FS6205 VCXO Clock Generator IC 1.0 Features 2.0 * On-chip tunable voltage-controlled crystal oscillator circuitry (VCXO) allows precise system frequency tuning (pull range typically 300ppm) * Uses inexpensive fundamental-mode crystals * Integrated phase-locked loops (PLL) multiply VCXO frequency to the higher system frequencies needed * 3.3V supply voltage available (contact factory for 5 volt versions) * Small circuit board footprint (8-pin 0.150 SOIC) * Custom frequency selections available - contact your local AMI Sales Representative for more information Description The FS6205 is a monolithic CMOS clock generator IC designed to minimize cost and component count in digital video/audio systems. An on-chip voltage-controlled crystal oscillator (VCXO) permits the reference frequency (or output frequency) to be tuned to match other frequencies present in the system. Phase-locked loops are used to generate precise output / reference frequency ratios. See Table 1 for information on the frequency ratios programmed into each version of the FS6205. Table 1: Version Information DEVICE Figure 1: Pin Configuration 1 VDD 2 XTUNE 3 VSS FS6205 XIN 4 8 XOUT 7 MS 6 FS FREF (MHz) FS MS 0 0 27.000 (REF * 2) 0 1 74.175824175... (REF * 500 / 91) 1 0 27.027 (REF * 2) 1 1 74.580835443... (REF * 436 / 79) 13.500 FS6205-01 5 VDD (nom) 3.3 13.5135 CLK 8-pin (0.150) SOIC CLK (MHz) NOTE: Contact AMI for custom versions Figure 2: Block Diagram XIN VCXO PLL A XOUT MUX CLK XTUNE PLL B FS MS FS6205 American Microsystems, Inc. reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. ISO9001 2.28.02 FS6205 VCXO Clock Generator IC Table 2: Pin Descriptions Key: AI = Analog Input; AO = Analog Output; DI = Digital Input; DIU = Input with Internal Pull-Up; DID = Input with Internal Pull-Down; DIO = Digital Input/Output; DI-3 = Three-Level Digital Input, DO = Digital Output; P = Power/Ground; # = Active Low pin PIN TYPE NAME DESCRIPTION 1 AI XIN VCXO Crystal Feedback 2 P VDD Power Supply (+3.3V nominal) 3 AI XTUNE 4 P VSS Ground 5 DO CLK Clock Output 6 DIU FS Frequency Select Input (changes PLL Frequencies) 7 DIU MS Multiplexer Select Input (chooses PLL A or PLL B) 8 AO XOUT VCXO Tune VCXO Crystal Drive 3.0 Functional Block Description 3.1 Phase-Locked Loops (PLL) A simple formula to obtain the pulling capability of a crystal oscillator is: f ( ppm) = The on-chip PLLs are a standard frequency- and phaselocked loop architecture. The PLL multiplies the reference oscillator to the desired frequency by a ratio of integers. The frequency multiplication is exactly that specified by the integer ratios. 3.2 C1 x (C L 2 - C L1) x 10 2 x (C 0 + C L 2 ) x (C 0 + C L1) 6 where CL1 and CL2 are the two extremes of the applied load capacitance. EXAMPLE: A crystal with the following parameters is used. With C1 = 0.02pF, C0 = 5pF, CL1 = 13pF, and CL2 = 35pF, the tuning range between extreme settings of XTUNE voltage is: Voltage-Controlled Crystal Oscillator (VCXO) The VCXO provides a tunable, low-jitter frequency reference for the rest of the FS6205 system components. Loading capacitance for the crystal is internal to the FS6205. No external components (other than the crystal resonator itself) are required for operation of the VCXO. Continuous fine-tuning of the VCXO frequency is accomplished by varying the voltage on the XTUNE pin. The total change (from one extreme to the other) in effective loading capacitance is 12pF nominal (i.e from 35pF to 13pF). "Pulling" of the crystal oscillation frequency, is accomplished by altering the effective load capacitance presented to the crystal by the oscillator circuit. The actual amount that changing the load capacitance alters the oscillator frequency will be dependent on the characteristics of the crystal as well as the oscillator circuit itself. Specifically, the motional capacitance of the crystal (usually referred to by crystal manufacturers as C1), the static capacitance of the crystal (C0), and the load capacitance (CL) of the oscillator determine the "warping" or "pulling" capability of the crystal in the oscillator circuit. f = 0.02 x (35 - 13) x 106 306 ppm . 2 x (5 + 35) x (5 + 13) 0 0.5 250 200 150 Deviation - ppm 100 50 0 1 1.5 2 2.5 3 3.5 -50 -100 -150 -200 -250 V(XTUNE) - volts Figure 3 - Typical VCXO Characteristic 2 ISO9001 2.28.02 FS6205 VCXO Clock Generator IC 4.0 Electrical Specifications Table 3: Absolute Maximum Ratings Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These conditions represent a stress rating only, and functional operation of the device at these or any other conditions above the operational limits noted in this specification is not implied. Exposure to maximum rating conditions for extended conditions may affect device performance, functionality, and reliability. PARAMETER SYMBOL MIN. MAX. UNITS VDD VSS-0.5 7 V Input Voltage, dc VI VSS-0.5 VDD+0.5 V Output Voltage, dc VO VSS-0.5 VDD+0.5 V Input Clamp Current, dc (VI < 0 or VI > VDD) IIK -50 50 mA Output Clamp Current, dc (VI < 0 or VI > VDD) IOK -50 50 mA Storage Temperature Range (non-condensing) TS -65 150 C Ambient Temperature Range, Under Bias TA -55 125 C Junction Temperature TJ 125 C 260 C 2 kV Supply Voltage (VSS = ground) Lead Temperature (soldering, 10s) Input Static Discharge Voltage Protection (MIL-STD 883E, Method 3015.7) CAUTION: ELECTROSTATIC SENSITIVE DEVICE Permanent damage resulting in a loss of functionality or performance may occur if this device is subjected to a high-energy electrostatic discharge. Table 4: Operating Conditions PARAMETER SYMBOL CONDITIONS/DESCRIPTION MIN. TYP. MAX. 3.3 3.6 V 70 C Supply Voltage (3.3 volt system) VDD 3.0 Ambient Operating Temperature Range TA 0 UNITS 3 ISO9001 2.28.02 FS6205 VCXO Clock Generator IC Table 5: DC Electrical Specifications Unless otherwise stated, VDD = 3.3V 10%, no load on any output, and ambient temperature range TA = 0C to 70C. Parameters denoted with an asterisk ( * ) represent nominal characterization data and are not production tested to any specific limits. Where given, MIN and MAX characterization data are 3 from typical. Negative currents indicate current flows out of the device. PARAMETER SYMBOL CONDITIONS/DESCRIPTION MIN. TYP. MAX. UNITS Overall Supply Current, Dynamic, with Loaded Outputs IDD fXTAL = 13.5MHz; CL = 10pF, VDD = 3.3V 12 mA High-Level Output Source Current * IOH VO = 2.0V -40 mA Low-Level Output Sink Current * IOL VO = 0.4V 17 mA zOH VO = 0.5VDD; output driving high 25 zOL VO = 0.5VDD; output driving low 25 Short Circuit Source Current * IOSH VO = 0V; shorted for 30s, max. -55 mA Short Circuit Sink Current * IOSL VO = 3.3V; shorted for 30s, max. 55 mA Clock Outputs (CLKx) Output Impedance * 4 ISO9001 2.28.02 FS6205 VCXO Clock Generator IC Table 6: AC Timing Specifications Unless otherwise stated, VDD = 3.3V 10%, no load on any output, and ambient temperature range TA = 0C to 70C. Parameters denoted with an asterisk ( * ) represent nominal characterization data and are not production tested to any specific limits. Where given, MIN and MAX characterization data are 3 from typical. PARAMETER SYMBOL CONDITIONS/DESCRIPTION MIN. TYP. MAX. UNITS 0 ppm Overall Synthesis Error (unless otherwise noted in Frequency Table) Crystal Oscillator Center Frequency Tuning Voltage Center Frequency Crystal Loading Capacitance VCENTER CL(xtal) Crystal Drive Level For crystal with specified CL(xtal) 1.4 V As seen by a crystal connected to XIN and XOUT (@VXTUNE=VCENTER). Crystal loading capacitance at nominal center frequency should be specified for this value. 20 pF RXTAL=20; 200 uW Clock Output (CLK) Ratio of high pulse width (as measured from rising edge to next falling edge at VDD/2) to one clock period Duty Cycle * Jitter, Period (peak-peak) * 45 55 % tj(P) From rising edge to next rising edge at VDD/2 150 ps Jitter, Long Term (y()) * tj(LT) From 0-500s at VDD/2 compared to ideal clock source (CLK =27MHz or 27.027MHz) 65 ps Jitter, Long Term (y()) * tj(LT) From 0-500s at VDD/2 compared to ideal clock source (CLK = 74.175MHz or 74.58MHz) 200 ps Rise Time * tr VDD = 3.3V; VO = 0.3V to 3.0V; CL = 10pF 1.2 ns Fall Time * tf VDD = 3.3V; VO = 3.0V to 0.3V; CL = 10pF 1.2 ns 5 ISO9001 2.28.02 FS6205 VCXO Clock Generator IC 5.0 Package Information Table 7: 8-pin SOIC (0.150") Package Dimensions 8 DIMENSIONS INCHES MIN. MAX. MILLIMETERS MIN. MAX. A 0.061 0.068 1.55 1.73 A1 0.004 0.0098 0.102 0.249 A2 0.055 0.061 1.40 1.55 B 0.013 0.019 0.33 0.49 C 0.0075 0.0098 0.191 0.249 D 0.189 0.196 4.80 4.98 E 0.150 0.157 3.81 3.99 e 0.050 BSC R E H AMERICAN MICROSYSTEMS, INC. 1 ALL RADII: 0.005" TO 0.01" h x 45 B 7 typ. e 1.27 BSC H 0.230 0.244 5.84 6.20 h 0.010 0.016 0.25 0.41 L 0.016 0.035 0.41 0.89 0 8 0 8 A2 A D C A1 BASE PLANE L SEATING PLANE Table 8: 8-pin SOIC (0.150") Package Characteristics PARAMETER SYMBOL Thermal Impedance, Junction to Free-Air 8-pin 0.150" SOIC JA Lead Inductance, Self L11 CONDITIONS/DESCRIPTION TYP. UNITS Air flow = 0 m/s 110 C/W Corner lead 2.0 Center lead 1.6 nH Lead Inductance, Mutual L12 Any lead to any adjacent lead 0.4 nH Lead Capacitance, Bulk C11 Any lead to VSS 0.27 pF 6 ISO9001 2.28.02 FS6205 VCXO Clock Generator IC 6.0 Ordering Information ORDERING CODE DEVICE NUMBER PACKAGE TYPE OPERATING TEMPERATURE RANGE SHIPPING CONFIGURATION 11640-822 FS6205-01 8-pin (0.150") SOIC (Small Outline Package) 0C to 70C (Commercial) Tape and Reel 11640-832 FS6205-01 8-pin (0.150") SOIC (Small Outline Package) 0C to 70C (Commercial) Tubes Copyright (c) 1999, 2000 American Microsystems, Inc. Devices sold by AMI are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. AMI makes no warranty, express, statutory implied or by description, regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. AMI makes no warranty of merchantability or fitness for any purposes. AMI reserves the right to discontinue production and change specifications and prices at any time and without notice. AMI's products are intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment, are specifically not recommended without additional processing by AMI for such applications. American Microsystems, Inc., 2300 Buckskin Rd., Pocatello, ID 83201, (208) 233-4690, FAX (208) 234-6796, WWW Address: http://www.amis.com E-mail: tgp@amis.com 7 ISO9001 2.28.02