GE Data Sheet ESTW010A0A Series (Eighth-Brick) DC-DC Converter Power Modules 36-75Vdc Input; 5.0Vdc Output; 10A Output Current STINGRAYTM SERIES RoHS Compliant Applications Features Wide input voltage range: 36-75 Vdc Monotonic startup into prebiased load Output Voltage adjust: 80% to 110% of Vo,nom Remote sense Constant switching frequency Positive remote On/Off logic Input under/over voltage protection Output overcurrent and overvoltage protection Over-temperature protection Industry standard, DOSA compliant footprint 57.9mm x 22.8mm x 8.5mm (2.28 in x 0.9 in x 0.335 in) Distributed Power Architectures Low profile height and reduced component skyline Wireless Networks Access and Optical Network Equipment Suitable for cold wall cooling using suitable Gap Pad applied directly to top side of module Industrial Equipment High efficiency: 91% No thermal derating up to 80 C, 1.0m/s (200 LFM) Wide operating temperature range (-40C to 85C) Compliant to RoHS EU Directive 2011/65/EU & REACH Directive (EC) No. 1907/2006 UL* 60950-1, 2nd Ed. Recognized, CSA C22.2 No. 60950 107 Certified, and VDE (EN60950-1, 2nd Ed.) Licensed CE mark meets 2014/35/EU directive Meets the voltage and current requirements for ETSI 300132-2 and complies with and licensed for Basic insulation rating per EN60950-1 2250 Vdc Isolation tested in compliance with IEEE 802.3 PoE standards ISO**9001 and ISO 14001 certified manufacturing facilities Options Negative Remote On/Off logic (preferred) Over current/Over temperature/Over voltage protections (Auto-restart) (preferred) Heat plate version (-H) RoHS 6/6 compliant; Lead Free (-Z) For additional options, see Table 2 (Device Options) under "Ordering Information" section. Description The ESTW010A0A, Eighth-brick low-height power module is an isolated dc-dc converter that can deliver up to 10A of output current and provide a precisely regulated output voltage of 5.0V over a wide range of input voltages (VIN = 36 - 75Vdc). The modules achieve typical full load efficiency of 91%. The open frame modules construction, available in through-hole packaging, enable designers to develop cost and space efficient solutions. * UL is a registered trademark of Underwriters Laboratories, Inc. CSA is a registered trademark of Canadian Standards Association. VDE is a trademark of Verband Deutscher Elektrotechniker e.V. This product is intended for integration into end-user equipment . All of the required procedures of end-use equipment should be followed. IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated. ** ISO is a registered trademark of the International Organization of Standards October 30, 2019 (c)2016 General Electric Company. All rights reserved. GE Data Sheet ESTW010A0A Series Eighth-Brick Power Modules 36-75Vdc Input; 5.0Vdc Output; 10A Output Current Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability. Parameter Device Symbol Min Max Unit Input Voltage Continuous All VIN -0.3 80 Vdc Transient, operational (100 ms) All VIN,trans -0.3 100 Vdc All TA -40 85 C Storage Temperature All Tstg -55 125 C I/O Isolation voltage (100% factory Hi-Pot tested) All 2250 Vdc Operating Ambient Temperature (see Thermal Considerations section) Electrical Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. Parameter Operating Input Voltage Maximum Input Current (VIN= VIN, min to VIN, max, IO=IO, max) Input No Load Current (VIN = 48V, IO = 0, module enabled) Input Stand-by Current Device Symbol Min Typ Max Unit All VIN 36 48 75 Vdc All IIN,max 2.0 Adc All IIN,No load 30 IIN,stand-by 5 All (VIN = 48V, module disabled) I2t mA 8 mA 0.5 A2s Inrush Transient All Input Reflected Ripple Current, peak-to-peak (5Hz to 20MHz, 1H source impedance; VIN, min to VIN, max, IO= IOmax ; See Test configuration section) All 30 mAp-p Input Ripple Rejection (120Hz) All 50 dB CAUTION: This power module is not internally fused. An input line fuse must always be used. This power module can be used in a wide variety of applications, ranging from simple standalone operation to an integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included, however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a maximum rating of 5 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer's data sheet for further information. October 30, 2019 (c)2016 General Electric Company. All rights reserved. Page 2 GE Data Sheet ESTW010A0A Series Eighth-Brick Power Modules 36-75Vdc Input; 5.0Vdc Output; 10A Output Current Electrical Specifications (continued) Parameter Device Symbol Min Typ Max Unit All VO, set 4.925 5.0 5.075 Vdc All VO 4.90 5.10 Vdc All All All 0.2 0.2 1.0 % VO, set % VO, set % VO, set All 25 50 mVrms mVpk-pk Nominal Output Voltage Set-point VIN= 48V IO=IO, max, TA=25C) Output Voltage (Over all operating input voltage, resistive load, and temperature conditions until end of life) Output Regulation Line (VIN=VIN, min to VIN, max) Load (IO=IO, min to IO, max) Temperature (Tref=TA, min to TA, max) Output Ripple and Noise (Co=1uF,ceramic+10uF,tantalum, VIN=VIN, min to VIN, max, IO= IO, max , TA=TA, min to TA, max) RMS (5Hz to 20MHz bandwidth) 75 200 External Capacitance1 All CO 0 2,000 F Output Current Output Current Limit Inception (Hiccup Mode ) (VO= 90% of VO, set) Output Short-Circuit Current (VO250mV) ( Hiccup Mode ) Efficiency All Io 0 10 Adc All IO, lim 105 120 130 % Io All IO, s/c 1.2 All 91.0 % All fsw 350 kHz All Vpk 250 mV All ts 200 s Device Symbol Min Typ Max Unit Isolation Capacitance All Ciso 1000 pF Isolation Resistance All Riso 10 M I/O Isolation Voltage (100% factory Hi-pot tested) All All 2250 Vdc Device Typ Max Peak-to-Peak (5Hz to 20MHz bandwidth) All VIN=48V, TA=25C, IO=IO, max , VO= VO,set Switching Frequency Dynamic Load Response (Co=1uF,ceramic+10uF,tantalum, dIo/dt=0.1A/s; VIN = 48V; TA=25C) Load Change from Io= 50% to 75% or 25% to 50% of Io,max Peak Deviation Settling Time (Vo<10% peak deviation) 1. Arms See Note 2 under Feature Specifications. Isolation Specifications Parameter General Specifications Calculated Reliability based upon Telcordia SR-332 Issue 2: Method I Case 3 (IO=80%IO, max, TA=40C, airflow = 200 lfm, 90% confidence) All Symbo l FIT All MTBF Weight (Open Frame) All Weight (with Heatplate) All Parameter October 30, 2019 Min Unit 9 242.1 10 /Hours 4,130,475 Hours (c)2016 General Electric Company. All rights reserved. 17 (0.60) 30 (1.06) g (oz.) g (oz.) Page 3 GE Data Sheet ESTW010A0A Series Eighth-Brick Power Modules 36-75Vdc Input; 5.0Vdc Output; 10A Output Current Feature Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for additional information. Parameter Device Symbol Min Typ Max Unit mA Remote On/Off Signal Interface (VIN=VIN, min to VIN, max ; open collector or equivalent, Signal referenced to VIN- terminal) Negative Logic: device code suffix "1" Logic Low = module On, Logic High = module Off Positive Logic: No device code suffix required Logic Low = module Off, Logic High = module On Logic Low - Remote On/Off Current All Ion/off 0.15 Logic Low - On/Off Voltage All Von/off -0.7 0.6 Vdc Logic High Voltage - (Typ = Open Collector) All Von/off 2.4 Vdc Logic High maximum allowable leakage current All Ion/off 15 25 All Tdelay 20 msec Case 2: On/Off input is set to Logic Low (Module ON) and then input power is applied (Tdelay from instant at which VIN = VIN, min until Vo=10% of VO,set) All Tdelay 150 msec Output voltage Rise time (time for Vo to rise from 10% of Vo,set to 90% of Vo, set) All Trise 15 msec 3 % VO, set 10 % VO, set A Turn-On Delay1 and Rise Times (IO=IO, max , VIN=VIN, nom, TA = 25oC) Case 1: Input power is applied for at least 1 second and then the On/Off input is set from OFF to ON (Tdelay = from instant at which On/Off signal is ON until VO = 10% of VO, set). Output voltage overshoot - Startup All IO= IO, max; VIN=VIN, min to VIN, max, TA = 25 oC Prebias Output Load Performance: All Monotonic Back Bias current drawn from output (Module Enabled) All -150 Remote Sense Range All Output Voltage Adjustment range All 110 % VO, set Output Overvoltage Protection (Co,min=220 F) 2 All VO, limit 6.0 7.0 Vdc Overtemperature Protection - Hiccup Auto Restart All Tref 135 Input Undervoltage Lockout All VUVLO Turn-on Threshold 32 34.5 Vdc Turn-off Threshold 27.5 30 Vdc 1 2 Vdc Output Start up characteristic Hysteresis 1. 2. VSENSE 80 mAdc O C The module has an adaptable extended Turn-On Delay interval, Tdelay, of 20mS. The extended Tdelay will occur when the module restarts following either: 1) the rapid cycling of Vin from normal levels to less than the Input Undervoltage Lockout (which causes module shutdown), and then back to normal; or 2) toggling the on/off signal from on to off and back to on without removing the input voltage. The normal Turn-On Delay interval, Tdelay, will occur whenever a module restarts with input voltage removed from the module for the preceding 1 second. The module requires a minimum of 220 F external output capacitor to prevent shutdown during no load to full load transients and to avoid exceeding the OVP maximum limits during startup into open loop fault conditions. October 30, 2019 (c)2016 General Electric Company. All rights reserved. Page 4 GE Data Sheet ESTW010A0A Series Eighth-Brick Power Modules 36-75Vdc Input; 5.0Vdc Output; 10A Output Current Characteristic Curves VO (V) (200mV/div) Io(A) (2A/div) EFFICIENCY, (%) OUTPUT CURRENT OUTPUT VOLTAGE The following figures provide typical characteristics for the module at 25oC. The figures are identical for either positive or negative remote On/Off logic. OUTPUT CURRENT, IO (A) VO (V) (2V/div) VOn/Off (V) (2V/div) OUTPUT VOLTAGE Figure 4. Transient Response to 0.1A/S Dynamic Load Change from 50% to 75% to 50% of full load, Vin=48V. On/Off VOLTAGE VO (V) (20mV/div) OUTPUT VOLTAGE Figure 1. Converter Efficiency versus Output Current. TIME, t (200s/div) TIME, t (20ms/div) TIME, t (2s/div) VIN (V) (50V/div) Vo (V) (2V/div) Figure 5. Typical Start-up Using Remote On/Off, negative logic version shown (VIN = 48V, Io = Io,max). INPUT VOLTAGE OUTPUT VOLTAGE VO (V) (200mV/div) Io(A) (2A/div) OUTPUT CURRENT OUTPUT VOLTAGE Figure 2. Typical output ripple and noise (Vin=48V, Io = Io,max). TIME, t (200s/div) Figure 3. Transient Response to 0.1A/S Dynamic Load Change from 25% to 50% to 25% of full load, Vin=48V. October 30, 2019 TIME, t (20ms/div) Figure 6. Typical Start-up Using Input Voltage (VIN = 48V, Io = Io,max). (c)2016 General Electric Company. All rights reserved. Page 5 GE Data Sheet ESTW010A0A Series Eighth-Brick Power Modules 36-75Vdc Input; 5.0Vdc Output; 10A Output Current Test Configurations Design Considerations Input Filtering CURRENT PROBE TO OSCILLOSCOPE LTES T Vin+ BATTERY 12H 33-100F CS 220F E.S.R.<0.1 @ 20C 100kHz Vin- Safety Considerations NOTE: Measure input reflected ripple current with a simulated source inductance (LTEST) of 12H. Capacitor C S offsets possible battery impedance. Measure current as shown above. Figure 7. Input Reflected Ripple Current Test Setup. COPPER STR IP V O (+) RESISTIVE LOAD SCOPE V O (- ) 1uF 10uF GROUND PLANE NOTE: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance. Figure 8. Output Ripple and Noise Test Setup. Rdistribution Rcontact Rcontact Vin+ Rdistribution RLOAD VO Rcontact Rcontact Vin- Rdistribution Vout+ VIN Rdistribution Vout- NOTE: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance. Figure 9. Output Voltage and Efficiency Test Setup. VO. IO Efficiency October 30, 2019 = VIN. IIN x 100 % The power module should be connected to a low ac-impedance source. Highly inductive source impedance can affect the stability of the power module. For the test configuration in Figure 7 a 33-100F electrolytic capacitor (ESR<0.7 at 100kHz), mounted close to the power module helps ensure the stability of the unit. Consult the factory for further application guidelines. For safety-agency approval of the system in which the power module is used, the power module must be installed in compliance with the spacing and separation requirements of the end-use safety agency standard, i.e. UL60950-1, CSA C22.2 No.60950-1, and VDE08051(IEC60950-1). If the input source is non-SELV (ELV or a hazardous voltage greater than 60 Vdc and less than or equal to 75Vdc), for the module's output to be considered as meeting the requirements for safety extra-low voltage (SELV), all of the following must be true: The input source is to be provided with reinforced insulation from any other hazardous voltages, including the ac mains. One VIN pin and one VOUT pin are to be grounded, or both the input and output pins are to be kept floating. The input pins of the module are not operator accessible. Another SELV reliability test is conducted on the whole system (combination of supply source and subject module), as required by the safety agencies, to verify that under a single fault, hazardous voltages do not appear at the module's output. Note: Do not ground either of the input pins of the module without grounding one of the output pins. This may allow a non-SELV voltage to appear between the output pins and ground. The power module has safety extra-low voltage (SELV) outputs when all inputs are SELV. For input voltages exceeding 60 Vdc but less than or equal to 75 Vdc, these converters have been evaluated to the applicable requirements of BASIC INSULATION between secondary DC MAINS DISTRIBUTION input (classified as TNV-2 in Europe) and unearthed SELV outputs. The input to these units is to be provided with a maximum 5 A fast-acting fuse in the ungrounded lead. (c)2016 General Electric Company. All rights reserved. Page 6 GE Data Sheet ESTW010A0A Series Eighth-Brick Power Modules 36-75Vdc Input; 5.0Vdc Output; 10A Output Current maximum output power of the module remains at or below the maximum rated power (Maximum rated power = Vo,set x Io,max). Feature Description Remote On/Off Two remote on/off options are available. Positive logic turns the module on during a logic high voltage on the ON/OFF pin, and off during a logic low. Negative logic remote On/Off, device code suffix "1", turns the module off during a logic high and on during a logic low. SENSE(+) SENSE(-) SUPPLY Vin+ VI(+) VO(+) VI(-) VO(-) CONTACT RESISTANCE Vout+ IO LOAD CONTACT AND DISTRIBUTION LOSSE Figure 11. Circuit Configuration for remote sense . Ion/off ON/OFF TRIM Input Undervoltage Lockout Von/off Vin- II At input voltages below the input undervoltage lockout limit, the module operation is disabled. The module will only begin to operate once the input voltage is raised above the undervoltage lockout turn-on threshold, VUV/ON. Vout- Figure 10. Remote On/Off Implementation. To turn the power module on and off, the user must supply a switch (open collector or equivalent) to control the voltage (Von/off) between the ON/OFF terminal and the VIN(-) terminal (see Figure 10). Logic low is 0V Von/off 0.6V. The maximum Ion/off during a logic low is 0.15mA; the switch should maintain a logic low level whilst sinking this current. During a logic high, the typical maximum Von/off generated by the module is 15V, and the maximum allowable leakage current at Von/off = 2.4V is 25A. If not using the remote on/off feature: For positive logic, leave the ON/OFF pin open. For negative logic, short the ON/OFF pin to VIN(-). Once operating, the module will continue to operate until the input voltage is taken below the undervoltage turn-off threshold, VUV/OFF. Overtemperature Protection To provide protection under certain fault temperature conditions, the unit is equipped with a thermal shutdown circuit. The unit will shutdown if any of the thermal reference points identified in Figures 13 & 14, exceed the stated trip points (typical). However, the thermal shutdown is not intended as a guarantee that the unit will survive temperatures beyond its rating. The module can be restarted by cycling the dc input power for at least one second or by toggling the remote on/off signal for at least one second. If the auto-restart option (4) is ordered, the module will automatically restart upon cool-down to a safe temperature. Remote Sense Output Overvoltage Protection Remote sense minimizes the effects of distribution losses by regulating the voltage at the remote-sense connections (See Figure 11). The voltage between the remote-sense pins and the output terminals must not exceed the output voltage sense range given in the Feature Specifications table: The output over voltage protection scheme of the modules has an independent over voltage loop to prevent single point of failure. This protection feature latches in the event of over voltage across the output. Cycling the on/off pin or input voltage resets the latching protection feature. If the auto-restart option (4) is ordered, the module will automatically restart upon an internally programmed time elapsing. [VO(+) - VO(-)] - [SENSE(+) - SENSE(-)] 0.5 V Although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. The maximum increase is the larger of either the remote sense or the trim. The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using remote sense and trim, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. Care should be taken to ensure that the October 30, 2019 Overcurrent Protection To provide protection in a fault (output overload) condition, the unit is equipped with internal current-limiting circuitry and can endure current limiting continuously. At the point of current-limit inception, the unit enters hiccup mode. If the unit is not configured with auto-restart, then it will latch off following the over current condition. The module can be restarted by cycling the dc input power for at least one second or by toggling the remote on/off signal for at least one second. (c)2016 General Electric Company. All rights reserved. Page 7 GE Data Sheet ESTW010A0A Series Eighth-Brick Power Modules 36-75Vdc Input; 5.0Vdc Output; 10A Output Current Feature Description (continued) 5.11 Vo, set (100 %) 511 Rtrim up 10.22 1.225 % % If the unit is configured with the auto-restart option (4), it will remain in the hiccup mode as long as the overcurrent condition exists; it operates normally, once the output current is brought back into its specified range. The average output current during hiccup is 10% IO, max. Where % V desired V o , set V o , set Output Voltage Programming For example, to trim-up the output voltage of the module by 5% to 12.6V, Rtrim-up is calculated is as follows: Trimming allows the output voltage set point to be increased or decreased, this is accomplished by connecting an external resistor between the TRIM pin and either the VO(+) pin or the VO(-) pin. 100 % 5 5 . 11 12 .0 (100 5 ) 511 R trim up 10 .22 1 .225 5 5 Rtrim up 938 .8 VIN(+) VO(+) Rtrim-up ON/OFF LOAD VOTRIM Rtrim-down VIN(-) VO(-) Figure 12. Circuit Configuration to Trim Output Voltage. Connecting an external resistor (Rtrim-down) between the TRIM pin and the VO(-) (or Sense(-)) pin decreases the output voltage set point. To maintain set point accuracy, the trim resistor tolerance should be 1.0%. The following equation determines the required external resistor value to obtain a percentage output voltage change of % The voltage between the VO(+) and VO(-) terminals must not exceed the minimum output overvoltage protection value shown in the Feature Specifications table. This limit includes any increase in voltage due to remote-sense compensation and output voltage set-point adjustment trim. Although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. The maximum increase is the larger of either the remote sense or the trim. The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using remote sense and trim, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. Care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power (Maximum rated power = VO,set x IO,max). 511 R trim down 10 . 22 % Where % V o , set V desired V o , set 100 For example, to trim-down the output voltage of the module by 8% to 11.04V, Rtrim-down is calculated as follows: % 8 511 Rtrim down 10.22 8 R trim down 53 . 655 Connecting an external resistor (Rtrim-up) between the TRIM pin and the VO(+) (or Sense (+)) pin increases the output voltage set point. The following equation determines the required external resistor value to obtain a percentage output voltage change of %: October 30, 2019 (c)2016 General Electric Company. All rights reserved. Page 8 GE Data Sheet ESTW010A0A Series Eighth-Brick Power Modules 36-75Vdc Input; 5.0Vdc Output; 10A Output Current The power modules operate in a variety of thermal environments; however, sufficient cooling should be provided to help ensure reliable operation. Considerations include ambient temperature, airflow, module power dissipation, and the need for increased reliability. A reduction in the operating temperature of the module will result in an increase in reliability. The thermal data presented here is based on physical measurements taken in a wind tunnel. The thermal reference points, Tref1 and Tref2, used in the specifications for open frame modules are shown in Figure 13. For reliable operation these temperatures should not exceed 110oC and 125 oC respectively. Please refer to the Application Note "Thermal Characterization Process For Open-Frame BoardMounted Power Modules" for a detailed discussion of thermal aspects including maximum device temperatures. OUTPUT CURRENT, IO (A) Thermal Considerations AMBIENT TEMEPERATURE, TA (oC) AIRFLOW Figure 13. Tref 1 & Tref2 Temperature Measurement Locations for Open Frame Module. The thermal reference point, Tref, used in the specifications for modules with heatplate is shown in Figure 14. For reliable operation this temperature should not exceed 110oC. OUTPUT CURRENT, IO (A) Figure 15. Output Current Derating for the Open Frame Module; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V. AMBIENT TEMEPERATURE, TA (oC) Figure 14. Tref Temperature Measurement Location for Module with Heatplate. In addition, the output power of the module should not exceed the rated power for the module as listed in the Ordering Information table, or the derated power for the actual operating conditions as indicated in Figs. 15-18. Heat Transfer via Convection Increased airflow over the module enhances the heat transfer via convection. Derating curves showing the maximum output current that can be delivered by each module versus local ambient temperature (TA) for natural convection and up to 1m/s (200 ft./min) forced airflow are shown in Figure 15. October 30, 2019 OUTPUT CURRENT, IO (A) Figure 16. Output Current Derating for the Module with Heatplate; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V. AMBIENT TEMEPERATURE, TA (oC) Figure 17. Output Current Derating for the Open Frame Module with Heatplate and 0.25" Heatsink; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V. (c)2016 General Electric Company. All rights reserved. Page 9 GE Data Sheet ESTW010A0A Series Eighth-Brick Power Modules 36-75Vdc Input; 5.0Vdc Output; 10A Output Current AMBIENT TEMEPERATURE, TA (oC) Figure 18. Output Current Derating for the Module with Heatplate with Heatplate and 0.50" Heatsink; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V. OUTPUT CURRENT, IO (A) OUTPUT CURRENT, IO (A) Thermal Considerations (continued) COLDPLATE TEMEPERATURE, TC (oC) Figure 20. Derated Output Current versus Cold Wall Temperature with local ambient temperature around module at 85C; Vin=48V. Heat Transfer via Conduction The module can also be used in a sealed environment with cooling via conduction from the module's top surface through a gap pad material to a cold wall, as shown in Figure 19. This capability is achieved by insuring the top side component skyline profile achieves no more than 1mm height difference between the tallest and the shortest power train part that benefits from contact with the gap pad material. The output current derating versus cold wall temperature, when using a gap pad such as Bergquist GP2500S20, is shown in Figure 20. Figure 19. Cold Wall Mounting October 30, 2019 (c)2016 General Electric Company. All rights reserved. Page 10 GE Data Sheet ESTW010A0A Series Eighth-Brick Power Modules 36-75Vdc Input; 5.0Vdc Output; 10A Output Current The modules use an open frame construction and are designed for a fully automated assembly process. The modules are fitted with a label designed to provide a large surface area for pick and place operations. The label meets all the requirements for surface mount processing, as well as safety standards, and is able to withstand reflow temperatures of up to 300oC. The label also carries product information such as product code, serial number and the location of manufacture. in the industry. These power modules can be reliably soldered using natural forced convection, IR (radiant infrared), or a combination of convection/IR. For reliable soldering the solder reflow profile should be established by accurately measuring the modules CP connector temperatures. 300 P eak Temp 235oC 250 REFLOW TEMP (C) Pick and Place Co o ling zo ne 1-4oCs -1 Heat zo ne max 4oCs -1 200 150 So ak zo ne 30-240s 100 50 Tlim above 205oC P reheat zo ne max 4oCs -1 0 REFLOW TIME (S) Figure 22. Reflow Profile for Tin/Lead (Sn/Pb) process. Figure 21. Pick and Place Location. Nozzle Recommendations 240 235 MAX TEMP SOLDER (C) The module weight has been kept to a minimum by using open frame construction. Even so, these modules have a relatively large mass when compared to conventional SMT components. Variables such as nozzle size, tip style, vacuum pressure and placement speed should be considered to optimize this process. The minimum recommended nozzle diameter for reliable operation is 6mm. The maximum nozzle outer diameter, which will safely fit within the allowable component spacing, is 9 mm. Oblong or oval nozzles up to 11 x 9 mm may also be used within the space available. 230 225 220 215 210 205 200 0 Tin Lead Soldering The power modules are lead free modules and can be soldered either in a lead-free solder process or in a conventional Tin/Lead (Sn/Pb) process. It is recommended that the customer review data sheets in order to customize the solder reflow profile for each application board assembly. The following instructions must be observed when soldering these units. Failure to observe these instructions may result in the failure of or cause damage to the modules, and can adversely affect long-term reliability. In a conventional Tin/Lead (Sn/Pb) solder process peak reflow temperatures are limited to less than 235oC. Typically, the eutectic solder melts at 183oC, wets the land, and subsequently wicks the device connection. Sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint. There are several types of SMT reflow technologies currently used October 30, 2019 10 20 30 40 50 60 Figure 23. Time Limit Curve Above 205oC for Tin/Lead (Sn/Pb) process Lead Free Soldering The -Z version of the modules are lead-free (Pb-free) and RoHS compliant and are both forward and backward compatible in a Pb-free and a SnPb soldering process. Failure to observe the instructions below may result in the failure of or cause damage to the modules and can adversely affect long-term reliability. Pb-free Reflow Profile Power Systems will comply with J-STD-020 Rev. C (Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. This standard provides a recommended forced-air-convection reflow profile based on the volume (c)2016 General Electric Company. All rights reserved. Page 11 GE Data Sheet ESTW010A0A Series Eighth-Brick Power Modules 36-75Vdc Input; 5.0Vdc Output; 10A Output Current and thickness of the package (table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The recommended linear reflow profile using Sn/Ag/Cu solder is shown in Figure 24. Figure 24. Recommended linear reflow profile using Sn/Ag/Cu solder. Post Solder Cleaning and Drying Considerations Post solder cleaning is usually the final circuit board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit board assembly. For guidance on appropriate soldering, cleaning and drying procedures, refer to Lineage Power Board Mounted Power Modules: Soldering and Cleaning Application Note (AN04-001). Through-Hole Lead-Free Soldering Information The RoHS-compliant through-hole products use the SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant components. They are designed to be processed through single or dual wave soldering machines. The pins have a RoHS-compliant finish that is compatible with both Pb and Pb-free wave soldering processes. A maximum preheat rate of 3C/s is suggested. The wave preheat process should be such that the temperature of the power module board is kept below 210C. For Pb solder, the recommended pot temperature is 260C, while the Pb-free solder pot is 270C max. Not all RoHScompliant through-hole products can be processed with paste-through-hole Pb or Pb-free reflow process. If additional information is needed, please consult with your GE representative for more details. October 30, 2019 (c)2016 General Electric Company. All rights reserved. Page 12 GE Data Sheet ESTW010A0A Series Eighth-Brick Power Modules 36-75Vdc Input; 5.0Vdc Output; 10A Output Current EMC Considerations The circuit and plots in Figure 25 show a suggested configuration to meet the conducted emission limits of EN55022 Class B. Note: Customer is ultimately responsible for the proper layout, component selection, rating and verification of the suggeted parts based on end application. LISN connected to L Line LISN connected to N Line Figure 25. EMC Considerations For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028). October 30, 2019 (c)2016 General Electric Company. All rights reserved. Page 13 GE Data Sheet ESTW010A0A Series Eighth-Brick Power Modules 36-75Vdc Input; 5.0Vdc Output; 10A Output Current Mechanical Outline for Through-Hole Module Dimensions are in millimeters and [inches]. Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated) x.xx mm 0.25 mm [x.xxx in 0.010 in.] *Top side label includes Lineage Power name, product designation and date code. Top View* Side View *For optional pin lengths, see Table 2, Device Coding Scheme and Options Bottom View Pin 1 2 3 4 5 6 7 8 October 30, 2019 Function Vi(+) ON/OFF Vi(-) Vo(-) SENSE(-) TRIM SENSE(+) Vo(+) (c)2016 General Electric Company. All rights reserved. Page 14 GE Data Sheet ESTW010A0A Series Eighth-Brick Power Modules 36-75Vdc Input; 5.0Vdc Output; 10A Output Current Mechanical Outline for Through-Hole Module with Heat Plate (-H Option) Dimensions are in millimeters and [inches]. Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated) x.xx mm 0.25 mm [x.xxx in 0.010 in.] Top View Side View *For optional pin lengths, see Table 2, Device Coding Scheme and Options Bottom View* Pin 1 2 3 4 5 6 7 8 October 30, 2019 Function Vi(+) ON/OFF Vi(-) Vo(-) SENSE(-) TRIM SENSE(+) Vo(+) (c)2016 General Electric Company. All rights reserved. Page 15 GE Data Sheet ESTW010A0A Series Eighth-Brick Power Modules 36-75Vdc Input; 5.0Vdc Output; 10A Output Current Recommended Pad Layout Dimensions are in millimeters and [inches]. Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated) x.xx mm 0.25 mm [x.xxx in 0.010 in.] Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) NOTES: FOR 0.030" X 0.025" RECTANGULAR PIN, USE 0.050" PLATED THROUGH HOLE DIAMETER FOR 0.62 DIA" PIN, USE 0.076" PLATED THROUGH HOLE DIAMETER TH Recommended Pad Layout (Component Side View) October 30, 2019 (c)2016 General Electric Company. All rights reserved. Page 16 GE Data Sheet ESTW010A0A Series Eighth-Brick Power Modules 36-75Vdc Input; 5.0Vdc Output; 10A Output Current Ordering Information Please contact your GE Sales Representative for pricing, availability and optional features. Table 1 Device Codes Product Codes Output Voltage 5.0V 5.0V Input Voltage ESTW010A0A41Z ESTW010A0A41-HZ 48V (36-75Vdc) 48V (36-75Vdc) Output Current 10A 10A On/Off Logic Negative Negative Connector Type Through hole Through hole Comcodes CC109163481 CC109169553 Table 2. Device Options Character and Position Ratings Characteristic Form Factor Family Designator Input Voltage Output Current Output Voltage Pin Length Options Action following Protective Shutdown On/Off Logic Customer Specific Mechanical Features RoHS E Definition E = Eighth Brick ST = STINGRAY Series W = Wide Range, 36V-75V 010A0 = 010.0 amps maximum A = 5.0V nominal Omit = Default Pin Length shown in Mechanical Outline Figures 6 = Pin Length: 3.68 mm 0.25mm , (0.145 in. 0.010 in.) 8 = Pin Length: 2.79 mm 0.25mm , (0.110 in. 0.010 in.) Omit = Latching Mode 4 = Auto-restart following shutdown (Overcurrent/Overvoltage/Overtermperature) Omit = Positive Logic 1 = Negative Logic ST W 010A0 A 6 8 4 1 XY XY = Customer Specific Modified Code, Omit for Standard Code Omit = Standard open Frame Module H H = Heat plate, for use with heat sinks or cold walls S S = Surface mount connections Omit = RoHS 5/6, Lead Based Solder Used Z Z = RoHS 6/6 Compliant, Lead free Contact Us For more information, call us at USA/Canada: +1 877 546 3243, or +1 972 244 9288 Asia-Pacific: +86.021.54279977*808 Europe, Middle-East and Africa: +49.89.878067-280 www.ge.com/powerelectronics GE Critical Power reserves the right to make changes to the product(s) or information contained herein without notice, and no liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. October 30, 2019 (c)2012 General Electric Company. All rights reserved. Version 2.3