Storagefrom

A and/orB TransferStored Data

to A and/orB

CLKBA

XCLKAB

XCLKBA

SBA

CLKBA

XCLKAB

HorL CLKBA

HorL

Operating Range

Range Ambient

Temperature VCC

Industrial −40°C to +85°C 5V ± 10%

CY74FCT16652T

CY74FCT162652T

DC Electrical Characteristics Over the Operating Range

Parameter Description Test Conditions[5] Min. Typ.[6] Max. Unit

VIH Input HIGH Voltage Logic HIGH Level 2.0 V

VIL Input LOW Voltage Logic LOW Level 0.8 V

VHInput Hysteresis 100 mV

VIK Input Clamp Diode Voltage VCC=Min., IIN=−18 mA −0.7 −1.2 V

IIH Input HIGH Current VCC=Max., VI=VCC ±1µA

IIL Input LOW Current VCC=Max., VI=GND ±1µA

IOZH High Impedance Output

Current

(Three-State Output pins)

VCC=Max., VOUT=2.7V ±1µA

IOZL High Impedance Output

Current

(Three-State Output pins)

VCC=Max., VOUT=0.5V ±1µA

IOS Short Circuit Current[8] VCC=Max., VOUT=GND −80 −140 −200 mA

IOOutput Drive Current[8] VCC=Max., VOUT=2.5V −50 −180 mA

IOFF Power-Off Disable VCC=0V, VOUT≤4.5V[7] ±1µA

Output Drive Characteristics for CY74FCT16652T

Parameter Description Test Conditions[5] Min. Typ.[6] Max. Unit

VOH Output HIGH Voltage VCC=Min., IOH=−3 mA 2.5 3.5 V

VCC=Min., IOH=−15 mA 2.4 3.5

VCC=Min., IOH=−32 mA 2.0 3.0

VOL Output LOW Voltage VCC=Min., IOL=64 mA 0.2 0.55 V

Output Drive Characteristics for CY74FCT162652T

Parameter Description Test Conditions[5] Min. Typ.[6] Max. Unit

IODL Output LOW Current[8] VCC=5V, VIN=VIH or VIL, VOUT=1.5V 60 115 150 mA

IODH Output HIGH Current[8] VCC=5V, VIN=VIH or VIL, VOUT=1.5V −60 −115 −150 mA

VOH Output HIGH Voltage VCC=Min., IOH=−24 mA 2.4 3.3 V

VOL Output LOW Voltage VCC=Min., IOL=24 mA 0.3 0.55 V

Capacitance(TA = +25˚C, f = 1.0 MHz)

Parameter Description[10] Test Conditions Typ. Max. Unit

CIN Input Capacitance VIN = 0V 4.5 6.0 pF

COUT Output Capacitance VOUT = 0V 5.5 8.0 pF

Notes:

5. For conditions shown as Max. or Min., use appropriate value speciﬁed under Electrical Characteristics for the applicable device type.

6. Typical values are at VCC=5.0V, +25°C ambient.

7. Tested at TA=+25°C.

8. Not more than one output should be tested at one time. Duration of the test should not exceed one second.

9. Duration of the condition cannot exceed one second.

10. This parameter is measured at characterization but not tested.

CY74FCT16652T

CY74FCT162652T

Power Supply Characteristics

Param. Description Test Conditions[11] Min. Typ.[12] Max. Unit

ICC Quiescent Power Supply

Current VCC=Max. VIN<0.2V

VIN>VCC−0.2V — 5 500 µA

∆ICC Quiescent Power Supply

Current

TTL Inputs HIGH

VCC = Max. VIN=3.4V[13] — 0.5 1.5 mA

ICCD Dynamic Power Supply

Current[14] VCC=Max.

Outputs Open

OEAB=OEAB=GND

One Input Toggling

50% Duty Cycle

VIN=VCC or

VIN=GND — 75 120 µA/

MHz

ICTotal Power Supply Current[15] VCC=Max.

Outputs Open

fo=10 MHz(CLKBA)

50% Duty Cycle

OEAB=OEBA=GND

One-Bit Toggling

f1=5 MHz

50% Duty Cycle

VIN=VCC or

VIN=GND — 0.8 1.7 mA

VIN=3.4V or

VIN=GND — 1.3 3.2 mA

VCC=Max.

Outputs Open

fo=10 MHz (CLKBA)

50% Duty Cycle

OEAB=OEBA=GND

Sixteen Bits Toggling

f1=2.5 MHz

50% Duty Cycle

VIN=VCC or

VIN=GND — 3.8 6.5[16] mA

VIN=3.4V or

VIN=GND — 8.3 20.0[16] mA

Notes:

11. For conditions shown as Max. or Min., use appropriate value speciﬁed under Electrical Characteristics for the applicable device type.

12. Typical values are at VCC=5.0V +25° ambient.

13. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND.

14. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.

15. IC=I

QUIESCENT + IINPUTS + IDYNAMIC

IC=I

CC+∆ICCDHNT+ICCD(f0/2 + f1N1)

ICC = Quiescent Current with CMOS input levels

∆ICC = Power Supply Current for a TTL HIGH input (VIN=3.4V)

DH= Duty Cycle for TTL inputs HIGH

NT= Number of TTL inputs at DH

ICCD = Dynamic Current caused by an input transition pair (HLH or LHL)

f0= Clock frequency for registered devices, otherwise zero

f1= Input signal frequency

N1= Number of inputs changing at f1

All currents are in milliamps and all frequencies are in megahertz.

16. Values for these conditions are examples of the ICC formula. These limits are speciﬁed but not tested.

CY74FCT16652T

CY74FCT162652T

Switching Characteristics Over the Operating Range[17]

Parameter Description

CY74FCT16652AT

CY74FCT162652AT

UnitMin. Max. Fig. No.[18]

tPLH

tPHL Propagation Delay Bus to Bus 1.5 6.3 ns 1, 3

tPZH

tPHL Output Enable Time OEAB or OEBA to Bus 1.5 9.8 ns 1, 7, 8

tPHZ

tPLZ Output Disable Time OEAB or OEBA to Bus 1.5 6.3 ns 1, 7, 8

tPLH

tPHL Propagation Delay Clock to Bus 1.5 6.3 ns 1, 5

tPLH

tPHL Propagation Delay SBA or SAB to Bus 1.5 7.7 ns 1, 5

tSU Set-Up time HIGH or LOW Bus to Clock 2.0 — ns 4

tHHold Time HIGH or LOW Bus to Clock 1.5 — ns 4

tWClock Pulse Width HIGH or LOW 5.0 — ns 5

tSK(O) Output Skew[19] — 0.5 ns

Parameter Description

CY74FCT16652CT

CY74FCT162652CT

UnitMin. Max. Fig. No.[18]

tPLH

tPHL Propagation Delay

Bus to Bus 1.5 5.4 ns 1, 3

tPZH

tPHL Output Enable Time

OEAB or OEBA to Bus 1.5 7.8 ns 1, 7, 8

tPHZ

tPLZ Output Disable Time

OEAB or OEBA to Bus 1.5 6.3 ns 1, 7, 8

tPLH

tPHL Propagation Delay

Clock to Bus 1.5 5.7 ns 1, 5

tPLH

tPHL Propagation Delay

SBA or SAB to Bus 1.5 6.2 ns 1, 5

tSU Set-Up Time

HIGH or LOW

Bus to Clock

2.0 — ns 4

tHHold Time

HIGH or LOW

Bus to Clock

1.5 — ns 4

tWClock Pulse Width

HIGH or LOW 5.0 — ns 5

tSK(O) Output Skew[19] — 0.5 ns

Notes:

17. Minimum limits are speciﬁed, but not tested, on propagation delays.

18. See “Parameter Measurement Information” in the General Information section.

19. Skew between any two outputs of the same package switching in the same direction. This parameter ensured by design.

CY74FCT16652T

CY74FCT162652T

Ordering Information CY74FCT16652

Speed

(ns) Ordering Code Package

Name Package Type Operating

Range

5.4 CY74FCT16652CTPVC/PVCT O56 56-Lead (300-Mil) SSOP Industrial

6.3 CY74FCT16652ATPVC/PVCT O56 56-Lead (300-Mil) SSOP Industrial

Ordering Information CY74FCT162652

Speed

(ns) Ordering Code Package

Name Package Type Operating

Range

5.4 74FCT162652CTPACT Z56 56-Lead (240-Mil) TSSOP Industrial

CY74FCT162652CTPVC O56 56-Lead (300-Mil) SSOP

74FCT162652CTPVCT O56 56-Lead (300-Mil) SSOP

6.3 CY74FCT162652ATPVC O56 56-Lead (300-Mil) SSOP Industrial

74FCT162652ATPVCT O56 56-Lead (300-Mil) SSOP

CY74FCT16652T

CY74FCT162652T

Package Diagrams

56-Lead Shrunk Small Outline Package O56

56-Lead Thin Shrunk Small Outline Package Z56

PACKAGE OPTION ADDENDUM

www.ti.com 7-Jun-2010

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

74FCT162652ATPVCG4 ACTIVE SSOP DL 56 20 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

74FCT162652ATPVCT ACTIVE SSOP DL 56 1000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor

or Sales Office

74FCT162652CTPACT ACTIVE TSSOP DGG 56 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor

or Sales Office

74FCT162652CTPVCG4 ACTIVE SSOP DL 56 20 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

74FCT162652ETPACT OBSOLETE TSSOP DGG 56 TBD Call TI Call TI Samples Not Available

74FCT162652ETPVCT OBSOLETE SSOP DL 56 TBD Call TI Call TI Samples Not Available

74FCT16652ATPVCG4 ACTIVE SSOP DL 56 20 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

74FCT16652ATPVCTG4 ACTIVE SSOP DL 56 1000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

74FCT16652CTPVCG4 ACTIVE SSOP DL 56 20 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

74FCT16652CTPVCTG4 ACTIVE SSOP DL 56 1000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

CY74FCT162652ATPVC ACTIVE SSOP DL 56 20 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

CY74FCT162652CTPVC ACTIVE SSOP DL 56 20 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

CY74FCT162652ETPAC OBSOLETE TSSOP DGG 56 TBD Call TI Call TI Samples Not Available

CY74FCT162652ETPVC OBSOLETE SSOP DL 56 TBD Call TI Call TI Samples Not Available

CY74FCT16652ATPVC ACTIVE SSOP DL 56 20 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

CY74FCT16652ATPVCT ACTIVE SSOP DL 56 1000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

CY74FCT16652CTPVC ACTIVE SSOP DL 56 20 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

CY74FCT16652CTPVCT ACTIVE SSOP DL 56 1000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

CY74FCT16652ETPAC OBSOLETE TSSOP DGG 56 TBD Call TI Call TI Samples Not Available

PACKAGE OPTION ADDENDUM

www.ti.com 7-Jun-2010

Addendum-Page 2

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

CY74FCT16652ETPACT OBSOLETE TSSOP DGG 56 TBD Call TI Call TI Samples Not Available

CY74FCT16652ETPVC OBSOLETE SSOP DL 56 TBD Call TI Call TI Samples Not Available

CY74FCT16652ETPVCT OBSOLETE SSOP DL 56 TBD Call TI Call TI Samples Not Available

FCT162652ATPVCTG4 ACTIVE SSOP DL 56 1000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor

or Sales Office

FCT162652CTPACTE4 ACTIVE TSSOP DGG 56 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor

or Sales Office

FCT162652CTPACTG4 ACTIVE TSSOP DGG 56 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor

or Sales Office

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

74FCT162652ATPVCT SSOP DL 56 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1

74FCT162652CTPACT TSSOP DGG 56 2000 330.0 24.4 8.6 15.6 1.8 12.0 24.0 Q1

CY74FCT16652ATPVCT SSOP DL 56 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1

CY74FCT16652CTPVCT SSOP DL 56 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2012

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

74FCT162652ATPVCT SSOP DL 56 1000 367.0 367.0 55.0

74FCT162652CTPACT TSSOP DGG 56 2000 367.0 367.0 45.0

CY74FCT16652ATPVCT SSOP DL 56 1000 367.0 367.0 55.0

CY74FCT16652CTPVCT SSOP DL 56 1000 367.0 367.0 55.0

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2012

Pack Materials-Page 2

MECHANICAL DATA

MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE

4040048/E 12/01

48 PINS SHOWN

0.730

(18,54)

0.720

(18,29)

4828

0.370

(9,40)

(9,65)

0.380

Gage Plane

DIM

0.420 (10,67)

0.395 (10,03)

A MIN

A MAX

0.010 (0,25)

PINS **

0.630

(16,00)

(15,75)

0.620

0.010 (0,25)

Seating Plane

0.020 (0,51)

0.040 (1,02)

0.008 (0,203)

0.0135 (0,343)

0.008 (0,20) MIN

0.110 (2,79) MAX

0.299 (7,59)

0.291 (7,39)

0.004 (0,10)

0.005 (0,13)

0.025 (0,635)

0°–ā8°

0.005 (0,13)

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).

D. Falls within JEDEC MO-118

MECHANICAL DATA

MTSS003D – JANUARY 1995 – REVISED JANUAR Y 1998

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE

4040078/F 12/97

48 PINS SHOWN

0,25

0,15 NOM

Gage Plane

6,00

6,20 8,30

7,90

0,75

0,50

Seating Plane

0,27

0,17

1,20 MAX

0,08

0,10

0,50

0°–8°

14,10

13,90

DIM

A MAX

A MIN

PINS **

12,40

12,60

17,10

16,90

0,15

0,05

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold protrusion not to exceed 0,15.

D. Falls within JEDEC MO-153

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