Agilent HSMx-C110/C170/C190/C191/C150
High Performance ChipLED
Data Sheet
Features
• High brightness AlInGaP material
• Small size
• Industry standard footprint
• Diffused optics
• Top emitting or right angle
emitting
• Available in 3 colors
(red, orange, amber)
• Compatible with IR soldering
• Available in 8 mm tape on
7" diameter reel
• Reel sealed in zip locked moisture
barrier bags
Applications
• LCD backlighting
• Push button backlighting
• Front panel indicator
• Symbol indicator
• Microdisplays
• Small message panel signage
These ChipLEDs come either in
two top emitting packages
(HSMx-C170/C190/C191/C150)
or in a side emitting package
(HSMx-C110). The right angle
ChipLEDs are suitable for
applications such as LCD back-
lighting. The top emitting
ChipLEDs with wide viewing
angle are suitable for light piping
and direct backlighting of
keypads and panels. In order to
facilitate pick and place opera-
tion, these ChipLEDs are shipped
in tape and reel, with 4000 units
per reel for HSMx-C170/C190/
C191 and 3000 units per reel for
HSMx-C110/C150.
These packages are compatible
with IR soldering process.
Description
These chip-type LEDs utilize Alu-
minum Indium Gallium Phosphide
(AlInGaP) material technology.
The AlInGaP material has a very
high luminous efficiency, capable
of producing high light output
over a wide range of drive
currents. The available colors in
this surface mount series are
592 nm Amber, 605 nm Orange,
626 nm Red for AS AlInGaP and
631 nm red for TS AlInGaP.
All packages are binned by both
color and intensity, except for red
color.
HSMA-C110/C170/C190/C191/C150
HSML-C110/C170/C190/C191/C150
HSMC-C110/C170/C190/C191/C150
HSMZ-C110/C170/C190
2
Package Dimensions
3.2 (0.126 )
0.5 (0.020)
0.9 (0.035)
POLARITY
CATHODE
MARK
1.5 (0.059)
LED DIE
CLEAR
EPOXY
PC BOARD
SOLDERING
TERMINAL
1.0 (0.039)
1.0 (0.039)
2.6 (0.102 )
1.6 (0.063 )
CATHODE LINE
HSMx-C110
3.2 (0.126 )
3.2 (0.126 )
2.0 (0.079 )
0.3 (0.012)
0.4 ± 0.15
(0.016 ± 0.006)
0.3 (0.012)
POLARITY
CATHODE
MARK
0.8 (0.031)
0.4 ± 0.15
(0.016 ± 0.006)
1.4
(0.055)
0.62 (0.024)
LED DIE
DIFFUSED
EPOXY
PC BOARD
SOLDERING
TERMINAL
1.25 (0.049)
HSMx-C170
CATHODE LINE
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
HSMx-C190
1.6
(0.063 )
0.3 (0.012)
0.3 ± 0.15
(0.012 ± 0.006)
0.3 (0.012)
POLARITY
CATHODE
MARK
0.8 (0.031)
0.3 ± 0.15
(0.012 ± 0.006)
1.0
(0.039)
0.4 (0.016)
LED DIE
DIFFUSED EPOXY
PC BOARD
SOLDERING
TERMINAL
0.8 (0.031)
CATHODE LINE
0.7 (0.028) MIN.
HSMx-C191
1.6
(0.063 )
0.3 (0.012)
0.3 ± 0.15
(0.012 ± 0.006)
0.3 (0.012)
POLARITY
CATHODE
MARK
0.6 (0.023)
0.3 ± 0.15
(0.012 ± 0.006)
1.0
(0.039)
0.4 (0.016)
LED DIE
DIFFUSED EPOXY
PC BOARD
SOLDERING
TERMINAL
0.8 (0.031)
CATHODE LINE
0.7 (0.028) MIN.
3
Package Dimensions, continued
Notes:
1. Dimensions in mm.
2. Tolerance ± 0.1 mm unless otherwise noted.
Device Selection Guide
Footprint AS AlInGaP AS AlInGaP AS AlInGaP TS AlInGaP Package
(mm)[1,2] Amber Orange Red Red Description
1.6 x 0.8 x 0.8 HSMA-C190 HSML-C190 HSMC-C190 HSMZ-C190 Untinted, Diffused
2.0 x 1.25 x 0.8 HSMA-C170 HSML-C170 HSMC-C170 HSMZ-C170 Untinted, Diffused
3.2 x 1.0 x 1.5 HSMA-C110 HSML-C110 HSMC-C110 HSMZ-C110 Untinted, Nondiffused
1.6 x 0.8 x 0.6 HSMA-C191 HSML-C191 HSMC-C191 Untinted, Diffused
3.2 x 1.6 x 1.1 HSMA-C150 HSML-C150 HSMC-C150 Untinted, Diffused
Absolute Maximum Ratings
TA = 25°C
HSMA-C110/170/190/191/150
HSML-C110/170/190/191/150
Parameter HSMC-C110/170/190/191/150 HSMZ-C110/170/190 Units
DC Forward Current[1,2] 30 30 mA
Power Dissipation 75 81 mW
Reverse Voltage (IR = 100 µA) 5 5 V
LED Junction Temperature 95 95 °C
Operating Temperature Range –30 to +85 –30 to +85 °C
Storage Temperature Range –40 to +85 –40 to +85 °C
Soldering Temperature See IR soldering profile (Figure 7)
Notes:
1. Derate linearly as shown in Figure 4.
2. Drive currents above 5 mA are recommended for best long term performance.
HSMx-C150
3.2 (0.126 )
0.5 (0.020)
0.50 ± 0.2
(0.020 ± 0.008)
0.6 (0.024)
POLARITY
CATHODE
MARK
1.1 (0.043)
0.50 ± 0.2
(0.020 ± 0.008)
2.0 (0.079)
0.8 (0.031)
LED DIE
DIFFUSED
EPOXY
PC BOARD
SOLDERING
TERMINAL
1.6 (0.063)
CATHODE LINE
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
4
Optical Characteristics
TA = 25°C
Luminous Color, Viewing Luminous
Intensity Peak Dominant Angle Efficacy
Iv (mcd) Wavelength Wavelength 2 θ1/2 ηv
Part @ 20 mA[1] λpeak (nm) λd[2] (nm) Degrees[3] (lm/w)
Number Color Min. Typ. Typ. Typ. Typ. Typ.
HSMA-C110 AS Amber 25 95 595 592 130 480
HSMA-C170/190/191/150 AS Amber 25 90 595 592 170 480
HSML-C110 AS Orange 25 95 609 605 130 370
HSML-C170/190/191/150 AS Orange 25 90 609 605 170 370
HSMC-C110 AS Red 25 95 637 626 130 155
HSMC-C170/190/191/150 AS Red 25 90 637 626 170 155
HSMZ-C110 TS Red 40 170 643 631 130 122
HSMZ-C170/190 TS Red 40 165 643 631 170 122
Notes:
1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the
lamp package.
2. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
Electrical Characteristics
TA = 25°C
Forward Voltage Reverse Breakdown Capacitance C Thermal
VF (Volts) VR (Volts) (pF), VF = 0, Resistance
@ IF = 20 mA @ IR = 100 µA f = 1 MHz RθJ-PIN = (°C/W)
Parameter Number Typ. Max. Min. Typ. Typ.
HSMA-C110 1.9 2.4 5 45 600
HSML-C110 1.9 2.4 5 45 600
HSMC-C110 1.9 2.4 5 45 600
HSMZ-C110 2.2 2.6 5 35 600
HSMA-C170/190/191/150 1.9 2.4 5 45 300
HSML-C170/190/191/150 1.9 2.4 5 45 300
HSMC-C170/190/191/150 1.9 2.4 5 45 300
HSMZ-C170/190 2.2 2.6 5 35 300
5
Note:
1. Bin categories are established for classification of products. Products
may not be available in all categories. Please contact your Agilent rep-
resentative for information on currently available bins.
Note:
1. Bin categories are established for classification of products. Products may not be available in all
categories. Please contact your Agilent representative for information on currently available bins.
Orange Color Bins[1]
Dom. Wavelength (nm)
Bin ID Min. Max.
A 597.0 600.0
B 600.0 603.0
C 603.0 606.0
D 606.0 609.0
E 609.0 612.0
F 612.0 615.0
Tolerance: ± 1 nm.
Yellow/Amber Color Bins[1]
Dom. Wavelength (nm)
Bin ID Min. Max.
A 582.0 584.5
B 584.5 587.0
C 587.0 589.5
D 589.5 592.0
E 592.0 594.5
F 594.5 597.0
Tolerance: ± 0.5 nm.
Light Intensity (Iv) Bin Limits[1]
Intensity (mcd) Intensity (mcd)
Bin ID Min. Max. Bin ID Min. Max.
A 0.11 0.18 N 28.50 45.00
B 0.18 0.29 P 45.00 71.50
C 0.29 0.45 Q 71.50 112.50
D 0.45 0.72 R 112.50 180.00
E 0.72 1.10 S 180.00 285.00
F 1.10 1.80 T 285.00 450.00
G 1.80 2.80 U 450.00 715.00
H 2.80 4.50 V 715.00 1125.00
J 4.50 7.20 W 1125.00 1800.00
K 7.20 11.20 X 1800.00 2850.00
L 11.20 18.00 Y 2850.00 4500.00
M 18.00 28.50
Tolerance: ± 15%.
Color Bin Limits[1]
6
Figure 3. Luminous intensity vs. forward
current.
Figure 2. Forward current vs. forward voltage.
100
10
1
0.11.5 1.7 1.9 2.1 2.5
V
F
– FORWARD VOLTAGE – V
I
F
– FORWARD CURRENT – mA
TS AlInGaP
2.3
AS AlInGaP
0 5 15 30
I
F
– FORWARD CURRENT – mA
0
0.4
1.0
1.4
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
20
0.6
0.2
0.8
10 25
1.2
0
35
020 60 80 100
5
I
F MAX.
– MAXIMUM FORWARD CURRENT – mA
T
A
– AMBIENT TEMPERATURE – °C
40
15
25
30
10
20 Rθ
J-A
= 800°C/W
Rθ
J-A
= 600°C/W
Rθ
J-A
= 500°C/W
Figure 4. Maximum forward current vs.
ambient temperature.
Figure 1. Relative intensity vs. wavelength.
WAVELENGTH – nm
TS AlInGaP
RED
AS AlInGaP
AMBER
RELATIVE INTENSITY
1.0
0.5
0500 550 600 650 700 750
AS AlInGaP
ORANGE
AS AlInGaP
RED
7
Figure 5. Relative intensity vs. angle for HSMx-C110.
RELATIVE INTENSITY
1.00
0
ANGLE
0.80
0.60
0.50
0.70
0.20
0.10
0.30
0.40
0.90
-70 -50 -30 02030507090-90 -20-80 -60 -40 -10 10 40 60 80
RELATIVE INTENSITY
1.00
0
ANGLE
0.80
0.60
0.50
0.70
0.20
0.10
0.30
0.40
0.90
-70 -50 -30 02030507090-90 -20-80 -60 -40 -10 10 40 60 80
Figure 6. Relative intensity vs. angle for HSMx-C170, C190, C191, and C150.
RELATIVE INTENSITY
1.00
0
ANGLE
0.80
0.60
0.50
0.70
0.20
0.10
0.30
0.40
0.90
-70 -50 -30 02030507090-90 -20-80 -60 -40 -10 10 40 60 80
8
230°C MAX.
10 SEC. MAX.
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
TEMPERATURE
4°C/SEC. MAX.
140-160°C
–3°C/SEC. MAX.
1.2 (0.047)
1.2
(0.047)
0.9
(0.035)
1.2
(0.047)
0.8 (0.031)
0.8
(0.031) 0.7
(0.028)
0.8
(0.031)
Figure 7. Recommended reflow soldering profile. Figure 8. Recommended soldering pattern for HSMx-C110.
Figure 9. Recommended soldering pattern for HSMx-C170. Figure 10. Recommended soldering pattern for HSMx-C190 and C191.
Note: All dimensions in millimeters (inches).
5.0 (0.200)
1.0 (0.039)
1.5
(0.059) 1.5
(0.059)
2.0
(0.079)
0.9 (0.035)
0.2 (0.008)
0.9 (0.035)
CENTERING
BOARD
Figure 11. Recommended soldering pattern for HSMx-C150.
1.5 (0.059)
1.5
(0.059) 1.5
(0.059)
2.0
(0.079)
9
Figure 12. Reeling orientation.
CATHODE SIDE
PRINTED LABEL
USER FEED DIRECTION
10.50 ± 1.0 (0.413 ± 0.039)
59.60 ± 1.00
(2.346 ± 0.039)
Ø 20.20 MIN.
(Ø 0.795 MIN.)
6
PS
178.40 ± 1.00
(7.024 ± 0.039)
3.0 ± 0.5
(0.118 ± 0.020)
4.0 ± 0.5
(0.157 ± 0.020) 5.0 ± 0.5
(0.197 ± 0.020)
Ø 13.1 ± 0.5
(Ø 0.516 ± 0.020)
8.0 ± 1.0 (0.315 ± 0.039)
Figure 13. Reel dimensions.
Note: All dimensions in millimeters (inches).
Figure 14. Tape dimensions.
Figure 15. Tape leader and trailer dimensions.
Convective IR Reflow Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060, Surface
Mounting SMT LED Indicator
Components.
Storage Condition: 5 to 30˚C
@ 60% RH max.
Baking is required under the
condition:
a) the blue silica gel indicator
becoming white/transparent
color
b) the pack has been opened for
more than 1 week
Baking recommended condition:
60 +/– 5˚C for 20 hours.
8.00 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE 1)
3.50 ± 0.05
(0.138 ± 0.002)
1.75 (0.069)
DIM. C
(SEE TABLE 1) 0.20 ± 0.05
(0.008 ± 0.002)
CARRIER TAPE
COVER TAPE
DIM. B
(SEE TABLE 1)
4.00 (0.157)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 (0.157) 1.50 (0.059)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
CATHODE
DIM. A
± 0.10 (± 0.004) DIM. B
± 0.10 (± 0.004)PART NUMBER DIM. C
± 0.10 (± 0.004)
HSMx-C170 SERIES 2.40 (0.094) 1.60 (0.063) 1.20 (0.047)
HSMx-C190 SERIES 1.80 (0.071) 0.95 (0.037) 0.87 (0.034)
HSMx-C110 SERIES 3.40 (0.134) 1.70 (0.067) 1.20 (0.047)
HSMx-C191 SERIES 1.80 (0.071) 0.95 (0.037) 0.75 (0.030)
HSMx-C150 SERIES 3.75 (0.148) 2.10 (0.083) 1.30 (0.051)
HSMx-C110
POSITION IN
CARRIER TAPE
DIM. B
(SEE TABLE 1)
DIM. A
(SEE TABLE 1)
R 1.0 ± 0.05
(0.039 ± 0.002)
END START
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
10
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Data subject to change.
Copyright © 2002 Agilent Technologies, Inc.
Obsoletes 5988-4259EN
March 11, 2002
5988-5891EN
