TJA1051TK/3,118 - NXP Semiconductors

1. General description

The TJA1051 is a high-speed CAN transceiver that provides an interface between a

Controller Area Network (CAN) protocol controller and the physical two-wire CAN bus.

The transceiver is designed for high-speed (up to 1 Mbit/s) CAN applications in the

automotive industry, providing differential transmit and receive capability to (a

microcontroller with) a CAN protocol controller.

The TJA1051 belongs to the third generation of high-speed CAN transceivers from NXP

Semiconductors, offering significant improvements over first- and second-generation

devices such as the TJA1050. It offers improved ElectroMagnetic Compatibility (EMC)

and ElectroStatic Discharge (ESD) performance, and also features:

•Ideal passive behavior to the CAN bus when the supply voltag e is off

•TJA1051T/3 an d TJ A1 05 1T K/ 3 can be inter fa ced directly to microcontrollers with

supply voltages from 3Vto5V

These features ma ke the TJA1051 an excellent choice for all types of HS-CAN networks,

in nodes that do not require a standby mode with wake-up capability via the bus.

2. Features and benefits

2.1 General

Fully ISO 11898-2 compliant

Suitable for 12 V and 24 V systems

Low ElectroMagnetic Emission (EME) and high ElectroMagnetic Immunity (EMI)

VIO input on TJA1051T/3 and TJA1051TK/3 allows for direct interfacing with 3 V to 5 V

microcontrollers (available in SO8 and very small HVSON8 packages respectively)

EN input on TJA1051T/E allows the microcontroller to switch the transceiver to a very

low-current Off mode

Available in SO8 and HVSON8 packages

Leadless HVSON8 package (3.0 mm ×3.0 mm) with improved Automated Optical

Inspection (AOI) capability

Dark green product (halogen free and Restriction of Hazardous Substances (RoHS)

compliant)

2.2 Low-power management

Functional behavior predictable under all supply conditions

Transcei ver disengages from the bus when not powered up (zero load)

TJA1051

High-speed CAN transceiver

Rev. 6 — 25 March 2011 Product data sheet

Product data sheet Rev. 6 — 25 March 2011 2 of 21

NXP Semiconductors TJA1051

High-speed CAN transceiver

2.3 Protection

High ElectroStatic Discharge (ESD) handling capability on the bus pins

Bus pins protected against transients in automotive environments

Transmit Data (TXD) dominant time-out function

Undervoltage detectio n on pin s VCC and VIO

Thermally protected

3. Quick reference data

4. Ordering information

[1] TJA1051T/3 and TJA1051TK/3 with VIO pin; TJA1051T/E with EN pin.

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

VCC supply voltage 4.5 - 5.5 V

Vuvd(VCC) undervoltage dete ction

voltage on pin VCC

3.5- 4.5V

ICC supply current Silent mode 0.1 1 2.5 mA

Normal mode; bus

recessive 2.5 5 10 mA

Normal mode; bus

dominant 20 50 70 mA

VESD electrostatic discharge

voltage IEC 61000-4-2 at pins

CANH and CANL −8- +8kV

VCANH voltage on pin CANH no time limit; DC

limiting value −58 - +58 V

VCANL voltage on pin CANL no time limit; DC

limiting value −58 - +58 V

Tvj virtual junction

temperature −40 - +150 °C

Table 2. Orderi ng information

Type number Package

Name Description Version

TJA1051T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

TJA1051T/3[1] SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

TJA1051T/E[1] SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

TJA1051TK/3[1] HVSON8 plastic thermal enhanced very thin small outline package; no leads;

8 ter minals; body 3 × 3 × 0.85 mm SOT782-1

Product data sheet Rev. 6 — 25 March 2011 3 of 21

NXP Semiconductors TJA1051

High-speed CAN transceiver

5. Block diagram

(1) In a transceiver without a VIO pin, the VIO input is internally connected to VCC.

(2) Only present in the TJA1051T/E.

Fig 1. Block diagram

TEMPERATURE

PROTECTION

TIME-OUT

MODE

CONTROL

DRIVER

TXD 1

VI/O(1)

EN(2) 5

RXD 4

SLOPE

CONTROL

AND

DRIVER

VCC

CANH

CANL

GND

TJA1051

015aaa036

VCC

VIO(1)

Product data sheet Rev. 6 — 25 March 2011 4 of 21

NXP Semiconductors TJA1051

High-speed CAN transceiver

6. Pinning information

6.1 Pinning

6.2 Pin description

a. TJA1051T: SO8 b. TJA1051T/E: SO8

c. TJA1051T/3: SO8 d. TJA1051TK/3: HVSON8

Fig 2. Pi n co nfiguration diagra ms

TXD S

GND CANH

CANL

RXD n.c.

015aaa225

TJA1051T

TXD S

GND CANH

CANL

RXD EN

015aaa223

TJA1051T/E

TXD S

GND CANH

CANL

RXD V

015aaa224

TJA1051T/3

015aaa222

TJA1051TK/3

VIO

VCC

RXD

CANL

GND CANH

TXD S

Transparent top view

3 6

2 7

1 8

terminal 1

index area

Table 3. Pin descripti on

Symbol Pin Description

TXD 1 transmit data input

GND 2 ground

VCC 3 supply voltage

RXD 4 receive data output; reads out data from the bus lines

n.c. 5 not connected; in TJA1051T version

EN 5 enable control input; TJ A1051T/E only

VIO 5 supply voltage for I/O level adapter; TJA1051T/3 and TJA1051TK/3 on ly

CANL 6 LOW-level CAN bus line

CANH 7 HIGH-level CAN bus line

S 8 Silent mode control input

Product data sheet Rev. 6 — 25 March 2011 5 of 21

NXP Semiconductors TJA1051

High-speed CAN transceiver

7. Functional description

The TJA1051 is a high-speed CAN stand- alone transce iver with Silent mode. It co mbines

the functiona lity of the TJ A10 50 tra n sce ive r with impr ov ed EMC an d ESD handlin g

capability. Improved slope control and high DC handling capability on the bus pins

provides additional application flexibility.

The TJA1051 is available in three versions, distinguished only by the function of pin 5:

•The TJA1051T is 100 % backwards compatible with the TJA1050

•The TJA1051T/3 and TJA1051TK/3 allow for dire ct interfacing to microcontrollers with

supply voltages down to 3 V

•The TJA1051T/E allows the transceiver to be switched to a very low-curren t Off mode .

7.1 Operating modes

The TJA1051 supports two operating modes, Normal and Silent, which are selected via

pin S. An additional Off mode is supported in the TJA1051T/E via pin EN. See Table 4 for

a description of th e op er a ting mo de s un de r norma l s upply conditions.

[1] Only available on the TJA1051T/E.

[2] LOW if the CAN bus is dominant, HIGH if the CAN bus is recessive.

[3] ‘X’ = don’t care.

7.1.1 Normal mode

A LOW level on pin S selects Norma l mode. In this mode, the transceiver is able to

transmit and receive data via the bus lines CANH and CANL (see Figure 1 for the block

diagram). The differential receiver co nverts the analog data on the bus lines into digital

data which is output to pin RXD. The slope of the output signals on the bus lines is

controlled and optimized in a way that guarantees the lowest possible ElectroMagnetic

Emission (EME).

7.1.2 Silent mode

A HIGH level on pin S selects Silent mode. In Silent mode the transmitter is disabled,

releasing the bus pin s to re ce ssiv e state. All other IC functions, including the receiver,

continue to operate as in Norm al mode. Si lent mode can be used to p revent a fa ulty CAN

controller from disrupting all network communications.

Table 4. Operating modes

Mode Inputs Outputs

Pin EN[1] Pin S Pin TXD CAN driver Pin RXD

Normal HIGH LOW LOW dominant active[2]

HIGH LOW HIGH recessive active[2]

Silent HIGH HIGH X[3] recessive active[2]

Off[1] LOW X[3] X[3] floating floating

Product data sheet Rev. 6 — 25 March 2011 6 of 21

NXP Semiconductors TJA1051

High-speed CAN transceiver

7.1.3 Off mode

A LOW level on pin EN of TJA1051T/E select s Off mode. In Off mode the entire

transceiver is disabled, allowing the microcontroller to save power when CAN

communication is not required. The bus pins are floating in Off mode, making the

transceiver inv isib le to th e re st of the ne two r k.

7.2 Fail-safe features

7.2.1 TXD dominant time-out function

A ‘TXD dominant time-out’ timer is started when pin TXD is set LOW. If the LOW sta te on

pin TXD persists for longer than tto(dom)TXD, the transmitter is disabled, releasing the bus

lines to recessive state. This function prevents a hardware and/or software application

failure from driving the bus lines to a permanent dominant state (blocking all network

communications). The TXD dominant time-out t imer is reset when pin TXD is set HIGH.

The TXD dominant time-out time also defines the minimum possible bit rate of 40 kbit/s.

7.2.2 Internal biasing of TXD, S and EN input pins

Pin TXD has an internal pull-up to VIO and pins S and EN (TJA1051T/E) have internal

pull-downs to GND. This ensures a safe, defined state in case one or more of these pins

is left floating.

7.2.3 Undervoltage detection on pins VCC and VIO

Should VCC or VIO drop below their respective un dervoltage detection levels (Vuvd(VCC)

and Vuvd (VIO); see Table 7), the transceiver will switch off and disengage from the bus

(zero load) until VCC and VIO have recovered.

7.2.4 Overtemperature protection

The output dri vers are protecte d against over temperature cond itions. If the virtual ju nction

temperature exceeds the shutdown junction temperature, Tj(sd), the output drivers will be

disabled until the virtual junctio n temperature falls below Tj(sd) and TXD becomes

recessive again. Including the TXD condition ensures that output driver oscillations due to

temperature drift are avoided.

7.3 VIO supply pin

There are thre e versions of the TJA1051 availabl e, only dif fering in the function of a single

pin. Pin 5 is either an enable control input (EN), a VIO supply pin or is not connected.

Pin VIO on the TJA1051T/3 and T JA1051TK/3 should be connected to the microcontro ller

supply voltage ( see Figure 6). This will adjust the signal levels of pins TXD, RXD and S to

the I/O levels of the microcontroller . For ve rsions of the TJA1051 with out a VIO pin, the VIO

input is internally connected to VCC. This set s the sign al levels of pins TXD, RXD and S to

levels compatible with 5 V microcontrollers.

Product data sheet Rev. 6 — 25 March 2011 7 of 21

NXP Semiconductors TJA1051

High-speed CAN transceiver

8. Limiting values

[1] V erified by an external test house to ensure pins CANH and CANL can withstand ISO 7637 part 3 automotive transient test pulses 1, 2a,

3a and 3b.

[2] IEC 61000-4-2 (150 pF, 330 Ω).

[3] ESD performance of pins CANH and CANL according to IEC 61000-4-2 (150 pF, 330 Ω) has been be verified by an external test house.

The result is equal to or better than ±8 kV (unaided).

[4] Human Body Model (HBM): according to AEC-Q100-002 (100 pF, 1.5 kΩ).

[5] Machine Model (MM): according to AEC-Q100-003 (200 pF, 0.75 μH, 10 Ω).

[6] Charged Device Model (CDM): according to AEC-Q100-011 (field Induced charge; 4 pF). The classification level is C5 (> 1000 V).

[7] In accordance with IEC 60747-1. An alternative definition of virtual junction temperature is: Tvj =T

amb +P×Rth(vj-a), where Rth(vj-a) is a

fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (P) and ambient

temperature (Tamb).

9. Thermal characteristics

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND.

Symbol Parameter Conditions Min Max Unit

Vxvoltage on pin x no time limit; DC value

on pins CANH and CANL −58 +58 V

on any other pin −0.3 +7 V

Vtrt transient voltage on pins CANH and CANL [1] −150 +100 V

VESD electrostatic discharge voltage IEC 61000-4-2 [2]

at pins CANH and CANL [3] −8+8 kV

HBM [4]

at pins CANH and CANL −8+8 kV

at any other pin −4+4 kV

MM [5]

at any pin −300 +300 V

CDM [6]

at corner pins −750 +750 V

at any pin −500 +500 V

Tvj virtual junction temperature [7] −40 +150 °C

Tstg storage temperature −55 +150 °C

Table 6. Thermal characteristics

According to IEC 60747-1.

Symbol Parameter Conditions Value Unit

Rth(vj-a) thermal resistance from virtual junction to ambient SO8 package; in free air 155 K/W

HVSON8 package; in free air 55 K/W

Product data sheet Rev. 6 — 25 March 2011 8 of 21

NXP Semiconductors TJA1051

High-speed CAN transceiver

10. Static characteristics

Table 7. Static characteristics

Tvj =

−

C to +150

C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL=60

unless specified otherwise; All voltages are

defined with respect to ground; Positive currents flow into the IC[2].

Symbol Parameter Conditions Min Typ Max Unit

Supply; pin VCC

VCC supply voltage 4.5 - 5.5 V

ICC supply current Off mode (TJA1051T/E) 1 5 8 μA

Silent mode 0.1 1 2.5 mA

Normal mode

recessive; VTXD =VIO -510mA

dominant; VTXD =0V - 50 70 mA

Vuvd(VCC) undervoltage detection

voltage on pin VCC

3.5 - 4.5 V

I/O level adapter supply; pin VIO[1]

VIO supply voltage on pin VIO 2.8 - 5.5 V

IIO supply current on pin VIO Normal and Silent modes

recessive; VTXD =V

IO -80250μA

dominant; VTXD = 0 V - 350 500 μA

Vuvd(VIO) undervoltage detection

voltage on pin VIO

1.3 - 2.7 V

Mode control inp uts; pins S and EN[3]

VIH HIGH-level input voltage [4] 0.7VIO -V

IO +0.3 V

VIL LOW-level input voltage −0.3 - 0.3VIO V

IIH HIGH-level input current VS=V

IO; VEN =V

IO 1410μA

IIL LOW-level input current VS=0V; V

EN =0 V −10+1μA

CAN transmit data input; pin TXD

VIH HIGH-level input voltage [4] 0.7VIO -V

IO +0.3 V

VIL LOW-level input voltage −0.3 - +0.3VIO V

IIH HIGH-level input current VTXD =V

IO −50+5μA

IIL LOW-level input current Normal mode; VTXD =0V −260 −150 −30 μA

Ciinput capacitance [5] -510pF

CAN receive data output; pin RXD

IOH HIGH-level output current VRXD =V

IO −0.4 V; VIO =V

CC −8−3−1mA

IOL LOW-level output current VRXD = 0.4 V ; bus dominant 2 5 12 mA

Bus lines; pins CANH and CANL

VO(dom) dominant output voltage VTXD =0V; t<t

to(dom)TXD

pin CANH 2.75 3.5 4.5 V

pin CANL 0.5 1.5 2.25 V

Vdom(TX)sym transmitter dominant voltage

symmetry Vdom(TX)sym = VCC −VCANH −VCANL −400 0 +400 mV

Product data sheet Rev. 6 — 25 March 2011 9 of 21

NXP Semiconductors TJA1051

High-speed CAN transceiver

[1] Only TJA1051T/3 and TJA1051TK/3 have a VIO pin. In transceiver s without a VIO pin, the VIO input is internally connected to VCC.

[2] All parameters are guaranteed over the virtual junction temperature range by design. Factory testing uses correlated test conditions to

cover the specified temperature and power supply voltage range.

[3] Only TJA1051T/E has an EN pin.

[4] Maximum value assumes VCC <V

IO; if VCC >V

IO, the maximum value will be VCC + 0.3 V.

[5] Not tested in production; guaranteed by design.

[6] Vcm(CAN) is the common mode voltage of CANH and CANL.

11. Dynamic characteristics

VO(dif)bus bus differential output voltage VTXD =0V; t<t

to(dom)TXD

VCC = 4.75 V to 5.25 V

RL=45Ωto 65 Ω

1.5 - 3 V

VTXD =V

IO; recessive; no load −50 - +50 mV

VO(rec) recessive output voltage Normal and Silent modes;

VTXD =V

IO; no load 20.5V

CC 3V

Vth(RX)dif differential receiver threshold

voltage Normal and Silent modes

Vcm(CAN)[6] =−30 V to +30 V 0.5 0.7 0.9 V

Vhys(RX)dif differenti al receiver hysteresis

voltage Normal and Silent modes

Vcm(CAN) =−30 V to +30 V 50 120 200 mV

IO(dom) dominant output current VTXD =0V; t<t

to(dom)TXD; VCC =5 V

pin CANH; VCANH =0V −100 −70 −40 mA

pin CANL; VCANL = 5 V / 40 V 40 70 100 mA

IO(rec) recessive output current Normal and Silent modes; VTXD =V

VCANH =V

CANL =−27 V to +32 V −5-+5mA

ILleakage current VCC =V

IO =0V;

VCANH =V

CANL =5V −50+5μA

Riinput resistance 9 15 28 kΩ

ΔRiinput resistance deviation between VCANH and VCANL −10+1%

Ri(dif) differential input resistance 19 30 52 kΩ

Ci(cm) common-mode input

capacitance [5] --20pF

Ci(dif) differential input capacitance [5] --10pF

Temperature protection

Tj(sd) shutdown junction

temperature [5] - 190 - °C

Table 7. Static characteristics …continued

Tvj =

−

C to +150

C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL=60

unless specified otherwise; All voltages are

defined with respect to ground; Positive currents flow into the IC[2].

Symbol Parameter Conditions Min Typ Max Unit

Table 8. Dynamic characteristics

Tvj =

−

C to +150

C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL=60

unless specified otherwise. All voltages are

defined with respect to ground. Positive currents flow into the IC.[2]

Symbol Parameter Conditions Min Typ Max Unit

Transceiver timing; pins CANH, CANL, TXD and RXD; see Figure 3 and Figure 4

td(TXD-busdom) delay time from TXD to bus dominant Normal mode - 65 - ns

td(TXD-busrec) delay time from TXD to bus recessive Normal mode - 90 - ns

Product data sheet Rev. 6 — 25 March 2011 10 of 21

NXP Semiconductors TJA1051

High-speed CAN transceiver

[1] Only TJA1051T/3 and TJA1051TK/3 have a VIO pin. In transceiver s without a VIO pin, the VIO input is internally connected to VCC.

[2] All parameters are guaranteed over the virtual junction temperature range by design. Factory testing uses correlated test conditions to

cover the specified temperature and power supply voltage range.

td(busdom-RXD) delay time from bus dominant to RX D Normal and Silent modes - 60 - ns

td(busrec-RXD) delay time from bus recessive to RXD Normal and Silent modes - 65 - ns

tPD(TXD-RXD) propagation delay from TXD to RXD Normal mode; versions

with VIO pin 40 - 250 ns

Normal mode; all other

versions 40 - 220 ns

tto(dom)TXD TXD dominant time-out time VTXD = 0 V; Normal mode 0.3 1 5 ms

Table 8. Dynamic characteristics …continued

Tvj =

−

C to +150

C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL=60

unless specified otherwise. All voltages are

defined with respect to ground. Positive currents flow into the IC.[2]

Symbol Parameter Conditions Min Typ Max Unit

(1) For versions with a VIO pin (TJA1051T/3 and TJA1051TK/3) or an EN pin (TJA1051T/E), these

inputs are connected to pin VCC.

Fig 3. Timing test circuit for CAN transceiver

TJA1051

GND

VCC

100 nF47 μF

+5 V

TXD

RXD

15 pF

CANL

CANH

VIO/EN(1)

RL100 pF

015aaa04

Product data sheet Rev. 6 — 25 March 2011 11 of 21

NXP Semiconductors TJA1051

High-speed CAN transceiver

12. Application information

Fig 4. CAN transceiver timing diagram

CANH

CANL

td(TXD-busdom)

TXD

VO(dif)(bus)

RXD

HIGH

LOW

dominant

recessive

0.9 V

0.5 V

0.3VIO

0.7VIO

td(busdom-RXD)

td(TXD-busrec)

td(busrec-RXD)

tPD(TXD-RXD)

tPD(TXD-RXD) 015aaa02

Fig 5. Typical application of the TJA1051 T/E

TJA1051T/E

TXD

RXD

MICRO-

CONTROLLER

Pxx

Pyy

TX0

RX0

VDD

GND

CANH CANH

CANL CANL

5 V

BAT

015aaa22

Product data sheet Rev. 6 — 25 March 2011 12 of 21

NXP Semiconductors TJA1051

High-speed CAN transceiver

13. Test information

13.1 Quality information

This product has been qualified to the appropriate Automotive Electronics Council (AEC)

standard Q100 or Q101 and is suitable for use in automotive applications.

Fig 6. Typical application of the TJA1051T/3 or TJA1051TK/3.

TJA1051T/3 S

TXD

RXD

TJA1051TK/3 MICRO-

CONTROLLER

Pxx

Pyy

TX0

RX0

VDD

GND

VCC

CANH CANH

CANL CANL

5 V

BAT 3 V

VIO

015aaa22

Product data sheet Rev. 6 — 25 March 2011 13 of 21

NXP Semiconductors TJA1051

High-speed CAN transceiver

14. Package outline

Fig 7. Package outline SOT96-1 (SO8)

UNIT A

max. A1A2A3bpcD

(1) E(2) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

inches

1.75 0.25

0.10

1.45

1.25 0.25 0.49

0.36

0.25

0.19

5.0

4.8

4.0

3.8 1.27 6.2

5.8 1.05 0.7

0.6

0.7

0.3 8

0.25 0.10.25

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

1.0

0.4

SOT96-1

detail X

vMA

(A )

pin 1 index

076E03 MS-012

0.069 0.010

0.004

0.057

0.049 0.01 0.019

0.014

0.0100

0.0075

0.20

0.19

0.16

0.15 0.05 0.244

0.228

0.028

0.024

0.028

0.012

0.010.010.041 0.004

0.039

0.016

0 2.5 5 mm

scale

O8: plastic small outline package; 8 leads; body width 3.9 mm SOT96

-1

99-12-27

03-02-18

Product data sheet Rev. 6 — 25 March 2011 14 of 21

NXP Semiconductors TJA1051

High-speed CAN transceiver

Fig 8. Package outline SOT782-1 (HVSON8)

References

Outline

version

European

projection Issue date

IEC JEDEC JEITA

SOT782-1 - - -- - -

sot782-1_po

09-08-25

09-08-28

Unit(1)

max

nom

min

1.00

0.85

0.80

0.05

0.03

0.00

0.2

3.10

3.00

2.90

2.45

2.40

2.35

3.10

3.00

2.90

0.65 1.95

0.45

0.40

0.35

0.1

Dimensions

Note

1. Plastic or metal protrusions of 0.075 maximum per side are not included.

VSON8: plastic thermal enhanced very thin small outline package; no leads;

terminals; body 3 x 3 x 0.85 mm SOT782-

A1b

0.35

0.30

0.25

cDD

hEE

1.65

1.60

1.55

0.35

0.30

0.25

0.1

0.05

0 1 2 mm

scale

MO-229

detail X

B A

terminal 1

index area

eAC B

1 4

8 5

terminal 1

index area

Product data sheet Rev. 6 — 25 March 2011 15 of 21

NXP Semiconductors TJA1051

High-speed CAN transceiver

15. Handling information

All input and output pins are protected against ElectroStatic Discharge (ESD) under

normal handling. When handling ensure that the appropriate pre ca utions are taken as

described in JESD625-A or equivalent standards.

16. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering ICs can be found in Application Note AN10365 “Surface mount reflow

soldering description”.

16.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to

Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both

the mechanical and the electrical connection. There is no single soldering method that is

ideal for all IC packages. Wave soldering is often preferred when through-hole and

Surface Mount Devices (SMDs) are mixed on on e printed wiring board; however, it is not

suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high

densities that come with increased miniaturization.

16.2 Wave and reflow soldering

W ave soldering is a joining te chnology in which the joints are m ade by solder coming from

a standing wave of liquid solder. The wave soldering process is suitable for the following:

•Through-hole components

•Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless

packages which have solde r lands underneath the body, cannot be wave soldered. Also,

leaded SMDs with leads ha ving a pitch smaller than ~0.6 mm cannot be wave soldered,

due to an increased probability of bridging.

The reflow soldering process involves applying solder paste to a board, followed by

component placement and exposure to a temperature profile. Leaded pa ckages,

packages with solder balls, and leadless packages are all reflow soldera ble.

Key characteristics in both wave and reflow soldering are:

•Board specifications, including the board finish, solder masks and vias

•Package footprints, including solder thieves and orientation

•The moisture sensitivity level of the packages

•Package placement

•Inspection and repair

•Lead-free soldering ve rsus SnPb soldering

16.3 Wave soldering

Key characteristics in wave soldering are:

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NXP Semiconductors TJA1051

High-speed CAN transceiver

•Process issues, such as application of adhesive and flux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are

exposed to the wave

•Solder bath specifications, including temperature and impurities

16.4 Reflow soldering

Key characteristics in reflow soldering are :

•Lead-free ve rsus SnPb soldering; note th at a lead-free reflow process usua lly leads to

higher minimum peak temperatures (see Figure 9) than a SnPb process, thus

reducing the process window

•Solder paste printing issues including smearing, release, and adjusting the process

window for a mix of large and small components on one board

•Reflow temperature profile; this profile includes preheat, reflow (in which the board is

heated to the peak temperature) an d cooling down. It is imperative that the peak

temperature is high enoug h for the solder to make reliable solder joint s (a solder paste

characteristic). In addition, the peak temperature must be low enough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on p ackage thickness and volume and is classified in accordance with

Table 9 and 10

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reflow

soldering, see Figure 9.

Table 9. SnPb eutectic process (from J-STD-020C)

Package thickness (mm) Package reflow temperature (°C)

Volume (mm3)

< 350 ≥ 350

< 2.5 235 220

≥ 2.5 220 220

Table 10. Lead-fr ee process (from J-STD-020C)

Package thickness (mm) Package reflow temperature (°C)

Volume (mm3)

< 350 350 to 2000 > 2000

< 1.6 260 260 260

1.6 to 2.5 260 250 245

> 2.5 250 245 245

Product data sheet Rev. 6 — 25 March 2011 17 of 21

NXP Semiconductors TJA1051

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For further informa tion on temperature profiles, refer to Application Note AN10365

“Surface mount reflow soldering description”.

17. Soldering of HVSON packages

Section 16 contains a brief introduction to the techniques most commonly used to solder

Surface Mounted Devices (SMD). A more detailed discussion on soldering HVSON

leadless package ICs can found in the following application notes:

•AN10365 ‘Surface mount reflow soldering description”

•AN10366 “HVQFN application information”

MSL: Moisture Sensitivity Level

Fig 9. Temperature profiles for large and small components

001aac84

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

Product data sheet Rev. 6 — 25 March 2011 18 of 21

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High-speed CAN transceiver

18. Revision history

Table 11. Revision history

Document ID Release date Data sheet status Change notice Supersedes

TJA1051 v.6 20110325 Product data sheet - TJA1051 v.5

Modifications •Section 2.1: package-related features added

•Table 5: parameter Tamb deleted

TJA1051 v.5 20101229 Produ ct data sheet - TJA1051 v.4

TJA1051 v.4 20091020 Produ ct data sheet - TJA1051 v.3

TJA1051 v.3 20090825 Produ ct data sheet - TJA1051 v.2

TJA1051 v.2 20090701 Produ ct data sheet - TJA1051 v.1

TJA1051 v.1 20090309 Produ ct data sheet - -

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19. Legal information

19.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

19.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not b e relied u pon to cont ain det ailed and

full information. For detailed and full informatio n see the relevant full data

sheet, which is available on request via the local NXP Semicond uctors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre va il.

Product specificat io n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyon d those described in the

Product data sheet.

19.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warrant ies, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability t owards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use in automotive applications — This NXP

Semiconductors product has been qualified for use in automotive

applications. The product is not designed, authorized or warranted to be

suitable for use in medica l, military, aircraft, space or life support equipment,

nor in applications where failure or malf unction of an NXP Semiconductor s

product can reasonably be expected to result in personal injury, death or

severe property or environmental damage. NXP Semiconductors accepts no

liability for inclusion and/or use of NXP Semiconductors products in such

equipment or applications and therefore such inclusion and/or use is at the

customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Custo mers should provide appropriate

design and operating safeguards to minimize the risks associated with t heir

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party custo m er(s). Customer is responsible for doing all necessary

testing for the customer’s applications and pro ducts using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter m s and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by cust omer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or the gr ant,

conveyance or implication of any license under any copyrights, patents or

other industrial or inte llectual property rights.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contain s data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

Product data sheet Rev. 6 — 25 March 2011 20 of 21

NXP Semiconductors TJA1051

High-speed CAN transceiver

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from national authorities.

Quick reference data — The Quick reference dat a is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

19.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respective ow ners.

20. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors TJA1051

High-speed CAN transceiver

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 25 March 2011

Document identifier: TJA1051

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

21. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1

2.1 General. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2.2 Low-power management . . . . . . . . . . . . . . . . . 1

2.3 Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

3 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2

4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4

6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

7 Functional description . . . . . . . . . . . . . . . . . . . 5

7.1 Operating modes . . . . . . . . . . . . . . . . . . . . . . . 5

7.1.1 Normal mode . . . . . . . . . . . . . . . . . . . . . . . . . . 5

7.1.2 Silent mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

7.1.3 Off mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

7.2 Fail-safe features . . . . . . . . . . . . . . . . . . . . . . . 6

7.2.1 TXD dominant time-out function. . . . . . . . . . . . 6

7.2.2 Internal biasing of TXD, S and EN input pins . . 6

7.2.3 Undervoltage detection on pins VCC and VIO . . 6

7.2.4 Overtemperature protection . . . . . . . . . . . . . . . 6

7.3 VIO supply pin. . . . . . . . . . . . . . . . . . . . . . . . . . 6

8 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . . . 7

9 Thermal characteristics . . . . . . . . . . . . . . . . . . 7

10 Static characteristics. . . . . . . . . . . . . . . . . . . . . 8

11 Dynamic characteristics . . . . . . . . . . . . . . . . . . 9

12 Application information. . . . . . . . . . . . . . . . . . 11

13 Test information. . . . . . . . . . . . . . . . . . . . . . . . 12

13.1 Quality information . . . . . . . . . . . . . . . . . . . . . 12

14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13

15 Handling information. . . . . . . . . . . . . . . . . . . . 15

16 Soldering of SMD packages . . . . . . . . . . . . . . 15

16.1 Introduction to soldering. . . . . . . . . . . . . . . . . 15

16.2 Wave and reflow soldering . . . . . . . . . . . . . . . 15

16.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 15

16.4 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 16

17 Soldering of HVSON packages. . . . . . . . . . . . 17

18 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 18

19 Legal information. . . . . . . . . . . . . . . . . . . . . . . 19

19.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19

19.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

19.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 19

19.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 20

20 Contact information. . . . . . . . . . . . . . . . . . . . . 20

21 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21