Express-SL/SLE
COM Express Basic Size Type 6 Module with 6th Gen Intel
®
Core™,
Intel
®
Xeon
®
and Celeron
®
Processor
Features
●
6th Gen Intel
®
Core™, Intel
®
Xeon
®
and Celeron
®
Processor
●
Up to 32 GB Dual Channel DDR4 at 1867/2133 MHz
(supports both ECC and non-ECC memory)
●
3x DDI channels, 1x LVDS (or 4 lanes eDP)
supports up to 3 independent displays
●
8x PCIe x1 (Gen3) and 1x PCIe x16 (Gen3)
●
GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0
●
Supports Smart Embedded Management Agent (SEMA
®
) functions
●
Extreme Rugged operating temperature: -40°C to +85°C (build option)
New
Specications
● Core System
CPU
Mobile Intel
®
Xeon
®
, Core™ and Celeron
®
Processors - 14nm
Xeon
®
E3-1515M v5 2.8/3.7GHz (Turbo), 45W (4C/GT4e)
Xeon
®
E3-1505M v5 2.8/3.7GHz (Turbo), 45W (4C/GT2)
Xeon
®
E3-1505L v5 2.0/2.8GHz (Turbo), 25W (4C/GT2)
Core™ i7-6820EQ 2.8/3.5GHz (Turbo), 45W (4C/GT2)
Core™ i7-6822EQ 2.0/2.8GHz (Turbo), 25W (4C/GT2)
Core™ i5-6440EQ 2.7/3.4GHz (Turbo), 45W (4C/GT2)
Core™ i5-6442EQ 1.9/2.7GHz (Turbo), 25W (4C/GT2)
Core™ i3-6100E 2.7GHz (no Turbo), 35W (2C/GT2)
Core™ i3-6102E 1.9GHz (no Turbo), 25W (2C/GT2)
Celeron
®
G3900E 2.4GHz (no Turbo), 35W (2C/GT1)
Celeron
®
G3902E 1.6GHz (no Turbo), 25W (2C/GT1)
Supports: Intel® VT, Intel® TXT, Intel® SSE4.2, Intel® HT Technology, Intel® 64
Architecture, Execute Disable Bit, Intel® Turbo Boost Technology 2.0, Intel®
AVX2, Intel® AES-NI, PCLMULQDQ Instruction, Intel® Secure Key and Intel® TSX.
Note: Availability of the features may vary between processor SKUs.
Memory
Dual channel 1867/2133 MHz DDR4 memory up to 32GB in dual SODIMM
sockets (ECC/non-ECC support dependent on selected CPU/PCH)
Embedded BIOS
AMI EFI with CMOS backup in 16MB SPI BIOS with Intel
®
AMT 11.0 support
Cache
8MB for Xeon
®
and Core™ i7, 6MB for Core™ i5, 3MB for Core™ i3, 2MB for Celeron
®
PCH
CM236 (supports ECC memory, Intel
®
AMT)
QM170 (supports non-ECC, Intel
®
AMT)
HM170 (supports non-ECC, no Intel
®
AMT support)
Expansion Busses
PCIe x16 or 2 PCIe x8 or 1 PCIe x8 with 2 PCIe x4 (Gen3)
6 PCI Express x1 (Gen3); AB connector, Lanes 0/1/2/3/4/5
2 PCI Express x2 (Gen3): CD connector, Lanes 6/7
LPC bus, SMBus (system) , I
2
C (user)
Debug Headers
40-pin at cable connector for use with DB-40 debug module providing BIOS
POST code LED, BMC access, SPI BIOS ashing, power testpoints, debug LEDs
60-pin XDP header for ICE debug of CPU/chipset
● Video
GPU Feature Support
Intel
®
Generation 9 LP Graphics Core Architecture, supporting 3 independent
and simultaneous display combinations of DisplayPort/HDMI/LVDS or eDP
outputs
Hardware encode/transcode
HD content (including HEVC) DirectX 12, DirectX 11.2, DirectX 11.1, DirectX
11, DirectX 10.1, DirectX 10, DirectX 9 support OpenGL 4.4/4.3 and ES 2.0
support
OpenCL 2.1, 2.0/1.2 support
Digital Display Interface
DDI1/2/3 supporting DisplayPort/HDMI/DVI
LVDS
Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC
eDP
4 lane support optional, in place of LVDS
● Audio
Chipset
Intel
®
HD Audio integrated in chipset
Audio Codec
located on carrier Express-BASE6 (ALC886 standard supported)
● Ethernet
Intel
®
MAC/PHY: i219LM/V (LM with AMT 11.0 support)
Interface: 10/100/1000 GbE connection
Note: “build option” indicates an alternative BOM conguration to support additional or alternative functions that are not available on the standard product.
Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.
Specications
● I/O Interfaces
USB: 4x USB v. 3.0 (USB 0,1,2,3) and 4x USB 2.0 (USB 4,5,6,7)
SATA: Four ports SATA 6Gb/s (SATA0,1,2,3)
Serial: 2 UART ports with console redirection
GPIO: 4 GPO and 4 GPI
● Super I/O
Supported on carrier if needed (standard support for W83627DHG-P)
● TPM
Chipset: Atmel AT97SC3204
Type: TPM1.2/2.0 (TPM 2.0 support with project basis)
● Power
Standard Input: ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5%
Wide Input:
ATX = 8.5-20 V / 5Vsb ±5% or AT = 8.5 ~20V (Standard temp. only)
Management: ACPI 5.0 compliant, Smart Battery support
Power States: C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake-on-USB S3/S4,
WOL S3/S4/S5)
ECO mode: Supports deep S5 mode for power saving
● Operating Systems
Standard Support
Windows 10/8.1 64-bit, Windows 7 32/64-bit, Linux 64-bit, VxWorks
Extended Support (BSP)
WES 7 32/64-bit, Linux 64-bit, VxWorks
● Mechanical and Environmental
Form Factor: PICMG COM.0, Rev 2.1 Type 6
Dimension: Basic size, 125 mm x 95 mm
Operating Temperature
Standard: 0°C to 60°C
Extreme Ruggeed: -40°C to +85°C (build option)
Humidity
5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
Shock and Vibration
IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A,
Table 214-I, Condition D
HALT
Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
● Intelligent Middleware
SEMA®
Local management, control of embedded computer systems
Extended EAPI for monitoring, controlling and analytics applications
Multiple OS support and across platforms (x86, ARM)
Note: “build option” indicates an alternative BOM conguration to support additional or alternative functions that are not available on the standard product.
Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.
Mobile Intel® Xeon®
6th Gen Intel® Core™
i7/i5/i3 Processor
Intel® Celeron®
Processor
(formerly “Skylake-H”)
LM73
Sensor
eDP - LVDS
TPM
Mobile Intel®
QM170/HM170/
CM236
Chipset
LAN
I219
GPIO
GP I2C
SPI 0
BIOS
LPC bus
SODIMM 1
1867/2133 MHz
4-16 GB DDR4
PCIe x16 (Gen3)
2 x8 or 1 x8 + 2 x4
SPI
UMI
Debug
header
PCIe x1
HD Audio
4x SATA 6Gb/s
(port 0/1/2/3)
8x USB 2.0
4x USB 3.0 (port 0/1/2/3)
UART0/1
SPI 1
BIOS
DDC I2C
SODIMM 2
1867/2133 MHz
4-16 GB DDR4
2x PCIe x1 (Gen3)
(port 6/7)
SPI_CS#
DDI1
DP/HDMI/DVI
DDI 2
DP/HDMI/DVI
DDI 3
DP/HDMI/DVI
single/dual
18/24 bit LVDS
6x PCIex1 (Gen3)
(port 0-5)
New
SEMA
BMC
eDP x4 lanes (optional)
XDP
60
SMBus
4x GPO, 4x GPI
SMBus
LPC to
UART
Functional Diagram
www.adlinktech.com
All products and company name listed are trademarks or trade names of their respective companies.
Updated Feb. 24, 2017. ©2017 ADLINK Technology, Inc. All Rights Reserved.
All specifications are subject to change without further notice.
Ordering Information
●
Express-SLE-E3-1515M v5
Basic COM Express Type 6 module with Intel
®
Xeon
®
E3-1515M
v5 and GT4e level graphics, CM236 chipset, support ECC
●
Express-SLE-E3-1505M v5
Basic COM Express Type 6 module with Intel
®
Xeon
®
E3-1505M
v5 and GT2 level graphics, CM236 chipset, support ECC
●
Express-SLE-E3-1505L v5
Basic COM Express Type 6 module with Intel
®
Xeon
®
E3-1505L
v5 and GT2 level graphics, CM236 chipset, support ECC
●
Express-SL-i7-6820EQ
Basic COM Express Type 6 module with Intel
®
Core™ i7-6820EQ
and GT2 level graphics, QM170 chipset
●
Express-SL-i7-6822EQ
Basic COM Express Type 6 module with Intel
®
Core™ i7-6822EQ,
and GT2 level graphics, QM170 chipset
●
Express-SL-i5-6440EQ
Basic COM Express Type 6 module with Intel
®
Core™ i5-6440EQ
and GT2 level graphics, QM170 chipset
●
Express-SL-i5-6442EQ
Basic COM Express Type 6 module with Intel
®
Core™ i5-6442EQ
and GT2 level graphics, QM170 chipset
●
Express-SL-i3-6100E
Basic COM Express Type 6 module with Intel
®
Core™ i3-6100E
and GT2 level graphics, HM170 chipset
●
Express-SL-i3-6102E
Basic COM Express Type 6 module with Intel
®
Core™ i3-6102E
and GT2 level graphics, HM170 chipset
●
Express-SL-G3900E
Basic COM Express Type 6 module with Intel
®
Celeron
®
G3900E
and GT1 level graphics, HM170 chipset
●
Express-SL-G3902E
Basic COM Express Type 6 module with Intel
®
Celeron
®
G3902E
and GT1 level graphics, HM170 chipset
Accessories
Heat Spreaders
●
HTS-SL-B
Heatspreader for Express-SL with threaded standoffs for
bottom mounting
●
HTS-SL-BT
Heatspreader for Express-SL with through hole standoffs for
top mounting
Passive Heatsinks
●
THS-SL-BL
Low profile heatsink for Express-SL with threaded standoffs for
bottom mounting
●
THS-SL-BT
Low profile heatsink for Express-SL with through hole standoffs
for top mounting
●
THSH-SL-BL
High profile heatsink for Express-SL with threaded standoffs
for bottom mounting
Active Heatsink
●
THSF-SL-BL
High profile heatsink with fan for Express-SL with threaded
standoffs for bottom mounting
Starter Kit
●
Starterkit-COM Express 6 PLUS
COM Express formfactor starter kit with Express-BASE6 board,
power supply, and accessory kit
