FEATURES
MECHANICAL DATA
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25oC ambient temperature unless ot herwise specif ied
S3DB S3GB S3JB S3KB S3MB
SAB SDB SGB SJB SKB SMB
Maximum recurrent peak reverse voltage VRRM
200 400 600 800 1000 V
Maximum RMS voltage VRWS 140 280 420 560 700 V
Maximum DC Blocking Voltage VDC
200 400 600 800 1000 V
Maximum average forword rectified current
V @ TL=90OC IF(AV) A
Peak forward surge current @ TL = 110°C 8.3ms
V single half-sine-wave superimposed on rated
V load(J EDEC Method) IFSM A
Maximum Instantaneous forward voltage at 3.0 A VF V
Maximum DC reverse current @TA=25oC
at rated DC block jing voltage @ T A=100oC
Typical junction capacitance CJ pF
JA
Operating junction and storage temperature range TJTSTG oC
Terminals:Solder plated, solderable per MIL-STD-
1111750, Method 2026
SURFACE MOUNT RECTIFIER
DO - 214AA(SMB)
P olarity: Color band denotes cathode end
Weight: 0.003 ounces, 0.093 gram
3.0
IR
50
100
2. Thermal resistance f rom junction to ambient and junction to lead P.C.B.mounted on 0.27''X0.27''(7.0X7.0mm2) copper pad areas
35
oC/W
Typical thermal resitance (NOTE 2)
100
1.15
-55--------+150
10
NOTE: 1.Measured at 1.0MHz and applied reverse voltage of 4.0 Volts
100
35 70
GALAXY ELECTRICAL
Plastic package has underwriters laboratory
111 flammability classification 94V-0
SBB
100
F or surface mounted applications
50
S3BB UNITS
G lass passivated chip junct ion
S3AB - - - S3MB
111REV ERSE V OLTAGE: 50 --- 1000 V
CURRENT: 3.0 A
B uilt-in st rain relief, ideal fo r aut omated placement
Case:JEDEC DO-214AA,molded plastic over
1111passiv ated chip
Device mar king code
High temperat ure soldering:
111 250oC/10 sec onds at t erminals
Low profile package
S3AB
www.galaxycn.com
BL
Document Number 0280011 BLGALAXY ELECTRICAL 1.
inch(mm)
40
R