©2011 Littelfuse, Inc.
Gas Discharge Tube (GDT) Products
63
Revised: September 26, 2011
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
SG Series
SG Series
Description
Littelfuse SG series GDT offers high surge ratings in a
miniature package. It’s designed for surface mounting on
PCB with small size 4.5x3.2x2.7mm. Low insertion loss
is perfectly suited to broadband equipment applications.
The capacitance does not vary with voltage, and will
not cause operational problems with ADSL2+, where
capacitance variation across Tip and Ring is undesirable.
These devices are extremely robust and are able to
divert a 1000A pulse without destruction.
Features
t3P)4DPNQMJBOUBOE
Lead-free
t()[XPSLJOHGSFRVFODZ
t&YDFMMFOUTUBCJMJUZPO
multiple pulse duty cycle
t&YDFMMFOUSFTQPOTFUP
fast rising transients.
t6MUSB-PX*OTFSUJPO-PTT
t,"TVSHFDBQBCJMJUZ
tested with 8/20μS
QVMTFBTEFmOFECZ*&$
61000-4-5
t6MUSBTNBMMEFWJDFT
offered in a variety of
mounting lead forms
t/PO3BEJPBDUJWF
t-PXDBQBDJUBODFQ'
t7PMUBHF3BOHFT7UP
7
t6-SFDPHOJ[FE
t$POGPSNTUP*565,
*&$
t4RVBSF0VUMJOF
Applications
SG Series
2 Electrode GDT Graphical Symbol
Agency Approvals
AGENCY AGENCY FILE NUMBER
E128662
t Communication
equipment
t$"57FRVJQNFOU
t5FTUFRVJQNFOU
t%BUBMJOFT
t1PXFSTVQQMJFT
t5FMFDPN4-*$
protection
t#SPBECBOEFRVJQNFOU
t"%4-FRVJQNFOU
including ADSL2+
t9%4-FRVJQNFOU
t4BUFMMJUFBOE$"57
equipment
t(FOFSBMUFMFDPN
equipment
©2011 Littelfuse, Inc.
Gas Discharge Tube (GDT) Products
64
Revised: September 26, 2011 Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
SG Series
SG Series
Part
Number
Device SpecificationsBU¡$ Life Ratings
DC Breakdown
in Volts
!7T
Impulse
Breakdown
in Volts
!7T
Impulse
Breakdown
In Volts
!,WTFD
Insulation
Resistance
Capaci-
tance
!.)[
Arc
Voltage
!"
Glow
to Arc
Transition
Current
Glow
Voltage
Nominal
AC
Discharge
Current
Y!)[
Nominal
Impulse
Discharge
Current
Y!T
Nominal
Impulse
Discharge
Current
T
DZDMFT
MIN TYP MAX MAX MIN MAX
SG75 52 75 98 500 650
!*ȍ
(at 50VDC)
<1 pf
~10 V ~1.0 A ~60 V 2 A
2kA
10 A
SG90 63 90 117 500 600
SG150 105 150 195 500 600
SG230 172 230 288 650 800
1kA
SG300 225 300 375 700 850 ~12 V ~0.5 A ~90 V
SG300Q 210 300 390 580 650 ~20 V ~0.8 A ~140 V NA*
SG350 263 350 437 750 900
<0.8 pf ~12 V ~0.5 A
~90 V 2 A
SG350Q 263 350 437 600 700 ~140 V NA*
SG400 300 400 500 800 950 ~90 V 2 A
SG420 315 420 525 800 1000 <1 pf ~10 V ~1.0 A ~60 V 2 A
SG420Q 315 420 525 650 750 ~20 V ~140 V NA*
4QFDJGJDBJPOJTOPUBQQMJDBCMFGPSRVJDLSFTQPOTF4(YYYQWFSTJPOPGQSPEVDU
Product Characteristics
Materials %FWJDF5JO1MBUFE.JDSPOT
Construction Ceramic Insulator.
Storage and
Operational
Temperature
UP¡$
Electrical Characteristics
Voltage
(V)
Time (ns)
0 200 400 600 800 1000 1200
Max dynamic breakover
voltage
Hold-over voltage
On-State voltage
Voltage vs. Time Characteristic
!()[E#
!()[E#
!()[E#
!()[E#
!()[E#
!()[E#
!()[E#
!()[E#
Typical Insertion Loss
©2011 Littelfuse, Inc.
Gas Discharge Tube (GDT) Products
65
Revised: September 26, 2011
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
SG Series
SG Series
Device Dimensions
4.5 +/- 0.3
2.7 +/- 0.3
0.5 +/- 0.1
5.2
2.8
3.2 +/- 0.3
Recommended Soldering Pad Layout
4
Dimensions in Millimeters.
Reflow Condition 1Co'SFFBTTFNCMZ
Pre Heat
- Temperature Min (Ts(min))¡$
- Temperature Max (Ts(max))¡$
- Time (Min to Max) (ts)60 – 180 secs
Average ramp up rate (Liquidus Temp
(TL) to peak ¡$TFDPOENBY
TS(max) to TL - Ramp-up Rate ¡$TFDPOENBY
Reflow - Temperature (TL) (Liquidus) ¡$
- Temperature (tL)60 – 150 seconds
Peak Temperature (TP)260+0/-5¡$
Time within 5°C of actual peak
Temperature (tp)10 – 30 seconds
Ramp-down Rate ¡$TFDPOENBY
Time 25°C to peak Temperature (TP)NJOVUFT.BY
Do not exceed ¡$
Soldering Parameters - Reflow Soldering (Surface Mount Devices)
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
(t 25ºC to peak)
Ramp-down
Ramp-up
Preheat
Critical Zone
TL to TP
Tape Dimenstions 5BQFTJ[FJTBDDPSEJOHUP*&$
8
3
1.5
3.65
4.9
12
Part Numbering System and Ordering Information
SG xxx Q
Breakdown Voltage
75 = 75V
90 = 90V
150 = 150V
230 = 230V
300 = 300V
350 = 350V
400 = 400V
420 = 420V
Series
Square GDT
Device Option Code
(Blank) = Standard device
Q = Quick Response Version
(300V, 350V and 420V only)
Packaging
Part Number and Device Type Quantity and Packaging
Description
SGxxx Surface mount 2000pcs/reel in tape and reel