5962-8700301CA - NXP SEMICONDUCTORS

REVISIONS

LTR DESCRIPTION DATE (YR-MO-DA) APPROVED

A Add the words, “CURRENT CAGE CODE 67268” to the first sheet.

Changes in accordance with NOR 5962-R178-96. 96-07-10 M. A. FRYE

B Update boilerplate paragraphs to current MIL-PRF-38535 requirements.

Redrawn. - ro 10-01-25 C. SAFFLE

CURRENT CAGE CODE 67268

THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.

REV

SHEET

REV

SHEET

REV STATUS REV B B B B B B B B B

OF SHEETS SHEET 1 2 3 4 5 6 7 8 9

PMIC N/A PREPARED BY

DONALD R. OSBORNE

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 4321 8-3990

http://www.dscc.dla.mil

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

CHECKED BY

D. A. DiCENZO

APPROVED BY

N. A. HAUCK

MICROCIRCUIT, LINEAR, TONE

DECODER/PHASE LOCKED L OOP, MONOLITHIC

SILICON

DRAWING APPROVAL DATE

87-02-24

AMSC N/A

REVISION LEVEL

B SIZE

A CAGE CODE

14933

5962-87003

SHEET 1 OF 9

DSCC FORM 2233

APR 97 5962-E136-10

STANDARD

MICROCIRCUIT DRAWING

SIZE

5962-87003

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990 REVISION LEVEL

B SHEET 2

DSCC FORM 2234

APR 97

1. SCOPE

1.1 Scope. This drawing describes device requireme nts for MIL-STD-883 compliant, non-JAN class level B microcircuits in

accordance with MIL-PRF-38535, appendix A.

1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:

5962-87003 01 C A

Drawing number Device type

(see 1.2.1) Case outline

(see 1.2.2) Lead finish

(see 1.2.3)

1.2.1 Device type(s). The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function

01 567 Tone and frequenc y decoder

1.2.2 Case outline(s). The case outline(s) are as desi gn ated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style

C GDIP1-T14 or CDIP2-T14 14 Dual-in-line

P GDIP1-T8 or CDIP2-T8 8 Dual-in-line

1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appe ndix A.

1.3 Absolute maximum ratings.

Supply voltage (VCC) ...................................................................................... +10 V

Positive voltage at input (+VIN) ....................................................................... VCC + 0.5 V dc

Negative voltage at input (-VIN) ...................................................................... -10 V dc

Output voltage (collector of output transistor) ................................................. 15 V dc

Maximum power dissipation (PD) ................................................................... 300 mW 1/

Storage temperature range ............................................................................. -65C to +150C

Lead temperature (soldering, 60 seconds) ...................................................... +300C

Junction temperature (TJ) ............................................................................... +150C

Thermal resistance, junction-to-case (JC) ..................................................... See MIL-STD-1835

1.4 Recommended operating conditions.

Operating voltage range (V+) .......................................................................... 4.75 V dc to 9 V dc

Operating voltage ............................................................................................ 5.0 V dc

Ambient operating temperature range (TA) ..................................................... -55C to +125C

STANDARD

MICROCIRCUIT DRAWING

SIZE

5962-87003

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990 REVISION LEVEL

B SHEET 3

DSCC FORM 2234

APR 97

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and han dbooks. The following specification, standards, and handbooks form a part

of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the

solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATION

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883 - Test Method Standard Microcircuits.

MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.

DEPARTMENT OF DEFENSE HANDBOOKS

MIL-HDBK-103 - List of Standard Microcircuit Drawings.

MIL-HDBK-780 - Standard Microcircuit Drawings.

(Copies of these documents ar e available online at https://assist.daps.dla.mil/quicksearch/ or from the Standardization

Document Order Desk, 700 Robbins Avenue , Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text

of this drawing takes precedence. Nothing in this document, however, supersedes applicabl e laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item r equirements shall be in accordance with MIL-PRF-38535, appendix A for non-

JAN class level B devices and as specified h erein. Product built to this drawing that is produced by a Qualified Manufacturer

Listing (QML) certified and qualified man ufacturer or a manufacturer who has been granted transitional certification to

MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approv ed program plan and

qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management

(QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the

device. These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with

MIL-PRF-38535 is required to identify when the QML flo w option is used.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified

in MIL-PRF-38535, appendix A and herein.

3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.

3.2.3 Logic diagram. The logic diagram shall be as specified on figure 2.

3.3 Electrical performance characteristics . Unless otherwise specified he r ein, the electri c al performance characteristics are

as specified in table I and shall app ly over the full ambient operating temperature ran ge.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical

tests for each subgroup are described in tabl e I.

STANDARD

MICROCIRCUIT DRAWING

SIZE

5962-87003

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990 REVISION LEVEL

B SHEET 4

DSCC FORM 2234

APR 97

3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN

listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD

PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the devic e.

3.5.1 Certification/compliance mark. A compliance indicat or “C” shall be marked on all non-JAN dev ices built in compliance

to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in

accordance with MIL-PRF-38535 to identify when the QML flow option is used.

3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an

approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of complian ce submitted to DSCC-VA prior to

listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of

MIL-PRF-38535, appendix A and the requirements herein.

3.7 Certificate of conformance. A certificate of conformance as require d in MIL-PRF-38535, appendix A shall b e provided

with each lot of microcircuits deliver ed to this drawing.

3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing.

3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's

facility and applicable required documentation. Offshore documentati on shall be made available onshore at the option of the

reviewer.

STANDARD

MICROCIRCUIT DRAWING

SIZE

5962-87003

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990 REVISION LEVEL

B SHEET 5

DSCC FORM 2234

APR 97

TABLE I. Electrical performance characteristi c s.

Test Symbol

Conditions

-55C  TA +125C

Group A

subgroups

Device

type

Limits Unit

unless otherwise specified Min Max

Input resistance 1/ RIN V

CC = 5.0 V 1,2,3 01 15 25

k

Smallest detectable input

voltage

VIN V

OUT = Low 1 01 25

mVrms

2,3 50

Largest no output input

voltage

VIN V

OUT = High 1 01 7

mVrms

2,3 5

Output leakage current ICEX V

OUT = 15 V 1 01 25

A

2,3 50

Output low voltage VOL I

OUT = 30 mA 1,2,3 01 0.4 V

IOUT = 100 mA 1 1.0

2,3 1.2

Operating supply voltage

range VCC 1,2,3 01 4.75 9.0 V

Supply current quiescent ICC R

L = 20 k, VCC = 5.0 V 1 01 8.0 mA

2,3 9.8

Supply current activated ICC R

L = 20 k, VCC = 5.0 V 1 01 13.0 mA

2,3 14.5

Center frequency distribution fO VCC = 5.0 V, 2/

fO = 100 kHz = 1.1 / R1C1 4,5,6 01 -10 +10 %

Center frequency shift with

supply voltage

fO /

VCC VCC = 5 V to 8 V, TA = +25C 4 01 1 %/V

Largest detection bandwidth DBW VCC = 5.0 V, 4 01 12 16

% of

fO = 100 kHz = 1.1 / R1C1 5,6 7 19

Largest detection bandwidth

skew DBW

skew VCC = 5.0 V 4,5,6 01 4

% of

1/ T hese parameters are guaranteed but not tested.

2/ Freque ncy determining resistor R1 should be between 2 k and 20 k.

STANDARD

MICROCIRCUIT DRAWING

SIZE

5962-87003

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990 REVISION LEVEL

B SHEET 6

DSCC FORM 2234

APR 97

FIGURE 1. Terminal connections.

STANDARD

MICROCIRCUIT DRAWING

SIZE

5962-87003

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990 REVISION LEVEL

B SHEET 7

DSCC FORM 2234

APR 97

FIGURE 2. Logic diagram.

STANDARD

MICROCIRCUIT DRAWING

SIZE

5962-87003

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990 REVISION LEVEL

B SHEET 8

DSCC FORM 2234

APR 97

4. VERIFICATION

4.1 Sampling and inspection. Sampling and inspection pr ocedures shall be in accordance with MIL-PRF-38535,

appendix A.

4.2 Screening. Screening shall b e in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices

prior to quality conformance inspection. The following additional criteri a shall apply:

a. Burn-in test, method 1015 of MIL-STD-883.

(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision l evel

control and shall be made available to the preparing or acquiring activity upon requ est. The test circuit shall specify

the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method

1015 of MIL-STD-883.

(2) TA = +125C, minimum.

b. Interim and final el ectrical test parameters shall be as spec ified in table II herein, except interim electrical parameter

tests prior to burn-in are optional at the discretion of the manufacturer.

4.3 Quality conformance ins pection. Quality conformance inspection shall be in accordance with method 5005 of

MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply.

4.3.1 Group A inspection.

a. Tests shall be as specified in table II herei n.

b. Subgr oups 7, 8, 9, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted.

4.3.2 Groups C and D inspections.

a. End-point e lectrical parameters shall be as specified in ta ble II herein.

b. Steady-state life test conditions, method 1005 of MIL-STD-883.

(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision

level control and shall be ma de available to the preparing or acquiring activity upon request. T he test circuit shall

specify the inputs, outputs, biases, and power dissipation, as applicable, in accordanc e wit h the intent specified in

method 1005 of MIL-STD-883.

(2) TA = +125C, minimum.

(3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.

STANDARD

MICROCIRCUIT DRAWING

SIZE

5962-87003

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990 REVISION LEVEL

B SHEET 9

DSCC FORM 2234

APR 97

TABLE II. Electrical test requirements.

MIL-STD-883 test requirements Subgroups

(in accordance with

MIL-STD-883, method 5005,

table I)

Interim electrical parameters

(method 5004) ---

Final electrical test parameters

(method 5004) 1*, 2, 3, 4

Group A test requirements

(method 5005) 1, 2, 3, 4, 5, 6

Groups C and D end-point

electrical parameters

(method 5005)

1, 4

* PDA applies to subgroup 1.

5. PACKAGING

5.1 Packaging requirements. The requir ements for packaging shall be in accordance with MIL-PRF-38535, appendix A .

6. NOTES

6.1 Intended use. Microcircuits conforming t o this drawing are intended for use for Government microcircuit applications

(original equipment), desig n applications, and logistics purposes.

6.2 Replaceability. Microcirc uits covered by this drawing will replace the same generic device covered by a contractor-

prepared specification or drawing.

6.3 Configuration control of SMD's. All proposed chan ges to existing SMD's will be coordinated with the users of record for

the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.

6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system

application requires configuration control and the applicable SMD. DSCC will maintain a record of user s and this list will be

used for coordination and distribution of changes to the dra wings. Users of drawings covering microelectronics device s

(FSC 5962) should contact DSCC-VA, telephone (614) 692-0544.

6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephon e

(614) 692-0547.

6.6 Approved sources of supply. Approved sources of suppl y are listed in MIL-HDBK-10 3. The vendors listed in

MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and

accepted by DSCC-VA.

STANDARD MICROCIRCUIT DRAWING BULLETIN

DATE: 10-01-25

Approved sources of suppl y for SMD 5962-87003 are listed below for immediate acquisition information only and

shall be added to MIL-HDBK-103 an d QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be

revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a

certificate of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded

by the next dated revision of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current

sources of supply at http://www.dscc.dla.mil/Programs/Smcr/.

Standard

microcircuit drawing

PIN 1/

Vendor

CAGE

number

Vendor

similar

PIN 2/

5962-8700301CA 3/ 567/BCA

5962-8700301PA 3/ 567/BPA

1/ The lead finish shown for each PIN representing

a hermetic package is the most readily available

from the manufacturer listed for that part. If the

desired lead finish is not listed contact the vendor

to determine its availability.

2/ Caution. Do not use this number for item

acquisition. Items acquired to this number m ay not

satisfy the performance requirements of this drawing.

3/ Not available from an approve d source of su pply.

The last known supplier is listed below.

Vendor CAGE Vendor name

number and address

18324 Phillips Semiconductors Incorporated

811 East Arques Avenue

Sunnyvale, CA 94088-3409

The information contained herein is disseminated for convenience only and the

Government assumes no liability whatsoeve r for any inaccuracies in the

information bulletin.