Features RX63N Group, RX631 Group Renesas MCUs R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 100-MHz 32-bit RX MCU, on-chip FPU, 165 DMIPS, up to 2-MB flash memory, Ethernet MAC, full-speed USB 2.0 host/function/OTG interface, various communications interfaces including CAN, 10- & 12-bit A/D converters, RTC Features RX63N Group products incorporate an Ethernet controller while RX631 Group products do not. PLQP0176KB-A 24 x 24 mm, 0.5-mm pitch PLQP0144KA-A 20 x 20mm, 0.5-mm pitch PLQP0100KB-A 14 x 14mm, 0.5-mm pitch 32-bit RX CPU core Max. operating frequency: 100 MHz Capable of 165 DMIPS in operation at 100 MHz Single precision 32-bit IEEE-754 floating point Two types of multiply-and-accumulation unit (between memories and between registers) 32-bit multiplier (fastest instruction execution takes one CPU clock cycle) Divider (fastest instruction execution takes two CPU clock cycles) Fast interrupt CISC Harvard architecture with 5-stage pipeline Variable-length instructions: Ultra-compact code Supports the memory protection unit (MPU) JTAG and FINE (two-line) debugging interfaces Low-power design and architecture Operation from a single 2.7- to 3.6-V supply Low power consumption: A product that supports all peripheral functions draws only 500 A/MHz. RTC is capable of operation from a dedicated power supply (min. operating voltage: 2 V). Four low-power modes On-chip main flash memory, no wait states Supports ROM-less versions and versions with up to 2 Mbytes of ROM (ROM-less version: RX631 Group only) 100-MHz operation, 10-ns read cycle (no wait states) 384-Kbyte to 2-Mbyte capacities User code programmable via the USB, SCI, or JTAG On-chip data flash memory ROM-less or 32 Kbytes of ROM (reprogrammable up to 100,000 times) Programming/erasing as background operations (BGOs) On-chip SRAM, no wait states 32- to 128-Kbyte capacities For instructions and operands Can provide backup on deep software standby DMA DMAC: Four channels DTC EXDMAC: Two channels Dedicated DMAC for the Ethernet controller: Single channel Reset and supply management Power-on reset (POR) Low voltage detection (LVD) with voltage settings Clock functions External crystal oscillator or internal PLL for operation at 4 to 16 MHz Internal 125-kHz LOCO and 50-MHz HOCO Dedicated 125-kHz LOCO for the IWDT Real-time clock Adjustment functions (30 seconds, leap year, and error) Time capture function (for capturing times in response to event-signal input on external pins) Independent watchdog timer 125-kHz LOCO clock operation R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 PTLG0177KA-A 8 x 8 mm, 0.5-mm pitch PTLG0145KA-A 7 x 7mm, 0.5-mm pitch PTLG0100KA-A 5.5 x 5.5mm, 0.5-mm pitch PLBG0176GA-A 13 x 13mm, 0.8-mm pitch Useful functions for IEC60730 compliance Oscillation-stoppage detection, frequency measurement, CRC, IWDT, selfdiagnostic function for the A/D converter, etc. Various communications interfaces Ethernet MAC (1) (not in RX631 Group products) Host/function or OTG controller (1) and function controller (1) with fullspeed USB 2.0 transfer CAN (compliant with ISO11898-1), incorporating 32 mailboxes (up to 3 modules) SCI with multiple functionalities (up to 13) Choose from among asynchronous mode, clock-synchronous mode, smartcard interface mode, simplified SPI, simplified I2C, and extended serial mode. I2C bus interface for transfer at up to 1 Mbps (up to 4) RSPI for high-speed transfer (up to 3) External address space Buses for high-speed data transfer (max. operating frequency of 50 MHz) 8 CS areas (8 x 16 Mbytes) Multiplexed address data or separate address lines are selectable per area. 8-, 16-, or 32-bit bus space is selectable per area Independent SDRAM area (128 Mbytes) Up to 20 extended-function timers 16-bit MTU2: input capture, output compare, PWM waveform output, phase-counting mode (6 channels) 16-bit TPU: input capture, output compare, phase-counting mode (12 channels) 8-bit TMR (4 channels) 16-bit compare-match timers (4 channels) A/D converter for 1-MHz Operation Up to 21 12-bit channels, and incorporating 1 sample-and-hold circuit Up to 8 10-bit channels, and incorporating 1 sample-and-hold circuit Addition of results of A/D conversion (in the 12-bit converter) Self diagnosis (for the 10-bit converter) 10-bit D/A converter: 2 channels Temperature sensor for measuring temperature within the chip Register write protection can protect values in important registers against overwriting. Up to 134 pins for GPIO 5-V tolerance, open drain, input pull-up, switchable driving ability Operating temp. range -40C to +85C Page 1 of 172 RX63N Group, RX631 Group 1. Overview 1. Overview 1.1 Outline of Specifications Table 1.1 lists the specifications in outline, and table 1.2 gives a comparison of the functions of products in different packages. Table 1.1 is for products with the greatest number of functions, so numbers of peripheral modules and channels will differ in accord with the package. For details, see Table 1.2, Comparison of Functions for Different Packages in the RX63N/RX631 Group. Table 1.1 Outline of Specifications (1/5) Classification Module/Function Description CPU CPU Maximum operating frequency: 100 MHz 32-bit RX CPU Minimum instruction execution time: One instruction per state (cycle of the system clock) Address space: 4-Gbyte linear Register set of the CPU General purpose: Sixteen 32-bit registers Control: Nine 32-bit registers Accumulator: One 64-bit register Basic instructions: 73 Floating-point instructions: 8 DSP instructions: 9 Addressing modes: 10 Data arrangement Instructions: Little endian Data: Selectable as little endian or big endian On-chip 32-bit multiplier: 32 x 32 64 bits On-chip divider: 32 / 32 32 bits Barrel shifter: 32 bits Memory protection unit (MPU) FPU Single precision (32-bit) floating point Data types and floating-point exceptions in conformance with the IEEE754 standard ROM RAM Capacity: 128 Kbytes 100 MHz, no-wait access E2 data flash Capacity: 32 Kbytes Programming/erasing: 100,000 times Memory Capacity: Romless, 768 Kbytes, 1 Mbyte, 1.5 Mbytes, 2 Mbytes 100 MHz, no-wait access On-board programming: Four types Off-board programming (parallel programmer mode) MCU operating modes Single-chip mode, on-chip ROM enabled expansion mode, and on-chip ROM disabled expansion mode (software switching) Clock Main clock oscillator, subclock oscillator, low-speed/high-speed on-chip oscillator, PLL frequency synthesizer, and IWDT-dedicated on-chip oscillator Main-clock oscillation stoppage detection Separate frequency-division and multiplication settings for the system clock (ICLK), peripheral module clock (PCLK), FlashIF clock (FCLK) and external bus clock (BCLK) The CPU and other bus masters run in synchronization with the system clock (ICLK): Up to 100 MHz Peripheral modules run in synchronization with the peripheral module clock (PCLK): Up to 50 MHz Flash IF run in synchronization with the flashIF clock (FCLK): Up to 50 MHz Devices connected to the external bus run in synchronization with the external bus clock (BCLK): Up to 50 MHz Clock generation circuit Reset Pin reset, power-on reset, voltage-monitoring reset, independent watchdog timer reset, watchdog timer reset, deep software standby reset, and software reset Voltage detection circuit When the voltage on VCC passes the voltage detection level (Vdet), an internal reset or internal interrupt is generated. R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 2 of 172 RX63N Group, RX631 Group Table 1.1 1. Overview Outline of Specifications (2/5) Classification Module/Function Description Low power consumption Low power consumption facilities Module stop function Four low power consumption modes Sleep mode, all-module clock stop mode, software standby mode, and deep software standby mode Battery backup function Interrupt Interrupt controller (ICUb) Peripheral function interrupts: 187 sources External interrupts: 16 (pins IRQ0 to IRQ15) Software interrupts: One source Non-maskable interrupts: 6 sources Sixteen levels specifiable for the order of priority External bus extension The external address space can be divided into nine areas (CS0 to CS7, SDCS), each with independent control of access settings. Capacity of each area: 16 Mbytes (CS0 to CS7), 128 Mbytes (SDCS) A chip-select signal (CS0# to CS7#, SDCS#) can be output for each area. Each area is specifiable as an 8-, 16-, or 32-bit bus space. The data arrangement in each area is selectable as little or big endian (only for data). SDRAM interface connectable Bus format: Separate bus, multiplex bus Wait control Write buffer facility DMA DMA controller (DMAC) 4 channels Three transfer modes: Normal transfer, repeat transfer, and block transfer Activation sources: Software trigger, external interrupts, and interrupt requests from peripheral functions EXDMA controller (EXDMACa) 2 channels Four transfer modes: Normal transfer, repeat transfer, block transfer, and cluster transfer Single-address transfer enabled with the EDACK signal Capable of direct data transfer to TFT LCD panels Activation sources: Software trigger, external DMA requests (EDREQ), and interrupt requests from peripheral functions Data transfer controller (DTCa) Three transfer modes: Normal transfer, repeat transfer, and block transfer Activation sources: External interrupts and interrupt requests from peripheral functions Programmable I/O ports I/O ports for the 177-pin TFLGA (in the planning stage), 176-pin LFBGA (in the planning stage), and 176-pin LQFP I/O pins: 133 Input pins: 1 Pull-up resistors: 133 Open-drain outputs: 133 5-V tolerance: 18 I/O ports for the 145-pin TFLGA (in the planning stage) and 144-pin LQFP I/O pins: 111 Input pins: 1 Pull-up resistors: 111 Open-drain outputs: 111 5-V tolerance: 18 I/O ports for the 100-pin LQFP I/O pins: 78 Input pins: 1 Pull-up resistors: 78 Open-drain outputs: 78 5-V tolerance: 17 I/O ports R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 3 of 172 RX63N Group, RX631 Group Table 1.1 1. Overview Outline of Specifications (3/5) Classification Module/Function Description Timers 16-bit timer pulse unit (TPUa) (16 bits x 6 channels) x 2 unit Maximum of 16 pulse-input/output possible Select from among seven or eight counter-input clock signals for each channel Input capture/output compare function Output of PWM waveforms in up to 15 phases in PWM mode Buffered operation and phase-counting mode (two phase encoder input) depending on the channel Support for cascade-connected operation (32 bits x 2 channels) PPG output trigger can be generated Capable of generating conversion start triggers for the A/D converters Signals from the input capture pins are input via a digital filter Clock frequency measuring method Multi-function timer pulse unit 2 (MTU2a) (16 bits x 6 channels) x 1 unit Time bases for the 6 16-bit timer channels can be provided via up to 16 pulse-input/ output lines and three pulse-input lines Select from among eight counter-input clock signals for each channel (PCLK/1, PCLK/ 4, PCLK/16, PCLK/64, MTCLKA, MTCLKB, MTCLKC, MTCLKD) other than channel 5, for which only four signals are available. Input capture function 21 output compare/input capture registers Complementary PWM output mode Reset synchronous PWM mode Phase-counting mode Generation of triggers for A/D converter conversion Digital filter Signals from the input capture pins are input via a digital filter PPG output trigger can be generated Clock frequency measuring function Frequency measuring method (MCK) The MTU or unit 0 TPU module can be used to monitor the main clock, subclock, HOCO clock, LOCO clock, and PLL clock for abnormal frequencies. Port output enable 2 (POE2a) Controls the high-impedance state of the MTU's waveform output pins Programmable pulse generator (PPG) (4 bits x 4 groups) x 2 units Pulse output with the MTU2 or TPU output as a trigger Maximum of 32 pulse-output possible 8-bit timers (TMR) (8 bits x 2 channels) x 2 units Select from among seven internal clock signals (PCLK/1, PCLK/2, PCLK/8, PCLK/32, PCLK/64, PCLK/1024, PCLK/8192) and one external clock signal Capable of output of pulse trains with desired duty cycles or of PWM signals The 2 channels of each unit can be cascaded to create a 16-bit timer Generation of triggers for A/D converter conversion Capable of generating baud-rate clocks for SCI5, SCI6, and SCI12 Compare match timer (CMT) (16 bits x 2 channels) x 2 units Select from among four internal clock signals (PCLK/8, PCLK/32, PCLK/128, PCLK/ 512) Realtime clock (RTCa) Clock sources: Main clock, subclock Clock and calendar functions Interrupt sources: Alarm interrupt, periodic interrupt, and carry interrupt Battery backup operation Time-capture facility for three values Watchdog timer (WDTA) 14 bits x 1 channel Select from among 6 counter-input clock signals (PCLK/4, PCLK/64, PCLK/128, PCLK/ 512, PCLK/2048, PCLK/8192) Independent watchdog timer (IWDTa) 14 bits x 1 channel Counter-input clock: IWDT-dedicated on-chip oscillator Dedicated clock/1, dedicated clock/16, dedicated clock/32, dedicated clock/64, dedicated clock/128, dedicated clock/256 R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 4 of 172 RX63N Group, RX631 Group Table 1.1 1. Overview Outline of Specifications (4/5) Classification Module/Function Description Communication function Ethernet controller (ETHERC) Input and output of Ethernet/IEEE 802.3 frames Transfer at 10 or 100 Mbps Full- and half-duplex modes MII (Media Independent Interface) or RMII (Reduced Media Independent Interface) as defined in IEEE 802.3u Detection of Magic PacketsTM*1 or output of a "wake-on-LAN" signal (WOL) Compliance with flow control as defined in IEEE 802.3x standards Note 1. Magic PacketTM is a registered trademark of Advanced Micro Devices, Inc. DMA controller for Ethernet controller (EDMAC) Alleviation of CPU loads by the descriptor control method Transmission FIFO: 2 Kbytes; Reception FIFO: 2 Kbytes USB 2.0 host/function module (USBa) Serial communications interfaces (SCIc, SCId) 13 channels (SCIc: 12 channels + SCId: 1 channel) SCIc Serial communications modes: Asynchronous, clock synchronous, and smart-card interface Multi-processor function On-chip baud rate generator allows selection of the desired bit rate Choice of LSB-first or MSB-first transfer Average transfer rate clock can be input from TMR timers for SCI5, SCI6, and SCI12 Simple I2C Simple SPI SCId (The following functions are added to SCIc) Supports the serial communications protocol, which contains the start frame and information frame Supports the LIN format I2C bus interfaces (RIIC) 4 channels (one of them is FM+) Communication formats I2C bus format/SMBus format Supports the multi-master Max. transfer rate: 1 Mbps (channel 0) IEBus (IEB) 1 channel Supports protocol control for the IEBus Half-duplex asynchronous transfer Multi-master operation Broadcast communications function Two selectable modes, differentiated by transfer rate Note: * IEBus (Inter Equipment Bus) is a registered trademark of Renesas Electronics Corporation. CAN module (CAN) 3 channels Compliance with the ISO11898-1 specification (standard frame and extended frame) 32 mailboxes each Serial peripheral interfaces (SPI) 3 channels RSPI transfer facility Using the MOSI (master out, slave in), MISO (master in, slave out), SSL (slave select), and RSPCK (RSPI clock) signals enables serial transfer through SPI operation (four lines) or clock-synchronous operation (three lines) Capable of handling serial transfer as a master or slave Data formats Switching between MSB first and LSB first The number of bits in each transfer can be changed to any number of bits from 8 to 16, or to 20, 24, or 32 bits. 128-bit buffers for transmission and reception Up to four frames can be transmitted or received in a single transfer operation (with each frame having up to 32 bits) Buffered structure Double buffers for both transmission and reception R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Includes a UDC (USB Device Controller) and transceiver for USB 2.0 Host/function module: one port, function module: one port Compliance with the USB 2.0 specification Transfer rate: Full speed (12 Mbps) Self-power mode and bus power are selectable OTG (On the Go) operation is possible Incorporates 2 Kbytes of RAM as a transfer buffer Page 5 of 172 RX63N Group, RX631 Group Table 1.1 Classification 1. Overview Outline of Specifications (5/5) Module/Function 12-bit A/D converter (S12ADa) Description 1 unit (1 unit x 14 channels) 12-bit resolution Conversion time: 1.0 s per channel (in operation with PCLK at 50 MHz) Operating mode Scan mode (single scan mode or continuous scan mode) Sample-and-hold function Reference voltage generation Three ways to start A/D conversion Conversion can be started by software, a conversion start trigger from a timer (MTU, TPU, or TMR), or an external trigger signal. A/D conversion of the temperature sensor output 10-bit A/D converter (ADb) D/A converter (DAa) 2 channels 10-bit resolution Output voltage: 0 V to VREFH Temperature sensor 1 channel Precision: 1C The voltage of the temperature is converted into a digital value by the 12-bit A/D converter. CRC calculator (CRC) CRC code generation for arbitrary amounts of data in 8-bit units Select any of three generating polynomials: X8 + X2 + X + 1, X16 + X15 + X2 + 1, or X16 + X12 + X5 + 1. Generation of CRC codes for use with LSB-first or MSB-first communications is selectable Operating frequency Up to 100 MHz Power supply voltage VCC = AVCC0 = VREFH = VCC_USB = 2.7 to 3.6 V, VREFH0 = 2.7 V to AVCC0, Vbatt = 2.0 V to 3.6 V Operating temperature 40 to +85C (products with wide-temperature-range spec.) Package 177-pin TFLGA (PTLG0177KA-A) (in the planning stage) 176-pin LFBGA (PLBG0176GA-A) (in the planning stage) 176-pin LQFP (PLQP0176KB-A) 145-pin TFLGA (PTLG0145KA-A) (in the planning stage) 144-pin LQFP (PLQP0144KA-A) 100-pin LQFP (PLQP0100KB-A) On-chip debugging system E1 emulator (JTAG and FINE interfaces) E20 emulator (JTAG interface) R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 1 unit (1 unit x 8 channels) 10-bit resolution Conversion time: 1.0 s per channel (in operation with PCLK at 50 MHz) Operating mode Scan mode (single scan mode or continuous scan mode) External amplifier connection mode Sample-and-hold function Three ways to start A/D conversion Conversion can be started by software, a conversion start trigger from a timer (MTU, TPU, or TMR), or an external trigger signal. Page 6 of 172 RX63N Group, RX631 Group Table 1.2 1. Overview Comparison of Functions for Different Packages in the RX63N/RX631 Group Functions RX63N Group 177-pin 176-pin RX631 Group 145-pin 144-pin 100-pin 177-pin 176-pin 145-pin 144-pin 100-pin Package External bus width External bus width DMA DMA controller SDRAM area controller 32 bits 16 bits Available EXDMA controller Data transfer controller Timers 16-bit timer pulse unit 32 bits 16 bits Available Ch. 0 to 3 Ch. 0 to 3 Ch. 0 and 1 Available Available Ch. 0 to 5 Ch. 0 to 11 Ch. 0 to 5 Port output enable 2 Not available Ch. 0 and 1 Ch. 0 to 11 Multi-function timer pulse unit 2 Available Available Ch. 0 and 1 8-bit timers Ch. 0 to 3 Ch. 0 to 3 Compare match timer Ch. 0 to 3 Ch. 0 to 3 Realtime clock Available Available Watchdog timer Available Available Independent watchdog timer Available Available Ethernet controller Available Not available DMA controller for Ethernet controller Available Not available USB 2.0 host/function module Serial communications interfaces (SClc) Ch. 0 and 1 ch0 Ch. 0 to 11 Serial communications interfaces (SCld) I2C bus interfaces IEBus Serial peripheral interfaces CAN module 12-bit A/D converter (channel) 10-bit A/D converter (channel) D/A converter (resolution x channel) Ch. 0 to 3, 5, 6, 8 and 9 Ch. 0 and 1 ch0 Ch. 0 to 11 Ch. 12 Ch. 0 to 3 For 1.5 M or more: Ch. 0 to 2, For 1 M or less: Ch. 0 and 1 AN000 to 020 ch0, 2 Ch. 0 to 3 Ch. 0 and 1 AN000 to 013 ch0 to 2 For 1.5 M or more: Ch. 0 to 2, For 1 M or less: Ch. 0 and 1 AN000 to 020 Ch. 0 and 1 Ch. 0 and 1 AN000 to 013 AN0 to 7 ch1 Ch. 0 and 1 Temperature sensor Available Available CRC calculator Available Available R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 ch0, 2 Available Ch. 0 and 1 AN0 to 7 Ch. 0 and 1 Ch. 0 to 3, 5, 6, 8 and 9 Ch. 12 Available ch0 to 2 Ch. 0 to 5 Ch. 0 to 5 Ch. 0 and 1 Programmable pulse generator Communication function Not available ch1 Page 7 of 172 RX63N Group, RX631 Group 1.2 1. Overview List of Products Table 1.3 is a list of products, and Figure 1.1 shows how to read the product part no. Table 1.3 List of Products (1/3) Group Part No. Package ROM Capacity RAM Capacity E2Data Flash Operating Frequency (Max.) RX63N R5F563NACDFP PLQP0100KB-A 768 Kbytes 128 Kbytes 32 Kbytes 100 MHz R5F563NADDFP PLQP0100KB-A 768 Kbytes 128 Kbytes 32 Kbytes 100 MHz R5F563NACDFB PLQP0144KA-A 768 Kbytes 128 Kbytes 32 Kbytes 100 MHz R5F563NADDFB PLQP0144KA-A 768 Kbytes 128 Kbytes 32 Kbytes 100 MHz R5F563NACDLK PTLG0145KA-A*1 768 Kbytes 128 Kbytes 32 Kbytes 100 MHz R5F563NADDLK PTLG0145KA-A*1 768 Kbytes 128 Kbytes 32 Kbytes 100 MHz R5F563NACDFC PLQP0176KB-A 768 Kbytes 128 Kbytes 32 Kbytes 100 MHz R5F563NADDFC PLQP0176KB-A 768 Kbytes 128 Kbytes 32 Kbytes 100 MHz R5F563NACDLC PTLG0177KA-A*1 768 Kbytes 128 Kbytes 32 Kbytes 100 MHz R5F563NADDLC PTLG0177KA-A*1 768 Kbytes 128 Kbytes 32 Kbytes 100 MHz R5F563NACDBG PLBG0176GA-A*1 768 Kbytes 128 Kbytes 32 Kbytes 100 MHz R5F563NADDBG PLBG0176GA-A*1 768 Kbytes 128 Kbytes 32 Kbytes 100 MHz R5F563NBCDFP PLQP0100KB-A 1 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F563NBDDFP PLQP0100KB-A 1 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F563NBCDFB PLQP0144KA-A 1 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F563NBDDFB PLQP0144KA-A 1 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F563NBCDLK PTLG0145KA-A 1 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F563NBDDLK PTLG0145KA-A 1 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F563NBCDFC PLQP0176KB-A 1 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F563NBDDFC PLQP0176KB-A 1 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F563NBCDLC PTLG0177KA-A*1 1 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F563NBDDLC PTLG0177KA-A*1 1 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F563NBCDBG PLBG0176GA-A*1 1 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F563NBDDBG PLBG0176GA-A*1 1 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F563NDCDFP PLQP0100KB-A 1.5 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F563NDDDFP PLQP0100KB-A 1.5 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F563NDCDFB PLQP0144KA-A 1.5 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F563NDDDFB PLQP0144KA-A 1.5 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F563NDCDLK PTLG0145KA-A*1 1.5 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F563NDDDLK PTLG0145KA-A*1 1.5 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F563NDCDFC PLQP0176KB-A 1.5 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F563NDDDFC PLQP0176KB-A 1.5 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F563NDCDLC PTLG0177KA-A*1 1.5 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F563NDDDLC PTLG0177KA-A*1 1.5 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F563NDCDBG PLBG0176GA-A*1 1.5 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F563NDDDBG PLBG0176GA-A*1 1.5 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F563NECDFP PLQP0100KB-A 2 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F563NEDDFP PLQP0100KB-A 2 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F563NECDFB PLQP0144KA-A 2 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F563NEDDFB PLQP0144KA-A 2 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F563NECDLK PTLG0145KA-A 2 Mbyte 128 Kbytes 32 Kbytes 100 MHz R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 8 of 172 RX63N Group, RX631 Group Table 1.3 1. Overview List of Products (2/3) Group Part No. Package ROM Capacity RAM Capacity E2Data Flash Operating Frequency (Max.) RX63N R5F563NEDDLK PTLG0145KA-A 2 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F563NECDFC PLQP0176KB-A 2 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F563NEDDFC PLQP0176KB-A 2 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F563NECDLC PTLG0177KA-A*1 2 Mbyte 128 Kbytes 32 Kbytes 100 MHz RX631 R5F563NEDDLC PTLG0177KA-A 2 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F563NECDBG PLBG0176GA-A*1 2 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F563NEDDBG PLBG0176GA-A*1 2 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F5631ACDFP PLQP0100KB-A 768K Kbytes 128 Kbytes 32 Kbytes 100 MHz R5F5631ADDFP PLQP0100KB-A 768 Kbytes 128 Kbytes 32 Kbytes 100 MHz R5F5631ACDFB PLQP0144KA-A 768 Kbytes 128 Kbytes 32 Kbytes 100 MHz R5F5631ADDFB PLQP0144KA-A 768 Kbytes 128 Kbytes 32 Kbytes 100 MHz R5F5631ACDLK PTLG0145KA-A*1 768 Kbytes 128 Kbytes 32 Kbytes 100 MHz R5F5631ADDLK PTLG0145KA-A*1 768 Kbytes 128 Kbytes 32 Kbytes 100 MHz R5F5631ACDFC PLQP0176KB-A 768 Kbytes 128 Kbytes 32 Kbytes 100 MHz R5F5631ADDFC PLQP0176KB-A 768 Kbytes 128 Kbytes 32 Kbytes 100 MHz R5F5631ACDLC PTLG0177KA-A*1 768 Kbytes 128 Kbytes 32 Kbytes 100 MHz R5F5631ADDLC PTLG0177KA-A*1 768 Kbytes 128 Kbytes 32 Kbytes 100 MHz R5F5631ACDBG PLBG0176GA-A*1 768 Kbytes 128 Kbytes 32 Kbytes 100 MHz R5F5631ADDBG PLBG0176GA-A*1 768 Kbytes 128 Kbytes 32 Kbytes 100 MHz R5F5631BCDFP PLQP0100KB-A 1 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F5631BDDFP PLQP0100KB-A 1 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F5631BCDFB PLQP0144KA-A 1 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F5631BDDFB PLQP0144KA-A 1 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F5631BCDLK PTLG0145KA-A 1 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F5631BDDLK PTLG0145KA-A 1 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F5631BCDFC PLQP0176KB-A 1 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F5631BDDFC PLQP0176KB-A 1 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F5631BCDLC PTLG0177KA-A*1 1 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F5631BDDLC PTLG0177KA-A*1 1 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F5631BCDBG PLBG0176GA-A*1 1 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F5631BDDBG PLBG0176GA-A*1 1 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F5631DCDFP PLQP0100KB-A 1.5 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F5631DDDFP PLQP0100KB-A 1.5 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F5631DCDFB PLQP0144KA-A 1.5 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F5631DDDFB PLQP0144KA-A 1.5 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F5631DCDLK PTLG0145KA-A*1 1.5 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F5631DDDLK PTLG0145KA-A*1 1.5 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F5631DCDFC PLQP0176KB-A 1.5 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F5631DDDFC PLQP0176KB-A 1.5 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F5631DCDLC PTLG0177KA-A*1 1.5 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F5631DDDLC PTLG0177KA-A*1 1.5 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F5631DCDBG PLBG0176GA-A*1 1.5 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F5631DDDBG PLBG0176GA-A*1 1.5 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F5631ECDFP PLQP0100KB-A 2 Mbyte 128 Kbytes 32 Kbytes 100 MHz R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 9 of 172 RX63N Group, RX631 Group Table 1.3 1. Overview List of Products (3/3) Group Part No. Package ROM Capacity RAM Capacity E2Data Flash Operating Frequency (Max.) RX631 R5F5631EDDFP PLQP0100KB-A 2 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F5631ECDFB PLQP0144KA-A 2 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F5631EDDFB PLQP0144KA-A 2 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F5631ECDLK PTLG0145KA-A 2 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F5631EDDLK PTLG0145KA-A 2 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F5631ECDFC PLQP0176KB-A 2 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F5631EDDFC PLQP0176KB-A 2 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F5631ECDLC PTLG0177KA-A*1 2 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F5631EDDLC PTLG0177KA-A 2 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F5631ECDBG PLBG0176GA-A*1 2 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5F5631EDDBG PLBG0176GA-A*1 2 Mbyte 128 Kbytes 32 Kbytes 100 MHz R5S56310CDFC PLQP0176KB-A 0 Mbyte 128 Kbytes 0 Kbytes 100 MHz Note 1. In the planning stage R 5 F 5 6 3 N A C D F P Package type, number of pins, and pin pitch FC : LQFP/176/0.50 BG: LFBGA/176/0.80 LC : TFLGA/177/0.50 FB : LQFP/144/0.50 LK : TFLGA/145/0.50 FP : LQFP/100/0.50 D : Products with wide-tempera ture-ranse spec. (-40 to 85C) C : CAN not included D : CAN included ROM, RAM and E2 data flash capacity E : 2 Mbytes/128 Kbytes/32 Kbytes D : 1.5 Mbytes/128 Kbytes/32 Kbytes B : 1 Mbyte/128 Kbytes/32 Kbytes A : 768 Kbytes/128 Kbytes/32 Kbytes 0 : 0 bytes/128 Kbytes/0 bytes Group name 3N : RX63N Group 31 : RX631 Group Series name RX600 Series Type of memory F : Flash memory version S : ROMless version Renesas MCU Renesas semiconductor product Figure 1.1 How to Read the Product Part No. R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 10 of 172 RX63N Group, RX631 Group 1.3 1. Overview Block Diagram Figure 1.2 shows a block diagram. E2 Data Flash WDTA IWDTa CRC SCIc x 12ch SCId x 1ch USB 2.0 host/function module USB 2.0 function module RSPI (unit 0) RSPI (unit 1) RSPI (unit 2) EDMAC Internal main bus 1 MPU Clock generati on circuit ETHERC EDMAC ICUb DTCa DMACA EXDMACa BSC WDTA IWDTa CRC SCIc, SCId MPU Figure 1.2 Internal main bus 2 Operand bus Instruction bus RX CPU Port 0 Port 1 MTU2a x 6ch POE2a TPUa x 6ch (unit 0) Port 2 Port 3 TPUa x 6ch (unit 1) Port 4 PPG (unit 0) PPG (unit 1) Port 5 Port 6 TMR x 2 channels (unit 0) ICUb ROM RAM Internal peripheral buses 1 to 6 ETHERC CAN x 3ch TMR x 2 channels (unit 1) Port 7 CMT x 2 channels (unit 0) Port 8 CMT x 2 channels (unit 1) Port 9 RTCa DTCa Port A RIIC x 4ch Port B IEB DMACA x 4ch 12-bit ADC x 21 channels Port C 10-bit ADC x 8 channels Port D 10-bit DAC x 2 channel Port E Temperature sensor Port F Port G EXDMACa : Ethernet controller : DMA controller for Ethernet controller : Interrupt controller : Data transfer controller : DMA controller : EXDMA controller : Bus controller : Watchdog timer : Independent watchdog timer : CRC (cyclic redundancy check) calculator : Serial communications interface : Memory protection unit Port H BSC External bus RSPI CAN MTU2a POE2a TPUa PPG TMR CMT RTCa RIIC IEB Port J : Serial peripheral interface : CAN module : Multi-function timer pulse unit 2 : Port output enable 2 : 16-bit timer pulse unit : Programmable pulse generator : 8-bit timer : Compare match timer : Realtime clock : I2C bus interface : IEBus controller Block Diagram R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 11 of 172 RX63N Group, RX631 Group 1.4 1. Overview Pin Functions Table 1.4 lists the pin functions. Table 1.4 Pin Functions (1/6) Classifications Pin Name I/O Description Power supply VCC Input Power supply pin. Connect it to the system power supply. Connect this pin to VSS via a 0.1-F capacitor. The capacitor should be placed close to the pin. VCL Input Connect this pin to VSS via a 0.1-F capacitor. The capacitor should be placed close to the pin. VSS Input Ground pin. Connect it to the system power supply (0 V). VBAT Input Backup power pin XTAL Output EXTAL Input Pins for a crystal resonator. An external clock signal can be input through the EXTAL pin. BCLK Output Outputs the external bus clock for external devices. SDCLK Output Outputs the clock dedicated for the SDRAM. XCOUT Output XCIN Input Input/output pins for the subclock oscillator. Connect a crystal resonator between XCOUT and XCIN. Operating mode control MD Input Pins for setting the operating mode. The signal levels on these pins must not be changed during operation. System control RES# Input Reset signal input pin. This LSI enters the reset state when this signal goes low. EMLE Input Input pin for the on-chip emulator enable signal. When the onchip emulator is used, this pin should be driven high. When not used, it should be driven low. BSCANP Input Boundary scan enable pin. Boundary scan is enabled when this pin goes high. When not used, it should be driven low. FINEC Input Fine interface clock pin FINED I/O Fine interface pin TRST# Input TMS Input On-chip emulator or boundary scan pins. When the EMLE pin is driven high, these pins are dedicated for the on-chip emulator. TDI Input TCK Input TDO Output TRCLK Output This pin outputs the clock for synchronization with the trace data. TRSYNC# Output This pin indicates that output from the TRDATA0 to TRDATA3 pins is valid. Clock On-chip emulator TRDATA0 to TRDATA3 Output These pins output the trace information. Address bus A0 to A23 Output Output pins for the address. Data bus D0 to D15 I/O Input and output pins for the bidirectional data bus. Multiplexed bus A0/D0 to A15/D15 I/O Address/data multiplexed bus R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 12 of 172 RX63N Group, RX631 Group Table 1.4 1. Overview Pin Functions (2/6) Classifications Pin Name I/O Description Bus control RD# Output Strobe signal which indicates that reading from the external bus interface space is in progress. WR# Output Strobe signal which indicates that writing to the external bus interface space is in progress, in 1-write strobe mode. WR0# to WR3# Output Strobe signals which indicate that either group of data bus pins (D7 to D0 and D15 to D8) is valid in writing to the external bus interface space, in byte strobe mode. BC0# to BC3# Output Strobe signals which indicate that either group of data bus pins (D7 to D0 and D15 to D8) is valid in access to the external bus interface space, in 1-write strobe mode. ALE Output Address latch signal when address/data multiplexed bus is selected. Bus control EXDMA controller CKE Output Output pin for SDRAM clock enable signals. SDCS# Output Output pin for SDRAM chip select signals. RAS# Output Output pin for SDRAM row address strobe signals. CAS# Output Output pin for SDRAM column address strobe signals. WE# Output Output pin for SDRAM write enable signals. DQM0 to DQM3 Output Output pins for SDRAM I/O data mask enable signals. CS0# to CS7# Output Select signals for CS area. WAIT# Input Input pins for wait request signals in access to the external space. EDREQ0, EDREQ1 Input pins for external DMA transfer requests. EDACK0, EDACK1 Interrupt Multi-function timer pulse unit 2 Port output enable 2 Output pins for single address transfer acknowledge signals. NMI Input Non-maskable interrupt request signal. IRQ0 to IRQ15 Input Maskable interrupt request signals. MTIOC0A, MTIOC0B MTIOC0C, MTIOC0D I/O The TGRA0 to TGRD0 input capture input/output compare output/PWM output pins. MTIOC1A, MTIOC1B I/O The TGRA1 and TGRB1 input capture input/output compare output/PWM output pins. MTIOC2A, MTIOC2B I/O The TGRA2 and TGRB2 input capture input/output compare output/PWM output pins. MTIOC3A, MTIOC3B MTIOC3C, MTIOC3D I/O The TGRA3 to TGRD3 input capture input/output compare output/PWM output pins. MTIOC4A, MTIOC4B MTIOC4C, MTIOC4D I/O The TGRA4 to TGRD4 input capture input/output compare output/PWM output pins. MTIC5U, MTIC5V MTIC5W Input The TGRU5, TGRV5, and TGRW5 input capture input/dead time compensation input pins. MTCLKA, MTCLKB MTCLKC, MTCLKD Input Input pins for external clock signals. POE0# to POE3# POE8# Input Input pins for request signals to place the MTU large-current pins in the high impedance state. R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 13 of 172 RX63N Group, RX631 Group Table 1.4 1. Overview Pin Functions (3/6) Classifications Pin Name I/O Description 16-bit timer pulse unit TIOCA0, TIOCB0 TIOCC0, TIOCD0 I/O The TGRA0 to TGRD0 input capture input/output compare output/PWM output pins. TIOCA1, TIOCB1 I/O The TGRA1 and TGRB1 input capture input/output compare output/PWM output pins. TIOCA2, TIOCB2 I/O The TGRA2 and TGRB2 input capture input/output compare output/PWM output pins. TIOCA3, TIOCB3 TIOCC3, TIOCD3 I/O The TGRA3 to TGRD3 input capture input/output compare output/PWM output pins. TIOCA4, TIOCB4 I/O The TGRA4 and TGRB4 input capture input/output compare output/PWM output pins. TIOCA5, TIOCB5 I/O The TGRA5 and TGRB5 input capture input/output compare output/PWM output pins. TCLKA, TCLKB TCLKC, TCLKD Input Input pins for external clock signals. TIOCA6, TIOCB6 TIOCC6, TIOCD6 I/O The TGRA6 to TGRD6 input capture input/output compare output/PWM output pins. TIOCA7, TIOCB7 I/O The TGRA7 and TGRB7 input capture input/output compare output/PWM output pins. TIOCA8, TIOCB8 I/O The TGRA8 and TGRB8 input capture input/output compare output/PWM output pins. TIOCA9, TIOCB9 TIOCC9, TIOCD9 I/O The TGRA9 to TGRD9 input capture input/output compare output/PWM output pins. TIOCA10, TIOCB10 I/O The TGRA10 and TGRB10 input capture input/output compare output/PWM output pins. TIOCA11, TIOCB11 I/O The TGRA11 and TGRB11 input capture input/output compare output/PWM output pins. TCLKE, TCLKF TCLKG, TCLKH Input Input pins for external clock signals. Programmable pulse generator PO0 to PO31 Output Output pins for the pulse signals. 8-bit timer TMO0 to TMO3 Output Output pins for the compare match signals. TMCI0 to TMCI3 Input Input pins for the external clock signals that drive for the counters. TMRI0 to TMRI3 Input Input pins for the counter-reset signals. Serial communications interface (SCIc) Asynchronous mode/clock synchronous mode SCK0 to SCK11 I/O Input/output pins for clock signals. RXD0 to RXD11 Input Input pins for data reception. TXD0 to TXD11 Output Output pins for data transmission. CTS0# to CTS11# Input Transfer start control input pins RTS0# to RTS11# Output Transfer start control output pins SSCL0 to SSCL11 I/O Input/output pins for the I2C clock SSDA0 to SSDA11 I/O Input/output pins for the I2C data SCK0 to SCK11 I/O Input/output pins for the clock SMISO0 to SMISO11 I/O Input/output pins for slave transmit data. SMOSI0 to SMOSI11 I/O Input/output pins for master transmit data. SS0# to SS11# Input Input pins for chip select signals Simple I2C mode Serial communications interface (SCIc) Simple SPI mode R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 14 of 172 RX63N Group, RX631 Group Table 1.4 1. Overview Pin Functions (4/6) Classifications Pin Name Serial communications interface (SCId) Asynchronous mode/clock synchronous mode I/O Description SCK12 I/O Input/output pin for clock signals. RXD12 Input Input pin for data reception. TXD12 Output Output pin for data transmission. CTS12# Input Transfer start control input pins RTS12# Output Transfer start control output pins Simple I2C mode SSCL12 I/O Input/output pins for the I2C clock SSDA12 I/O Input/output pins for the I2C data Simple SPI mode SCK12 I/O Input/output pins for the clock SMISO12 I/O Input/output pins for slave transmit data. SMOSI12 I/O Input/output pins for master transmit data. SS12# Input Input pins for chip select signals RXDX12 Input Input pin for receive data TXDX12 Output Output pin for transmit data Extended serial mode I2C bus interface Ethernet controller SIO12 I/O Input/output pin for transfer data SCL0[FM+], SCL1 to SCL3 I/O Input/output pin for clocks. Bus can be directly driven by the N-channel open drain output. SDA0[FM+], SDA1 to SDA3 I/O Input/output pin for data. Bus can be directly driven by the N-channel open drain output. REF50CK Input 50-MHz reference clock. This pin inputs reference signals for transmission/reception timings in RMII mode. RMII_CRS_DV Input Indicates that there are carrier detection signals and valid receive data on RMII_RXD1 and RMII_RXD0 in RMII mode. RMII_TXD0, RMII_TXD1 Output 2-bit transmit data in RMII mode. RMII_RXD0, RMII_RXD1 Input 2-bit receive data in RMII mode. RMII_TXD_EN Output Output pin for data transmit enable signals in RMII mode. RMII_RX_ER Input Indicates an error has occurred during reception of data in RMII mode. ET_CRS Input Carrier detection/data reception enable pin. ET_RX_DV Input Indicates that there are valid receive data on ET_ERXD3 to ET_ERXD0. ET_EXOUT Output General-purpose external output pin. ET_LINKSTA Input Inputs link status from the PHY-LSI. ET_ETXD0 to ET_ETXD3 Output 4 bits of MII transmit data. ET_ERXD0 to ET_ERXD3 Input 4 bits of MII receive data. ET_TX_EN Output Transmit enable pin. Indicates that transmit data is ready on ET_ETXD3 to ET_ETXD0. ET_TX_ER Output Transmit error pin. Notifies the PHY_LSI of an error during transmission. ET_RX_ER Input Receive error pin. Recognizes an error during reception. ET_TX_CLK Input Transmit clock pin. This pin inputs reference signals for output timings from ET_TX_EN, ET_ETXD3 to ET_ETXD0, and ET_TX_ER. ET_RX_CLK Input Receive clock pin. This pin inputs reference signals for input timings to ET_RX_DV, ET_ERXD3 to ET_ERXD0, and ET_RX_ER. R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 15 of 172 RX63N Group, RX631 Group Table 1.4 1. Overview Pin Functions (5/6) Classifications Pin Name I/O Description Ethernet controller ET_COL Input Inputs collision detection signals. ET_WOL Output Receives Magic packets. ET_MDC Output Outputs reference clock signals for information transfer via ET_MDIO. ET_MDIO I/O Inputs or outputs bidirectional signals for exchange of management information between the RX63N Group and the PHY-LSI. VCC_USB Input Power supply pin. VSS_USB Input Ground pin. USB0_DP, USB1_DP I/O Inputs or outputs USB transceiver D+ data. USB0_DM, USB1_DM I/O Inputs or outputs USB transceiver D- data. USB0_VBUS, USB1_VBUS Input Input pins for detection of connection and disconnection of the USB cable. USB0_EXICEN Output Output pin for control the low power of the OTG chip. USB0_VBUSEN Output Supply enable pin of VBUS (5 V) for the OTG chip. USB0_OVRCURA, USB0_OVRCURB, Input Input pin for detection of external over current. USB 2.0 host/function module USB0_ID Input ID input pin of mini-AB connector at the OGT operation. USB0_DPUPE, USB1_DPUPE Output Pull-up control pins of the D+ signal at the function operation. USB0_DPRPD Output Pull-down control pins of the D+ signal at the host operation. USB0_DRPD Output Pull-down control pins of the D- signal at the host operation. CRX0 to CRX2 Input Input pin. CTX0 to CTX2 Output Output pin. RSPCKA, RSPCKB RSPCKC I/O Clock input/output pin. MOSIA, MOSIB, MOSIC I/O Inputs or outputs data output from the master. MISOA, MISOB, MISOC I/O Inputs or outputs data output from the slave. SSLA0, SSLB0, SSLC0 I/O Input or output pins slave selection SSLA1 to SSLA3 SSLB1 to SSLB3 SSLC1 to SSLC3 Output Output pins slave selection IERXD Input Input pin for data reception. IETXD Output Output pin for data transmission. RTCOUT Output Output pin for 1-Hz clock. RTCIC0 to RTCIC2 Input Time capture event input pin AN000 to AN020 Input Input pins for the analog signals to be processed by the A/D converter. ADTRG0# Input Input pins for the external trigger signals that start the A/D conversion. AN0 to AN7 Input Input pins for the analog signals to be processed by the A/D converter. ANEX0 Output Extended analog output pin ANEX1 Input Extended analog input pin ADTRG# Input Input pins for the external trigger signals that start the A/D conversion. D/A converter DA0, DA1 Output Output pins for the analog signals to be processed by the D/A converter. Analog power supply AVCC0 Input Analog voltage supply pin for the 12-bit A/D converter. Connect this pin to VCC if the 12-bit A/D converter is not to be used. AVSS0 Input Analog ground pin for the 12-bit A/D converter. Connect this pin to VSS if the 12-bit A/D converter is not to be used. VREFH0 Input Analog reference voltage supply pin for the 12-bit A/D converter. Connect this pin to VCC if the 12-bit A/D converter is not to be used. CAN module Serial peripheral interface IEBus controller Realtime clock 12-bit A/D converter 10-bit A/D converter R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 16 of 172 RX63N Group, RX631 Group Table 1.4 1. Overview Pin Functions (6/6) Classifications Pin Name I/O Description Analog power supply VREFL0 Input Analog reference ground pin for the 12-bit A/D converter. Connect this pin to VSS if the 12-bit A/D converter is not to be used. VREFH Input Reference voltage input pin for the 10-bit A/D converter and D/A converter. This is used as the analog power supply for the respective modules. Connect this pin to VCC if neither the 10-bit A/D converter nor the D/A converter is in use. VREFL Input Reference ground pin for the 10-bit A/D converter and D/A converter. This is used as the analog ground for the respective modules. Set this pin to the same potential as the VSS pin. I/O ports P00 to P03, P05, P07 I/O 6-bit input/output pins. P10 to P17 I/O 8-bit input/output pins. P20 to P27 I/O 8-bit input/output pins. P30 to P37 I/O 8-bit input/output pins. (P35 input/output pins) P40 to P47 I/O 8-bit input/output pins. P50 to P57 I/O 8-bit input/output pins. P60 to P67 I/O 8-bit input/output pins. P70 to P77 I/O 8-bit input/output pins. P80 to P87 I/O 8-bit input/output pins. P90 to P97 I/O 8-bit input/output pins. PA0 to PA7 I/O 8-bit input/output pins. PB0 to PB7 I/O 8-bit input/output pins. PC0 to PC7 I/O 8-bit input/output pins. PD0 to PD7 I/O 8-bit input/output pins. PE0 to PE7 I/O 8-bit input/output pins. PF0 to PF5 I/O 6-bit input/output pins. PG0 to PG7 I/O 8-bit input/output pins. PJ3, PJ5 I/O 2-bit input/output pins. R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 17 of 172 RX63N Group, RX631 Group 1.5 1. Overview Pin Assignments Figure 1.5 to Figure 1.8 show the pins assignments. Table 1.5 to Table 1.9 show the list of pins and pin functions. Power pins and I/O ports are shown in the pin assignment diagrams. A B C D E F G H J K L M N P R 15 PE2 PE3 P70 P65 P67 VSS VCC PG7 PA6 PB0 P72 PB4 VSS VCC PC1 15 14 PE1 PE0 VSS PE7 PG3 PA0 PA1 PA2 PA7 VCC PB1 PB5 P73 P75 P74 14 13 P63 P64 PE4 VCC PG2 PG4 PG6 PA3 VSS P71 PB3 PB7 PC0 PC2 P76 13 12 P60 VSS P62 PE5 PE6 P66 PG5 PA4 PA5 PB2 PB6 P77 PC3 PC4 P80 12 11 PD6 PG1 VCC P61 P81 P82 PC6 VCC 11 10 P97 PD4 PG0 PD7 PC5 PC7 P83 VSS 10 9 VCC P96 PD3 PD5 P50 P51 P52 P84 9 8 P94 PD1 PD2 VSS P53 VCC_ USB USB1_ DP USB1_ DM 8 7 VSS P92 PD0 P95 P54 P55 VSS_ USB USB0_ DP 7 6 VCC P91 P90 P93 P56 P57 VCC_ USB USB0_ DM 6 5 P46 P47 P45 P44 NC P13 P12 P10 P11 5 4 P42 P41 P43 P00 VSS BSCANP PF4 P35 PF3 PF1 P25 P86 P15 P14 P85 4 3 VREFL0 P40 VREFH0 P03 PF5 PJ3 MD/ FINED RES# P34 PF2 PF0 P24 P22 P87 P16 3 2 AVCC0 P07 VREFH P02 EMLE VCL XCOUT VSS VCC P32 P30 P26 P23 P17 P20 2 1 AVSS0 P05 VREFL P01 PJ5 VBATT XCIN XTAL EXTAL P33 P31 P27 VCC VSS P21 1 A B C D E F G H J K L M N P R Figure 1.3 RX63N Group RX631 Group PTLG0177KA-A (177-pin TFLGA) (Top perspective view) Pin Assignment (177-Pin TFLGA) R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 18 of 172 RX63N Group, RX631 Group 1. Overview A B C D E F G H J K L M N P R 15 PE2 PE3 P70 P65 P67 VSS VCC PG7 PA6 PB0 P72 PB4 VSS VCC PC1 15 14 PE1 PE0 VSS PE7 PG3 PA0 PA1 PA2 PA7 VCC PB1 PB5 P73 P75 P74 14 13 P63 P64 PE4 VCC PG2 PG4 PG6 PA3 VSS P71 PB3 PB7 PC0 PC2 P76 13 12 P60 VSS P62 PE5 PE6 P66 PG5 PA4 PA5 PB2 PB6 P77 PC3 PC4 P80 12 11 PD6 PG1 VCC P61 P81 P82 PC6 VCC 11 10 P97 PD4 PG0 PD7 PC5 PC7 P83 VSS 10 9 VCC P96 PD3 PD5 P50 P51 P52 P84 9 8 P94 PD1 PD2 VSS P53 VCC_ USB USB1_ DP USB1_ DM 8 7 VSS P92 PD0 P95 P54 P55 VSS_ USB USB0_ DP 7 6 VCC P91 P90 P93 P56 P57 VCC_ USB USB0_ DM 6 5 P46 P47 P45 P44 P13 P12 P10 P11 5 4 P42 P41 P43 P00 VSS BSCANP PF4 P35 PF3 PF1 P25 P86 P15 P14 P85 4 3 VREFL0 P40 VREFH0 P03 PF5 PJ3 MD/ FINED RES# P34 PF2 PF0 P24 P22 P87 P16 3 2 AVCC0 P07 VREFH P02 EMLE VCL XCOUT VSS VCC P32 P30 P26 P23 P17 P20 2 1 AVSS0 P05 VREFL P01 PJ5 VBATT XCIN XTAL EXTAL P33 P31 P27 VCC VSS P21 1 A B C D E F G H J K L M N P R Figure 1.4 RX63N Group RX631 Group PTBG0176GA-A (176-pin LFBGA) (Top perspective view) Pin Assignment (176-Pin LFBGA) R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 19 of 172 1. Overview 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 133 88 134 87 135 86 136 85 137 84 138 83 139 82 140 81 141 80 142 79 143 78 144 77 145 76 146 75 147 74 148 73 149 72 RX63N Group RX631 Group PLQP0176KB-A (176-pin LQFP) (Top view) 150 151 152 153 154 155 156 157 158 159 160 71 70 69 68 67 66 65 64 63 62 61 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 P74 P75 PC2 P76 P77 PC3 PC4 P80 P81 P82 PC5 PC6 PC7 VCC P83 VSS P50 P51 P52 P84 P53 P54 P55 VCC_USB USB1_DP USB1_DM P56 P57 VSS_USB USB0_DP USB0_DM VCC_USB P10 P11 P12 P13 P85 P14 P15 P86 P16 P87 P17 P20 AVSS0 P05 VREFH P03 VREFL P02 P01 P00 PF5 EMLE PJ5 VSS PJ3 VCL VBATT NC PF4 MD/FINED XCIN XCOUT RES# P37/XTAL VSS P36/EXTAL VCC P35 P34 P33 P32 PF3 PF2 P31 P30 PF1 PF0 P27 P26 P25 VCC P24 VSS P23 P22 P21 18 45 17 46 176 16 47 175 15 48 174 14 49 173 13 50 172 12 51 171 11 52 170 10 53 169 9 54 168 8 55 167 7 56 166 6 57 165 5 58 164 4 59 163 3 60 162 2 161 1 PE2 PE1 PE0 P64 P63 P62 P61 VSS P60 VCC PD7 PG1 PD6 PG0 PD5 PD4 P97 PD3 VSS P96 VCC PD2 P95 PD1 P94 PD0 P93 P92 P91 VSS P90 VCC P47 P46 P45 P44 P43 P42 P41 VREFL0 P40 VREFH0 AVCC0 P07 132 PE3 PE4 PE5 VSS P70 VCC PE6 PE7 P65 PG2 P66 PG3 P67 PG4 PA0 VSS PG5 VCC PA1 PG6 PA2 PG7 PA3 PA4 PA5 PA6 PA7 VSS PB0 VCC P71 P72 PB1 PB2 PB3 PB4 PB5 PB6 PB7 P73 VSS PC0 VCC PC1 RX63N Group, RX631 Group Figure 1.5 Pin Assignment (176-Pin LQFP) R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 20 of 172 RX63N Group, RX631 Group 1. Overview A B C D E F G H J K L M N 13 PE3 PE4 VSS PE6 P67 PA2 PA4 PA7 PB1 PB5 VSS VCC P74 13 12 PE1 PE2 P70 PE5 P65 PA1 VCC PB0 PB2 PB6 P73 PC1 P75 12 11 P62 P61 PE0 VCC P66 VSS PA6 P71 PB4 PB7 PC2 PC0 PC3 11 10 VSS VCC P63 PE7 PA0 PA3 PA5 P72 PB3 P76 PC4 P77 P82 10 9 PD6 PD4 PD7 P64 P80 PC5 P81 PC7 9 8 PD2 PD0 PD3 P60 VCC P83 PC6 VSS 8 7 P92 P91 PD1 PD5 P51 P52 P50 P55 7 6 P90 P47 VSS P93 P53 P56 VSS_ USB USB0_ DP 6 5 P45 P43 P46 VCC P44 P54 P13 VCC_ USB USB0_ DM 5 4 P42 VREFL0 P41 P01 EMLE VBATT BSCANP P35 P30 P15 P24 P12 P14 4 3 P40 P05 VREFH0 P03 PJ5 PJ3 MD/ FINED VSS P32 P31 P16 P86 P87 3 2 P07 AVCC0 P02 PF5 VCL XCOUT RES# VCC P33 P26 P23 P17 P20 2 1 AVSS0 VREFH VREFL P00 VSS XCIN XTAL EXTAL P34 P27 P25 P22 P21 1 A B C D E F G H J K L M N Figure 1.6 RX63N Group RX631 Group PTLG0145KA-A (145-pin TFLGA) (Top perspective view) Pin Assignment (145-Pin TFLGA) R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 21 of 172 73 74 VSS PC0 VCC PC1 75 76 77 PB6 PB7 P73 79 78 PB4 PB5 80 81 82 83 84 85 86 87 88 89 90 PA4 VCC PA5 PA6 PA7 PB0 P71 P72 PB1 PB2 PB3 91 92 93 94 95 PA0 PA1 PA2 PA3 VSS 96 97 98 P65 P66 P67 100 99 PE6 PE7 101 102 103 104 105 106 107 PE3 PE4 PE5 VSS P70 VCC 1. Overview 108 RX63N Group, RX631 Group PE2 109 72 P74 PE1 110 71 P75 PE0 111 70 PC2 P64 112 69 P76 P63 113 68 P62 114 67 P77 PC3 P61 VSS 115 66 PC4 116 65 P80 P60 117 64 P81 VCC 118 63 P82 PD7 119 62 PC5 PD6 120 61 PC6 PD5 121 60 PC7 PD4 122 59 PD3 123 VCC P83 PD2 124 PD1 PD0 125 P93 127 P92 128 P91 129 VSS 130 P90 VCC 131 RX63N Group RX631 Group PLQP0144KA-A (144-pin LQFP) (Top view) 58 57 P14 P41 VREFL0 139 42 P15 140 41 P86 P40 VREFH0 AVCC0 141 40 142 39 143 38 P16 P87 P17 P07 144 37 P20 P23 P22 P21 P30 P27 P26 P25 P24 PJ3 VCL VBATT MD/FINED 12 11 PJ5 VSS 10 9 PF5 EMLE 8 7 P01 P00 6 5 4 3 2 1 AVSS0 P05 VREFH P03 VREFL P02 Figure 1.7 36 43 35 138 34 P13 P42 33 44 32 137 31 P12 P43 30 VCC_USB 45 29 46 136 28 135 P44 27 P45 26 USB0_DP USB0_DM 25 47 P34 P33 P32 P31 134 24 P46 P35 48 23 133 22 VSS_USB P47 21 49 20 P56 132 19 P55 50 18 P54 51 17 P53 52 XCIN PH6/XCOUT RES# P37/XTAL VSS P36/EXTAL VCC P52 53 16 P51 54 15 55 126 14 VSS P50 13 56 Pin Assignment (144-Pin LQFP) R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 22 of 172 1. Overview 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 PE3 PE4 PE5 PE6 PE7 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 VSS PB0 VCC PB1 PB2 PB3 PB4 PB5 PB6 PB7 PC0 PC1 RX63N Group, RX631 Group PE2 76 50 PE1 77 49 PC2 PC3 PE0 78 48 PC4 PD7 79 47 PC5 PD6 80 46 PC6 PD5 81 45 PC7 PD4 82 44 P50 PD3 83 43 P51 PD2 84 42 P52 PD1 85 41 P53 PD0 86 40 P54 P47 87 39 P55 P46 88 38 VSS_USB P45 89 37 USB0_DP P44 90 36 USB0_DM P43 91 35 VCC_USB P42 92 34 P12 P41 93 33 P13 VREFL0 94 32 P14 P40 95 31 P15 VREFH0 96 30 P16 AVCC0 97 29 P17 P07 98 28 P20 AVSS0 99 27 P21 P05 100 26 P22 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 VREFH EMLE VREFL PJ3 VCL VBATT MD/FINED XCIN PH6/XCOUT RES# P37/XTAL VSS P36/EXTAL VCC P35 P34 P33 P32 P31 P30 P27 P26 P25 P24 P23 1 RX63N Group RX631 Group PLQP0100KB-A (100-pin LQFP) (Top view) Figure 1.8 Pin Assignment (100-Pin LQFP) R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 23 of 172 RX63N Group, RX631 Group Table 1.5 1. Overview List of Pin and Pin Functions (177-Pin TFLGA, 176-Pin LFBGA) (1/5) Pin Number 177-Pin TFLGA 176-Pin LFBGA Power Supply Clock System Control A1 AVSS0 A2 AVCC0 A3 VREFL0 I/O Port Bus EXDMAC SDRAMC Timer Communications (MTU, TPU, TMR, PPG, RTC, POE) (ETHERC, SCIc, SCId, RSPI, RIIC, CAN, IEB, USB) Interrupt S12AD, AD, DA A4 P42 IRQ10-DS AN002 A5 P46 IRQ14-DS AN006 IRQ6 AN6 A6 VCC A7 VSS A8 P94 A20/D20 A10 P97 A23/D23 A11 PD6 D6[A6/D6] A9 VCC MTIC5V/POE1# SSLC2 A12 P60 CS0# A13 P63 CS3#/CAS# A14 PE1 D9[A9/D9] MTIOC4C/TIOCD9/PO18 TXD12/SMOSI12/ SSDA12/TXDX12/ SIOX12/SSLB2/RSPCKB A15 PE2 D10[A10/D10] MTIOC4A/TIOCA9/PO23 RXD12/SMISO12/ SSCL12/RXDX12/SSLB3/ MOSIB ANEX1 IRQ7-DS AN0 B1 P05 IRQ13 DA1 B2 P07 IRQ15 ADTRG0# B3 P40 IRQ8-DS AN000 B4 P41 IRQ9-DS AN001 B5 P47 IRQ15-DS AN007 B6 P91 A17/D17 SCK7 AN015 B7 P92 A18/D18 RXD7/SMISO7/SSCL7 AN016 B8 PD1 D1[A1/D1] B9 P96 A22/D22 B10 PD4 D4[A4/D4] PG1 D25 P64 CS4#/WE# B11 B12 MTIOC4B/TIOCB7/ TCLKG MOSIC/CTX0 IRQ1 AN009 POE3# SSLC0 IRQ4 AN012 VSS B13 B14 PE0 D8[A8/D8] TIOCC9 SCK12/SSLB1 ANEX0 B15 PE3 D11[A11/D11] MTIOC4B/TIOCB9/PO26/ POE8# ET_ERXD3/CTS12#/ RTS12#/SS12#/MISOB AN1 C1 VREFL C2 VREFH C3 VREFH0 C4 P43 C5 P45 C6 P90 A16/D16 C7 PD0 D0[A0/D0] IRQ11-DS AN003 IRQ13-DS AN005 IRQ0 AN008 TXD7/SMOSI7/SSDA7 TIOCA7 AN014 C8 PD2 D2[A2/D2] MTIOC4D/TIOCA8 MISOC/CRX0 IRQ2 AN010 C9 PD3 D3[A3/D3] TIOCB8/TCLKH/POE8# RSPCKC IRQ3 AN011 C10 PG0 D24 C12 P62 CS2#/RAS# C13 PE4 D12[A12/D12] MTIOC4D/MTIOC1A/ TIOCA10/PO28 ET_ERXD2/SSLB0 C11 VCC R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 AN2 Page 24 of 172 RX63N Group, RX631 Group Table 1.5 1. Overview List of Pin and Pin Functions (177-Pin TFLGA, 176-Pin LFBGA) (2/5) Pin Number 177-Pin TFLGA 176-Pin LFBGA Power Supply Clock System Control C14 VSS C15 SDCLK I/O Port Bus EXDMAC SDRAMC Timer Communications (MTU, TPU, TMR, PPG, RTC, POE) (ETHERC, SCIc, SCId, RSPI, RIIC, CAN, IEB, USB) Interrupt S12AD, AD, DA P70 D1 P01 TMCI0 RXD6/SMISO6/SSCL6 IRQ9 AN019 D2 P02 TMCI1 SCK6 IRQ10 AN020 D3 P03 IRQ11 DA0 D4 P00 D5 P44 D6 P93 A19/D19 P95 A21/D21 D9 PD5 D5[A5/D5] MTIC5W/POE2# SSLC1 IRQ5 AN013 D10 PD7 D7[A7/D7] MTIC5U/POE0# SSLC3 IRQ7 AN7 D11 P61 CS1#/SDCS# D12 PE5 D13[A13/D13] MTIOC4C/MTIOC2B/ TIOCB10 ET_RX_CLK/REF50CK/ RSPCKB IRQ5 AN3 D14 PE7 D15[A15/D15] TIOCB11 MISOB IRQ7 AN5 D15 P65 CS5#/CKE D7 D8 D13 CTS7#/RTS7#/SS7# AN017 PJ5 PF5 E4 VSS NC E12 IRQ4 PE6 D14[A14/D14] E13 TRDATA0 PG2 D26 E14 TRDATA1 PG3 D27 P67 CS7#/DQM1 E15 F1 VBATT F2 VCL F3 PJ3 TIOCA11 MTIOC3C MOSIB IRQ6 CRX2*3 IRQ15 AN4 CTS6#/RTS6#/CTS0#/ RTS0#/SS6#/SS0# BSCANP F12 TRSYNC# F14 F15 AN018 AN004 EMLE E5*1 F13 IRQ8 IRQ12-DS VCC E3 F4 TXD6/SMOSI6/SSDA6 VSS E1 E2 TMRI0 P66 CS6#/DQM0 PG4 D28 PA0 A0/BC0#/DQM2 CTX2*3 MTIOC4A/TIOCA0/PO16 ET_TX_EN/ RMII_TXD_EN/SSLA1 MTIOC0B/MTCLKC/ TIOCB0/PO17 ET_WOL/SCK5/SSLA2 VSS G1 XCIN G2 XCOUT G3 MD/FINED G4 TRST# G12 TRCLK PG5 D29 G13 TRDATA2 PG6 D30 PA1 A1/DQM3 G14 G15 VCC H1 XTAL H2 VSS PF4 IRQ11 P37 R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 25 of 172 RX63N Group, RX631 Group Table 1.5 1. Overview List of Pin and Pin Functions (177-Pin TFLGA, 176-Pin LFBGA) (3/5) Pin Number 177-Pin TFLGA 176-Pin LFBGA H3 Power Supply Clock System Control I/O Port Bus EXDMAC SDRAMC Timer Communications (MTU, TPU, TMR, PPG, RTC, POE) (ETHERC, SCIc, SCId, RSPI, RIIC, CAN, IEB, USB) Interrupt RES# H4 P35 H12 PA4 A4 MTIC5U/MTCLKA/ TIOCA1/TMRI0/PO20 ET_MDC/TXD5/SMOSI5/ SSDA5/SSLA0 IRQ5-DS H13 PA3 A3 MTIOC0D/MTCLKD/ TIOCD0/TCLKB/PO19 ET_MDIO/RXD5/SMISO5/ SSCL5 IRQ6-DS H14 PA2 A2 PO18 RXD5/SMISO5/SSCL5/ SSLA3 D31 MTIOC0A/TMCI3/PO12/ POE2# SCK6/SCK0/ USB0_DPRPD TIOCB1/PO21 ET_LINKSTA/RSPCKA H15 TRDATA3 PG7 J1 EXTAL P36 J2 VCC J3 J4 NMI P34 TMS J12 J13 IRQ4 PF3 PA5 A5 VSS J14 PA7 A7 TIOCB2/PO23 ET_WOL/MISOA J15 PA6 A6 MTIC5V/MTCLKB/ TIOCA2/TMCI3/PO22/ POE2# ET_EXOUT/CTS5#/ RTS5#/SS5#/MOSIA K1 P33 MTIOC0D/TIOCD0/ TMRI3/PO11/POE3# RXD6/RXD0/SMISO6/ SMISO0/SSCL6/SSCL0/ CRX0 IRQ3-DS K2 P32 MTIOC0C/TIOCC0/TMO3/ PO10/RTCOUT/RTCIC2 TXD6/TXD0/SMOSI6/ SMOSI0/SSDA6/SSDA0/ CTX0/USB0_VBUSEN IRQ2-DS K3 TDI K4 TCK/FINEC PF2 RXD1/SMISO1/SSCL1 PF1 SCK1 K12 PB2 A10 K13 P71 CS1# K15 PB0 A8 L1 L2 K14 L3 S12AD, AD, DA TIOCC3/TCLKC/PO26 ET_RX_CLK/REF50CK/ CTS4#/RTS4#/CTS6#/ RTS6#/SS4#/SS6# ET_MDIO VCC TDO MTIC5W/TIOCA3/PO24 ET_ERXD1/RMII_RXD1/ RXD4/RXD6/SMISO4/ SMISO6/SSCL4/SSCL6/ RSPCKA IRQ12 P31 MTIOC4D/TMCI2/PO9/ RTCIC1 CTS1#/RTS1#/SS1#/ SSLB0/USB0_DPUPE IRQ1-DS P30 MTIOC4B/TMRI3/PO8/ RTCIC0/POE8# RXD1/SMISO1/SSCL1/ MISOB/USB0_DRPD IRQ0-DS PF0 TXD1/SMOSI1/SSDA1 L4 P25 CS5#/EDACK1 MTIOC4C/MTCLKB/ TIOCA4/PO5 RXD3/SMISO3/SSCL3/ USB0_DPRPD L12 PB6 A14 MTIOC3D/TIOCA5/PO30 ET_ETXD1/RMII_TXD1/ RXD9/SMISO9/SSCL9 L13 PB3 A11 MTIOC0A/MTIOC4A/ TIOCD3/TCLKD/TMO0/ PO27/POE3# ET_RX_ER/RMII_RX_ER/ SCK4/SCK6 L14 PB1 A9 MTIOC0C/MTIOC4C/ TIOCB3/TMCI0/PO25 ET_ERXD0/RMII_RXD0/ TXD4/TXD6/SMOSI4/ SMOSI6/SSDA4/SSDA6 L15 P72 CS2# M1 P27 CS7# MTIOC2B/TMCI3/PO7 SCK1/RSPCKB M2 P26 CS6# MTIOC2A/TMO1/PO6 TXD1/CTS3#/RTS3# SMOSI1/SS3#/SSDA1/ MOSIB R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 ADTRG0# IRQ4-DS ET_MDC Page 26 of 172 RX63N Group, RX631 Group Table 1.5 1. Overview List of Pin and Pin Functions (177-Pin TFLGA, 176-Pin LFBGA) (4/5) Pin Number 177-Pin TFLGA 176-Pin LFBGA Communications (MTU, TPU, TMR, PPG, RTC, POE) (ETHERC, SCIc, SCId, RSPI, RIIC, CAN, IEB, USB) I/O Port Bus EXDMAC SDRAMC M3 P24 CS4#/EDREQ1 M4 P86 TIOCA0 M5 P13 MTIOC0B/TIOCA5/TMO3/ PO13 M6 P56 WR2#/BC2#/ EDACK1 MTIOC3C/TIOCA1 M7 P54 ALE/EDACK0 MTIOC4B/TMCI1 M8 P53*2 BCLK M9 P50 WR0#/WR# M10 PC5 A21/CS2#/ WAIT# MTIOC3B/MTCLKD/ TIOCD6/TCLKF/TMRI2/ PO29 ET_ETXD2/SCK8/ RSPCKA M11 P81 EDACK0 MTIOC3D/PO27 ET_ETXD0/RMII_TXD0/ RXD10/SMISO10/SSCL10 M12 P77 CS7# PO23 ET_RX_ER/RMII_RX_ER/ TXD11/SMOSI11/SSDA11 M13 PB7 A15 MTIOC3B/TIOCB5/PO31 ET_CRS/RMII_CRS_DV/ TXD9/SMOSI9/SSDA9 M14 PB5 A13 MTIOC2A/MTIOC1B/ TIOCB4/TMRI1/PO29/ POE1# ET_ETXD0/RMII_TXD0/ SCK9 M15 PB4 A12 TIOCA4/PO28 ET_TX_EN/ RMII_TXD_EN/CTS9#/ RTS9#/SS9# N2 P23 EDACK0 MTIOC3D/MTCLKD/ TIOCD3/PO3 TXD3/CTS0#/RTS0#/ SMOSI3/SS0#/SSDA3/ USB0_DPUPE N3 P22 EDREQ0 MTIOC3B/MTCLKC/ TIOCC3/TMO0/PO2 SCK0/USB0_DRPD N4 P15 MTIOC0B/MTCLKB/ TIOCB2/TCLKB/TMCI2/ PO13 RXD1/SCK3/SMISO1/ SSCL1/CRX1-DS/ USB1_DPUPE IRQ5 N5 P12 MTIC5U/TMCI1 RXD2/SMISO2/SSCL2/ SCL0[FM+] IRQ2 N6 P57 WAIT#/WR3#/ BC3#/EDREQ1 N7 P55 WAIT#/ EDREQ0 MTIOC4D/TMO3 ET_EXOUT/CRX1 IRQ10 N9 P51 WR1#/BC1#/ WAIT# N10 PC7 A23/CS0# MTIOC3A/MTCLKB/ TIOCB6/TMO2/PO31 ET_COL/TXD8/SMOSI8/ SSDA8/MISOA N11 P82 EDREQ1 MTIOC4A/PO28 ET_ETXD1/RMII_TXD1/ TXD10/SMOSI10/SSDA10 N12 PC3 A19 MTIOC4D/TCLKB/PO24 ET_TX_ER/TXD5/ SMOSI5/SSDA5/IETXD N13 PC0 A16 MTIOC3C/TCLKC/PO17 ET_ERXD3/CTS5#/ RTS5#/SS5#/SSLA1/ SCL3 P73 CS3# PO16 ET_WOL N1 N8 Power Supply Clock System Control Timer MTIOC4A/MTCLKA/ TIOCB4/TMRI1/PO4 Interrupt S12AD, AD, DA IRQ3 ADTRG# SCK3/USB0_VBUSEN TXD2/SMOSI2/SSDA2/ SDA0[FM+] ET_LINKSTA/CTS2#/ RTS2#/SS2#/CTX1 TXD2/SMOSI2/SSDA2/ SSLB1 VCC VCC_USB N14 N15 VSS P1 VSS R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 SCK2/SSLB2 IRQ14 IRQ14 Page 27 of 172 RX63N Group, RX631 Group Table 1.5 1. Overview List of Pin and Pin Functions (177-Pin TFLGA, 176-Pin LFBGA) (5/5) Pin Number 177-Pin TFLGA 176-Pin LFBGA Power Supply Clock System Control I/O Port Bus EXDMAC SDRAMC Timer Communications (MTU, TPU, TMR, PPG, RTC, POE) (ETHERC, SCIc, SCId, RSPI, RIIC, CAN, IEB, USB) P2 P17 MTIOC3A/MTIOC3B/ TIOCB0/TCLKD/TMO1/ PO15/POE8# P3 P87 TIOCA2 P4 P14 MTIOC3A/MTCLKA/ TIOCB5/TCLKA/TMRI2/ PO15 P10 MTIC5W/TMRI3 P5 P6 VCC_USB P7 VSS_USB P8 Interrupt S12AD, AD, DA SCK1/TXD3/SMOSI3/ SSDA3/MISOA/SDA2-DS/ IETXD/USB1_VBUS IRQ7 ADTRG# CTS1#/RTS1#/SS1#/ CTX1/USB0_DPUPE/ USB0_OVRCURA IRQ4 IRQ0 USB1_DP P9 P52 RD# P10 P83 EDACK1 MTIOC4C ET_CRS/RMII_CRS_DV/ CTS10#/RTS10#/SS10# P11 PC6 A22/CS1# MTIOC3C/MTCLKA/ TIOCA6/TMCI2/PO30 ET_ETXD3/RXD8/ SMISO8/SSCL8/MOSIA P12 PC4 A20/CS3# MTIOC3D/MTCLKC/ TIOCC6/TCLKE/TMCI1/ PO25/POE0# ET_TX_CLK/SCK5/ CTS8#/RTS8#/SS8#/ SSLA0 P13 PC2 A18 MTIOC4B/TCLKA/PO21 ET_RX_DV/RXD5/ SMISO5/SSCL5/SSLA3/ IERXD P14 P75 CS5# PO20 ET_ERXD0/RMII_RXD0/ SCK11 P15 RXD2/SMISO2/SSCL2/ SSLB3 IRQ13 VCC R1 P21 MTIOC1B/TIOCA3/ TMCI0/PO1 RXD0/SMISO0/SSCL0/ SCL1/USB0_EXICEN IRQ9 R2 P20 MTIOC1A/TIOCB3/ TMRI0/PO0 TXD0/SMOSI0/SSDA0/ SDA1/USB0_ID IRQ8 R3 P16 MTIOC3C/MTIOC3D/ TIOCB1/TCLKC/TMO2/ PO14/RTCOUT TXD1/RXD3/SMOSI1/ SMISO3/SSDA1/SSCL3/ MOSIA/SCL2-DS/IERXD/ USB0_VBUS/ USB0_VBUSEN/ USB0_OVRCURB IRQ6 R4 P85 R5 P11 MTIC5V/TMCI3 SCK2 IRQ1 R6 USB0_DM R7 USB0_DP R8 USB1_DM R9 ADTRG0# P84 R10 VSS R11 VCC R12 P80 EDREQ0 MTIOC3B/PO26 ET_TX_EN/ RMII_TXD_EN/SCK10 R13 P76 CS6# PO22 ET_RX_CLK/REF50CK/ RXD11/SMISO11/SSCL11 R14 P74 CS4# PO19 ET_ERXD1/RMII_RXD1/ CTS11#/RTS11#/SS11# R15 PC1 A17 MTIOC3A/TCLKD/PO18 ET_ERXD2/SCK5/SSLA2/ SDA3 IRQ12 Note 1. 176-pin LFBGA does not have E5 pin Note 2. The BCLK function is multiplexed with the I/O port function for pin P53, so the port function is not available if the external bus is enabled. Note 3. Enabled only for the ROM capacity: 2 Mbytes/1.5 Mbytes R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 28 of 172 RX63N Group, RX631 Group Table 1.6 1. Overview List of Pin and Pin Functions (176-Pin LQFP) (1/5) Pin Number 176-Pin LQFP 1 Power Supply Clock System Control Communications (MTU, TPU, TMR, PPG, RTC, POE) (ETHERC, SCIc, SCId, RSPI, RIIC, CAN, IEB, USB) Interrupt S12AD, AD, DA P05 IRQ13 DA1 P03 IRQ11 DA0 I/O Port VREFH 4 5 Timer AVSS0 2 3 Bus EXDMAC SDRAMC VREFL 6 P02 TMCI1 SCK6 IRQ10 AN020 7 P01 TMCI0 RXD6/SMISO6/SSCL6 IRQ9 AN019 8 P00 TMRI0 TXD6/SMOSI6/SSDA6 IRQ8 AN018 9 10 PF5 11 12 PJ5 VSS 13 14 IRQ4 EMLE PJ3 MTIOC3C CTS6#/RTS6#/CTS0#/ RTS0#/SS6#/SS0# VCL 15 VBATT 16 NC 17 TRST# 18 MD/FINED 19 XCIN 20 XCOUT 21 RES# 22 XTAL 23 VSS 24 EXTAL 25 VCC PF4 P37 P36 26 P35 27 P34 MTIOC0A/TMCI3/PO12/ POE2# SCK6/SCK0/ USB0_DPRPD IRQ4 28 P33 MTIOC0D/TIOCD0/ TMRI3/PO11/POE3# RXD6/RXD0/SMISO6/ SMISO0/SSCL6/SSCL0/ CRX0 IRQ3-DS 29 P32 MTIOC0C/TIOCC0/TMO3/ PO10/RTCOUT/RTCIC2 TXD6/TXD0/SMOSI6/ SMOSI0/SSDA6/SSDA0/ CTX0/USB0_VBUSEN IRQ2-DS 30 TMS PF3 31 TDI PF2 NMI RXD1/SMISO1/SSCL1 32 P31 MTIOC4D/TMCI2/PO9/ RTCIC1 CTS1#/RTS1#/SS1#/ SSLB0/USB0_DPUPE IRQ1-DS 33 P30 MTIOC4B/TMRI3/PO8/ RTCIC0/POE8# RXD1/SMISO1/SSCL1/ MISOB/USB0_DRPD IRQ0-DS 34 TCK/FINEC PF1 35 TDO PF0 SCK1 TXD1/SMOSI1/SSDA1 36 P27 CS7# MTIOC2B/TMCI3/PO7 SCK1/RSPCKB 37 P26 CS6# MTIOC2A/TMO1/PO6 TXD1/CTS3#/RTS3# SMOSI1/SS3#/SSDA1/ MOSIB 38 P25 CS5#/EDACK1 MTIOC4C/MTCLKB/ TIOCA4/PO5 RXD3/SMISO3/SSCL3/ USB0_DPRPD P24 CS4#/EDREQ1 MTIOC4A/MTCLKA/ TIOCB4/TMRI1/PO4 SCK3/USB0_VBUSEN 39 40 ADTRG0# VCC R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 29 of 172 RX63N Group, RX631 Group Table 1.6 1. Overview List of Pin and Pin Functions (176-Pin LQFP) (2/5) Pin Number Timer Communications (MTU, TPU, TMR, PPG, RTC, POE) (ETHERC, SCIc, SCId, RSPI, RIIC, CAN, IEB, USB) I/O Port Bus EXDMAC SDRAMC 42 P23 EDACK0 MTIOC3D/MTCLKD/ TIOCD3/PO3 TXD3/CTS0#/RTS0#/ SMOSI3/SS0#/SSDA3/ USB0_DPUPE 43 P22 EDREQ0 MTIOC3B/MTCLKC/ TIOCC3/TMO0/PO2 SCK0/USB0_DRPD 44 P21 MTIOC1B/TIOCA3/ TMCI0/PO1 RXD0/SMISO0/SSCL0/ SCL1/USB0_EXICEN IRQ9 45 P20 MTIOC1A/TIOCB3/ TMRI0/PO0 TXD0/SMOSI0/SSDA0/ SDA1/USB0_ID IRQ8 46 P17 MTIOC3A/MTIOC3B/ TIOCB0/TCLKD/TMO1/ PO15/POE8# SCK1/TXD3/SMOSI3/ SSDA3/MISOA/SDA2-DS/ IETXD/USB1_VBUS IRQ7 ADTRG# TXD1/RXD3/SMOSI1/ SMISO3/SSDA1/SSCL3/ MOSIA/SCL2-DS/IERXD/ USB0_VBUS/ USB0_VBUSEN/ USB0_OVRCURB IRQ6 ADTRG0# 176-Pin LQFP 41 Power Supply Clock System Control Interrupt VSS 47 P87 TIOCA2 48 P16 MTIOC3C/MTIOC3D/ TIOCB1/TCLKC/TMO2/ PO14/RTCOUT 49 P86 TIOCA0 50 P15 MTIOC0B/MTCLKB/ TIOCB2/TCLKB/TMCI2/ PO13 RXD1/SCK3/SMISO1/ SSCL1/CRX1-DS/ USB1_DPUPE IRQ5 51 P14 MTIOC3A/MTCLKA/ TIOCB5/TCLKA/TMRI2/ PO15 CTS1#/RTS1#/SS1#/ CTX1/USB0_DPUPE/ USB0_OVRCURA IRQ4 52 P85 53 P13 MTIOC0B/TIOCA5/TMO3/ PO13 TXD2/SMOSI2/SSDA2/ SDA0[FM+] IRQ3 54 P12 MTIC5U/TMCI1 RXD2/SMISO2/SSCL2/ SCL0[FM+] IRQ2 55 P11 MTIC5V/TMCI3 SCK2 IRQ1 56 P10 MTIC5W/TMRI3 57 IRQ0 USB0_DM 59 USB0_DP VSS_USB 61 P57 WAIT#/WR3#/ BC3#/EDREQ1 62 P56 WR2#/BC2#/ EDACK1 MTIOC3C/TIOCA1 63 USB1_DM 64 65 ADTRG# VCC_USB 58 60 S12AD, AD, DA USB1_DP VCC_USB 66 P55 WAIT#/ EDREQ0 MTIOC4D/TMO3 ET_EXOUT/CRX1 67 P54 ALE/EDACK0 MTIOC4B/TMCI1 ET_LINKSTA/CTS2#/ RTS2#/SS2#/CTX1 68 P53*1 BCLK 69 P84 70 P52 RD# RXD2/SMISO2/SSCL2/ SSLB3 71 P51 WR1#/BC1#/ WAIT# SCK2/SSLB2 72 P50 WR0#/WR# TXD2/SMOSI2/SSDA2/ SSLB1 R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 IRQ10 Page 30 of 172 RX63N Group, RX631 Group Table 1.6 1. Overview List of Pin and Pin Functions (176-Pin LQFP) (3/5) Pin Number Timer Communications I/O Port Bus EXDMAC SDRAMC (MTU, TPU, TMR, PPG, RTC, POE) (ETHERC, SCIc, SCId, RSPI, RIIC, CAN, IEB, USB) P83 EDACK1 MTIOC4C ET_CRS/RMII_CRS_DV/ CTS10#/RTS10#/SS10# 76 PC7 A23/CS0# MTIOC3A/MTCLKB/ TIOCB6/TMO2/PO31 ET_COL/TXD8/SMOSI8/ SSDA8/MISOA IRQ14 77 PC6 A22/CS1# MTIOC3C/MTCLKA/ TIOCA6/TMCI2/PO30 ET_ETXD3/RXD8/ SMISO8/SSCL8/MOSIA IRQ13 78 PC5 A21/CS2#/ WAIT# MTIOC3B/MTCLKD/ TIOCD6/TCLKF/TMRI2/ PO29 ET_ETXD2/SCK8/ RSPCKA 79 P82 EDREQ1 MTIOC4A/PO28 ET_ETXD1/RMII_TXD1/ TXD10/SMOSI10/SSDA10 80 P81 EDACK0 MTIOC3D/PO27 ET_ETXD0/RMII_TXD0/ RXD10/SMISO10/SSCL10 81 P80 EDREQ0 MTIOC3B/PO26 ET_TX_EN/ RMII_TXD_EN/SCK10 82 PC4 A20/CS3# MTIOC3D/MTCLKC/ TIOCC6/TCLKE/TMCI1/ PO25/POE0# ET_TX_CLK/SCK5/ CTS8#/RTS8#/SS8#/ SSLA0 83 PC3 A19 MTIOC4D/TCLKB/PO24 ET_TX_ER/TXD5/ SMOSI5/SSDA5/IETXD 84 P77 CS7# PO23 ET_RX_ER/RMII_RX_ER/ TXD11/SMOSI11/SSDA11 85 P76 CS6# PO22 ET_RX_CLK/REF50CK/ RXD11/SMISO11/SSCL11 86 PC2 A18 MTIOC4B/TCLKA/PO21 ET_RX_DV/RXD5/ SMISO5/SSCL5/SSLA3/ IERXD 87 P75 CS5# PO20 ET_ERXD0/RMII_RXD0/ SCK11 88 P74 CS4# PO19 ET_ERXD1/RMII_RXD1/ CTS11#/RTS11#/SS11# 89 PC1 A17 MTIOC3A/TCLKD/PO18 ET_ERXD2/SCK5/SSLA2/ SDA3 IRQ12 PC0 A16 MTIOC3C/TCLKC/PO17 ET_ERXD3/CTS5#/ RTS5#/SS5#/SSLA1/ SCL3 IRQ14 176-Pin LQFP 73 Power Supply Clock System Control 90 VCC VCC 91 92 S12AD, AD, DA VSS 74 75 Interrupt VSS 93 P73 CS3# PO16 ET_WOL 94 PB7 A15 MTIOC3B/TIOCB5/PO31 ET_CRS/RMII_CRS_DV/ TXD9/SMOSI9/SSDA9 95 PB6 A14 MTIOC3D/TIOCA5/PO30 ET_ETXD1/RMII_TXD1/ RXD9/SMISO9/SSCL9 96 PB5 A13 MTIOC2A/MTIOC1B/ TIOCB4/TMRI1/PO29/ POE1# ET_ETXD0/RMII_TXD0/ SCK9 97 PB4 A12 TIOCA4/PO28 ET_TX_EN/ RMII_TXD_EN/CTS9#/ RTS9#/SS9# 98 PB3 A11 MTIOC0A/MTIOC4A/ TIOCD3/TCLKD/TMO0/ PO27/POE3# ET_RX_ER/RMII_RX_ER/ SCK4/SCK6 99 PB2 A10 TIOCC3/TCLKC/PO26 ET_RX_CLK/REF50CK/ CTS4#/RTS4#/CTS6#/ RTS6#/SS4#/SS6# 100 PB1 A9 MTIOC0C/MTIOC4C/ TIOCB3/TMCI0/PO25 ET_ERXD0/RMII_RXD0/ TXD4/TXD6/SMOSI4/ SMOSI6/SSDA4/SSDA6 R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 IRQ4-DS Page 31 of 172 RX63N Group, RX631 Group Table 1.6 1. Overview List of Pin and Pin Functions (176-Pin LQFP) (4/5) Pin Number Timer Communications (MTU, TPU, TMR, PPG, RTC, POE) (ETHERC, SCIc, SCId, RSPI, RIIC, CAN, IEB, USB) I/O Port Bus EXDMAC SDRAMC 101 P72 CS2# ET_MDC 102 P71 CS1# ET_MDIO PB0 A8 176-Pin LQFP 103 Power Supply Clock System Control MTIC5W/TIOCA3/PO24 ET_ERXD1/RMII_RXD1/ RXD4/RXD6/SMISO4/ SMISO6/SSCL4/SSCL6/ RSPCKA IRQ12 VSS 106 PA7 A7 TIOCB2/PO23 ET_WOL/MISOA 107 PA6 A6 MTIC5V/MTCLKB/ TIOCA2/TMCI3/PO22/ POE2# ET_EXOUT/CTS5#/ RTS5#/SS5#/MOSIA 108 PA5 A5 TIOCB1/PO21 ET_LINKSTA/RSPCKA 109 PA4 A4 MTIC5U/MTCLKA/ TIOCA1/TMRI0/PO20 ET_MDC/TXD5/SMOSI5/ SSDA5/SSLA0 IRQ5-DS 110 PA3 A3 MTIOC0D/MTCLKD/ TIOCD0/TCLKB/PO19 ET_MDIO/RXD5/SMISO5/ SSCL5 IRQ6-DS PG7 D31 PA2 A2 PO18 RXD5/SMISO5/SSCL5/ SSLA3 MTIOC0B/MTCLKC/ TIOCB0/PO17 ET_WOL/SCK5/SSLA2 MTIOC4A/TIOCA0/PO16 ET_TX_EN/ RMII_TXD_EN/SSLA1 111 TRDATA3 112 113 TRDATA2 114 115 VCC 116 TRCLK 117 VSS 118 119 TRSYNC# 120 121 TRDATA1 122 123 S12AD, AD, DA VCC 104 105 Interrupt TRDATA0 PG6 D30 PA1 A1/DQM3 PG5 D29 PA0 A0/BC0#/DQM2 PG4 D28 P67 CS7#/DQM1 PG3 D27 P66 CS6#/DQM0 CRX2*2 IRQ11 IRQ15 CTX2*2 PG2 D26 124 P65 CS5#/CKE 125 PE7 D15[A15/D15] TIOCB11 MISOB IRQ7 AN5 PE6 D14[A14/D14] TIOCA11 MOSIB IRQ6 AN4 IRQ5 AN3 126 127 VCC 128 SDCLK 129 VSS P70 130 PE5 D13[A13/D13] MTIOC4C/MTIOC2B/ TIOCB10 ET_RX_CLK/REF50CK/ RSPCKB 131 PE4 D12[A12/D12] MTIOC4D/MTIOC1A/ TIOCA10/PO28 ET_ERXD2/SSLB0 AN2 132 PE3 D11[A11/D11] MTIOC4B/TIOCB9/PO26/ POE8# ET_ERXD3/CTS12#/ RTS12#/SS12#/MISOB AN1 133 PE2 D10[A10/D10] MTIOC4A/TIOCA9/PO23 RXD12/SMISO12/ SSCL12/RXDX12/SSLB3/ MOSIB 134 PE1 D9[A9/D9] MTIOC4C/TIOCD9/PO18 TXD12/SMOSI12/ SSDA12/TXDX12/ SIOX12/SSLB2/RSPCKB ANEX1 TIOCC9 SCK12/SSLB1 ANEX0 135 PE0 D8[A8/D8] 136 P64 CS4#/WE# 137 P63 CS3#/CAS# R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 IRQ7-DS AN0 Page 32 of 172 RX63N Group, RX631 Group Table 1.6 1. Overview List of Pin and Pin Functions (176-Pin LQFP) (5/5) Pin Number 176-Pin LQFP Power Supply Clock System Control I/O Port Bus EXDMAC SDRAMC 138 P62 CS2#/RAS# 139 P61 CS1#/SDCS# P60 CS0# 140 Communications (MTU, TPU, TMR, PPG, RTC, POE) (ETHERC, SCIc, SCId, RSPI, RIIC, CAN, IEB, USB) Interrupt S12AD, AD, DA MTIC5U/POE0# SSLC3 IRQ7 AN7 MTIC5V/POE1# SSLC2 IRQ6 AN6 VSS 141 142 Timer VCC 143 PD7 D7[A7/D7] 144 PG1 D25 145 PD6 D6[A6/D6] 146 PG0 D24 147 PD5 D5[A5/D5] MTIC5W/POE2# SSLC1 IRQ5 AN013 148 PD4 D4[A4/D4] POE3# SSLC0 IRQ4 AN012 149 P97 A23/D23 150 PD3 D3[A3/D3] TIOCB8/TCLKH/POE8# RSPCKC IRQ3 AN011 P96 A22/D22 PD2 D2[A2/D2] MTIOC4D/TIOCA8 MISOC/CRX0 IRQ2 AN010 155 P95 A21/D21 156 PD1 D1[A1/D1] MTIOC4B/TIOCB7/ TCLKG MOSIC/CTX0 IRQ1 AN009 157 P94 A20/D20 158 PD0 D0[A0/D0] 159 P93 A19/D19 151 VSS 152 153 VCC 154 TIOCA7 IRQ0 AN008 CTS7#/RTS7#/SS7# AN017 160 P92 A18/D18 RXD7/SMISO7/SSCL7 AN016 161 P91 A17/D17 SCK7 AN015 P90 A16/D16 TXD7/SMOSI7/SSDA7 AN014 162 VSS 163 164 VCC 165 P47 IRQ15-DS AN007 166 P46 IRQ14-DS AN006 167 P45 IRQ13-DS AN005 168 P44 IRQ12-DS AN004 169 P43 IRQ11-DS AN003 170 P42 IRQ10-DS AN002 171 P41 IRQ9-DS AN001 P40 IRQ8-DS AN000 P07 IRQ15 ADTRG0# 172 VREFL0 173 174 VREFH0 175 AVCC0 176 Note 1. The BCLK function is multiplexed with the I/O port function for pin P53, so the port function is not available if the external bus is enabled. Note 2. Enabled only for the ROM capacity: 2 Mbytes/1.5 Mbytes R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 33 of 172 RX63N Group, RX631 Group Table 1.7 1. Overview List of Pins and Pin Functions (145-Pin TFLGA) (1/5) Pin No. 145-pin TFLGA A1 Power Supply Clock System Control I/O Port Bus EXDMAC SDRAMC Timers Communications (MTU, TPU, TMR, PPG, RTC, POE) (ETHERC, SCIc, SCId, RSPI, RIIC, CAN, IEB, USB) Interrupt S12AD AD DA AVSS0 A2 P07 IRQ15 ADTRG0# A3 P40 IRQ8-DS AN000 A4 P42 IRQ10-DS AN002 IRQ13-DS AN005 A5 P45 A6 P90 A16 TXD7/SMOSI7/SSDA7 AN014 A7 P92 A18 RXD7/SMISO7/SSCL7 AN016 A8 PD2 D2[A2/D2] MTIOC4D/TIOCA8 MISOC/CRX0 IRQ2 AN010 A9 PD6 D6[A6/D6] MTIC5V/POE1# SSLC2 IRQ6 AN6 A11 P62 CS2#/RAS# A12 PE1 D9[A9/D9] MTIOC4C/TIOCD9/ PO18 TXD12/SMOSI12/SSDA12/ TXDX12/SIOX12/SSLB2/ RSPCKB ANEX1 A13 PE3 D11[A11/D11] MTIOC4B/TIOCB9/ PO26/POE8# CTS12#/RTS12#/SS12#/ MISOB/ET_ERXD3 AN1 A10 VSS B1 VREFH B2 AVCC0 B3 P05 IRQ13 DA1 B5 P43 IRQ11-DS AN003 B6 P47 IRQ15-DS AN007 IRQ0 AN008 B4 VREFL0 B7 P91 A17 B8 PD0 D0[A0/D0] TIOCA7 B9 PD4 D4[A4/D4] POE3# SSLC0 IRQ4 AN012 B11 P61 CS1#/SDCS# B12 PE2 D10[A10/D10] MTIOC4A/TIOCA9/ PO23 RXD12/SMISO12/SSCL12/ RXDX12/SSLB3/MOSIB IRQ7-DS AN0 B13 PE4 D12[A12/D12] MTIOC4D/MTIOC1A/ TIOCA10/PO28 SSLB0/ET_ERXD2 TMCI1 SCK6 B10 C1 AN015 VCC AN2 VREFL C2 C3 SCK7 P02 IRQ10 AN020 VREFH0 C4 P41 IRQ9-DS AN001 C5 P46 IRQ14-DS AN006 C6 VSS C7 PD1 D1[A1/D1] MTIOC4B/TIOCB7/ TCLKG MOSIC/CTX0 IRQ1 AN009 C8 PD3 D3[A3/D3] TIOCB8/TCLKH/POE8# RSPCKC IRQ3 AN011 MTIC5U/POE0# SSLC3 IRQ7 AN7 TIOCC9 SCK12/SSLB1 TMRI0 TXD6/SMOSI6/SSDA6 C9 PD7 D7[A7/D7] C10 P63 CS3#/CAS# C11 PE0 D8[A8/D8] C12 SDCLK C13 VSS ANEX0 P70 D1 P00 D2 PF5 IRQ4 D3 P03 IRQ11 DA0 D4 P01 IRQ9 AN019 R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 TMCI0 RXD6/SMISO6/SSCL6 IRQ8 AN018 Page 34 of 172 RX63N Group, RX631 Group Table 1.7 1. Overview List of Pins and Pin Functions (145-Pin TFLGA) (2/5) Pin No. Power Supply Clock System Control I/O Port Bus EXDMAC SDRAMC D6 P93 A19 D7 PD5 D5[A5/D5] D8 P60 CS0# D9 P64 CS4#/WE# D10 PE7 D12 D13 145-pin TFLGA D5 D11 (MTU, TPU, TMR, PPG, RTC, POE) (ETHERC, SCIc, SCId, RSPI, RIIC, CAN, IEB, USB) VSS VCL E3 Interrupt CTS7#/RTS7#/SS7# AN017 MTIC5W/POE2# SSLC1 IRQ5 AN013 D15[A15/D15] TIOCB11 MISOB IRQ7 AN5 PE5 D13[A13/D13] MTIOC4C/MTIOC2B/ TIOCB10 RSPCKB/ET_RX_CLK/ REF50CK IRQ5 AN3 PE6 D14[A14/D14] TIOCA11 MOSIB IRQ6 AN4 IRQ12-DS AN004 PJ5 EMLE E5 P44 E10 PA0 A0/BC0# E11 P66 CS6#/DQM0 E12 P65 CS5#/CKE E13 P67 CS7#/DQM1 F1 XCIN F2 XCOUT F3 PJ3 MTIOC4A/TIOCA0/ PO16 SSLA1/ET_TX_EN/ RMII_TXD_EN CTX2*2 CRX2*2 MTIOC3C CTS6#/RTS6#/CTS0#/ RTS0#/SS6#/SS0# IRQ15 VBATT F10 PA3 A3 MTIOC0D/MTCLKD/ TIOCD0/TCLKB/PO19 RXD5/SMISO5/SSCL5/ ET_MDIO IRQ6-DS F12 PA1 A1 MTIOC0B/MTCLKC/ TIOCB0/PO17 SCK5/SSLA2/ET_WOL IRQ11 F13 PA2 A2 PO18 RXD5/SMISO5/SSCL5/ SSLA3 F11 VSS G1 XTAL G2 RES# G3 MD/FINED G4 BSCANP P37 G10 PA5 A5 TIOCB1/PO21 RSPCKA/ET_LINKSTA G11 PA6 A6 MTIC5V/MTCLKB/ TIOCA2/TMCI3/PO22/ POE2# CTS5#/RTS5#/SS5# MOSIA/ET_EXOUT PA4 A4 MTIC5U/MTCLKA/ TIOCA1/TMRI0/PO20 TXD5/SMOSI5/SSDA5/ SSLA0/ET_MDC G12 S12AD AD DA VCC E2 F4 Communications VCC E1 E4 Timers VCC G13 H1 EXTAL H2 VCC H3 VSS IRQ5-DS P36 H4 P35 H10 P72 CS2# ET_MDC H11 P71 CS1# ET_MDIO R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 NMI Page 35 of 172 RX63N Group, RX631 Group Table 1.7 1. Overview List of Pins and Pin Functions (145-Pin TFLGA) (3/5) Pin No. Power Supply Clock System Control Timers Communications (MTU, TPU, TMR, PPG, RTC, POE) (ETHERC, SCIc, SCId, RSPI, RIIC, CAN, IEB, USB) I/O Port Bus EXDMAC SDRAMC H12 PB0 A8 MTIC5W/TIOCA3/PO24 RXD4/RXD6/SMISO4/ SMISO6/SSCL4/SSCL6/ RSPCKA/T_ERXD1/ RMII_RXD1 H13 PA7 A7 TIOCB2/PO23 MISOA/ET_WOL P34 MTIOC0A/TMCI3/PO12/ POE2# SCK6/SCK0/ USB0_DPRPD IRQ4 J2 P33 MTIOC0D/TIOCD0/ TMRI3/PO11/POE3# RXD6/RXD0/SMISO6/ SMISO0/SSCL6/SSCL0/ CRX0 IRQ3-DS J3 P32 MTIOC0C/TIOCC0/ TMO3/PO10/RTCOUT/ RTCIC2 TXD6/TXD0/SMOSI6/ SMOSI0/SSDA6/SSDA0/ CTX0/USB0_VBUSEN IRQ2-DS P30 MTIOC4B/TMRI3/PO8/ RTCIC0/POE8# RXD1/SMISO1/SSCL1/ MISOB/USB0_DRPD IRQ0-DS 145-pin TFLGA J1 J4 TRST# TDI J10 PB3 A11 MTIOC0A/MTIOC4A/ TIOCD3/TCLKD/TMO0/ PO27/POE3# SCK4/SCK6/ET_RX_ER/ RMII_RX_ER J11 PB4 A12 TIOCA4/PO28 CTS9#/RTS9#/SS9#/ ET_TX_EN/RMII_TXD_EN J12 PB2 A10 TIOCC3/TCLKC/PO26 CTS4#/RTS4#/CTS6#/ RTS6#/SS4#/SS6#/ ET_RX_CLK/REF50CK J13 PB1 A9 MTIOC0C/MTIOC4C/ TIOCB3/TMCI0/PO25 TXD4/TXD6/SMOSI4/ SMOSI6/SSDA4/SSDA6/ ET_ERXD0/RMII_RXD0 Interrupt IRQ12 IRQ4-DS K1 TCK/FINEC P27 CS7# MTIOC2B/TMCI3/PO7 SCK1/RSPCKB K2 TDO P26 CS6# MTIOC2A/TMO1/PO6 TXD1/CTS3#/RTS3#/ SMOSI1/SS3#/SSDA1/ MOSIB K3 TMS P31 MTIOC4D/TMCI2/PO9/ RTCIC1 CTS1#/RTS1#/SS1#/ SSLB0/USB0_DPUPE IRQ1-DS P15 MTIOC0B/MTCLKB/ TIOCB2/TCLKB/TMCI2/ PO13 RXD1/SCK3/SMISO1/ SSCL1/CRX1-DS IRQ5 MTIOC4B/TMCI1 CTS2#/RTS2#/SS2#/ CTX1/ET_LINKSTA K4 K5 TRDATA2 P54 ALE/EDACK0 K6 P53*1 BCLK K7 P51 WR1#/BC1#/ WAIT# P80 EDREQ0 MTIOC3B/PO26 SCK10/ET_TX_EN/ RMII_TXD_EN K10 P76 CS6# PO22 RXD11/SMISO11/SSCL11/ ET_RX_CLK/REF50CK K11 PB7 A15 MTIOC3B/TIOCB5/ PO31 TXD9/SMOSI9/SSDA9/ ET_CRS/RMII_CRS_DV K12 PB6 A14 MTIOC3D/TIOCA5/ PO30 RXD9/SMISO9/SSCL9/ ET_ETXD1/RMII_TXD1 K13 PB5 A13 MTIOC2A/MTIOC1B/ TIOCB4/TMRI1/PO29/ POE1# SCK9/ET_ETXD0/ RMII_TXD0 L1 P25 CS5#/EDACK1 MTIOC4C/MTCLKB/ TIOCA4/PO5 RXD3/SMISO3/SSCL3/ USB0_DPRPD L2 P23 EDACK0 MTIOC3D/MTCLKD/ TIOCD3/PO3 TXD3/CTS0#/RTS0#/ SMOSI3/SS0#/SSDA3/ USB0_DPUPE K8 VCC K9 TRDATA0 R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 S12AD AD DA SCK2/SSLB2 ADTRG0# Page 36 of 172 RX63N Group, RX631 Group Table 1.7 1. Overview List of Pins and Pin Functions (145-Pin TFLGA) (4/5) Pin No. 145-pin TFLGA Power Supply Clock System Control I/O Port Bus EXDMAC SDRAMC Timers Communications (MTU, TPU, TMR, PPG, RTC, POE) (ETHERC, SCIc, SCId, RSPI, RIIC, CAN, IEB, USB) Interrupt S12AD AD DA IRQ6 ADTRG0# IRQ3 ADTRG# SCK1/TXD3/SMOSI3/ SSDA3/MISOA/SDA2-DS/ IETXD IRQ7 ADTRG# RXD2/SMISO2/SSCL2/ SCL0[FM+] IRQ2 L3 P16 L4 P24 L5 P13 L6 P56 EDACK1 L7 P52 RD# P83 EDACK1 MTIOC4C CTS10#/RTS10#/SS10#/ ET_CRS/RMII_CRS_DV L9 PC5 A21/CS2#/ WAIT# MTIOC3B/MTCLKD/ TIOCD6/TCLKF/TMRI2/ PO29 SCK8/RSPCKA/ ET_ETXD2 L10 PC4 A20/CS3# MTIOC3D/MTCLKC/ TIOCC6/TCLKE/TMCI1/ PO25/POE0# SCK5/CTS8#/RTS8#/ SS8#/SSLA0/ET_TX_CLK L11 PC2 A18 MTIOC4B/TCLKA/PO21 RXD5/SMISO5/SSCL5/ SSLA3/IERXD/ET_RX_DV P73 CS3# PO16 ET_WOL M1 P22 EDREQ0 MTIOC3B/MTCLKC/ TIOCC3/TMO0/PO2 SCK0/USB0_DRPD M2 P17 MTIOC3A/MTIOC3B/ TIOCB0/TCLKD/TMO1/ PO15/POE8# M3 P86 TIOCA0 M4 P12 TMCI1 L8 TRCLK L12 L13 CS4#/EDREQ1 MTIOC3C/MTIOC3D/ TIOCB1/TCLKC/TMO2/ PO14/RTCOUT TXD1/RXD3/SMOSI1/ SMISO3/SSDA1/SSCL3/ MOSIA/SCL2-DS/IERXD/ USB0_VBUS/ USB0_VBUSEN/ USB0_OVRCURB MTIOC4A/MTCLKA/ TIOCB4/TMRI1/PO4 SCK3/USB0_VBUSEN MTIOC0B/TIOCA5/ TMO3/PO13 TXD2/SMOSI2/SSDA2/ SDA0[FM+] MTIOC3C/TIOCA1 RXD2/SMISO2/SSCL2/ SSLB3 VSS M5 VCC_USB M6 VSS_USB M7 P50 WR0#/WR# M8 PC6 A22/CS1# MTIOC3C/MTCLKA/ TIOCA6/TMCI2/PO30 RXD8/SMISO8/SSCL8/ MOSIA/ET_ETXD3 P81 EDACK0 MTIOC3D/PO27 RXD10/SMISO10/SSCL10/ ET_ETXD0/RMII_TXD0 M10 P77 CS7# PO23 TXD11/SMOSI11/SSDA11/ ET_RX_ER/RMII_RX_ER M11 PC0 A16 MTIOC3C/TCLKC/PO17 CTS5#/RTS5#/SS5#/ SSLA1/SCL3/ET_ERXD3 IRQ14 M12 PC1 A17 MTIOC3A/TCLKD/PO18 SCK5/SSLA2/SDA3/ ET_ERXD2 IRQ12 M9 M13 TRDATA1 TXD2/SMOSI2/SSDA2/ SSLB1 IRQ13 VCC N1 P21 MTIOC1B/TIOCA3/ TMCI0/PO1 RXD0/SMISO0/SSCL0/ SCL1/USB0_EXICEN IRQ9 N2 P20 MTIOC1A/TIOCB3/ TMRI0/PO0 TXD0/SMOSI0/SSDA0/ SDA1/USB0_ID IRQ8 N3 P87 TIOCA2 N4 P14 MTIOC3A/MTCLKA/ TIOCB5/TCLKA/TMRI2/ PO15 CTS1#/RTS1#/SS1#/ CTX1/USB0_DPUPE/ USB0_OVRCURA IRQ4 N5 USB0_DM N6 USB0_DP R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 37 of 172 RX63N Group, RX631 Group Table 1.7 1. Overview List of Pins and Pin Functions (145-Pin TFLGA) (5/5) Pin No. Timers Communications (MTU, TPU, TMR, PPG, RTC, POE) (ETHERC, SCIc, SCId, RSPI, RIIC, CAN, IEB, USB) Interrupt Power Supply Clock System Control I/O Port N7 TRDATA3 P55 WAIT#/ EDREQ0 MTIOC4D/TMO3 CRX1/ET_EXOUT IRQ10 N8 VSS PC7 A23/CS0# MTIOC3A/MTCLKB/ TIOCB6/TMO2/PO31 TXD8/SMOSI8/SSDA8/ MISOA/ET_COL IRQ14 P82 EDREQ1 MTIOC4A/PO28 TXD10/SMOSI10/SSDA10/ ET_ETXD1/RMII_TXD1 N11 PC3 A19 MTIOC4D/TCLKB/PO24 TXD5/SMOSI5/SSDA5/ IETXD/ET_TX_ER N12 P75 CS5# PO20 SCK11/ET_ERXD0/ RMII_RXD0 N13 P74 CS4# PO19 CTS11#/RTS11#/SS11#/ ET_ERXD1/RMII_RXD1 145-pin TFLGA N9 N10 TRSYNC# Bus EXDMAC SDRAMC S12AD AD DA Note 1. The BCLK function is multiplexed with the I/O port function for pin P53, so the port function is not available if the external bus is enabled. Note 2. Enabled only for the ROM capacity: 2 Mbytes/1.5 Mbytes R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 38 of 172 RX63N Group, RX631 Group Table 1.8 1. Overview List of Pins and Pin Functions (144-Pin LQFP) (1/5) Pin No. 144-pin LQFP 1 Power Supply Clock System Control (MTU, TPU, TMR, PPG, RTC, POE) (ETHERC, SCIc, SCId, RSPI, RIIC, CAN, IEB, USB) Interrupt S12AD AD DA P05 IRQ13 DA1 P03 IRQ11 DA0 I/O Port VREFH 4 5 Communications AVSS0 2 3 Bus EXDMAC SDRAMC Timers VREFL 6 P02 TMCI1 SCK6 IRQ10 AN020 7 P01 TMCI0 RXD6/SMISO6/SSCL6 IRQ9 AN019 8 P00 TMRI0 TXD6/SMOSI6/SSDA6 IRQ8 AN018 9 PF5 10 EMLE 11 12 PJ5 VSS 13 14 PJ3 MTIOC3C CTS6#/RTS6#/CTS0#/ RTS0#/SS6#/SS0# VCL 15 VBATT 16 MD/FINED 17 XCIN 18 XCOUT 19 RES# 20 XTAL 21 VSS 22 EXTAL 23 VCC 24 25 IRQ4 P37 P36 P35 TRST# NMI P34 MTIOC0A/TMCI3/ PO12/POE2# SCK6/SCK0/ USB0_DPRPD IRQ4 26 P33 MTIOC0D/TIOCD0/ TMRI3/PO11/POE3# RXD6/RXD0/SMISO6/ SMISO0/SSCL6/ SSCL0/CRX0 IRQ3-DS 27 P32 MTIOC0C/TIOCC0/ TMO3/PO10/RTCOUT/ RTCIC2 TXD6/TXD0/SMOSI6/ SMOSI0/SSDA6/ SSDA0/CTX0/ USB0_VBUSEN IRQ2-DS 28 TMS P31 MTIOC4D/TMCI2/PO9/ RTCIC1 CTS1#/RTS1#/SS1#/ SSLB0/USB0_DPUPE IRQ1-DS 29 TDI P30 MTIOC4B/TMRI3/PO8/ RTCIC0/POE8# RXD1/SMISO1/SSCL1/ MISOB/USB0_DRPD IRQ0-DS 30 TCK/FINEC P27 CS7# MTIOC2B/TMCI3/PO7 SCK1/RSPCKB 31 TDO P26 CS6# MTIOC2A/TMO1/PO6 TXD1/CTS3#/RTS3#/ SMOSI1/SS3#/SSDA1/ MOSIB 32 P25 CS5#/EDACK1 MTIOC4C/MTCLKB/ TIOCA4/PO5 RXD3/SMISO3/SSCL3/ USB0_DPRPD 33 P24 CS4#/EDREQ1 MTIOC4A/MTCLKA/ TIOCB4/TMRI1/PO4 SCK3/USB0_VBUSEN 34 P23 EDACK0 MTIOC3D/MTCLKD/ TIOCD3/PO3 TXD3/CTS0#/RTS0#/ SMOSI3/SS0#/SSDA3/ USB0_DPUPE 35 P22 EDREQ0 MTIOC3B/MTCLKC/ TIOCC3/TMO0/PO2 SCK0/USB0_DRPD 36 P21 MTIOC1B/TIOCA3/ TMCI0/PO1 RXD0/SMISO0/SSCL0/ SCL1/USB0_EXICEN R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 ADTRG0# IRQ9 Page 39 of 172 RX63N Group, RX631 Group Table 1.8 1. Overview List of Pins and Pin Functions (144-Pin LQFP) (2/5) Pin No. 144-pin LQFP Power Supply Clock System Control I/O Port Bus EXDMAC SDRAMC Timers Communications (MTU, TPU, TMR, PPG, RTC, POE) (ETHERC, SCIc, SCId, RSPI, RIIC, CAN, IEB, USB) Interrupt S12AD AD DA 37 P20 MTIOC1A/TIOCB3/ TMRI0/PO0 TXD0/SMOSI0/SSDA0/ SDA1/USB0_ID IRQ8 38 P17 MTIOC3A/MTIOC3B/ TIOCB0/TCLKD/TMO1/ PO15/POE8# SCK1/TXD3/SMOSI3/ SSDA3/MISOA/SDA2DS/IETXD IRQ7 ADTRG# TXD1/RXD3/SMOSI1/ SMISO3/SSDA1/ SSCL3/MOSIA/SCL2DS/IERXD/ USB0_VBUS/ USB0_VBUSEN/ USB0_OVRCURB IRQ6 ADTRG0# 39 P87 TIOCA2 40 P16 MTIOC3C/MTIOC3D/ TIOCB1/TCLKC/TMO2/ PO14/RTCOUT 41 P86 TIOCA0 42 P15 MTIOC0B/MTCLKB/ TIOCB2/TCLKB/ TMCI2/PO13 RXD1/SCK3/SMISO1/ SSCL1/CRX1-DS IRQ5 43 P14 MTIOC3A/MTCLKA/ TIOCB5/TCLKA/ TMRI2/PO15 CTS1#/RTS1#/SS1#/ CTX1/USB0_DPUPE/ USB0_OVRCURA IRQ4 44 P13 MTIOC0B/TIOCA5/ TMO3/PO13 TXD2/SMOSI2/SSDA2/ SDA0[FM+] IRQ3 45 P12 TMCI1 RXD2/SMISO2/SSCL2/ SCL0[FM+] IRQ2 46 VCC_USB 47 USB0_DM 48 USB0_DP 49 ADTRG# VSS_USB 50 P56 EDACK1 MTIOC3C/TIOCA1 51 TRDATA3 P55 WAIT#/ EDREQ0 MTIOC4D/TMO3 CRX1/ET_EXOUT 52 TRDATA2 P54 ALE/EDACK0 MTIOC4B/TMCI1 CTS2#/RTS2#/SS2#/ CTX1/ET_LINKSTA 53 P53*1 BCLK 54 P52 RD# RXD2/SMISO2/SSCL2/ SSLB3 55 P51 WR1#/BC1#/ WAIT# SCK2/SSLB2 56 P50 WR0#/WR# TXD2/SMOSI2/SSDA2/ SSLB1 P83 EDACK1 MTIOC4C CTS10#/RTS10#/ SS10#/ET_CRS/ RMII_CRS_DV 60 PC7 A23/CS0# MTIOC3A/MTCLKB/ TIOCB6/TMO2/PO31 TXD8/SMOSI8/SSDA8/ MISOA/ET_COL IRQ14 61 PC6 A22/CS1# MTIOC3C/MTCLKA/ TIOCA6/TMCI2/PO30 RXD8/SMISO8/SSCL8/ MOSIA/ET_ETXD3 IRQ13 62 PC5 A21/CS2#/ WAIT# MTIOC3B/MTCLKD/ TIOCD6/TCLKF/ TMRI2/PO29 SCK8/RSPCKA/ ET_ETXD2 57 VSS 58 TRCLK 59 VCC 63 TRSYNC# P82 EDREQ1 MTIOC4A/PO28 TXD10/SMOSI10/ SSDA10/ET_ETXD1/ RMII_TXD1 64 TRDATA1 P81 EDACK0 MTIOC3D/PO27 RXD10/SMISO10/ SSCL10/ET_ETXD0/ RMII_TXD0 R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 IRQ10 Page 40 of 172 RX63N Group, RX631 Group Table 1.8 1. Overview List of Pins and Pin Functions (144-Pin LQFP) (3/5) Pin No. Timers Communications (MTU, TPU, TMR, PPG, RTC, POE) (ETHERC, SCIc, SCId, RSPI, RIIC, CAN, IEB, USB) Power Supply Clock System Control I/O Port Bus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pin LQFP 65 74 VCC 75 76 Interrupt S12AD AD DA VSS 77 P73 CS3# PO16 ET_WOL 78 PB7 A15 MTIOC3B/TIOCB5/ PO31 TXD9/SMOSI9/SSDA9/ ET_CRS/ RMII_CRS_DV 79 PB6 A14 MTIOC3D/TIOCA5/ PO30 RXD9/SMISO9/SSCL9/ ET_ETXD1/RMII_TXD1 80 PB5 A13 MTIOC2A/MTIOC1B/ TIOCB4/TMRI1/PO29/ POE1# SCK9/ET_ETXD0/ RMII_TXD0 81 PB4 A12 TIOCA4/PO28 CTS9#/RTS9#/SS9#/ ET_TX_EN/ RMII_TXD_EN 82 PB3 A11 MTIOC0A/MTIOC4A/ TIOCD3/TCLKD/TMO0/ PO27/POE3# SCK4/SCK6/ ET_RX_ER/ RMII_RX_ER 83 PB2 A10 TIOCC3/TCLKC/PO26 CTS4#/RTS4#/CTS6#/ RTS6#/SS4#/SS6#/ ET_RX_CLK/REF50CK 84 PB1 A9 MTIOC0C/MTIOC4C/ TIOCB3/TMCI0/PO25 TXD4/TXD6/SMOSI4/ SMOSI6/SSDA4/ SSDA6/ET_ERXD0/ RMII_RXD0 85 P72 CS2# ET_MDC 86 P71 CS1# ET_MDIO 87 PB0 A8 MTIC5W/TIOCA3/ PO24 RXD4/RXD6/SMISO4/ SMISO6/SSCL4/ SSCL6/RSPCKA/ T_ERXD1/RMII_RXD1 88 PA7 A7 TIOCB2/PO23 MISOA/ET_WOL 89 PA6 A6 MTIC5V/MTCLKB/ TIOCA2/TMCI3/PO22/ POE2# CTS5#/RTS5#/SS5# MOSIA/ET_EXOUT 90 PA5 A5 TIOCB1/PO21 RSPCKA/ET_LINKSTA R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 IRQ4-DS IRQ12 Page 41 of 172 RX63N Group, RX631 Group Table 1.8 1. Overview List of Pins and Pin Functions (144-Pin LQFP) (4/5) Pin No. Power Supply Clock System Control Timers Communications (MTU, TPU, TMR, PPG, RTC, POE) (ETHERC, SCIc, SCId, RSPI, RIIC, CAN, IEB, USB) I/O Port Bus EXDMAC SDRAMC PA4 A4 MTIC5U/MTCLKA/ TIOCA1/TMRI0/PO20 TXD5/SMOSI5/SSDA5/ SSLA0/ET_MDC IRQ5-DS 94 PA3 A3 MTIOC0D/MTCLKD/ TIOCD0/TCLKB/PO19 RXD5/SMISO5/SSCL5/ ET_MDIO IRQ6-DS 95 PA2 A2 PO18 RXD5/SMISO5/SSCL5/ SSLA3 96 PA1 A1 MTIOC0B/MTCLKC/ TIOCB0/PO17 SCK5/SSLA2/ET_WOL 97 PA0 A0/BC0# MTIOC4A/TIOCA0/ PO16 SSLA1/ET_TX_EN/ RMII_TXD_EN 98 P67 CS7#/DQM1 CRX2*2 99 P66 CS6#/DQM0 CTX2*2 144-pin LQFP 91 VCC 92 93 Interrupt S12AD AD DA VSS IRQ11 IRQ15 100 P65 CS5#/CKE 101 PE7 D15[A15/D15] TIOCB11 MISOB IRQ7 AN5 102 PE6 D14[A14/D14] TIOCA11 MOSIB IRQ6 AN4 IRQ5 AN3 103 VCC 104 SDCLK 105 VSS P70 106 PE5 D13[A13/D13] MTIOC4C/MTIOC2B/ TIOCB10 RSPCKB/ET_RX_CLK/ REF50CK 107 PE4 D12[A12/D12] MTIOC4D/MTIOC1A/ TIOCA10/PO28 SSLB0/ET_ERXD2 AN2 108 PE3 D11[A11/D11] MTIOC4B/TIOCB9/ PO26/POE8# CTS12#/RTS12#/ SS12#/MISOB/ ET_ERXD3 AN1 109 PE2 D10[A10/D10] MTIOC4A/TIOCA9/ PO23 RXD12/SMISO12/ SSCL12/RXDX12/ SSLB3/MOSIB 110 PE1 D9[A9/D9] MTIOC4C/TIOCD9/ PO18 TXD12/SMOSI12/ SSDA12/TXDX12/ SIOX12/SSLB2/ RSPCKB ANEX1 TIOCC9 SCK12/SSLB1 ANEX0 SSLC3 IRQ7 AN7 AN6 111 PE0 D8[A8/D8] 112 P64 CS4#/WE# 113 P63 CS3#/CAS# 114 P62 CS2#/RAS# P61 CS1#/SDCS# P60 CS0# PD7 D7[A7/D7] MTIC5U/POE0# 115 116 119 AN0 VSS 117 118 IRQ7-DS VCC 120 PD6 D6[A6/D6] MTIC5V/POE1# SSLC2 IRQ6 121 PD5 D5[A5/D5] MTIC5W/POE2# SSLC1 IRQ5 AN013 122 PD4 D4[A4/D4] POE3# SSLC0 IRQ4 AN012 123 PD3 D3[A3/D3] TIOCB8/TCLKH/ POE8# RSPCKC IRQ3 AN011 124 PD2 D2[A2/D2] MTIOC4D/TIOCA8 MISOC/CRX0 IRQ2 AN010 125 PD1 D1[A1/D1] MTIOC4B/TIOCB7/ TCLKG MOSIC/CTX0 IRQ1 AN009 TIOCA7 126 PD0 D0[A0/D0] 127 P93 A19 R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 IRQ0 CTS7#/RTS7#/SS7# AN008 AN017 Page 42 of 172 RX63N Group, RX631 Group Table 1.8 1. Overview List of Pins and Pin Functions (144-Pin LQFP) (5/5) Pin No. Power Supply Clock System Control Timers Communications (MTU, TPU, TMR, PPG, RTC, POE) (ETHERC, SCIc, SCId, RSPI, RIIC, CAN, IEB, USB) I/O Port Bus EXDMAC SDRAMC 128 P92 A18 RXD7/SMISO7/SSCL7 AN016 129 P91 A17 SCK7 AN015 P90 A16 TXD7/SMOSI7/SSDA7 AN014 144-pin LQFP 130 VSS 131 132 Interrupt S12AD AD DA VCC 133 P47 IRQ15-DS AN007 134 P46 IRQ14-DS AN006 135 P45 IRQ13-DS AN005 136 P44 IRQ12-DS AN004 137 P43 IRQ11-DS AN003 138 P42 IRQ10-DS AN002 139 P41 IRQ9-DS AN001 P40 IRQ8-DS AN000 P07 IRQ15 ADTRG0# 140 VREFL0 141 142 VREFH0 143 AVCC0 144 Note 1. The BCLK function is multiplexed with the I/O port function for pin P53, so the port function is not available if the external bus is enabled. Note 2. Enabled only for the ROM capacity: 2 Mbytes/1.5 Mbytes R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 43 of 172 RX63N Group, RX631 Group Table 1.9 1. Overview List of Pins and Pin Functions (100-Pin LQFP) (1/4) Pin No. 100-pin LQFP Power Supply Clock System Control 1 VREFH 2 EMLE 3 VREFL 4 I/O Port Bus EXDMAC PJ3 Timers Communications (MTU, TPU, TMR, PPG, RTC, POE) (ETHERC, SCIc, SCId, RSPI, RIIC, CAN, IEB, USB) Interrupt MTIOC3C CTS6#/RTS6#/CTS0#/ RTS0#/SS6#/SS0# P34 MTIOC0A/TMCI3/ PO12/POE2# SCK6/SCK0/ USB0_DPRPD IRQ4 17 P33 MTIOC0D/TIOCD0/ TMRI3/PO11/POE3# RXD6/RXD0/SMISO6/ SMISO0/SSCL6/ SSCL0/CRX0*1 IRQ3-DS 18 P32 MTIOC0C/TIOCC0/ TMO3/PO10/RTCOUT/ RTCIC2 TXD6/TXD0/SMOSI6/ SMOSI0/SSDA6/ SSDA0/CTX0*1/ USB0_VBUSEN IRQ2-DS 5 VCL 6 VBATT 7 MD/FINED 8 XCIN 9 XCOUT 10 RES# 11 XTAL 12 VSS 13 EXTAL 14 VCC 15 16 P37 P36 P35 TRST# S12AD AD DA NMI 19 TMS P31 MTIOC4D/TMCI2/PO9/ RTCIC1 CTS1#/RTS1#/SS1#/ SSLB0/USB0_DPUPE IRQ1-DS 20 TDI P30 MTIOC4B/TMRI3/PO8/ RTCIC0/POE8# RXD1/SMISO1/SSCL1/ MISOB/USB0_DRPD IRQ0-DS 21 TCK/FINEC P27 CS7# MTIOC2B/TMCI3/PO7 SCK1/RSPCKB 22 TDO P26 CS6# MTIOC2A/TMO1/PO6 TXD1/CTS3#/RTS3#/ SMOSI1/SS3#/SSDA1/ MOSIB 23 P25 CS5#/EDACK1 MTIOC4C/MTCLKB/ TIOCA4/PO5 RXD3/SMISO3/SSCL3/ USB0_DPRPD 24 P24 CS4#/EDREQ1 MTIOC4A/MTCLKA/ TIOCB4/TMRI1/PO4 SCK3/USB0_VBUSEN 25 P23 EDACK0 MTIOC3D/MTCLKD/ TIOCD3/PO3 TXD3/CTS0#/RTS0#/ SMOSI3/SS0#/SSDA3/ USB0_DPUPE 26 P22 EDREQ0 MTIOC3B/MTCLKC/ TIOCC3/TMO0/PO2 SCK0/USB0_DRPD 27 P21 MTIOC1B/TIOCA3/ TMCI0/PO1 RXD0/SMISO0/SSCL0/ USB0_EXICEN IRQ9 28 P20 MTIOC1A/TIOCB3/ TMRI0/PO0 TXD0/SMOSI0/SSDA0/ USB0_ID IRQ8 29 P17 MTIOC3A/MTIOC3B/ TIOCB0/TCLKD/TMO1/ PO15/POE8# SCK1/TXD3/SMOSI3/ SSDA3/MISOA/SDA2DS/IETXD IRQ7 ADTRG# 30 P16 MTIOC3C/MTIOC3D/ TIOCB1/TCLKC/TMO2/ PO14/RTCOUT TXD1/RXD3/SMOSI1/ SMISO3/SSDA1/ SSCL3/MOSIA/SCL2DS/IERXD/ USB0_VBUS/ USB0_VBUSEN/ USB0_OVRCURB IRQ6 ADTRG0# R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 ADTRG0# Page 44 of 172 RX63N Group, RX631 Group Table 1.9 1. Overview List of Pins and Pin Functions (100-Pin LQFP) (2/4) Pin No. 100-pin LQFP Power Supply Clock System Control I/O Port Bus EXDMAC Timers Communications (MTU, TPU, TMR, PPG, RTC, POE) (ETHERC, SCIc, SCId, RSPI, RIIC, CAN, IEB, USB) Interrupt 31 P15 MTIOC0B/MTCLKB/ TIOCB2/TCLKB/TMCI2/ PO13 RXD1/SCK3/SMISO1/ SSCL1/CRX1-DS IRQ5 32 P14 MTIOC3A/MTCLKA/ TIOCB5/TCLKA/TMRI2/ PO15 CTS1#/RTS1#/SS1#/ CTX1/USB0_DPUPE/ USB0_OVRCURA IRQ4 33 P13 MTIOC0B/TIOCA5/ TMO3/PO13 TXD2/SMOSI2/SSDA2/ SDA0[FM+] IRQ3 34 P12 TMCI1 RXD2/SMISO2/SSCL2/ SCL0[FM+] IRQ2 35 ADTRG# VCC_USB 36 USB0_DM 37 USB0_DP 38 S12AD AD DA VSS_USB 39 P55 WAIT#/ EDREQ0 MTIOC4D/TMO3 CRX1/ET_EXOUT 40 P54 ALE/EDACK0 MTIOC4B/TMCI1 CTS2#/RTS2#/SS2#/ CTX1/ET_LINKSTA IRQ10 41 P53*2 BCLK 42 P52 RD# RXD2/SMISO2/SSCL2/ SSLB3 43 P51 WR1#/BC1#/ WAIT# SCK2/SSLB2 44 P50 WR0#/WR# TXD2/SMOSI2/SSDA2/ SSLB1 45 PC7 A23/CS0# MTIOC3A/MTCLKB/ TMO2/PO31 TXD8/SMOSI8/SSDA8/ MISOA/ET_COL IRQ14 46 PC6 A22/CS1# MTIOC3C/MTCLKA/ TMCI2/PO30 RXD8/SMISO8/SSCL8/ MOSIA/ET_ETXD3 IRQ13 47 PC5 A21/CS2#/ WAIT# MTIOC3B/MTCLKD/ TMRI2/PO29 SCK8/RSPCKA/ ET_ETXD2 48 PC4 A20/CS3# MTIOC3D/MTCLKC/ TMCI1/PO25/POE0# SCK5/CTS8#/RTS8#/ SS8#/SSLA0/ ET_TX_CLK 49 PC3 A19 MTIOC4D/TCLKB/ PO24 TXD5/SMOSI5/SSDA5/ IETXD/ET_TX_ER 50 PC2 A18 MTIOC4B/TCLKA/PO21 RXD5/SMISO5/SSCL5/ SSLA3/IERXD/ ET_RX_DV 51 PC1 A17 MTIOC3A/TCLKD/ PO18 SCK5/SSLA2/ ET_ERXD2 IRQ12 52 PC0 A16 MTIOC3C/TCLKC/ PO17 CTS5#/RTS5#/SS5#/ SSLA1/ET_ERXD3 IRQ14 53 PB7 A15 MTIOC3B/TIOCB5/ PO31 TXD9/SMOSI9/SSDA9/ ET_CRS/ RMII_CRS_DV 54 PB6 A14 MTIOC3D/TIOCA5/ PO30 RXD9/SMISO9/SSCL9/ ET_ETXD1/RMII_TXD1 55 PB5 A13 MTIOC2A/MTIOC1B/ TIOCB4/TMRI1/PO29/ POE1# SCK9/ET_ETXD0/ RMII_TXD0 56 PB4 A12 TIOCA4/PO28 CTS9#/RTS9#/SS9#/ ET_TX_EN/ RMII_TXD_EN 57 PB3 A11 MTIOC0A/MTIOC4A/ TIOCD3/TCLKD/TMO0/ PO27/POE3# SCK6/ET_RX_ER/ RMII_RX_ER 58 PB2 A10 TIOCC3/TCLKC/PO26 CTS6#/RTS6#/SS6#/ ET_RX_CLK/REF50CK R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 45 of 172 RX63N Group, RX631 Group Table 1.9 1. Overview List of Pins and Pin Functions (100-Pin LQFP) (3/4) Pin No. 100-pin LQFP Power Supply Clock System Control 59 60 Communications I/O Port Bus EXDMAC (MTU, TPU, TMR, PPG, RTC, POE) (ETHERC, SCIc, SCId, RSPI, RIIC, CAN, IEB, USB) PB1 A9 MTIOC0C/MTIOC4C/ TIOCB3/TMCI0/PO25 TXD6/SMOSI6/SSDA6/ ET_ERXD0/ RMII_RXD0 IRQ4-DS PB0 A8 MTIC5W/TIOCA3/PO24 RXD6/SMISO6/SSCL6/ RSPCKA/ET_ERXD1/ RMII_RXD1 IRQ12 Interrupt S12AD AD DA VCC 61 62 Timers VSS 63 PA7 A7 TIOCB2/PO23 MISOA/ET_WOL 64 PA6 A6 MTIC5V/MTCLKB/ TIOCA2/TMCI3/PO22/ POE2# CTS5#/RTS5#/SS5#/ MOSIA/ET_EXOUT 65 PA5 A5 TIOCB1/PO21 RSPCKA/ET_LINKSTA 66 PA4 A4 MTIC5U/MTCLKA/ TIOCA1/TMRI0/PO20 TXD5/SMOSI5/SSDA5/ SSLA0/ET_MDC IRQ5-DS 67 PA3 A3 MTIOC0D/MTCLKD/ TIOCD0/TCLKB/PO19 RXD5/SMISO5/SSCL5/ ET_MDIO IRQ6-DS 68 PA2 A2 PO18 RXD5/SMISO5/SSCL5/ SSLA3 69 PA1 A1 MTIOC0B/MTCLKC/ TIOCB0/PO17 SCK5/SSLA2/ET_WOL 70 PA0 A0/BC0# MTIOC4A/TIOCA0/ PO16 SSLA1/ET_TX_EN/ RMII_TXD_EN IRQ11 71 PE7 D15[A15/D15] MISOB IRQ7 AN5 72 PE6 D14[A14/D14] MOSIB IRQ6 AN4 73 PE5 D13[A13/D13] MTIOC4C/MTIOC2B RSPCKB/ET_RX_CLK/ REF50CK IRQ5 AN3 74 PE4 D12[A12/D12] MTIOC4D/MTIOC1A/ PO28 SSLB0/ET_ERXD2 AN2 75 PE3 D11[A11/D11] MTIOC4B/PO26/POE8# CTS12#/RTS12#/ SS12#/MISOB/ ET_ERXD3 AN1 76 PE2 D10[A10/D10] MTIOC4A/PO23 RXD12/SMISO12/ SSCL12/RXDX12/ SSLB3/MOSIB 77 PE1 D9[A9/D9] MTIOC4C/PO18 TXD12/SMOSI12/ SSDA12/TXDX12/ SIOX12/SSLB2/ RSPCKB 78 PE0 D8[A8/D8] 79 PD7 D7[A7/D7] MTIC5U/POE0# IRQ7 AN7 80 PD6 D6[A6/D6] MTIC5V/POE1# IRQ6 AN6 IRQ7-DS AN0 ANEX1 SCK12/SSLB1 ANEX0 81 PD5 D5[A5/D5] MTIC5W/POE2# IRQ5 AN013 82 PD4 D4[A4/D4] POE3# IRQ4 AN012 83 PD3 D3[A3/D3] POE8# IRQ3 AN011 84 PD2 D2[A2/D2] MTIOC4D CRX0*1 IRQ2 AN010 85 PD1 D1[A1/D1] MTIOC4B CTX0*1 IRQ1 AN009 86 PD0 D0[A0/D0] IRQ0 AN008 87 P47 IRQ15-DS AN007 88 P46 IRQ14-DS AN006 89 P45 IRQ13-DS AN005 90 P44 IRQ12-DS AN004 91 P43 IRQ11-DS AN003 92 P42 IRQ10-DS AN002 93 P41 IRQ9-DS AN001 R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 46 of 172 RX63N Group, RX631 Group Table 1.9 1. Overview List of Pins and Pin Functions (100-Pin LQFP) (4/4) Pin No. 100-pin LQFP 94 Power Supply Clock System Control 96 VREFH0 97 AVCC0 98 100 Communications (MTU, TPU, TMR, PPG, RTC, POE) (ETHERC, SCIc, SCId, RSPI, RIIC, CAN, IEB, USB) Interrupt S12AD AD DA P40 IRQ8-DS AN000 P07 IRQ15 ADTRG0# P05 IRQ13 DA1 I/O Port Bus EXDMAC VREFL0 95 99 Timers AVSS0 Note 1. Enabled only for the ROM capacity of 768 Kbytes or more Note 2. The BCLK function is multiplexed with the I/O port function for pin P53, so the port function is not available if the external bus is enabled. R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 47 of 172 RX63N Group, RX631 Group 2. 2. CPU CPU The RX CPU has sixteen general-purpose registers, nine control registers, and one accumulator used for DSP instructions. General-purpose register b31 b0 R0 (SP)*1 R1 R2 R3 R4 R5 R6 R7 R8 R9 R10 R11 R12 R13 R14 R15 Control register b31 b0 ISP (Interrupt stack pointer) USP (User stack pointer) INTB (Interrupt table register) PC (Program counter) PSW (Processor status word) BPC (Backup PC) BPSW (Backup PSW) FINTV (Fast interrupt vector register) FPSW (Floating-point status word) DSP instruction register b63 b0 ACC (Accumulator) Note 1. The stack pointer (SP) can be the interrupt stack pointer (ISP) or user stack pointer (USP), according to the value of the U bit in the PSW. Figure 2.1 Register Set of the CPU R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 48 of 172 RX63N Group, RX631 Group 2.1 2. CPU General-Purpose Registers (R0 to R15) This CPU has sixteen general-purpose registers (R0 to R15). R1 to R15 can be used as data registers or address registers. R0, a general-purpose register, also functions as the stack pointer (SP). The stack pointer is switched to operate as the interrupt stack pointer (ISP) or user stack pointer (USP) by the value of the stack pointer select bit (U) in the processor status word (PSW). 2.2 (1) Control Registers Interrupt Stack Pointer (ISP)/User Stack Pointer (USP) The stack pointer (SP) can be either of two types, the interrupt stack pointer (ISP) or the user stack pointer (USP). Whether the stack pointer operates as the ISP or USP depends on the value of the stack pointer select bit (U) in the processor status word (PSW). Set the ISP or USP to a multiple of four, as this reduces the numbers of cycles required to execute interrupt sequences and instructions entailing stack manipulation. (2) Interrupt Table Register (INTB) The interrupt table register (INTB) specifies the address where the relocatable vector table starts. (3) Program Counter (PC) The program counter (PC) indicates the address of the instruction being executed. (4) Processor Status Word (PSW) The processor status word (PSW) indicates the results of instruction execution or the state of the CPU. (5) Backup PC (BPC) The backup PC (BPC) is provided to speed up response to interrupts. After a fast interrupt has been generated, the contents of the program counter (PC) are saved in the BPC register. (6) Backup PSW (BPSW) The backup PSW (BPSW) is provided to speed up response to interrupts. After a fast interrupt has been generated, the contents of the processor status word (PSW) are saved in the BPSW. The allocation of bits in the BPSW corresponds to that in the PSW. (7) Fast Interrupt Vector Register (FINTV) The fast interrupt vector register (FINTV) is provided to speed up response to interrupts. The FINTV register specifies a branch destination address when a fast interrupt has been generated. (8) Floating-Point Status Word (FPSW) The floating-point status word (FPSW) indicates the results of floating-point operations. When an exception handling enable bit (Ej) enables the exception handling (Ej = 1), the exception cause can be identified by checking the corresponding Cj flag in the exception handling routine. If the exception handling is masked (Ej = 0), the occurrence of exception can be checked by reading the Fj flag at the end of a series of processing. Once the Fj flag has been set to 1, this value is retained until it is cleared to 0 by software (j = X, U, Z, O, or V). R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 49 of 172 RX63N Group, RX631 Group 2.2.1 (1) 2. CPU Register Associated with DSP Instructions Accumulator (ACC) The accumulator (ACC) is a 64-bit register used for DSP instructions. The accumulator is also used for the multiply and multiply-and-accumulate instructions; EMUL, EMULU, FMUL, MUL, and RMPA, in which case the prior value in the accumulator is modified by execution of the instruction. Use the MVTACHI and MVTACLO instructions for writing to the accumulator. The MVTACHI and MVTACLO instructions write data to the higher-order 32 bits (bits 63 to 32) and the lower-order 32 bits (bits 31 to 0), respectively. Use the MVFACHI and MVFACMI instructions for reading data from the accumulator. The MVFACHI and MVFACMI instructions read data from the higher-order 32 bits (bits 63 to 32) and the middle 32 bits (bits 47 to 16), respectively. R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 50 of 172 RX63N Group, RX631 Group 3. Address Space 3.1 Address Space 3. Address Space This LSI has a 4-Gbyte address space, consisting of the range of addresses from 0000 0000h to FFFF FFFFh. That is, linear access to an address space of up to 4 Gbytes is possible, and this contains both program and data areas. Figure 3.1 shows the memory maps in the respective operating modes. Accessible areas will differ according to the operating mode and states of control bits. R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 51 of 172 RX63N Group, RX631 Group 3. Address Space On-chip ROM enabled extended mode Single-chip mode*1 0000 0000h 0002 0000h On-chip RAM*2 0000 0000h On-chip RAM*2 0000 0000h On-chip RAM*2 Reserved area*3 0002 0000h Reserved area*3 0002 0000h Reserved area*3 0008 0000h 0008 0000h 0008 0000h Peripheral I/O registers 0010 0000h Reserved 007F 8000h 0010 0000h On-chip ROM (E2 data flash) Reserved area*3 007F 8000h 007F A000h 007F A000h 007F C000h 007F C500h 0010 0000h 0010 8000h area*3 FCU-RAM*4 Reserved FCU-RAM*4 area*3 Reserved area*3 007F C000h 007F C500h Peripheral I/O registers Peripheral I/O registers Reserved area*3 007F FC00h 0080 0000h Peripheral I/O registers Peripheral I/O registers On-chip ROM (E2 data flash) 0010 8000h 00E0 0000h On-chip ROM disabled extended mode Reserved area*3 Reserved area*3 Peripheral I/O registers 007F FC00h Peripheral I/O registers Reserved area*3 0080 0000h Reserved area*3 00E0 0000h On-chip ROM (program ROM) (write only) On-chip ROM (program ROM) (write only) 0100 0000h 0100 0000h 0100 0000h 0800 0000h Reserved area*3 External address space External address space (CS area) (CS area) 0800 0000h External address space External address space (SDRAM area) (SDRAM area) 1000 0000h 1000 0000h Reserved area*3 Reserved area*3 FEFF E000h FEFF E000h On-chip ROM (FCU firmware) (read only)*4 FF00 0000h FF00 0000h Reserved area*3 FF7F C000h FF7F C000h On-chip ROM (user boot) (read only) FF80 0000h On-chip ROM (FCU firmware) (read only)*4 On-chip ROM (user boot) (read only) FF80 0000h Reserved area*3 FFE0 0000h FF00 0000h Reserved area*3 External address space Reserved area*3 FFE0 0000h On-chip ROM (program ROM) (read only)*2 On-chip ROM (program ROM) (read only)*3 FFFF FFFFh FFFF FFFFh FFFF FFFFh Note 1. The address space in boot mode and user boot mode/USB boot mode is the same as the address space in single-chip mode. Note 2. The capacity of ROM/RAM differs depending on the products. ROM (byt) RAM (byt) Capacity Address (for reading only) Address (for programming only) Capacity Address 2M FFE0 0000h to FFFF FFFFh 00E0 0000h to 00FF FFFFh 128 K 0000 0000h to 0001 FFFFh 1.5 M FFE8 0000h to FFFF FFFFh 00E8 0000h to 00FF FFFFh 1M FFF0 0000h to FFFF FFFFh 00F0 0000h to 00FF FFFFh 768 K FFF4 0000h to FFFF FFFFh 00F4 0000h to 00FF FFFFh Note: * See Table 1.3, List of Products, for the product type name. Note 3. Reserved areas should not be accessed. Note 4. For details on the FCU, see section 46, ROM (Flash Memory for Code Storage) and section 47, E2 DataFlash Memory (Flash Memory for Data Storage) in the User's manual: Hardware. Figure 3.1 Memory Map in Each Operating Mode R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 52 of 172 RX63N Group, RX631 Group 3.2 3. Address Space External Address Space The external address space is classified into CS areas (CS0 to CS7) and SDRAM area (SDCS). Figure 3.2 shows the address ranges corresponding to the individual CS areas (CS0 to CS7) and SDRAM area (SDCS) in on-chip ROM disabled extended mode. 0000 0000h On-chip RAM 0002 0000h Reserved area*1 0100 0000h CS7 (16 Mbytes) 0008 0000h Peripheral I/O registers 01FF FFFFh 0200 0000h 0010 0000h CS6 (16 Mbytes) Reserved area*1 02FF FFFFh 0300 0000h CS5 (16 Mbytes) 03FF FFFFh 0400 0000h 0100 0000h CS4 (16 Mbytes) External address space (CS area) 04FF FFFFh 0500 0000h CS3 (16 Mbytes) 0800 0000h External address space (SDRAM area) 05FF FFFFh 0600 0000h 1000 0000h CS2 (16 Mbytes) 06FF FFFFh 0700 0000h CS1 (16 Mbytes) 07FF FFFFh 0800 0000h Reserved area*1 SDCS (128 Mbytes) 0FFF FFFFh FF00 0000h FF00 0000h External address space (CS area)*2 FFFF FFFFh CS0 (16 Mbytes) FFFF FFFFh Note 1. Reserved areas should not be accessed. Note 2. The CS0 area is disabled in on-chip ROM enabled extended mode. In this mode, the address space for addresses above 1000 0000h is as shown in figure on this section, Memory Map in Each Operating Mode. Figure 3.2 Correspondence between External Address Spaces and CS Areas (In On-Chip ROM Disabled Extended Mode) R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 53 of 172 RX63N Group, RX631 Group 4. I/O Registers 4. I/O Registers 4.1 I/O Register Addresses (Address Order) Table 4.1 List of I/O Registers (Address Order) (1/51) Number of Access States Address Module Symbol Register Name Register Symbol Number of Bits Access Size Related ICLKPCLK ICLK 200 ns Figure 5.15 tc (PCLK) x 2 tc (PCLK) x 2 200 ns Figure 5.16 tc (PCLK) x 2 > 200 ns Figure 5.16 NMI tNMIW Figure 5.15 NMI Interrupt Input Timing IRQ tIRQW Figure 5.16 IRQ Interrupt Input Timing R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 119 of 172 RX63N Group, RX631 Group 5. Electrical Characteristics 5.4.4 Bus Timing Table 5.15 Bus Timing (packages with 177 to 144 pins) Conditions: VCC = AVCC0 = VCC_USB = 2.7 to 3.6 V, VREFH/VREFH0 = 2.7 V to AVCC0, VSS = AVSS0 = VREFL/VREFL0 = VSS_USB = 0 V, ICLK = 8 to 100 MHz, BCLK = 8 to 50 MHz, Ta = Topr Output load conditions: VOH = VCC x 0.5, VOL = VCC x 0.5, IOH = -1.0 mA, IOL = 1.0 mA, C = 30 pF High drive output is selected by the drive capacity control register. Item Symbol Min. Max. Unit Test Conditions Address delay time tAD -- 15 ns Byte control delay time tBCD -- 15 ns Figure 5.17 to Figure 5.22 CS# delay time tCSD -- 15 ns ALE delay time tALED -- 20 ns RD# delay time tRSD -- 15 ns Read data setup time tRDS 15 -- ns Read data hold time tRDH 0 -- ns WR# delay time tWRD -- 15 ns Write data delay time tWDD -- 15 ns Write data hold time tWDH 0 -- ns WAIT# setup time tWTS 15 -- ns WAIT# hold time tWTH 0 -- ns Address delay time 2 (SDRAM) tAD2 1 15 ns CS# delay time 2 (SDRAM) tCSD2 1 15 ns DQM delay time (SDRAM) tDQMD 1 15 ns CKE delay time (SDRAM) tCKED 1 15 ns Read data setup time 2 (SDRAM) tRDS2 12 -- ns Read data hold time 2 (SDRAM) tRDH2 0 -- ns Write data delay time 2 (SDRAM) tWDD2 -- 15 ns Write data hold time 2 (SDRAM) tWDH2 1 -- ns WE# delay time (SDRAM) tWED 1 15 ns RAS# delay time (SDRAM) tRASD 1 15 ns CAS# delay time (SDRAM) tCASD 1 15 ns R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Figure 5.23 Figure 5.24 to Figure 5.30 Page 120 of 172 RX63N Group, RX631 Group Table 5.16 5. Electrical Characteristics Bus Timing (packages with 100 pins or less) Conditions: VCC = AVCC0 = VCC_USB = 2.7 to 3.6 V, VREFH/VREFH0 = 2.7 V to AVCC0, VSS = AVSS0 = VREFL/VREFL0 = VSS_USB = 0 V, ICLK = 8 to 100 MHz, BCLK = 8 to 50 MHz, Ta = Topr Output load conditions: VOH = VCC x 0.5, VOL = VCC x 0.5, IOH = -1.0 mA, IOL = 1.0 mA, C = 30 pF High drive output is selected by the drive capacity control register. Item Symbol Min. Max. Unit Test Conditions Address delay time tAD -- 20 ns Byte control delay time tBCD -- 20 ns Figure 5.17 to Figure 5.22 CS# delay time tCSD -- 20 ns ALE delay time tALED -- 20 ns RD# delay time tRSD -- 20 ns Read data setup time tRDS 15 -- ns Read data hold time tRDH 0 -- ns WR# delay time tWRD -- 20 ns Write data delay time tWDD -- 20 ns Write data hold time tWDH 0 -- ns WAIT# setup time tWTS 15 -- ns WAIT# hold time tWTH 0 -- ns R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Figure 5.23 Page 121 of 172 RX63N Group, RX631 Group 5. Electrical Characteristics Data cycle Address cycle Ta1 Ta1 Tan TW1 TW2 TW3 TW4 Tend TW5 Tn1 Tn2 BCLK tAD Address bus tAD tRDS tAD tRDH Address bus/ data bus tALED tALED Address latch (ALE) tRSD tRSD Data read (RD#) Figure 5.17 tCSD tCSD Chip select (CS1#) Address/Data Multiplexed Bus Read Access Timing Data cycle Address cycle Ta1 Ta1 Tan TW1 TW2 TW3 TW4 TW5 Tend Tn1 Tn2 BCLK tAD Address bus tAD tRDS tAD tRDH Address bus/ data bus tALED tALED Address latch (ALE) tRSD tRSD Data read (RD#) tCSD Chip select (CS1#) Figure 5.18 tCSD Address/Data Multiplexed Bus Write Access Timing R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 122 of 172 RX63N Group, RX631 Group 5. Electrical Characteristics CSRWAIT:2 RDON:1 CSROFF:2 CSON:0 TW1 TW2 Tend Tn1 Tn2 BCLK Byte write strobe mode tAD tAD tAD tAD tBCD tBCD tCSD tCSD A23 to A0 1-write strobe mode A23 to A1 BC3# to BC0# Common to both byte write strobe mode and 1-write strobe mode CS7# to CS0# tRSD tRSD RD# (Read) tRDS tRDH D31 to D0 (Read) Figure 5.19 External Bus Timing/Normal Read Cycle (Bus Clock Synchronized) R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 123 of 172 RX63N Group, RX631 Group 5. Electrical Characteristics CSWWAIT:2 WRON:1 WDON:1*1 CSWOFF:2 WDOFF:1*1 CSON:0 TW1 TW2 Tend Tn1 Tn2 BCLK Byte write strobe mode tAD tAD tAD tAD tBCD tBCD tCSD tCSD A23 to A0 1-write strobe mode A23 to A1 BC3# to BC0# Common to both byte write strobe mode and 1-write strobe mode CS7# to CS0# tWRD tWRD WR3# to WR0#, WR# (Write) tWDD tWDH D31 to D0 (Write) Note1. Be sure to specify WDON and WDOFF as at least one cycle of BCLK. Figure 5.20 External Bus Timing/Normal Write Cycle (Bus Clock Synchronized) R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 124 of 172 RX63N Group, RX631 Group 5. Electrical Characteristics CSRWAIT:2 CSON:0 CSPRWAIT:2 CSPRWAIT:2 RDON:1 RDON:1 TW1 TW2 Tend CSROFF:2 CSROFF:2 RDON:1 Tpw1 Tpw2 Tend Tpw1 Tpw2 Tend Tn1 Tn2 Tend Tn1 Tn2 BCLK Byte write strobe mode tAD tAD tAD tAD tAD tAD tAD tAD tAD tAD A23 to A0 1-write strobe mode A23 to A1 tBCD tBCD tCSD tCSD BC3# to BC0# Common to both byte write strobe mode and 1-write strobe mode CS7# to CS0# tRSD tRSD tRSD tRSD tRSD tRSD tRSD tRSD RD# (Read) tRDS tRDH tRDS tRDH tRDS tRDH tRDS tRDH D31 to D0 (Read) Figure 5.21 External Bus Timing/Page Read Cycle (Bus Clock Synchronized) CSPWWAIT:2 CSWWAIT:2 WRON:1 WDON:1*1 CSON:0 TW1 WDOFF:1*1 TW2 Tend Tdw1 WRON:1 WDON:1*1 Tpw1 CSPWWAIT:2 WDOFF:1*1 Tpw2 Tend Tdw1 WRON:1 WDON:1*1 Tpw1 CSWOFF:2 WDOFF:1*1 Tpw2 Tend Tn1 Tn2 BCLK Byte write strobe mode tAD tAD tAD tAD tAD tAD tAD tAD A23 to A0 1-write strobe mode A23 to A1 tBCD tBCD tCSD tCSD BC3# to BC0# Common to both byte write strobe mode and 1-write strobe mode CS7# to CS0# tWRD tWRD tWRD tWRD tWRD tWRD WR3# to WR0#, WR# (Write) tWDD tWDH tWDD tWDH tWDD tWDH D31 to D0 (Write) Note 1. Be sure to specify WDON and WDOFF as at least one cycle of BCLK. Figure 5.22 External Bus Timing/Page Write Cycle (Bus Clock Synchronized) R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 125 of 172 RX63N Group, RX631 Group 5. Electrical Characteristics CSRWAIT:3 CSWWAIT:3 TW1 TW2 TW3 (Tend) Tend Tn1 Tn2 BCLK A23 to A0 CS7# to CS0# RD# (Read) WR# (Write) External wait tWTS tWTH tWTS tWTH WAIT# Figure 5.23 External Bus Timing/External Wait Control R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 126 of 172 RX63N Group, RX631 Group 5. Electrical Characteristics SDRAM command ACT RD PRA SDCLK tAD2 tAD2 Row Address A18 to A0 tAD2 tAD2 tAD2 tAD2 tAD2 Column Address tAD2 AP*1 PRA Command tCSD2 tCSD2 tRASD tRASD tCSD2 tCSD2 tCSD2 tCSD2 tRASD tRASD tWED tWED SDCS# RAS# tCASD tCASD CAS# WE# (High) CKE tDQMD DQMn tRDS2 tRDH2 D31 to D0 Note 1: Address pins for output of the precharge-setting command (Precharge-sel) for SDRAM. Figure 5.24 SDRAM Space Single Read Bus Timing R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 127 of 172 RX63N Group, RX631 Group SDRAM command 5. Electrical Characteristics ACT WR PRA SDCLK tAD2 tAD2 Row Address A18 to A0 tAD2 tAD2 tAD2 tAD2 tAD2 Column Address tAD2 AP*1 PRA command tCSD2 tCSD2 tRASD tRASD tCSD2 tCSD2 tCSD2 tCSD2 tRASD tRASD tWED tWED SDCS# RAS# tCASD tCASD tWED tWED CAS# WE# (High) CKE tDQMD DQMn tWDD2 tWDH2 D31 to D0 Note 1: Address pins for output of the precharge-setting command (Precharge-sel) for SDRAM. Figure 5.25 SDRAM Space Single Write Bus Timing R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 128 of 172 RX63N Group, RX631 Group 5. Electrical Characteristics ACT RD RD RD RD PRA SDCLK tAD2 tAD2 tAD2 tAD2 A18 to A0 C0 Row Address (Column Address) C1 C2 tAD2 tAD2 tAD2 tAD2 C3 tAD2 tAD2 tAD2 tAD2 AP*1 tAD2 PRA command tCSD2 tCSD2 tCSD2 tCSD2 tCSD2 tRASD tRASD tRASD tCASD tCASD SDCS# tRASD tRASD RAS# tCASD CAS# tWED tWED WE# (High) CKE tDQMD tDQMD DQMn tRDS2 tRDH2 tRDS2 tRDH2 D31 to D0 Note 1: Address pins for output of the precharge-setting command (Precharge-sel) for SDRAM. Figure 5.26 SDRAM Space Multiple Read Bus Timing R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 129 of 172 RX63N Group, RX631 Group 5. Electrical Characteristics ACT WR WR WR WR PRA SDCLK tAD2 A18 to A0 tAD2 tAD2 tAD2 C0 Row Address (Column Address) tAD2 C1 tAD2 C2 tAD2 tAD2 tAD2 C3 tAD2 tAD2 AP*1 tAD2 tAD2 PRA command tCSD2 tCSD2 tCSD2 tCSD2 tCSD2 SDCS# tRASD tRASD tRASD tRASD tRASD RAS# tCASD tCASD tCASD CAS# tWED tWED WE# (High) CKE tDQMD tDQMD DQMn tWDD2 tWDH2 tWDD2 tWDH2 D31 to D0 Note 1: Address pins for output of the precharge-setting command (Precharge-sel) for SDRAM. Figure 5.27 SDRAM Space Multiple Write Bus Timing R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 130 of 172 RX63N Group, RX631 Group SDRAM command 5. Electrical Characteristics ACT RD RD RD RD t AD2 t AD2 t AD2 PRA ACT RD RD RD RD PRA SDCLK t AD2 A18 to A0 t AD2 Row Address t AD2 C0 (Column Address 0) C1 C2 t AD2 t AD2 C3 t AD2 t AD2 t AD2 C4 R1 t AD2 AP*1 t AD2 t AD2 t AD2 t AD2 C5 t AD2 C6 t AD2 C7 t AD2 t AD2 PRA command t CSD2 t CSD2 t CSD2 t CSD2 t CSD2 t CSD2 t AD2 t AD2 PRA command t CSD2 t CSD2 SDCS# t RASD t RASD t RASD t RASD t RASD t RASD t RASD t RASD RAS# t CASD t CASD t CASD t CASD CAS# t WED t WED t WED t WED WE# (High) CKE tDQMD DQMn t RDS2 t RDH2 t RDS2 t RDH2 t RDS2 t RDH2 t RDS2 t RDH2 D31 to D0 Note 1: Address pins for output of the precharge-setting command (Precharge-sel) for SDRAM. Figure 5.28 SDRAM Space Multiple Read Line Stride Bus Timing R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 131 of 172 RX63N Group, RX631 Group 5. Electrical Characteristics MRS SDRAM command SDCLK t AD2 t AD2 t AD2 t AD2 t CSD2 t CSD2 t RASD t RASD t CASD t CASD t WED t WED A18 to A0 AP*1 SDCS# RAS# CAS# WE# (High) CKE DQMn (Hi-Z) D31 to D0 Note 1: Address pins for output of the precharge-setting command (Precharge-sel) for SDRAM. Figure 5.29 SDRAM Space Mode Register Set Bus Timing R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 132 of 172 RX63N Group, RX631 Group SDRAM command 5. Electrical Characteristics Ts (RFA) (RFS) (RFX) (RFA) SDCLK t AD2 t AD2 t AD2 t AD2 A18 to A0 AP*1 t CSD2 t CSD2 t CSD2 t CSD2 t CSD2 t CSD2 t CSD2 t RASD t RASD t RASD t RASD t RASD t RASD t RASD t CASD t CASD t CASD t CASD t CASD t CASD t CASD SDCS# RAS# CAS# (High) WE# t CKED t CKED CKE t DQMD t DQMD DQMn (Hi-Z) D31 to D0 Note 1: Address pins for output of the precharge-setting command (Precharge-sel) for SDRAM. Figure 5.30 SDRAM Space Self-Refresh Bus Timing R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 133 of 172 RX63N Group, RX631 Group 5. Electrical Characteristics 5.4.5 EXDMAC Timing Table 5.17 EXDMAC Timing Conditions: VCC = AVCC0 = VCC_USB = 2.7 to 3.6 V, VREFH/VREFH0 = 2.7 V to AVCC0, VSS = AVSS0 = VREFL/VREFL0 = VSS_USB = 0 V ICLK = 8 to 100 MHz, PCLK = 8 to 50 MHz, BCLK = 8 to 100 MHz, SDCLK = 8 to 50 MHz, Ta = Topr High drive output is selected by the drive capacity control register Item EXDMAC Symbol Min. Max. Unit Test Conditions EDREQ setup time tEDRQS 20 -- ns Figure 5.31 EDREQ hold time tEDRQH 5 -- ns EDACK delay time tEDACD -- 15 ns Figure 5.32 and Figure 5.33 BCLK tEDRQS tEDRQH EDREQ0 EDREQ1 Figure 5.31 EDREQ0 and EDREQ1 Input Timing BCLK tEDACD tEDACD EDACK0 EDACK1 Figure 5.32 EDACK0 and EDACK1 Single-Address Transfer Timing (for a CS Area) BCLK tEDACD tEDACD EDACK0 EDACK1 Figure 5.33 EDACK0 and EDACK1 Single-Address Transfer Timing (for SDRAM) R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 134 of 172 RX63N Group, RX631 Group 5. Electrical Characteristics 5.4.6 Timing of On-Chip Peripheral Modules Table 5.18 Timing of On-Chip Peripheral Modules (1) Conditions: VCC = AVCC0 = VCC_USB = 2.7 to 3.6 V, VREFH/VREFH0 = 2.7 V to AVCC0, VSS = AVSS0 = VREFL/VREFL0 = VSS_USB = 0 V PCLK = 8 to 50 MHz Ta = Topr High drive output is selected by the drive capacity control register. Symbol Min. Max. Unit*1 Test Conditions tPRW 1.5 -- tPcyc Figure 5.34 tTICW 1.5 -- tPcyc Figure 5.35 2.5 -- 1.5 -- tPcyc Figure 5.36 Both-edge setting 2.5 -- Phase counting mode 2.5 -- tPOEW 1.5 -- tPcyc Figure 5.37 tTMCWH, tTMCWL 1.5 -- tPcyc Figure 5.38 2.5 -- 4 -- tPcyc Figure 5.39 6 -- Item I/O ports Input data pulse width MTU Input capture input pulse width Single-edge setting Both-edge setting Timer clock pulse width POE POE# input pulse width 8-bit timer Timer clock pulse width Single-edge setting Single-edge setting tTCKWH, tTCKWL Both-edge setting SCI Input clock cycle Asynchronous tScyc Clock synchronous Input clock pulse width tSCKW 0.4 0.6 tScyc Input clock rise time tSCKr -- 20 ns Input clock fall time tSCKf -- 20 ns tScyc 16 -- tPcyc 4 -- Output clock cycle Asynchronous Clock synchronous A/D converter Output clock pulse width tSCKW 0.4 0.6 tScyc Output clock rise time tSCKr -- 20 ns Output clock fall time tSCKf -- 20 ns Transmit data delay time Clock synchronous tTXD -- 40 ns Receive data setup time Clock synchronous tRXS 40 -- ns Receive data hold time Clock synchronous tRXH 40 -- ns tTRGW 1.5 -- tPcyc 1.5 -- 10-bit A/D converter trigger input pulse width 12-bit A/D converter trigger input pulse width Figure 5.40 Figure 5.41 Note 1. tPcyc: PCLK cycle R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 135 of 172 RX63N Group, RX631 Group Table 5.19 5. Electrical Characteristics Timing of On-Chip Peripheral Modules (2) Conditions: VCC = AVCC0 = VCC_USB = 2.7 to 3.6 V*1, VREFH/VREFH0 = 3.0 V to AVCC0*1, VSS = AVSS0 = VREFL/VREFL0 = VSS_USB = 0 V, PCLK = 8 to 50 MHz, Ta = Topr High drive output is selected by the drive capacity control register. Item RSPI RSPCK clock cycle Master Symbol Min. Max. Unit*2 Test Conditions tSPcyc 2 4096 tPcyc 8 4096 Figure 5.42 C = 30PF Slave RSPCK clock high pulse width Master tSPCKWH (tSPcyc - tSPCKR - tSPCKF) / 2 - 3 -- (tSPcyc - tSPCKR - tSPCKF) / 2 -- (tSPcyc - tSPCKR - tSPCKF) / 2 - 3 -- (tSPcyc - tSPCKR - tSPCKF) / 2 -- -- 5 -- 10 -- 1 s 15 -- ns 20 -- 30 -- Slave RSPCK clock low pulse width Master tSPCKWL Slave RSPCK clock rise/ fall time Output [packages with 177 to 144 pins] tSPCKr, tSPCKf Output [packages with 100 pins or less] Input Data input setup time Master [packages with 177 to 144 pins] VCC 3.0 V tSU VCC < 3.0 V Master [packages with 100 pins or less] Master SSL setup time Master -- 0 -- 20 + 2 x tPcyc -- tLEAD 1 8 tSPcyc 4 -- tPcyc Slave Master Slave R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 ns 20 - tPcyc Slave SSL hold time ns tH Slave Data input hold time ns tLAG Figure 5.43 to Figure 5.46 C = 30PF ns 1 8 tSPcyc 4 -- tPcyc Page 136 of 172 RX63N Group, RX631 Group Table 5.20 5. Electrical Characteristics Timing of On-Chip Peripheral Modules (3) Conditions: VCC = AVCC0 = VCC_USB = 2.7 to 3.6 V*1, VREFH/VREFH0 = 3.0 V to AVCC0*1, VSS = AVSS0 = VREFL/VREFL0 = VSS_USB = 0 V, PCLK = 8 to 50 MHz, Ta = Topr High drive output is selected by the drive capacity control register. Symbol Min. Max. Unit*2 Test Conditions tOD -- 18 ns Figure 5.43 to Figure 5.46 C = 30PF Packages with 100 pins or less -- 30 Packages with 177 to 144 pins -- 3 x tPcyc + 40 Packages with 100 pins or less -- 3 x tPcyc + 50 0 -- 0 -- tSPcyc + 2 x tPcyc 8 x tSPcyc + 2 x tPcyc 4 x tPcyc -- -- 5 -- 10 -- 1 s -- 5 ns -- 10 -- 1 s Item RSPI Data output delay time Master Slave Data output hold time Successive transmission delay time MOSI and MISO rise/fall time Packages with 177 to 144 pins Master tOH Slave Master tTD Slave Output Packages with 177 to 144 pins tDr, tDf Packages with 100 pins or less Input SSL rise/fall time Output Packages with 177 to 144 pins tSSLr, tSSLf Packages with 100 pins or less Input ns ns ns Slave access time tSA -- 4 tPcyc Slave output release time tREL -- 3 tPcyc Figure 5.45 and Figure 5.46 C = 30PF Note 1. When operation at 3.0 V or a lower voltage is needed, please contact a Renesas sales office. Note 2. tPcyc: PCLK cycle R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 137 of 172 RX63N Group, RX631 Group Table 5.21 5. Electrical Characteristics Timing of On-Chip Peripheral Modules (4) Conditions: VCC = AVCC0 = VCC_USB = 2.7 to 3.6 V, VREFH/VREFH0 = 2.7 V to AVCC0 VSS = AVSS0 = VREFL/VREFL0 = VSS_USB = 0 V PCLK = 8 to 50 MHz Ta = Topr High drive output is selected by the drive capacity control register. Item Simple SPI SCK clock cycle output (master) Symbol Min. Max. Unit*1 Test Conditions tSPcyc 4 65536 tPcyc Figure 5.42 8 65536 SCK clock cycle input (slave) SCK clock high pulse width tSPCKWH 0.4 0.6 tSPcyc SCK clock low pulse width tSPCKWL 0.4 0.6 tSPcyc SCK clock rise/fall time tSPCKr, tSPCKf -- 20 ns Data input setup time tSU 40 -- ns Data input hold time tH 40 -- ns SS input setup time tLEAD 1 -- tSPcyc SS input hold time tLAG 1 -- tSPcyc Data output delay time tOD -- 40 ns Data output hold time tOH -10 -- ns Data rise/fall time tDr, tDf -- 20 ns SS input rise/fall time tSSLr, tSSLf -- 20 ns Slave access time tSA -- 5 tPcyc Slave output release time tREL -- 5 tPcyc Figure 5.43 to Figure 5.46 Figure 5.46 Note 1. tPcyc: PCLK cycle R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 138 of 172 RX63N Group, RX631 Group Table 5.22 5. Electrical Characteristics Timing of On-Chip Peripheral Modules (5) Conditions: VCC = AVCC0 = VCC_USB = 2.7 to 3.6 V, VREFH/VREFH0 = 2.7 V to AVCC0 VSS = AVSS0 = VREFL/VREFL0 = VSS_USB = 0 V PCLK = 8 to 50 MHz Ta = Topr High drive output is selected by the drive capacity control register. Item RIIC (Standard-mode, SMBus) ICFER.FMPE = 0 RIIC (Fast-mode) SCL input cycle time Symbol Min.*1,*2 Max.* Unit Test Conditions tSCL 6(12) x tIICcyc + 1300 -- ns Figure 5.47 SCL input high pulse width tSCLH 3(6) x tIICcyc + 300 -- ns SCL input low pulse width tSCLL 3(6) x tIICcyc + 300 -- ns SCL, SDA input rise time tSr -- 1000 ns SCL, SDA input fall time tSf -- 300 ns SCL, SDA input spike pulse removal time tSP 0 1(4) x tIICcyc ns SDA input bus free time tBUF 3(6) x tIICcyc + 300 -- ns Start condition input hold time tSTAH tIICcyc + 300 -- ns Restart condition input setup time tSTAS 1000 -- ns Stop condition input setup time tSTOS 1000 -- ns Data input setup time tSDAS tIICcyc + 50 -- ns Data input hold time tSDAH 0 -- ns SCL, SDA capacitive load Cb -- 400 pF SCL input cycle time tSCL 6(12) x tIICcyc + 600 -- ns SCL input high pulse width tSCLH 3(6) x tIICcyc + 300 -- ns SCL input low pulse width tSCLL 3(6) x tIICcyc + 300 -- ns SCL, SDA input rise time tSr 20 + 0.1Cb 300 ns SCL, SDA input fall time tSf 20 + 0.1Cb 300 ns SCL, SDA input spike pulse removal time tSP 0 1(4) x tIICcyc ns SDA input bus free time tBUF 3(6) x tIICcyc + 300 -- ns Start condition input hold time tSTAH tIICcyc + 300 -- ns Restart condition input setup time tSTAS 300 -- ns Stop condition input setup time tSTOS 300 -- ns Data input setup time tSDAS tIICcyc + 50 -- ns Data input hold time tSDAH 0 -- ns SCL, SDA capacitive load Cb -- 400 pF Note: * tIICcyc: RIIC internal reference clock (IIC) Cycle Note 1. The value within parentheses is applicable when the value of the ICMR3.NF[1:0] bits is 11b while the digital filter is enabled by the setting ICFER.NFE = 1. Note 2. Cb is the total capacitance of the bus lines. R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 139 of 172 RX63N Group, RX631 Group Table 5.23 5. Electrical Characteristics Timing of On-Chip Peripheral Modules (6) Conditions: VCC = AVCC0 = VCC_USB = 2.7 to 3.6 V, VREFH/VREFH0 = 2.7 V to AVCC0 VSS = AVSS0 = VREFL/VREFL0 = VSS_USB = 0 V PCLK = 8 to 50 MHz Ta = Topr High drive output is selected by the drive capacity control register. Symbol Min.*, *2 Max.* Unit tSCL 6(12) x tIICcyc + 240 -- ns SCL input high pulse width tSCLH 3(6) x tIICcyc + 120 -- ns SCL input low pulse width tSCLL 3(6) x tIICcyc + 120 -- ns SCL, SDA input rise time tSr -- 120 ns SCL, SDA input fall time tSf -- 120 ns SCL, SDA input spike pulse removal time tSP 0 1(4) x tIICcyc ns SDA input bus free time tBUF 3(6) x tIICcyc + 120 -- ns Start condition input hold time tSTAH tIICcyc + 120 -- ns Restart condition input setup time tSTAS 120 -- ns Stop condition input setup time tSTOS 120 -- ns Data input setup time tSDAS tIICcyc + 120 -- ns Data input hold time tSDAH 0 -- ns SCL, SDA capacitive load Cb -- 550 pF SDA input rise time tSr -- 1000 ns SDA input fall time tSf -- 300 ns Item RIIC (Fast-mode+) ICFER.FMPE = 1 Simple IIC (Standard-mode) Simple IIC (Fast-mode) SCL input cycle time SDA input spike pulse removal time tSP 0 4 x tIICcyc ns Data input setup time tSDAS 250 -- ns Data input hold time tSDAH 0 -- ns SCL, SDA capacitive load Cb -- 400 pF SCL, SDA input rise time tSr 20 + 0.1Cb 300 ns SCL, SDA input fall time tSf 20 + 0.1Cb 300 ns SCL, SDA input spike pulse removal time tSP 0 4 x tIICcyc ns Data input setup time tSDAS 100 -- ns Data input hold time tSDAH 0 -- ns SCL, SDA capacitive load Cb -- 400 pF Test Conditions Figure 5.47 Note: * tIICcyc: RIIC internal reference clock (IIC) Cycle, tPcyc: PCLK cycle Note 1. The value in parentheses is used when ICMR3.NF[1:0] are set to 11b while a digital filter is enabled with ICFER.NFE = 1. Note 2. Cb indicates the total capacity of the bus line. R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 140 of 172 RX63N Group, RX631 Group Table 5.24 5. Electrical Characteristics Timing of On-Chip Peripheral Modules (7) Conditions: VCC = AVCC0 = VCC_USB = 2.7 to 3.6 V, VREFH/VREFH0 = 2.7 V to AVCC VSS = AVSS0 = VREFL/VREFL0 = VSS_USB = 0 V ICLK = 12.5 to 100 MHz, Ta = Topr High drive output is selected by the drive capacity control register. Item ETHERC(RMII) Symbol Min. Max. Unit REF50CK cycle time Tck 20 -- ns REF50CK frequency Typ. 50 MHz -- -- 50 + 100ppm MHz REF50CK duty -- 35 65 % REF50CK rise/fall time Tckr/ckf 0.5 3.5 ns RMII_xxxx*1 output delay time Tco 2.5 15.0 ns RMII_xxxx*2 setup time Tsu 3 -- ns RMII_xxxx*2 ETHERC(MII) hold time Test Conditions Figure 5.48 to Figure 5.51 Thd 1 -- ns RMII_xxxx*1, *2 rise/fall time Tr/Tf 0.5 6 ns ET_WOL output delay time tWOLd 1 23.5 ns Figure 5.52 ET_TX_CLK cycle time tTcyc 40 -- ns -- ET_TX_EN output delay time tTENd 1 20 ns Figure 5.53 ET_ETXD0 to ET_ETXD3 output delay time tMTDd 1 20 ns ET_CRS setup time tCRSs 10 -- ns ET_CRS hold time tCRSh 10 -- ns ET_COL setup time tCOLs 10 -- ns ET_COL hold time tCOLh 10 -- ns Figure 5.54 ET_RX_CLK cycle time tTRcyc 40 -- ns -- ET_RX_DV setup time tRDVs 10 ns Figure 5.55 ET_RX_DV hold time tRDVh 10 -- ns ET_ERXD0 to ET_ERXD3 setup time tMRDs 10 -- ns ET_ERXD0 to ET_ERXD3 hold time tMRDh 10 -- ns ET_RX_ER setup time tRERs 10 -- ns ET_RX_ER hold time tRESh 10 -- ns ET_WOL output delay time tWOLd 1 23.5 ns Figure 5.56 Figure 5.57 Note 1. RMII_TXD_EN, RMII_TXD1, RMII_TXD0. Note 2. RMII_CRS_DV, RMII_RXD1, RMII_RXD0, RMII_RX_ER PCLK Port tPRW Figure 5.34 I/O Port Input Timing R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 141 of 172 RX63N Group, RX631 Group 5. Electrical Characteristics PCLK Output compare output Input capture input Figure 5.35 tTICW MTU Input/Output Timing PCLK MTCLKA to MTCLKH tTCKWL Figure 5.36 tTCKWH MTU Clock Input Timing PCLK POEn# input tPOEW Figure 5.37 POE# Input Timing PCLK TMCI0 to TMCI3 tTMCWL Figure 5.38 tTMCWH 8-Bit Timer Clock Input Timing R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 142 of 172 RX63N Group, RX631 Group 5. Electrical Characteristics tSCKW tSCKr tSCKf SCKn (n = 0 to 12) tScyc Figure 5.39 SCK Clock Input Timing SCKn tTXD TxDn tRXS tRXH RxDn n = 0 to 12 Figure 5.40 SCI Input/Output Timing: Clock Synchronous Mode PCLK ADTRG0#-A/B ADTRG1# tTRGW Figure 5.41 A/D Converter External Trigger Input Timing R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 143 of 172 RX63N Group, RX631 Group RSPI Simple SPI RSPCKm Master select output SCKn Master select output 5. Electrical Characteristics tSPCKr tSPCKWH VOH VOH VOL tSPCKf VOH VOH VOL tSPCKWL VOL tSPcyc tSPCKr tSPCKWH RSPCKm Slave select input SCKn Slave select input (m = A to C) (n = 0 to 12) VIH VIH VIL tSPCKf VIH VIH VIL tSPCKWL VIL tSPcyc VOH = 0.7 x VCC, VOL = 0.3 x VCC, VIH = 0.7 x VCC, VIL = 0.3 x VCC Figure 5.42 RSPI Clock Timing and Simple SPI Clock Timing R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 144 of 172 RX63N Group, RX631 Group RSPI 5. Electrical Characteristics Simple SPI tTD SSLm0 to SSLm3 output tLEAD RSPCKm CPOL = 0 output SCKn CKPOL = 0 output RSPCKm CPOL = 1 output SCKn CKPOL = 1 output tLAG tSSLr, tSSLf tSU MISOm input SMISOm input MOSIm output SMOSIm output (m = A to C) (n = 0 to 12) tH MSB IN DATA tDr, tDf tOH MSB OUT Figure 5.43 LSB IN MSB IN tOD DATA LSB OUT IDLE MSB OUT RSPI Timing (Master, CPHA = 0) and Simple SPI Timing (Master, CKPH = 1) RSPI Simple SPI tTD SSLm0 to SSLm3 output tLEAD RSPCKm CPOL = 0 output SCKn CKPOL = 1 output RSPCKm CPOL = 1 output SCKn CKPOL = 0 output tLAG tSSLr, tSSLf tSU MISOm input SMISOm input tH MSB IN tOH MOSIm output SMOSIm output (m = A to C) (n = 0 to 12) Figure 5.44 DATA LSB IN tOD MSB OUT MSB IN tDr, tDf DATA LSB OUT IDLE MSB OUT RSPI Timing (Master, CPHA = 1) and Simple SPI Timing (Master, CKPH = 0) R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 145 of 172 RX63N Group, RX631 Group RSPI Simple SPI SSLm0 input SSLn# input RSPCKm CPOL = 0 input SCKn CKPOL = 0 input RSPCKm CPOL = 1 input SCKn CKPOL = 1 input 5. Electrical Characteristics tTD tLEAD tLAG tSA MISOm output SMISOm output MOSIm input SMOSIm input (m = A to C) (n = 0 to 12) tOH MSB OUT tSU Figure 5.45 tOD tREL DATA LSB OUT tH MSB IN MSB OUT tDr, tDf MSB IN DATA LSB IN MSB IN RSPI Timing (Slave, CPHA = 0) and Simple SPI Timing (Slave, CKPH = 1) RSPI Simple SPI SSLm0 input SSLn# input RSPCKm CPOL = 0 input SCKn CKPOL = 1 input RSPCKm CPOL = 1 input SCKn CKPOL = 0 input tTD tLEAD tSA MISOm output SMISOm output tLAG tOH tOD LSB OUT (Last data) MSB OUT tSU MOSIm input SMOSIm input (m = A to C) (n = 0 to 12) Figure 5.46 tREL DATA tH MSB IN LSB OUT MSB OUT tDr, tDf DATA LSB IN MSB IN RSPI Timing (Slave, CPHA = 1) and Simple SPI Timing (Slave, CKPH = 0) R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 146 of 172 RX63N Group, RX631 Group 5. Electrical Characteristics VIH SDA0 to SDA3 VIL tBUF tSCLH tSTAS tSTAH tSTOS tSP SCL0 to SCL3 P *1 tSCLL tSr tSf tSDAS tSCL tSDAH Note 1. S, P, and Sr indicate the following conditions. S: Start condition P: Stop condition Sr: Restart condition Figure 5.47 P *1 Sr *1 S *1 Test conditions VIH = VCC x 0.7, VIL = VCC x 0.3 RIIC Bus Interface Input/Output Timing and Simple IIC Bus Interface Input/Output Timing Tck 90% REF50CK Tckr 50% Tckf 10% Tco Tf Tr Tsu Thd 90% RMII_xxxx *1 50% Signal Signal transitions Signal transitions Signal transitions Signal 10% Note1. RMII_TXD_EN, RMII_TXD1, RMII_TXD0, RMII_CRS_DV, RMII_RXD1, RMII_RXD0, RMII_RX_ER Figure 5.48 REF50CK and RMII Signal Timing Tck REF50CK Tco RMII_TXD_EN Tco RMII_TXD1 RMII_TXD0 Figure 5.49 Preamble SFD DATA CRC RMII Transmission Timing R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 147 of 172 RX63N Group, RX631 Group 5. Electrical Characteristics REF50CK Tsu Thd RMII_CRS_DV Thd Tsu RMII_RXD1 RMII_RXD0 Preamble DATA CRC SFD RMII_RX_ER Figure 5.50 L RMII Reception Timing (Normal Operation) REF50CK RMII_CRS_DV RMII_RXD1 RMII_RXD0 Preamble SFD DATA xxxx Thd Tsu RMII_RX_ER Figure 5.51 RMII Reception Timing (Error Occurrence) REF50CK tWOLd ET_WOL Figure 5.52 WOL Output Timing (RMII) R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 148 of 172 RX63N Group, RX631 Group 5. Electrical Characteristics ET_TX_CLK tTENd ET_TX_EN tMTDd ET_ETXD[3:0] Preamble SFD DATA CRC ET_TX_ER tCRSs tCRSh ET_CRS ET_COL Figure 5.53 MII Transmission Timing (Normal Operation) ET_TX_CLK ET_TX_EN ET_ETXD[3:0] Preamble JAM ET_TX_ER ET_CRS tCOLs tCOLh ET_COL Figure 5.54 MII Transmission Timing (Conflict Occurrence) ET_RX_CLK tRDVs tRDVn ET_RX_DV tMRDh tMRDs ET_ERXD[3:0] Preamble SFD DATA CRC ET_RX_ER R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 149 of 172 RX63N Group, RX631 Group Figure 5.55 5. Electrical Characteristics MII Reception Timing (Normal Operation) ET_RX_CLK ET_RX_DV ET_ERXD[3:0] Preamble SFD DATA tRERs XXXX tRERh ET_RX_ER Figure 5.56 MII Reception Timing (Error Occurrence) ET_RX_CLK tWOLd ET_WOL Figure 5.57 WOL Output Timing (MII) R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 150 of 172 RX63N Group, RX631 Group 5.5 5. Electrical Characteristics USB Characteristics Table 5.25 On-Chip USB Full-Speed Characteristics (DP and DM Pin Characteristics) Conditions: VCC = AVCC0 = VCC_USB = 3.0 to 3.6 V, VREFH/VREFH0 = 3.0 V to AVCC0 VSS = AVSS0 = VREFL/VREFL0 = VSS_USB = 0 V PCLK = 24 to 50 MHz Ta = Topr High drive output is selected by the drive capacity control register. Item Input characteristics Output characteristics Symbol Min. Max. Unit Input high level voltage VIH 2.0 -- V Input low level voltage VIL -- 0.8 V Differential input sensitivity VDI 0.2 -- V Differential common mode range VCM 0.8 2.5 V Output high level voltage VOH 2.8 3.6 V IOH = -200 A IOL = 2 mA | DP - DM | Output low level voltage VOL 0.0 0.3 V Cross-over voltage VCRS 1.3 2.0 V Rise time tLr 4 20 ns Fall time tLf 4 20 ns Rise/fall time ratio tLr / tLf 90 111.11 % tLr / tLf Output resistance ZDRV 28 44 Rs = 22 included DP, DM 90% VCRS Figure 5.58 90% 10% 10% tLr Figure 5.58 Test Conditions tLf DP and DM Output Timing (Full-Speed) dp 22 Observation point 50 pF dm 22 50 pF Figure 5.59 Test Circuit (Full-Speed) R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 151 of 172 RX63N Group, RX631 Group 5.6 5. Electrical Characteristics A/D Conversion Characteristics Table 5.26 10-Bit A/D Conversion Characteristics Conditions: VCC = AVCC0 = VCC_USB = 2.7 to 3.6 V, VREFH/VREFH0 = 2.7 V to AVCC0 VSS = AVSS0 = VREFL/VREFL0 = VSS_USB = 0 V PCLK = 8 to 50 MHz Ta = Topr Item Resolution Conversion time*1 (Operation at PCLK = 50 MHz) enough*2 Min. Typ. Max. Unit 10 10 10 Bit (2.5)*3 -- -- s Test Conditions With 0.1-F external capacitor When the capacitor is charged Without 0.1-F external capacitor Permissible signal source impedance (max.) = 1.0 k, VCC 3.0 V 1.5 (1.0)*3 -- -- Sampling in 50 states Permissible signal source impedance (max.) = 1.0 k, VCC 2.7 V 3.5 (3.0)*3 -- -- Sampling in 150 states Permissible signal source impedance (max.) = 5.0 k, VCC 3.0 V 2.0 (1.5)*3 -- -- Sampling in 75 states Permissible signal source impedance (max.) = 5.0 k, VCC 2.7 V 4.0 (3.5)*3 -- -- Sampling in 175 states -- -- 6.0 Analog input capacitance 3.0 Sampling in 125 states pF Offset error -- 1.5 3.0 LSB Full-scale error -- 1.5 3.0 LSB Quantization error -- 0.5 -- LSB Absolute accuracy -- 1.5 3.0 LSB DNL differential nonlinearity error -- 0.5 1.0 LSB INL integral nonlinearity error -- 1.5 3.0 LSB Note: * The above specification values apply when there is no access to the external bus during A/D conversion. If access proceeds during A/D conversion, values may not fall within the above ranges. Note 1. The conversion time includes the sampling time and the comparison time. As the test conditions, the number of sampling states is indicated. Note 2. The scanning is not supported. Note 3. The value in parentheses indicates the sampling time. R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 152 of 172 RX63N Group, RX631 Group Table 5.27 5. Electrical Characteristics 12-Bit A/D Conversion Characteristics Conditions: VCC = AVCC0 = VCC_USB = 2.7 to 3.6 V, VREFH/VREFH0 = 2.7 V to AVCC0 VSS = AVSS0 = VREFL/VREFL0 = VSS_USB = 0 V PCLK = 8 to 50 MHz Ta = Topr Item Resolution Min. Typ. Max. Unit 12 Test Conditions 12 12 Bit (0.4)*2 -- -- s Sampling in 20 states AN0 to AN7 Permissible signal source impedance (max.) = 1.0 k 1.0 Other channels Permissible signal source impedance (max.) = 1.0 k, AVCC 3.0 V 2.0 (1.4)*2 -- -- s Sampling in 70 states Permissible signal source impedance (max.) = 1.0 k, AVCC 2.7 V 5.6 (5.0)*2 -- -- s Sampling in 250 states Analog input capacitance -- -- 30 pF Offset error -- 2.0 7.5 LSB Full-scale error -- 2.0 7.5 LSB Quantization error -- 0.5 -- LSB Absolute accuracy -- 2.5 8.0 LSB DNL differential nonlinearity error -- 2.0 4.0 LSB INL integral nonlinearity error -- 2.0 4.0 LSB Conversion time*1 (Operation at PCLK = 50 MHz) Note: * The above specification values apply when there is no access to the external bus during A/D conversion. If access proceeds during A/D conversion, values may not fall within the above ranges. Note 1. The conversion time includes the sampling time and the comparison time. As the test conditions, the number of sampling states is indicated. Note 2. The value in parentheses indicates the sampling time. Table 5.28 A/D Internal Reference Voltage Characteristics Conditions: VCC = AVCC0 = VCC_USB = 2.7 to 3.6 V, VREFH/VREFH0 = 2.7 V to AVCC0 VSS = AVSS0 = VREFL/VREFL0 = VSS_USB = 0 V PCLK = 8 to 50 MHz Ta = Topr Item A/D Internal reference voltage R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Min. Typ. Max. Unit 1.45 1.50 1.55 V Test Conditions Page 153 of 172 RX63N Group, RX631 Group 5.7 5. Electrical Characteristics D/A Conversion Characteristics Table 5.29 D/A Conversion Characteristics Conditions: VCC = AVCC0 = VCC_USB = 2.7 to 3.6 V, VREFH/VREFH0 = 2.7 V to VCC VSS = AVSS0 = VREFL/VREFL0 = VSS_USB = 0 V Ta = Topr Item Min. Typ. Max. Unit Test Conditions Resolution 10 10 10 Bit Conversion time -- -- 3.0 s 20-pF capacitive load Absolute accuracy -- 2.0 4.0 LSB 2-M resistive load -- -- 3.0 LSB 4-M resistive load -- -- 2.0 LSB 10-M resistive load -- 3.6 -- k RO output resistance 5.8 Temperature Sensor Characteristics Table 5.30 Temperature Sensor Characteristics Conditions: VCC = AVCC0 = VCC_USB = 2.7 to 3.6 V, VREFH/VREFH0 = 2.7 V to VCC VSS = AVSS0 = VREFL/VREFL0 = VSS_USB = 0 V Ta = Topr Item Min. Typ. Max. Unit Relative accuracy 1 C Temperature slope 4.1 mV/C Output voltage (@25C) 1.26 V Temperature sensor start time 30 s Sampling time 5 s R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Test Conditions Page 154 of 172 RX63N Group, RX631 Group 5.9 5. Electrical Characteristics Power-on Reset Circuit and Voltage Detection Circuit Characteristics Table 5.31 Power-on Reset Circuit and Voltage Detection Circuit Characteristics Conditions: VCC = AVCC0 = VCC_USB = Vbatt = 2.7 to 3.6 V, VREFH/VREFH0 = 2.7 V to AVCC0 VSS = AVSS0 = VREFL/VREFL0 = VSS_USB = 0 V Ta = Topr Item Voltage detection level Power-on reset (POR) Low power consumption function disabled Symbol Min. Typ. Max. Unit Test Conditions VPOR 2.5 2.6 2.7 V Figure 5.60 2.0 2.35 2.7 Low power consumption function enabled Voltage detection circuit (LVD0) Vdet0 2.7 2.80 2.9 Figure 5.61 Voltage detection circuit (LVD1) Vdet1_A 2.75 2.95 3.15 Figure 5.62 Voltage detection circuit (LVD2) Vdet2_A 2.75 2.95 3.15 Power-on reset time tPOR -- 4.6 -- LVD0 reset time tLVD0 -- 4.6 -- Figure 5.61 LVD1 reset time tLVD1 -- 0.9 -- Figure 5.62 LVD2 reset time tLVD2 -- 0.9 -- Figure 5.63 Minimum VCC down time tVOFF 200 -- -- s Figure 5.60 and Figure 5.61 Response delay time tdet -- -- 200 s Figure 5.60 to Figure 5.63 LVD operation stabilization time (after LVD is enabled) Td(E-A) -- -- 3 s Hysteresis width (LVD1 and LVD2) V LVH -- 80 -- mV Figure 5.62 and Figure 5.63 Internal reset time Figure 5.63 ms Figure 5.60 Note: * The minimum VCC down time indicates the time when VCC is below the minimum value of voltage detection levels VPOR, Vdet1, and Vdet2 for the POR/ LVD. tVOFF VPOR VCC Internal reset signal (active-low) tdet Figure 5.60 tPOR tdet tdet tPOR Power-on Reset Timing R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 155 of 172 RX63N Group, RX631 Group 5. Electrical Characteristics tVOFF VCC Vdet0 Internal reset signal (active-low) tdet Figure 5.61 tLVD0 Voltage Detection Circuit Timing (Vdet0) tVOFF VCC VLVH Vdet1 LVD1E Td(E-A) LVD1 Comparator output LVD1CMPE LVD1MON Internal reset signal (active-low) When LVD1RN = L tdet tdet tLVD1 When LVD1RN = H tLVD1 Figure 5.62 Voltage Detection Circuit Timing (Vdet1) R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 156 of 172 RX63N Group, RX631 Group 5. Electrical Characteristics tVOFF VCC VLVH Vdet2 LVD2E Td(E-A) LVD2 Comparator output LVD2CMPE LVD2MON Internal reset signal (active-low) When LVD2RN = L tdet tdet tLVD2 When LVD2RN = H tLVD2 Figure 5.63 Voltage Detection Circuit Timing (Vdet2) R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 157 of 172 RX63N Group, RX631 Group 5.10 5. Electrical Characteristics Oscillation Stop Detection Timing Table 5.32 Oscillation Stop Detection Circuit Characteristics Conditions: VCC = AVCC0 = VCC_USB = Vbatt = 2.7 to 3.6 V, VREFH/VREFH0 = 2.7 V to AVCC0 VSS = AVSS0 = VREFL/VREFL0 = VSS_USB = 0 V Ta = Topr Item Symbol Min. Typ. Max. Unit Test Conditions Detection time tdr -- -- 1 ms Figure 5.64 Main clock or PLL clock tdr OSTDSR.OSTDF LOCO clock ICLK Figure 5.64 5.11 Oscillation Stop Detection Timing Battery Backup Function Characteristics Table 5.33 Battery Backup Function Characteristics Conditions: VCC = AVCC0 = VCC_USB = 2.7 to 3.6 V, VREFH/VREFH0 = 2.7 V to AVCC0, Vbatt = 2.3 to 3.6 V VSS = AVSS0 = VREFL/VREFL0 = VSS_USB = 0 V Ta = Topr Item Symbol Min. Typ. Max. Unit Test Conditions Voltage level for switching to battery backup VDETBATT 2.50 2.60 2.70 V Figure 5.65 Lower-limit VBATT voltage for power supply switching due to VCC voltage drop VBATTSW 2.70 -- -- VCC-off period for starting power supply switching tVOFFBATT 200 -- -- s Note: * The VCC-off period for starting power supply switching indicates the period in which VCC is below the minimum value of the voltage level for switching to battery backup (VDETBATT). tVOFFBATT VCC VBATT Backup power area Figure 5.65 VDETBATT VBATTSW VCC supply VBATT supply VCC supply Battery Backup Function Characteristics R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 158 of 172 RX63N Group, RX631 Group 5.12 5. Electrical Characteristics ROM (Flash Memory for Code Storage) Characteristics Table 5.34 ROM (Flash Memory for Code Storage) Characteristics Conditions: VCC = AVCC0 = VCC_USB = 2.7 to 3.6 V, VREFH/VREFH0 = 2.7 V to AVCC0 VSS = AVSS0 = VREFL/VREFL0 = VSS_USB = 0 V Temperature range for the programming/erasure operation: Ta = Topr Item Programming time NPEC 100 hours Programming time NPEC > 100 hours Erasure time NPEC 100 hours Erasure time NPEC > 100 hours Symbol 20 MHz FCLK 50 MHz FCLK = 4 MHz Min. Typ. Max. Min. Typ. Max. Unit 128 bytes tP128 -- 2.8 28 -- 1 10 ms 4 Kbytes tP4K -- 63 140 -- 23 50 ms 16 Kbytes tP16K -- 252 560 -- 90 200 ms 128 bytes tP128 -- 3.4 33.6 -- 1.2 12 ms 4 Kbytes tP4K -- 75.6 168 -- 27.6 60 ms 16 Kbytes tP16K -- 302.4 672 -- 108 240 ms 4 Kbytes tE4K -- 50 120 -- 25 60 ms 16 Kbytes tE16K -- 200 480 -- 100 240 ms 4 Kbytes tE4K -- 60 144 -- 30 72 ms 16 Kbytes tE16K -- 240 576 -- 120 288 ms Reprogram/erase cycle*1 NPEC 1000*2 -- -- 1000*2 -- -- Times Suspend delay time during programming tSPD -- -- 400 -- -- 120 s First suspend delay time during erasing (in suspend priority mode) tSESD1 -- -- 300 -- -- 120 s Second suspend delay time during erasing (in suspend priority mode) tSESD2 -- -- 1.7 -- -- 1.7 ms Suspend delay time during erasing (in erasure priority mode) tSEED -- -- 1.7 -- -- 1.7 ms Data hold time*3 tDRP 10 -- -- 10 -- -- Year FCU reset time tFCUR 35 -- -- 35 -- -- s Note 1. Definition of reprogram/erase cycle: The reprogram/erase cycle is the number of erasing for each block. When the reprogram/erase cycle is n times (n = 1000), erasing can be performed n times for each block. For instance, when 256-byte programming is performed 16 times for different addresses in 4-Kbyte block and then the entire block is erased, the reprogram/erase cycle is counted as one. However, programming the same address for several times as one erasing is not enabled (overwriting is prohibited). Note 2. This indicates the minimum number that guarantees the characteristics after reprogramming. (The guaranteed value is in the range from one to the minimum number.) Note 3. This indicates the characteristic when reprogram is performed within the specification range including the minimum number. R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 159 of 172 RX63N Group, RX631 Group 5.13 5. Electrical Characteristics E2 Flash Characteristics Table 5.35 E2 Flash Characteristics Conditions: VCC = AVCC0 = VCC_USB = 2.7 to 3.6 V, VREFH/VREFH0 = 2.7 V to AVCC0 VSS = AVSS0 = VREFL/VREFL0 = VSS_USB = 0 V Temperature range for the programming/erasure operation: Ta = Topr Item Symbol FCLK = 4 MHz 20 MHz FCLK 50 MHz Min. Typ. Max. Min. Typ. Max. Unit Programming time NPEC 100 hours 2 bytes tDP2 -- 0.7 6 -- 0.25 2 ms Programming time NPEC > 100 hours 2 bytes tDP2 -- 0.7 6 -- 0.25 2 ms Erasure time NPEC 100 hours 32 bytes tDE32 -- 4 40 -- 2 20 ms Erasure time NPEC > 100 hours 32 bytes tDE32 -- 7 40 -- 4 20 ms Blank check time 2 bytes tDBC2 -- -- 100 -- -- 30 s Reprogram/erase cycle*1 NDPEC 100000*2 -- -- 100000*2 -- -- Times Suspend delay time during programming tDSPD -- -- 250 -- -- 120 s First suspend delay time during erasing (in suspend priority mode) tDSESD1 -- -- 250 -- -- 120 s Second suspend delay time during erasing (in suspend priority mode) tDSESD2 -- -- 500 -- -- 300 s Suspend delay time during erasing (in erasure priority mode) tDSEED -- -- 500 -- -- 300 s Data hold time*3 tDDRP 10 -- -- 10 -- -- Year Note 1. Definition of reprogram/erase cycle: The reprogram/erase cycle is the number of erasing for each block. When the reprogram/erase cycle is n times (n = 100000), erasing can be performed n times for each block. For instance, when 128-byte programming is performed 16 times for different addresses in 2-Kbyte block and then the entire block is erased, the reprogram/erase cycle is counted as one. However, programming the same address for several times as one erasing is not enabled (overwriting is prohibited). Note 2. This indicates the minimum number that guarantees the characteristics after reprogramming. (The guaranteed value is in the range from one to the minimum number.) Note 3. This indicates the characteristic when reprogram is performed within the specification range including the minimum number. R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 160 of 172 RX63N Group, RX631 Group 5. Electrical Characteristics * Suspension during programming FCU command Program Suspend tSPD FSTATR0.FRDY Ready Programming pulse Not Ready Ready Programming * Suspension during erasure in suspend priority mode FCU command Erase Suspend Resume Suspend tSESD1 FSTATR0.FRDY Ready Erasure pulse Not Ready tSESD2 Ready Erasing Not Ready Erasing * Suspension during erasure in erasure priority mode FCU command Erase FSTATR0.FRDY Ready Suspend tSEED Erasure pulse Figure 5.66 Not Ready Ready Erasing Flash Memory Program/Erase Suspend Timing R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 161 of 172 RX63N Group, RX631 Group 5.14 5. Electrical Characteristics Boundary Scan Table 5.36 Boundary Scan Conditions: VCC = AVCC0 = VCC_USB = 2.7 to 3.6V, VREFH/VREFH0 = 2.7V to AVCC0 VSS = AVSS0 = VREFL/VREFL0 = VSS_USB = 0V Ta = Topr Item Symbol Min. Typ. Max. Unit Test Conditions Figure 5.67 TCK clock cycle time tTCKcyc 100 ns TCK clock high pulse width tTCKH 45 ns TCK clock low pulse width tTCKL 45 ns TCK clock rise time tTCKr 5 ns TCK clock fall time tTCKf 5 ns TRST# pulse width tTRSTW 20 tTCKcyc Figure 5.68 TMS setup time tTMSS 20 ns Figure 5.69 TMS hold time tTMSH 20 ns TDI setup time tTDIS 20 ns TDI hold time tTDIH 20 ns TDO data delay time tTDOD 40 ns tTCKcyc tTCKH TCK tTCKf tTCKL Figure 5.67 tTCKr Boundary Scan TCK Timing TCK RES# TRST# tTRSTW Figure 5.68 Boundary Scan TRST# Timing R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 162 of 172 RX63N Group, RX631 Group 5. Electrical Characteristics TCK tTMSS tTMSH tTDIS tTDIH TMS TDI tTDOD TDO Figure 5.69 Boundary Scan Input/Output Timing R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 163 of 172 RX63N Group, RX631 Group Appendix 1. Package Dimensions Appendix 1.Package Dimensions Information on the latest version of the package dimensions or mountings has been displayed in "Packages" on Renesas Electronics Corporation. website. JEITA Package Code P-TFLGA177-8x8-0.50 RENESAS Code PTLG0177KA-A Previous Code 177F0E-A MASS[Typ.] 0.2g w S B b1 D x M S AB b w S A x M S AB e ZD A A e R P N M L K B E J H G F E D C B y S x4 v Index mark (Laser mark) S ZE A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Reference Dimension in Millimeters Symbol Min D E v w A e b b1 x y ZD ZE Nom 8.0 8.0 Max 0.15 0.20 1.05 0.21 0.29 0.5 0.25 0.34 0.29 0.39 0.08 0.08 0.5 0.5 Figure A 177-pin TFLGA (PTLG0177KA-A) R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 164 of 172 RX63N Group, RX631 Group Appendix 1. Package Dimensions Figure B 176-pin LFBGA (PLBG0176GA-A) R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 165 of 172 RX63N Group, RX631 Group JEITA Package Code P-LQFP176-24x24-0.50 RENESAS Code PLQP0176KB-A Appendix 1. Package Dimensions Previous Code 176P6Q-A / FP-176E / FP-176EV MASS[Typ.] 1.8g HD *1 D 132 89 88 133 NOTE) 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. bp c c1 HE Reference Dimension in Millimeters Symbol *2 E b1 176 45 c F A Index mark A1 ZD 44 A2 1 ZE Terminal cross section e y *3 b L L1 p x Detail F D E A2 HD HE A A1 bp b1 c c1 e x y ZD ZE L L1 Min Nom Max 23.9 24.0 24.1 23.9 24.0 24.1 1.4 25.8 26.0 26.2 25.8 26.0 26.2 1.7 0.05 0.1 0.15 0.15 0.20 0.25 0.18 0.09 0.145 0.20 0.125 0 8 0.5 0.08 0.10 1.25 1.25 0.35 0.5 0.65 1.0 Figure C 176-pin LQFP (PLQP0176KB-A) R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 166 of 172 RX63N Group, RX631 Group JEITA Package Code P-TFLGA145-7x7-0.50 RENESAS Code PTLG0145KA-A Appendix 1. Package Dimensions Previous Code 145F0G MASS[Typ.] 0.1g w S B b1 D S AB b S AB w S A ZD A e e N M L K J E H G F E D C B y S x4 v Index mark (Laser mark) ZE A 1 2 3 4 5 6 7 8 9 10 11 12 13 Reference Dimension in Millimeters Symbol Min D E v w A e b b1 x y ZD ZE Nom Max 7.0 7.0 0.15 0.20 1.05 0.5 0.21 0.25 0.29 0.29 0.34 0.39 0.08 0.10 0.5 0.5 Figure D 145-pin TFLGA (PTLG0145KA-A) R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 167 of 172 RX63N Group, RX631 Group JEITA Package Code P-LQFP144-20x20-0.50 Appendix 1. Package Dimensions RENESAS Code PLQP0144KA-A Previous Code 144P6Q-A / FP-144L / FP-144LV MASS[Typ.] 1.2g HD *1 D 108 73 109 NOTE) 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. 72 bp c HE Reference Dimension in Millimeters Symbol *2 E c1 b1 36 A 1 ZD Index mark c 37 A2 144 ZE Terminal cross section A1 F L D E A2 HD HE A A1 bp b1 c c1 L1 *3 e y bp x Detail F e x y ZD ZE L L1 Min Nom Max 19.9 20.0 20.1 19.9 20.0 20.1 1.4 21.8 22.0 22.2 21.8 22.0 22.2 1.7 0.05 0.1 0.15 0.17 0.22 0.27 0.20 0.09 0.145 0.20 0.125 0 8 0.5 0.08 0.10 1.25 1.25 0.35 0.5 0.65 1.0 Figure E 144-pin LQFP (PLQP0144KA-A) R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 168 of 172 RX63N Group, RX631 Group JEITA Package Code P-TFLGA100-5.5x5.5-0.50 RENESAS Code PTLG0100KA-A Appendix 1. Package Dimensions Previous Code 100F0M MASS[Typ.] 0.1g b1 x M S w S B b D w S A AB x M S ZD A AB e e A K J H G B E F E D C B ZE A x4 1 v 2 y S Index mark Index mark (Laser mark) S 3 4 5 6 7 8 9 10 Reference Dimension in Millimeters Symbol D E v w A e b b1 x y ZD ZE Min Nom Max 5.5 5.5 0.15 0.20 1.05 0.5 0.21 0.25 0.29 0.29 0.34 0.39 0.08 0.10 0.5 0.5 Figure F 100-pin TFLGA (PTLG0100KA-A) R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 169 of 172 RX63N Group, RX631 Group JEITA Package Code P-LQFP100-14x14-0.50 Appendix 1. Package Dimensions RENESAS Code PLQP0100KB-A Previous Code 100P6Q-A / FP-100U / FP-100UV MASS[Typ.] 0.6g HD *1 D 51 75 NOTE) 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. 50 76 bp c1 Reference Dimension in Millimeters Symbol c E *2 HE b1 D E A2 HD HE A A1 bp b1 c c1 100 26 1 ZE Terminal cross section 25 Index mark ZD y e *3 bp A1 c A A2 F L x L1 Detail F e x y ZD ZE L L1 Min Nom Max 13.9 14.0 14.1 13.9 14.0 14.1 1.4 15.8 16.0 16.2 15.8 16.0 16.2 1.7 0.05 0.1 0.15 0.15 0.20 0.25 0.18 0.09 0.145 0.20 0.125 0 8 0.5 0.08 0.08 1.0 1.0 0.35 0.5 0.65 1.0 Figure G 100-pin LQFP (PLQP0100KB-A) R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 170 of 172 REVISION HISTORY RX63N Group, RX631 Group REVISION HISTORY REVISION HISTORY Rev. Date RX63N Group, RX631 Group Datasheet Description Summary Page 0.50 May 13, 2011 -- 0.90 Dec 27. 2011 All First Edition issued -- Package added (177-pin TFLGA, 176-pin LFBGA, 145-pin TFLGA), module name changed -- Interrupt Controller (ICUb) module name changed 1. Overview 2 to 6 Table 1.1 Outline of Specifications, Reset, Realtime clock, Temperature sensor, Power supply voltage, changed 8 to 10 Table 1.3 List of Products, changed 10 Figure 1.1 How to Read the Product Part No., changed 12 to 17 Table 1.4 Pin Functions, BSCANP pin added 18 Figure 1.3 Pin Assignment (176-Pin TFLGA), added 19 Figure 1.4 Pin Assignment (176-Pin LFBGA), added 20 Figure 1.5 Pin Assignment (176-Pin LQFP), pin 18 changed 21 Figure 1.6 Pin Assignment (144-Pin TFLGA), added 22 Figure 1.7 Pin Assignment (144-Pin LQFP), pin 16 changed 23 Figure 1.8 Pin Assignment (100-Pin LQFP), pin 7 changed 24 to 28 Table 1.5 List of Pins and Pin Functions (177-pin TFLGA, 176-pin LFBGA), added 34 to 38 Table 1.7 List of Pins and Pin Functions (145-Pin TFLGA), added 4. I/O Registers 56 to 99 Table 5.1 List of I/O Registers, changed Appendix 2. Package Dimensions 100 1.00 Jun 06. 2012 Figure A. 177-pin TFLGA (PTLG0177KA-A), added 101 Figure B. 176-pin LFBGA (PLBG0176GA-A), added 103 Figure D. 145-pin TFLGA (PTLG0145KA-A), added 105 Figure F. 100-pin TFLGA (PTLG0100KA-A), added 1. Overview 2 to 6 8 to 10 Table 1.1 Outline of Specifications: CPU, ROM, RAM, E2 DataFlash, clock generation circuit, temperature sensor, power supply voltage, changed. Low power consumption, deleted Table 1.3 List of Products, changed 11 Figure 1.2 Block Diagram, changed 12 Table 1.4 Pin Functions, description of VCC, changed Table 1.5 List of Pin and Pin Functions (177-Pin TFLGA, 176-Pin LFBGA): SDRAMC, added to table header; BCLK in pin number line M8, moved to Power Supply Clock System Control column Table 1.6 List of Pin and Pin Functions (176-Pin LQFP): SDRAMC, added to table header; BCLK in 29 to 33 pin number line 68, moved to Power Supply Clock System Control column Table 1.7 List of Pin and Pin Functions (145-Pin TFLGA): SDRAMC, added to table header; 34 to 38 MOSIB, added to pin number line D13; T_ERXD1 in pin number line H12, changed to ET_ERXD1; PO8, added to pin number line J4; BCLK in pin number line K6, moved to Power Supply Clock System Control column Table 1.8 List of Pins and Pin Functions (144-Pin LQFP): SDRAMC, added to table header; PO8, 39 to 43 added to pin number line 29; BCLK in pin number line 53, moved to Power Supply Clock System Control column; T_ERXD1 in pin number 87, changed to ET_ERXD1; MOSIB, added to pin number line 102 Table 1.9 List of Pins and Pin Functions (100-Pin LQFP): BCLK in pin number line 41, moved to 44 to 47 Power Supply Clock System Control column 4. I/O Registers 24 to 28 57, 58 Table 4.1, MPU registers, added 5. Electrical Characteristics 105 to 163 R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Added Page 171 of 172 RX63N Group, RX631 Group REVISION HISTORY All trademarks and registered trademarks are the property of their respective owners. R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 Page 172 of 172 General Precautions in the Handling of MPU/MCU Products The following usage notes are applicable to all MPU/MCU products from Renesas. For detailed usage notes on the products covered by this manual, refer to the relevant sections of the manual. If the descriptions under General Precautions in the Handling of MPU/MCU Products and in the body of the manual differ from each other, the description in the body of the manual takes precedence. 1. Handling of Unused Pins Handle unused pins in accord with the directions given under Handling of Unused Pins in the manual. The input pins of CMOS products are generally in the high-impedance state. In operation with an unused pin in the open-circuit state, extra electromagnetic noise is induced in the vicinity of LSI, an associated shoot-through current flows internally, and malfunctions occur due to the false recognition of the pin state as an input signal become possible. Unused pins should be handled as described under Handling of Unused Pins in the manual. 2. Processing at Power-on The state of the product is undefined at the moment when power is supplied. The states of internal circuits in the LSI are indeterminate and the states of register settings and pins are undefined at the moment when power is supplied. In a finished product where the reset signal is applied to the external reset pin, the states of pins are not guaranteed from the moment when power is supplied until the reset process is completed. In a similar way, the states of pins in a product that is reset by an on-chip power-on reset function are not guaranteed from the moment when power is supplied until the power reaches the level at which resetting has been specified. 3. Prohibition of Access to Reserved Addresses Access to reserved addresses is prohibited. The reserved addresses are provided for the possible future expansion of functions. Do not access these addresses; the correct operation of LSI is not guaranteed if they are accessed. 4. Clock Signals After applying a reset, only release the reset line after the operating clock signal has become stable. When switching the clock signal during program execution, wait until the target clock signal has stabilized. When the clock signal is generated with an external resonator (or from an external oscillator) during a reset, ensure that the reset line is only released after full stabilization of the clock signal. Moreover, when switching to a clock signal produced with an external resonator (or by an external oscillator) while program execution is in progress, wait until the target clock signal is stable. 5. Differences between Products Before changing from one product to another, i.e. to one with a different part number, confirm that the change will not lead to problems. The characteristics of MPU/MCU in the same group but having different part numbers may differ because of the differences in internal memory capacity and layout pattern. When changing to products of different part numbers, implement a system-evaluation test for each of the products. Notice 1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 2. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics 3. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others. 4. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. Renesas Electronics assumes no responsibility for any losses incurred by you or 5. Renesas Electronics products are classified according to the following two quality grades: "Standard" and "High Quality". The recommended applications for each Renesas Electronics product depends on third parties arising from such alteration, modification, copy or otherwise misappropriation of Renesas Electronics product. the product's quality grade, as indicated below. "Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots etc. "High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-crime systems; and safety equipment etc. Renesas Electronics products are neither intended nor authorized for use in products or systems that may pose a direct threat to human life or bodily injury (artificial life support devices or systems, surgical implantations etc.), or may cause serious property damages (nuclear reactor control systems, military equipment etc.). You must check the quality grade of each Renesas Electronics product before using it in a particular application. You may not use any Renesas Electronics product for any application for which it is not intended. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for which the product is not intended by Renesas Electronics. 6. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the use of Renesas Electronics products beyond such specified ranges. 7. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or systems manufactured by you. 8. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. 9. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. You should not use Renesas Electronics products or technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. When exporting the Renesas Electronics products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. 10. It is the responsibility of the buyer or distributor of Renesas Electronics products, who distributes, disposes of, or otherwise places the product with a third party, to notify such third party in advance of the contents and conditions set forth in this document, Renesas Electronics assumes no responsibility for any losses incurred by you or third parties as a result of unauthorized use of Renesas Electronics products. 11. This document may not be reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics. 12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. (Note 1) "Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its majority-owned subsidiaries. (Note 2) "Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics. http://www.renesas.com SALES OFFICES Refer to "http://www.renesas.com/" for the latest and detailed information. Renesas Electronics America Inc. 2880 Scott Boulevard Santa Clara, CA 95050-2554, U.S.A. Tel: +1-408-588-6000, Fax: +1-408-588-6130 Renesas Electronics Canada Limited 1101 Nicholson Road, Newmarket, Ontario L3Y 9C3, Canada Tel: +1-905-898-5441, Fax: +1-905-898-3220 Renesas Electronics Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K Tel: +44-1628-585-100, Fax: +44-1628-585-900 Renesas Electronics Europe GmbH Arcadiastrasse 10, 40472 Dusseldorf, Germany Tel: +49-211-65030, Fax: +49-211-6503-1327 Renesas Electronics (China) Co., Ltd. 7th Floor, Quantum Plaza, No.27 ZhiChunLu Haidian District, Beijing 100083, P.R.China Tel: +86-10-8235-1155, Fax: +86-10-8235-7679 Renesas Electronics (Shanghai) Co., Ltd. Unit 204, 205, AZIA Center, No.1233 Lujiazui Ring Rd., Pudong District, Shanghai 200120, China Tel: +86-21-5877-1818, Fax: +86-21-6887-7858 / -7898 Renesas Electronics Hong Kong Limited Unit 1601-1613, 16/F., Tower 2, Grand Century Place, 193 Prince Edward Road West, Mongkok, Kowloon, Hong Kong Tel: +852-2886-9318, Fax: +852 2886-9022/9044 Renesas Electronics Taiwan Co., Ltd. 13F, No. 363, Fu Shing North Road, Taipei, Taiwan Tel: +886-2-8175-9600, Fax: +886 2-8175-9670 Renesas Electronics Singapore Pte. Ltd. 1 harbourFront Avenue, #06-10, keppel Bay Tower, Singapore 098632 Tel: +65-6213-0200, Fax: +65-6278-8001 Renesas Electronics Malaysia Sdn.Bhd. Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No. 18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: +60-3-7955-9390, Fax: +60-3-7955-9510 Renesas Electronics Korea Co., Ltd. 11F., Samik Lavied' or Bldg., 720-2 Yeoksam-Dong, Kangnam-Ku, Seoul 135-080, Korea Tel: +82-2-558-3737, Fax: +82-2-558-5141 (c) 2012 Renesas Electronics Corporation. All rights reserved. Colophon 2.0