1
AAT2601/2601A
DATA SHEET
Total Power Solution for Portable Applications
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
202179B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 19, 2013
General Description
The AAT2601 and AAT2601A are members of Skyworks'
Total Power Management IC (TPMICTM) product family.
They contain a single-cell Lithium Ion/Polymer battery
charger, a fully integrated step-down converter and 5 low
dropout (LDO) regulators. The device also includes 2 load
switches for dynamic power path/sleep mode operation,
making it ideal for small handheld portable GSM or CDMA
mobile telephones.
The battery charger is a complete thermally regulated
constant current/constant voltage linear charger. It
includes an integrated pass device, reverse blocking pro-
tection, high accuracy current and voltage regulation,
charge status, and charge termination. The charging
current, charge termination current, and recharge volt-
age are programmable with an external resistor and/or
by a standard I2C interface. The AAT2601 has a typical
battery under-voltage lockout of 2.35V and the AAT2601A
has a typical battery under-voltage lockout of 2.9V.
The step-down DC/DC converter is integrated with internal
compensation and operates at a switching frequency of
1.5MHz, thus minimizing the size of external components
while keeping switching losses low and efficiency greater
than 92%. All LDO output voltages are programmable
using the I2C interface.
The five LDOs offer 60dB power supply rejection ratio
(PSRR) and low noise operation making them suitable for
powering noise-sensitive loads.
All six voltage regulators operate with low quiescent cur-
rent. The total no load current when the step-down con-
verter and 2 LDOs are enabled is only 170μA.
The AAT2601 and AAT2601A are available in a thermally
enhanced low profile 5x5x0.75mm 36-pin TQFN package.
Features
• Voltage Regulator VIN Range: 4.5V to 6V
• Complete Power Integration
▪ Integrated Load Switches to Power Converters from
AC Adapter or Battery Automatically
• Low Standby Current
▪ 170μA (typ) w/ Buck (Core), LDO1 (PowerDigital),
and LDO2 (PowerAnalog) Active, No Load
• One Step-Down Buck Converter (Core)
▪ 1.8V, 300mA Output
▪ 3.3V, 300mA Output (AAT2601A-3.3 ONLY)
▪ 1.5MHz Switching Frequency
▪ Fast Turn-On Time (100μs typ)
• Five LDOs Programmable with I2C
▪ LDO1: 3.0V, 300mA (PowerDigital)
▪ LDO2: 3.0V, 150mA (PowerAnalog or PLL)
▪ LDO3: 3.0V, 150mA (TCXO)
▪ LDO4: 3.0V, 150mA (TX)
▪
LDO5: 3.0V, 150mA (RX)
▪ PSRR: 60dB@10kHz
▪ Noise: 50μVrms for LDO3, LDO4, and LDO5
• One Battery Charger
▪ Digitized Thermal Regulation
▪ Charge Current Programming up to 1.4A
▪ Charge Current Termination Programming
▪ Automatic Trickle Charge for Battery Preconditioning
(2.8V Cutoff)
•
Adapter OK (ADPP) and Reset (RESET) Timer Outputs
• AAT2601 Typical UVLO: 2.35V
• AAT2601A Typical UVLO: 2.9V
• Separate Enable Pins for Supply Outputs
• Over-Current Protection
• Over-Temperature Protection
• 5x5mm TQFN55-36 Package
Applications
• Digital Cameras
• GSM or CDMA Cellular Phones
• Handheld Instruments
• PDAs and Handheld Computers
• Portable Media Players
2
AAT2601/2601A
DATA SHEET
Total Power Solution for Portable Applications
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
202179B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 19, 2013
Typical Application
LDO2
Enable
LDO1
Enable
LDO4
LDO5
Enable
Enable
Enable
LDO3
Enable
Step-down
BUCK
CHGIN
UVLO
BAT
PGND
SYSOUT
100mΩ
500mΩ
PVIN
LX
OUTBUCK
OUT1
OUT2
VIN
VIN
VIN
VIN
VIN
VIN
OUT3OUT4
OUT5
REF
AVIN2
EN5
EN4
EN3
EN_TEST
EN_HOLD
RESET
Ref
Ref
Ref
Ref
Ref
Ref
CNOISE
AGND
AVIN1
VIN
I2C
and
Enable
Control
EN_KEY
ON_KEY
SDA
SCL
ISET
Ref
Charger
Control
STAT
ADPP
ENBAT
USE_USB
TS
SYSOUT
LDO
CT
EN2
To AVIN1,AVIN2, PVIN
10μF
5V from
A
C Adapter or USB Port
System
Supply
10μF
1 cell
Li+
battery
+
-
To SYSOUT To SYSOUT
To SYSOUT
10μF
0.01μF
4.7μF
3.3μH Core : 1.8V
300mA
4.7μF 4.7μF 4.7μF 4.7μF 22μF
TCXO
3.0V
150mA
1.24k
10kΩ
NTC
For BAT
Temp sense
0.1μF
100k
To OUT1
100k
To SYSOUT
100k
To
SYSOUT
100k
To
SYSOUT
μC
PowerDigital
3.0 V
300mA
RX
3.0V
150mA
PowerAnalog
3.0V
150mA
TX
3.0V
150mA
3
AAT2601/2601A
DATA SHEET
Total Power Solution for Portable Applications
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
202179B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 19, 2013
Pin Descriptions
Pin # Symbol Function
1 EN_TEST Similar to EN_HOLD but intended for use with the automatic tester or as a hands free enable input pin indi-
cating hands free phone operation with a headset. It is also internally pulled to GND when fl oating.
2 EN_HOLD Enable for the system. EN_HOLD must be held high by the processor to maintain core power. It is inter-
nally pulled to GND when fl oating.
3EN_KEY
Enable for the system. An internal pull-up resistor keeps the pin pulled up to an internal supply to keep
the system off when there is no CHGIN input. Connect a normally-open pushbutton switch from this pin to
GND. There is an internal 300ms debounce delay circuit to fi lter noise.
4ON_KEY Buffered logic output of the EN_KEY pin with a logic signal from ground to OUT1.
5 EN2 Enable for LDO2 (PowerAnalog or PLL). (Internally pulled low when fl oating)
6 EN3 Enable for LDO3 (TCXO). (Internally pulled low when fl oating)
7 EN4 Enable for LDO4 (TX) (Internally pulled low when fl oating)
8 EN5 Enable for LDO5 (RX) (Internally pulled low when fl oating)
9 OUT5 Output for LDO5 (RX) (when shut down, pulled down with 10kΩ)
10 OUT4 Output for LDO4 (TX) (when shut down, pulled down with 10kΩ)
11 AVIN2 Analog voltage input. Must be tied to SYSOUT on the PCB.
12 OUT3 Output for LDO3 (TCXO)
13 OUT2 Output for LDO2 (PowerAnalog)
14 AVIN1 Analog voltage input. Must be tied to SYSOUT on the PCB.
15 OUT1 Output for LDO1 (PowerDigital)
16 AGND Signal ground
17 CNOISE Noise Bypass pin for the internal reference voltage. Connect a 0.01μF capacitor to AGND.
18 RESET
RESET is the open drain output of a 65ms reset timer. RESET is released after the 50ms timer times out.
RESET is active low and is held low during shutdown. RESET should be tied to a 10K or larger pullup to
OUTBUCK.
19 ADPP
Open Drain output. Will pull low when VCHGIN > 4.5V. When this happens, depending on the status of the
USE_USB pin, the charge current will be reset to the default values (see Battery Charger and I2C Serial
Interface and Programmability section)
20 LX Step-down Buck converter (Core) switching node. Connect an inductor between this pin and the output.
21 PGND Power Ground for step-down Buck converter (Core)
22 PVIN Input power for step-down Buck converter (Core). Must be tied to SYSOUT.
23 OUTBUCK Feedback input for the step-down Buck converter (Core)
24, 25 SYSOUT System Power output. Connect to the input voltage pins PIN, AVIN1/2 for the step-down converter and
LDOs and other external supply requirements.
26, 27 BAT Connect to a Lithium Ion battery.
28 CHGIN Power input from either external adapter or USB port.
29 USE_USB
When pulled high, fast charge current is set to 100mA regardless of the resistor value present on the
ISET pin. Additionally, the CHGIN-SYSOUT LDO will be disabled and the BAT-SYSOUT load switch will be
enabled.
30 ENBAT Active low enable for the battery charger (Internally pulled low when fl oating)
31 TS Battery Temperature Sense pin with 75μA output current. Connect the battery’s NTC resistor to this pin
and ground.
32 ISET Charge current programming input pin (Tie a 1k to GND for maximum fast charge current). Can be used
to monitor charge current.
33 CT Charger Safety Timer Pin. A 0.1μF ceramic capacitor should be connected between this pin and GND. Con-
nect directly to GND to disable the timer function.
34 STAT Battery charging status pin output. Connected internally between GND and OUT1 (PowerDigital). Used to
monitor battery charge status.
35 SDA I2C serial data pin, open drain; requires a pullup resistor.
36 SCL I2C serial clock pin, open drain; requires a pullup resistor.
EP EP
The exposed thermal pad (EP) must be connected to board ground plane and pins 16 and 21. The ground
plane should include a large exposed copper pad under the package for thermal dissipation (see package
outline).
4
AAT2601/2601A
DATA SHEET
Total Power Solution for Portable Applications
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
202179B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 19, 2013
Pin Configuration
TQFN55-36
(Top View)
EN_TEST
EN_HOLD
EN_KEY
ON_KEY
EN2
EN3
EN4
EN5
OUT5
BAT
BAT
SYSOUT
SYSOUT
OUTBUC
K
PVIN
PGND
LX
ADPP
SCL
SDA
STAT
CT
ISET
TS
ENBAT
USE_USB
CHGIN
OUT4
AVIN2
OUT3
OUT2
AVIN1
OUT1
AGND
CNOISE
RESET
1
2
3
4
5
6
7
8
9
27
26
25
24
23
22
21
20
19
10 11 12 13 14 15 16 17 18
36 35 34 33 32 31 30 29 28
5
AAT2601/2601A
DATA SHEET
Total Power Solution for Portable Applications
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
202179B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 19, 2013
Absolute Maximum Ratings1
TA = 25°C unless otherwise noted.
Symbol Description Value Units
VIN Input Voltage, CHGIN, BAT -0.3 to 6.5 V
Power and logic pins Maximum Rating VIN + 0.3 V
TAOperating Temperature Range -40 to 85 °C
TSStorage Temperature Range -65 to 150 °C
TLEAD Maximum Soldering Temperature (at leads, 10 sec) 300 °C
Recommended Operating Conditions2
Symbol Description Value Units
θJA Thermal Resistance 25 °C/W
PDMaximum Power Dissipation 4 W
1. Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. Functional operation at conditions other than the operating conditions
specified is not implied.
2. Thermal Resistance was measured with the AAT2601 device on the 4-layer FR4 evaluation board in a thermal oven. The amount of power dissipation which will cause the
thermal shutdown to activate will depend on the ambient temperature and the PC board layout ability to dissipate the heat. See Figures 11-14. Measurements are also valid
for the AAT2601A device.
6
AAT2601/2601A
DATA SHEET
Total Power Solution for Portable Applications
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
202179B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 19, 2013
Electrical Characteristics1
VIN = 5V, VBAT = 3.6V, -40C ≤ TA ≤ +85C, unless noted otherwise. Typical values are TA = 25C.
Symbol Description Conditions Min Typ Max Units
Power Supply
VIN CHGIN Input Voltage 4.5 6 V
IQBattery Standby Current Buck, LDO1 + LDO2, no load 170 μA
ISHDN Battery Shutdown Current EN_TEST, EN_HOLD, EN2, EN3, EN4,
EN5 = GND, EN_KEY fl oating 10.0 μA
UVLO
Under-Voltage Lockout for CHGIN CHGIN rising 4.25 4.5 V
CHGIN falling 4.15
Battery Under-Voltage Lockout
AAT2601 BAT rising 2.6 V
BAT falling 2.35
AAT2601A BAT rising 3.0 3.1 3.2 V
BAT falling 2.8 2.9 3.0
IBAT Leakage Current from BAT Pin VBAT = 4V, VCHGIN = 0V 2 5 μA
Startup Timers
RESET Reset Timer Initiated when OUT1 = 90% of fi nal value 35 ms
Charger Voltage Regulation
VBAT_REG Output Charge Voltage Regulation 0C ≤ TA ≤ +70C 4.158 4.200 4.242 V
VMIN Preconditioning Voltage Threshold (No trickle charge option available) 2.6 2.8 3.0 V
VRCH Battery Recharge Voltage Threshold
I2C Recharge Code = 00 (default) 4.00 V
I2C Recharge Code = 01 4.05 V
I2C Recharge Code = 10 4.10 V
I2C Recharge Code = 11 4.15 V
Charger Current Regulation
ICH_CC Constant-Current Mode Charge Current
RISET = 1.24k (for 0.8A), USE_USB = Low,
I2C ISET code = 000, VBAT = 3.6V, VCHGIN =
5.0V
720 800 880
mA
USE_USB = High, I2C ISET Code = 000,
VBAT = 3.6V 85 100 115
KI_SET Charge Current Set Factor: ICH_CC/IISET Constant Current Mode, VBAT = 3.6V 800 mA
ICH_PRE Preconditioning Charge Current RISET = 1.24k, USE_USB = Low 12 %
ICH_CC
I2C ISET Code = 000, USE_USB = High 50 mA
ICH_TERM Charge Termination Threshold Current
I2C Term Code = 00 (default) 5
%
ICH_CC
I2C Term Code = 01 10
I2C Term Code = 10 15
I2C Term Code = 11 20
Charging Devices
RDS(ON) Charging Transistor ON Resistance VIN = 5V 0.6 0.9 Ω
Logic Control / Protection
VEN_HOLD,
VEN_KEY,
VEN_TEST
Input High Threshold 1.4 V
Input Low Threshold 0.4 V
VADPP Output Low Voltage Pin Sinks 4mA 0.4 V
IADPP Output Pin Current Sink Capability 8mA
VSTAT Output High Voltage VOUT1 V
ISTAT Output Pin Current Source Capability 1.5 mA
VOVP Over-Voltage Protection Threshold 4.3 V
1. Specification over the –40°C to +85°C operating temperature range is assured by design, characterization and correlation with statistical process controls.
7
AAT2601/2601A
DATA SHEET
Total Power Solution for Portable Applications
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
202179B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 19, 2013
Electrical Characteristics1
VIN = 5V, VBAT = 3.6V, -40C ≤ TA ≤ +85C, unless noted otherwise. Typical values are TA = 25C.
Symbol Description Conditions Min Typ Max Units
Logic Control / Protection (continued)
VOCP Over Current Protection Threshold 105 %VCS
TCConstant Current Mode Time Out
CCT = 100nF, VCHGIN = 5V
3 Hours
TKTrickle Charge Time Out TC/8 Hours
TVConstant Voltage Mode Time Out 3 Hours
ITS Current Source from TS Pin 71 75 79 μA
TS1TS Hot Temperature Fault Falling Threshold 318 331 346 mV
Hysteresis 25
TS2TS Cold Temperature Fault Rising Threshold 2.30 2.39 2.48 V
Hysteresis 25 mV
TLOOP_IN Thermal Loop Entering Threshold 115 °C
TLOOP_OUT Thermal Loop Exiting Threshold 85 °C
TREG Thermal Loop Regulation 100 °C
Load Switches / SYSOUT LDO
RDS(ON),BAT-SYSOUT
On-Resistance of BAT-SYSOUT
Load Switch VBAT = 3.6V 100 150 mΩ
RDS(ON),CHGIN-SYSOUT
On-Resistance of CHGIN-SYSOUT
Load Switch VCHGIN = 4.5V 0.5 0.75 Ω
Sysout LDO Input Voltage Range 4.5 V
Sysout LDO Output Voltage ISYSOUT 900mA, VCHGIN = 4.5V ~ 6.0V 3.4 3.9 4.2 V
Step-Down Buck Converter (Core)
VOUTBUCK Output Voltage Accuracy
VOUT ≤ 2V IOUTBUCK = 0 ~ 300mA;
VIN = 2.7V ~ 5.5V 1.71 1.80 1.89 V
VOUT > 2V IOUTBUCK = 0 ~ 300mA;
VIN = VOUTBUCK +1V ~ 5.5V -5 5 %
ILIMOUTBUCK P-Channel Current Limit 0.8 A
RDS(ON)L High Side Switch On-Resistance 0.8 Ω
RDS(ON)H Low Side Switch On-Resistance 0.8 Ω
FOSC Oscillator Frequency TA = 25°C 1.5 MHz
TSStart-Up Time From Enable to Regulation; COUTBUCK =
4.7μF, C NOISE = On 100 μs
LDO1 (PowerDigital)
VOUT1 Output Voltage Accuracy IOUT1 = 0~300mA, VAVINx = 3.3V ~ 5.5V -3 +3 %
IOUT1 Output Current 300 mA
ILIM1 Output Current Limit 1000 mA
VDO1 Dropout Voltage IOUT1 = 300mA 150 300 mV
VOUT1(VOUT1VIN1) Line Regulation IOUT1 = 100mA, 3.3V < VAVINx < 5.5V 0.07 %/V
VOUT1 Load Regulation IOUT1 = 0.5mA ~ 150mA 40 mV
PSRR Power Supply Rejection Ratio IOUT1 = 10mA, COUT1=22μF, 100Hz ~ 10KHz 60 dB
TSStart Up Time From Enable to Regulation; C OUT1 = 22μF,
CNOISE = On 175 μs
1. Specification over the –40°C to +85°C operating temperature range is assured by design, characterization and correlation with statistical process controls.
8
AAT2601/2601A
DATA SHEET
Total Power Solution for Portable Applications
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
202179B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 19, 2013
Electrical Characteristics1
VIN = 5V, VBAT = 3.6V, -40C ≤ TA ≤ +85C, unless noted otherwise. Typical values are TA = 25C.
Symbol Description Conditions Min Typ Max Units
LDO2 (PowerAnalog)
VOUT2 Output Voltage Accuracy IOUT2 = 0 ~ 150mA, VAVINx: 3.3V ~ 5.5V -3 +3 %
IOUT2 Output Current 150 mA
ILIM2 Output Current Limit 1000 mA
VDO2 Dropout Voltage IOUT2 = 150mA 150 mV
VOUT2/
(VOUT2VIN2)Line Regulation IOUT2 = 100mA, 3.3V<VAVINx<5.5V 0.07 %/V
VOUT2 Load Regulation Load: 0.5mA~150mA 40 mV
PSRR Power Supply Rejection Ratio IOUT2 = 10mA, COUT2 = 4.7μF, 10 ~ 10KHz 60 dB
Ts Start Up Time From Enable to Regulation; COUT2 = 4.7μF,
CNOISE = On 65 μs
LDO3 (TCXO), LDO4 (TX) and LDO5 (RX)
VOUTx Output Voltage Accuracy IOUTX = 0 ~ 150mA, VAVINx = 3.3V ~ 5.5V -3 +3 %
IOUTx Output Current 150 mA
ILIMx Output Current Limit 1000 mA
VDOx Dropout Voltage IOUTX = 150mA 150 mV
VOUTx/
(VOUTxVINx)Line Regulation IOUTX = 100mA, 3.3V < VAVINx < 5.5V 0.07 %/V
VOUTx Load Regulation IOUTX = 0.5mA ~ 150mA 40 mV
PSRR Power Supply Rejection Ratio IOUTX = 10mA, COUTx = 4.7μF, 10 ~ 10KHz 60 dB
eNOutput Noise Voltage
IOUTX = 10mA, Power BW: 10kHz ~ 100KHz
40 μVrms
Ts Start Up Time From Enable to Regulation; COUTX = 4.7μF,
CNOISE = On 65 μs
Logic Control
VIH Enable Pin Logic High Level For EN2, EN3, EN4 and EN5 1.4 V
VIL Enable Pin Logic Low Level 0.4 V
Thermal
TSD Over Temperature Shutdown Threshold 140 ˚C
THYS Over Temperature Shutdown Hysteresis 15 ˚C
SCL, SDA (I2C Interface)
FSCL Clock Frequency 0 400 KHz
TLOW Clock Low Period 1.3 μs
THIGH Clock High Period 0.6 μs
THD_STA Hold Time START Condition 0.6 μs
TSU_STA Setup Time for Repeat START 0.6 μs
TSU_DTA Data Setup Time 100 ns
TSU_STO Setup Time for STOP Condition 0.6 μs
TBUF
Bus Free Time Between STOP and
START Condition 1.3 μs
VIL Input Threshold Low 2.7V ≤ VIN ≤ 5.5V 0.4 V
VIH Input Threshold High 2.7V ≤ VIN ≤ 5.5V 1.4 - V
IIInput Current -1.0 1.0 μA
VOL Output Logic Low (SDA) IPULLUP = 3mA 0.4 V
1. Specification over the –40°C to +85°C operating temperature range is assured by design, characterization and correlation with statistical process controls.
9
AAT2601/2601A
DATA SHEET
Total Power Solution for Portable Applications
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
202179B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 19, 2013
Basic I2C Timing Diagram
T
SU_STO
T
SU_STA
T
HD_STA
T
HIGH
T
LOW
T
SU_DAT
T
HD_DAT
SDA
SCL
T
BUF
T
HD_STA
10
AAT2601/2601A
DATA SHEET
Total Power Solution for Portable Applications
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
202179B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 19, 2013
Typical Characteristics—Charger
Preconditioning Threshold Voltage
vs. Temperature
Temperature (°C)
VMIN (V)
2.790
2.792
2.794
2.796
2.798
2.800
2.802
2.804
2.806
2.808
2.810
-50 -25 0 25 50 75 100
VCHGIN = 6.0V
VCHGIN = 5.5V
VCHGIN = 5.0V VCHGIN = 4.5V
Preconditioning Charge Current vs. Temperature
(VBAT = 2.5V, RISET = 1.24kΩ)
Temperature (°C)
ICH_PRE (mA)
80
85
90
95
100
105
110
115
-50 -25 0 25 50 75 100
VCHGIN = 6.0V
VCHGIN = 5.5V
VCHGIN = 5.0V
VCHGIN = 4.5V
Recharge Voltage Threshold vs. Temperature
(VRCH set to 4.0V)
Temperature (°C)
VRCH (V)
3.96
3.97
3.98
3.99
4.00
4.01
4.02
4.03
4.04
4.05
4.06
-50 -25 0 25 50 75 100
VCHGIN = 6.0V
VCHGIN = 5.5V
VCHGIN = 5.0V
VCHGIN = 4.5V
Output Charge Voltage Regulation vs. Temperatur
e
(End of Charge Voltage)
Temperature (°C)
VBAT_REG (V)
4.16
4.17
4.18
4.19
4.20
4.21
4.22
4.23
4.24
4.25
-50 -25 0 25 50 75 100
VCHGIN = 6.0V
VCHGIN = 5.5V
VCHGIN = 5.0V VCHGIN = 4.5V
Charge Termination Threshold Current
vs. Temperature
Temperature (°C)
ICH_TERM (mA)
0
10
20
30
40
50
60
70
80
90
100
-50 -25 0 25 50 75 100
VCHGIN = 6.0V
VCHGIN = 5.5V
VCHGIN = 5.0V VCHGIN = 4.5V
Charging Current vs. Battery Voltage
(RISET = 1.24kΩ
Ω
)
Battery Voltage (V)
ICH (mA)
0
100
200
300
400
500
600
700
800
900
2.5 2.9 3.3 3.7 4.1 4.5
VCHGIN = 6.0V
VCHGIN = 5.5V
VCHGIN = 5.0V
VCHGIN = 4.5V
11
AAT2601/2601A
DATA SHEET
Total Power Solution for Portable Applications
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
202179B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 19, 2013
Typical Characteristics—Charger (continued)
Constant Current Mode Charge Current
vs. Temperature
(VBAT = 3.6V; RISET = 1.24kΩ
Ω
)
Temperature (°C)
ICH_CC (mA)
300
400
500
600
700
800
900
-50 -25 0 25 50 75 100
VCHGIN = 6.0V
VCHGIN = 5.5V
VCHGIN = 5.0V
VCHGIN = 4.5V
Constant Current Mode Charge Current
vs. Input Voltage
(RISET = 1.24kΩ)
CHGIN Voltage (V)
ICH_CC (mA)
700
720
740
760
780
800
820
840
860
880
900
4.5 4.75 5 5.25 5.5 5.75 6
VBAT = 3.3V
VBAT = 3.6V
VBAT = 4.1V
12
AAT2601/2601A
DATA SHEET
Total Power Solution for Portable Applications
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
202179B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 19, 2013
Typical Characteristics—Step-Down Buck Converter
Step-Down Buck Efficiency vs. Output Current
(VOUT = 1.8V; L = 3.3µH)
Output Current (mA)
Efficiency (%)
0
10
20
30
40
50
60
70
80
90
100
1 10 100 1000
VBAT = 2.7V
VBAT = 4.2V
VCHGIN = 4.5V
VCHGIN = 5.0V
VCHGIN = 6.0V
VCHGIN = 5.5V
VBAT = 3.6V
Step-Down Buck Load Regulation
vs. Output Current
(VOUT = 1.8V; L = 3.3µH)
Output Current (mA)
Load Regulation (%)
-0.5
-0.4
-0.3
-0.2
-0.1
0.0
0.1
0.2
0.3
0.4
0.5
1 10 100 1000
VBAT = 2.7V
VBAT = 4.2V
VCHGIN = 4.5V
VCHGIN = 5.0V
VCHGIN = 6.0V
VCHGIN = 5.5V
VBAT = 3.6V
Step-Down Buck Line Regulation
vs. CHGIN and Battery Input Voltage
(VOUT = 1.8V; L = 3.3µH)
Input VBAT, VCHGIN (V)
Line Regulation (%)
-0.5
-0.4
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0.4
0.5
2.5 3 3.5 4 4.5 5 5.5 6
4.2
IOUT = 1mA
IOUT = 0.01mA
IOUT = 10mA
IOUT = 300mA
IOUT = 200mA
IOUT = 100mA
VBAT VCHGIN
IOUT = 50mA
Step-Down Buck Output Voltage vs. Temperature
(IOUT = 10mA)
Temperature (°C)
VOUT (V)
1.780
1.785
1.790
1.795
1.800
1.805
1.810
1.815
1.820
1.825
-50 -25 0 25 50 75 100
VCHGIN = 6.0V VBAT = 2.7V
VBAT = 3.6V
VBAT = 4.2V
VCHGIN = 4.5V
VCHGIN = 5.5V
VCHGIN = 5.0V
VBAT Line Transient Response Step-Down Buck
(VBAT = 3.5V to 4.2V; IOUT = 300mA; VOUT = 1.8V; COUT = 4.7µF)
Time (100µs/div)
Output Voltage (top) (V)
Input Voltage (bottom) (V)
1.76
1.80
1.84
1.88
1.92
3.0
3.5
4.0
4.5
VO
VBAT
VCHGIN Line Transient Response Step-Down Buck
(VCHGIN = 4.5V to 5.5V; IOUT = 300mA; VOUT = 1.8V; COUT = 4.7µF)
Time (100µs/div)
Output Voltage (top) (V)
Input Voltage (bottom) (V)
1.76
1.78
1.80
1.82
1.84
1.86
4.0
4.5
5.0
5.5
6.0
V
O
V
CHGIN
13
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Typical Characteristics—Step-Down Buck Converter (continued)
Load Transient Response Step-Down Buck
(IOUTBUCK = 10mA to 100mA; VBAT = 3.6V;
VOUT = 1.8V; COUT = 4.7µF)
Time (100µs/div)
Output Voltage (top) (V)
Output Current
(bottom) (mA)
1.60
1.70
1.80
1.90
2.00
0
50
100
V
O
IO
Load Transient Response Step-Down Buck
(IOUTBUCK = 100mA to 300mA; VBAT = 3.6V;
VOUT = 1.8V; COUT = 4.7µF)
Time (100µs/div)
Output Voltage (top) (V)
Output Current
(bottom) (mA)
1.60
1.70
1.80
1.90
2.00
0
100
200
300
VO
IO
14
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202179B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 19, 2013
Typical Characteristics—LDO1
LDO1 Load Regulation vs. Output Current
(VOUT1 = 3.0V)
Output Current (mA)
Load Regulation (%)
-1.0
-0.8
-0.6
-0.4
-0.2
0.0
0.2
0.4
0.6
0.8
1.0
0.1 1 10 100 1000
VBAT = 4.2V
VBAT = 3.6V
VBAT = 3.3V
LDO1 Line Regulation vs. Battery
and CHGIN Input Voltage
(VOUT1 = 3.0V)
Input Voltage VBAT, VCHGIN (V)
Line Regulation (%)
-0.15
-0.13
-0.11
-0.09
-0.07
-0.05
-0.03
-0.01
0.01
0.03
0.05
3 3.5 4 4.5 5 5.5 6
IOUT = 0.01mA
IOUT = 1mA
IOUT = 10mA
IOUT = 50mA
IOUT = 100mA
IOUT = 200mA
IOUT = 300mA
4.2
VBAT VCHGIN
LDO1 Output Voltage vs. Temperature
(IOUT1 = 10mA)
Temperature (°C)
Output Voltage VOUT1 (V)
2.992
2.994
2.996
2.998
3.000
3.002
3.004
-50 -25 0 25 50 75 100
VCHGIN = 6.0V
VCHGIN = 5.5V
VCHGIN = 5.0V
VCHGIN = 4.5V
VBAT = 4.2V
VBAT = 3.6V
VBAT = 3.1V
LDO1 Dropout Characteristics vs. Input Voltage
(VOUT1 = 3.0V)
Input Voltage (V)
Output Voltage
VOUT1
(V)
2.80
2.85
2.90
2.95
3.00
3.05
3.10
3.0 3.1 3.2 3.3 3.4 3.5 3.
6
IOUT = 1mA
IOUT = 50mA
IOUT = 100mA
IOUT = 150mA
IOUT = 200mA
IOUT = 250mA
IOUT = 300mA
LDO1 Dropout Voltage vs. Output Current
(VOUT1 = 3.0V)
Output Current (mA)
Dropout Voltage (mV)
0
20
40
60
80
100
120
140
160
180
200
0 50 100 150 200 250 300
-40°C
25°C
85°C
VBAT Line Transient Response LDO1
(VBAT = 3.5V to 4.2V; IOUT1 = 300mA; VOUT1 = 3V)
Time (100µs/div)
Output Voltage (top) (V)
Input Voltage (bottom) (V)
2.98
2.99
3.00
3.01
3.02
3.0
3.5
4.0
4.5
VO
VBAT
15
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202179B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 19, 2013
Typical Characteristics—LDO1 (continued)
VCHGIN Line Transient Response LDO1
(VCHGIN = 4.5V to 5.5V; IOUT = 300mA; VOUT = 3V)
Time (100µs/div)
Output Voltage (top) (V)
Input Voltage (bottom) (V)
2.98
2.99
3.00
3.01
3.02
4.0
4.5
5.0
5.5
6.0
VO
VCHGIN
Load Transient Response LDO1
(IOUT1 = 10mA to 100mA; VBAT = 3.6V; VOUT1 = 3V)
Time (100µs/div)
Output Voltage (top) (V)
Output Current
(bottom) (mA)
2.96
2.98
3.00
3.02
3.04
0
50
100
VO
IO
Load Transient Response LDO1
(IOUT1 = 100mA to 300mA; VBAT = 3.6V; VOUT1 = 3V)
Time (100µs/div)
Output Voltage (top) (V)
Output Current
(bottom) (mA)
2.96
2.98
3.00
3.02
3.04
0
100
200
300
VO
IO
16
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202179B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 19, 2013
Typical Characteristics—LDO4
LDO4 Load Regulation vs. Output Current
(VOUT4 = 3.0V)
Output Current (mA)
Load Regulation (%)
-1.0
-0.8
-0.6
-0.4
-0.2
0.0
0.2
0.4
0.6
0.8
1.0
0.1 1 10 100 1000
VCHGIN = 4.5V
VCHGIN = 5.0V
VCHGIN = 5.5V
VCHGIN = 6.0V
LDO4 Load Regulation vs. Output Current
(VOUT4 = 3.0V)
Output Current (mA)
Load Regulation (%)
-1.0
-0.8
-0.6
-0.4
-0.2
0.0
0.2
0.4
0.6
0.8
1.0
0.1 1 10 100 100
0
VBAT = 4.2V
VBAT = 3.6V
VBAT = 3.3V
VBAT = 3.1V
LDO4 Output Voltage vs. Temperature
(IOUT4 = 10mA)
Temperature (°C)
Output Voltage VOUT4 (V)
2.990
2.992
2.994
2.996
2.998
3.000
3.002
3.004
3.006
3.008
-50 -25 0 25 50 75 100
VCHGIN = 6.0V
VCHGIN = 5.5V
VCHGIN = 5.0V
VCHGIN = 4.5V
VBAT = 4.2V
VBAT = 3.6V
VBAT = 3.1V
LDO4 Line Regulation vs. Battery
and CHGIN Input Voltage
(VOUT4 = 3.0V)
Input Voltage VBAT, VCHGIN (V)
Line Regulation (%)
-0.14
-0.12
-0.1
-0.08
-0.06
-0.04
-0.02
0
0.02
0.04
0.06
3 3.5 4 4.5 5 65.5
4.2
IOUT = 0.01mA
IOUT = 1mA
IOUT = 10mA
IOUT = 50mA
IOUT = 100mA
IOUT = 150mA
VBAT VCHGIN
LDO4 Dropout Characteristics vs. Input Voltage
(VOUT4 = 3.0V)
Input Voltage (V)
Output Voltage (V)
2.80
2.85
2.90
2.95
3.00
3.05
3.10
3.0 3.1 3.2 3.3 3.4 3.5 3.6
IOUT = 1mA
IOUT = 50mA
IOUT = 100mA
IOUT = 150mA
LDO4 Dropout Voltage vs. Output Current
(VOUT4 = 3.0V)
Output Current (mA)
Dropout Voltage (mV)
0
20
40
60
80
100
120
140
160
180
200
0 25 50 75 100 125 150
-40°C
25°C
85°C
17
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202179B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 19, 2013
Typical Characteristics—LDO4 (continued)
VBAT Line Transient Response LDO4
(VBAT = 3.5V to 4.2V; IOUT4 = 150mA; VOUT4 = 3V)
Time (100µs/div)
Output Voltage (top) (V)
Input Voltage (bottom) (V)
2.98
2.99
3.00
3.01
3.02
3.0
3.5
4.0
4.5
VO
VBAT
VCHGIN Line Transient Response LDO4
(VCHGIN = 4.5V to 5.5V; IOUT4 = 150mA; VOUT4 = 3V)
Time (100µs/div)
Output Voltage (top) (V)
Input Voltage (bottom) (V)
2.98
2.99
3.00
3.01
3.02
4.0
4.5
5.0
5.5
6.0
VO
VCHGIN
Load Transient Response LDO4
(IOUT4 = 10mA to 75mA; VBAT = 3.6V;
VOUT4 = 3V; COUT = 4.7µF)
Time (100µs/div)
Output Voltage (top) (V)
Output Current
(bottom) (mA)
2.96
2.98
3.00
3.02
3.04
0
50
100
VO
IO
Load Transient Response LDO4
(IOUT4 = 75mA to 150mA; VBAT = 3.6V;
VOUT4 = 3V; COUT = 4.7µF)
Time (100µs/div)
Output Voltage (top) (V)
Output Current
(bottom) (mA)
2.96
2.98
3.00
3.02
3.04
0
50
100
150
VO
IO
18
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DATA SHEET
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Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
202179B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 19, 2013
Typical Characteristics—General
Quiescent Current vs. Input Voltage
(VOUT = 1.8V; L = 3.3µH)
Input VBAT, VCHGIN (V)
Quiescent Current (µA)
0
50
100
150
200
250
300
350
400
450
500
2.7 3.2 3.7 4.2 4.7 5.2 5.7
-40°C
25°C
85°C
VBAT VCHGIN
Start-up Sequence
(VCHGIN = 5.0V)
Time (50µs/div)
Output Voltage (2V/div)
Buck
LDO1
LDO2
LDO3
LDO4
LDO5
LDO Output Voltage Noise
(No Load; Power BW: 100~100KHz)
Frequency (Hz)
Noise (µVRMS)
0.00
0.60
1.20
1.80
2.40
3.00
3.60
4.20
4.80
5.40
6.00
100 1000 10000 100000
LDO Output Voltage Noise
(IOUT3 = 10mA, Power BW = 100~100KHz)
Frequency (Hz)
Noise (µVRMS)
0.00
0.60
1.20
1.80
2.40
3.00
3.60
4.20
4.80
5.40
6.00
100 1000 10000 100000
LDO Power Supply Rejection Ratio, PSRR
(IOUT3 = 10mA, BW = 100~100KHz)
Frequency (Hz)
Magnitude (dB)
0
15
30
45
60
75
90
105
120
135
150
100 1000 10000 100000
19
AAT2601/2601A
DATA SHEET
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Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
202179B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 19, 2013
Functional Block Diagram
LDO2
Enable
LDO1
Enable
LDO4
LDO5
Enable
Enable
Enable
LDO3
Enable
BUCK
CHGIN
UVLO
BAT
PGND
SYSOUT
100 mΩ
500mΩ
PVIN
LX
OUTBUCK
OUT1
OUT2
VIN
VIN
VIN
VIN
VIN
VIN
OUT3
OUT4
OUT5
REF
AVIN2
EN5
EN4
EN3
EN_TEST
EN_HOLD
RESET
Ref
Ref
Ref
Ref
Ref
Ref
CNOISE
AGND
AVIN1
VIN
I2C
and
Enable
Control
EN_KEY
ON_KEY
SDA
SCL
ISET
Ref
Charger
Control STAT
ADPP
ENBAT
USE_USB
TS
SYSOUT
LDO
CT
EN2
Functional Description
The AAT2601 and AAT2601A are complete power man-
agement solutions which seamlessly integrate an intelli-
gent, stand-alone CC/CV (Constant Current/Constant
Voltage), linear-mode single-cell battery charger with
one step-down Buck converter and five low-dropout
(LDO) regulators to provide power from either a wall
adapter or a single-cell Lithium Ion/Polymer battery.
Internal load switches allow the LDO regulators and
DC-DC converter to operate from the best available
power source of either an AC wall adapter, USB port sup-
ply or battery.
If only the battery is available, then the voltage regula-
tors and converter are powered directly from the battery
through a 100mΩ load switch. (The charger is put into
sleep mode and draws less than 1μA quiescent current.)
20
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If the system is connected to a wall adapter, then the
voltage converters are powered directly from the adapt-
er through a 500mΩ load switch and the battery is dis-
connected from the voltage converter inputs. This
allows the system to operate regardless of the charging
state of the battery or with no battery.
System Output (SYSOUT)
Intelligent control of the integrated load switches is
managed by the switch control circuitry to allow the
Step-down converter and the LDOs to have the best
available power source. When the CHGIN pin voltage is
above 4.5V, the system automatically turns on and the
power to the SYSOUT pin will be provided by either the
CHGIN pin or the BAT pin. When the USE_USB pin is
low, the CHGIN provides power to SYSOUT through an
internal LDO regulated to 3.9V. When the USE_USB pin
is high or if forced through use of an I2C command, the
BAT pin is shorted to SYSOUT through a 100mohm
switch. If a CHGIN voltage is not present and the sys-
tem is enabled, SYSOUT will be shorted to BAT.
This system allows the step-down converter and LDOs to
always have the best available source of power. This
also allows the voltage converters to operate with no
battery, or with a battery voltage that falls below the
precondition trickle charge threshold.
Typical Power Up Sequence
The AAT2601 and AAT2601A support a variety of push-
button or enable/disable schemes. A typical startup and
shutdown process proceeds as follows (referring to
Figures 1 and 2): System startup is initiated whenever
one of the following conditions occurs:
1) A push-button is used to assert EN_KEY low.
2) A valid supply (>CHGIN UVLO) is connected to the
charger input CHGIN.
3) A hands free device or headset is connected, assert-
ing EN_TEST high.
The startup sequence for the AAT2601 and AAT2601A
core (Buck and LDO1) is typically initiated by pulling the
EN_KEY pin low with a pushbutton switch as shown in
Figure 1. The Buck (Core) is the first block to be turned
on. When the output of the Buck reaches 90% of its
final value, then LDO1 is enabled. When LDO1
(PowerDigital) reaches 90% of its final value, the 65ms
RESET timer is initiated holding the microprocessor in
reset. When the RESET pin goes High, the μP can begin
a power up sequence. After the startup sequence has
commenced, LDO2 (PowerAnalog), LDO3 (TCXO), LDO4
(TX) and LDO5 (RX) can be enabled and disabled as
desired using their independent enable pins, even while
the Buck and LDO1 are still starting up. However, if they
are shut down, then LDO2, LDO3, LDO4, and LDO5 can-
not be enabled. The μP must pull the EN_HOLD signal
high before the EN_KEY signal can be released by the
push-button. This procedure requires that the push-
button be held until the μP assumes control of EN_HOLD,
providing protection against inadvertent momentary
assertions of the pushbutton. Once EN_HOLD is high the
startup sequence is complete. If the μP is unable to
complete its power-up routine successfully before the
user lets go of the push-button, the AAT2601 will auto-
matically shut itself down. (EN_KEY and EN_HOLD are
OR’d internally to enable the two core converters.)
Alternatively, the startup sequence is automatically
started without the pushbutton switch when the CHGIN
pin rises above its UVLO threshold. The system cannot
be disabled until the voltage at the CHGIN pin drops
below the falling UVLO threshold. Thirdly, the EN_TEST
pin can be used to startup the device for test purposes
or for hands free operation such as when connecting a
headset to the system.
Typical Power Down Sequence
If only the battery is connected and the voltage level is
above the BAT UVLO , then the EN_KEY pin can be held
low in order to power down the AAT2601/AAT2601A. The
user can initiate a shutdown process by pressing the
push-button a second time. Upon detecting a second
assertion of EN_KEY (by depressing the push-button), the
AAT2601 asserts ON_KEY to interrupt the microprocessor
which initiates an interrupt service routine that the user
pressed the push-button. If EN_TEST and CHGIN are both
low, the microprocessor then initiates a power-down rou-
tine, the final step of which will be to de-assert EN_HOLD,
disabling LDO2, LDO3, LDO4, and LDO5.
When the voltage at the CHGIN pin is above the CHGIN
UVLO, the device cannot be powered down. If the volt-
age at the CHGIN pin is below the CHGIN UVLO, both the
EN_KEY and EN_HOLD pins must be held low in order to
power down the AAT2601/AAT2601A. If LDO2, LDO3,
LDO4, and LDO5 have not been disabled individually
prior to global power down, then they will be turned off
simultaneously with the Buck. The outputs of LDO4 and
LDO5 are internally pulled to ground with 10k during
shutdown to discharge the output capacitors and ensure
a fast turn-off response time.
21
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202179B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 19, 2013
BAT
CHGIN
EN_KEY
UVLO
Micro
Processor
μP
ON_KEY
OUT1
EN_ HOLD
Automatic
Tester or
Handsfree
Operation
EN_TEST
Enable for
SYSOUT and
Regulators
EN_BAT
Enable for
Battery Charger
Debounce
Push-button
On Switch
Figure 1: Enable Function Detailed Schematic.
EN_KEY
EN_HOLD
OUTBuck
(Core)
RESET
65ms
300ms
debounce
delay
OUT1
(PowerDigital)
90% Regulation
EN_HOLD must be held high
before EN _KEY can be released .
Power Up Sequence
ON_KEY
90% R egulation
Power Down Sequence
Figure 2: Typical Power Up/Down Sequence.
22
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202179B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 19, 2013
Battery Charger
Figure 3 illustrates the entire battery charging profile
which consists of three phases.
1. Preconditioning Current Mode (Trickle) Charge
2. Constant Current Mode Charge
3. Constant Voltage Mode Charge
Battery charging commences only after the AAT2601/
AAT2601A's battery charger checks several conditions in
order to maintain a safe charging environment. The sys-
tem operation flow chart for the battery charger opera-
tion is shown in Figure 4. The input supply must be
above the minimum operating voltage (UVLO) and the
enable pin (ENBAT) must be low (it is internally pulled
down). When the battery is connected to the BAT pin,
the battery charger checks the condition of the battery
and determines which charging mode to apply.
Preconditioning Current Mode
Charge Current
If the battery voltage is below the preconditioning volt-
age threshold VMIN, then the battery charger initiates
precondition trickle charge mode and charges the bat-
tery at 12% of the programmed constant-current mag-
nitude. For example, if the programmed current is
500mA, then the trickle charge current will be 60mA.
Trickle charge is a safety precaution for a deeply dis-
charged cell. It also reduces the power dissipation in the
internal series pass MOSFET when the input-output volt-
age differential is at its highest.
Constant Current Mode Charge Current
Trickle charge continues until the battery voltage reach-
es VMIN. At this point the battery charger begins con-
stant-current charging. The current level default for this
mode is programmed using a resistor from the ISET pin
to ground. Once that resistor has been selected for the
default charge current, then the current can be adjusted
through I2C from a range of 40% to 180% of the pro-
grammed default charge current. Programmed current
can be set at a minimum of 100mA and up to a maxi-
mum of 1A. When the ADPP signal goes high, the default
I2C setting of 100% is reset. If the USE_USB signal is
high when this happens, the charge current is reset to
an internally set 100mA current until the microcontroller
sends another I2C signal to change the charge current.
(see I2C Programming section).
Constant Voltage Mode Charge
Constant current charging will continue until the battery
voltage reaches the Output Charge Voltage Regulation
point VBAT_REG. When the battery voltage reaches the regu-
lation voltage (VBAT_REG), the battery charger will transition
to constant-voltage mode. VBAT_REG is factory programmed
to 4.2V (nominal). Charging in constant-voltage mode
will continue until the charge current has reduced to the
end of charge termination current programmed using the
I2C interface (5%, 10%, 15%, or 20%).
Constant Current
Charge Phase
Constant Voltage
Charge Phase
Preconditioning
Trickle Charge
Phase
I (mA) V (V)
Preconditioning Threshold
Voltage (VMiN)
Charge Termination
Threshold Current
(ICH_TERM)
T (s)
Battery End of Charge
Voltage Regulation (VBAT_REG)
FAST-CHARGE to
TOP-OFF Charge
Threshold
Trickle Charge
Timeout
(TK)
Constant-Current Mode
Charge Current (ICH_CC)
Preconditioning Charge
Current (ICH_PRE)
Charge Current
Charge Voltage
Constant Current Timeout
(TC)
Constant Voltage Timeout
(TV)
Figure 3: Current vs. Voltage and Charger Time Profile.
23
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Power On Reset
Power Input
Voltage
V
CHGIN
> V
UVLO
Fault
Conditions Monitoring
OV, OT,
V
TS
V
TS1
< < V
TS2
Preconditioning
Test
V
MIN
< V
BAT
Current Phase Test
V
BAT
< V
BAT_REG
Voltage Phase Test
I
CH
> I
CH_TERM
No
No
Yes
No
Preconditioning
(Trickle Charge)
Constant
Current Charge
Mode
Constant
Voltage Charge
Mode
Yes
Yes
Yes
Charge Completed
Charge Timer
Control
No
Recharge Test
V
RCH
< V
BAT
Yes
No
Shut Down Yes
No
Enable
Yes
No
Device Thermal
Loop Monitor
T
J
> 115°C
Thermal Loop
Current
Reduction in ADP
Charging Mode
Thermal Loop
Current
Reduction in
C.C. Mode
Expired
T < Timeout
No
Figure 4: System Operation Flow Chart for the Battery Charger.
24
AAT2601/2601A
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202179B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 19, 2013
Power Saving Mode
After the charge cycle is complete, the battery charger
turns off the series pass device and automatically goes
into a power saving sleep mode. During this time, the
series pass device will block current in both directions to
prevent the battery from discharging through the battery
charger.
The battery charger will remain in sleep mode even if the
charger source is disconnected. It will come out of sleep
mode if either the battery terminal voltage drops below
the VRCH threshold, the charger EN pin is recycled, or the
charging source is reconnected. In all cases, the battery
charger will monitor all parameters and resume charging
in the most appropriate mode.
Temperature Sense (TS)
The TS pin is available to monitor the battery tempera-
ture. Connect a 10k NTC resistor from the TS pin to
ground. The TS pin outputs a 75μA constant current into
the resistor and monitors the voltage to ensure that the
battery temperature does not fall outside the limits
depending on the temperature coefficient of the resistor
used. When the voltage goes above 2.39V or goes below
0.331V, the charging current will be suspended.
Charge Safety Timer (CT)
While monitoring the charge cycle, the AAT2601/
AAT2601A utilizes a charge safety timer to help identify
damaged cells and to ensure that the cell is charged
safely. Operation is as follows: upon initiating a charging
cycle, the AAT2601/AAT2601A charges the cell at 12% of
the programmed maximum charge until VBAT >2.8V. If the
cell voltage fails to reach the preconditioning threshold of
2.8V (typ) before the safety timer expires, the cell is
assumed to be damaged and the charge cycle terminates.
If the cell voltage exceeds 2.8V prior to the expiration of
the timer, the charge cycle proceeds into fast charge.
There are three timeout periods: 1 hour for Trickle Charge
mode, 3 hours for Constant Current mode, and 3 hours
for Constant Voltage mode.
The CT pin is driven by a constant current source and will
provide a linear response to increases in the timing
capacitor value. Thus, if the timing capacitor were to be
doubled from the nominal 0.1μF value, the time-out
periods would be doubled. If the programmable watch-
dog timer function is not needed, it can be disabled by
terminating the CT pin to ground. The CT pin should not
be left floating or unterminated, as this will cause errors
in the internal timing control circuit. The constant cur-
rent provided to charge the timing capacitor is very
small, and this pin is susceptible to noise and changes in
capacitance value. Therefore, the timing capacitor should
be physically located on the printed circuit board layout
as close as possible to the CT pin. Since the accuracy of
the internal timer is dominated by the capacitance value,
a 10% tolerance or better ceramic capacitor is recom-
mended. Ceramic capacitor materials, such as X7R and
X5R types, are a good choice for this application.
Programming Charge Current (ISET)
The default constant current mode charge level is user
programmed with a set resistor placed between the ISET
pin and ground. The accuracy of the constant charge cur-
rent, as well as the preconditioning trickle charge cur-
rent, is dominated by the tolerance of the set resistor. For
this reason, a 1% tolerance metal film resistor is recom-
mended for the set resistor function. The constant charge
current levels from 100mA to 1A may be set by selecting
the appropriate resistor value from Table 1 and Figure 5.
The ISET pin current to charging current ratio is 1 to 800.
It is regulated to 1.25V during constant current mode
unless changed using I2C commands. It can be used as a
charging current monitor, based on the equation:
I
CH
= 800
⋅
⎛
⎝⎞
⎠
V
ISET
R
ISET
During preconditioning charge, the ISET pin is regulated
to 12% of the fast charge current ISET voltage level
(Figure 5), but the equation stays the same. During con-
stant voltage charge mode, the ISET pin voltage will
slew down and be directly proportional to the battery
current at all times.
Constant Charging
Current ICH_CC (mA)
Set Resistor
Value (kΩ)
100 10
200 4.99
300 3.32
400 2.49
500 2
600 1.65
700 1.43
800 1.24
900 1.1
1000 1
Table 1: Constant Current Charge vs.
ISET Resistor Value.
25
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Reverse Battery Leakage
The AAT2601/AAT2601A includes internal circuitry that
eliminates the need for series blocking diodes, reducing
solution size and cost as well as dropout voltage relative
to conventional battery chargers. When the input supply
is removed or when CHGIN goes below the AAT2601’s
under voltage-lockout (UVLO) voltage, or when CHGIN
drops below VBAT
, the AAT2601/AAT2601A automatically
reconfigures its power switches to minimize current
drain from the battery.
Adapter Power Indicator (ADPP)
This is an open drain output which will pull low when
VCHGIN > 4.5V. When this happens, depending on the sta-
tus of the USE_USB pin, the charge current will be reset
to the default ISET values or I2C programmed values.
Charge Status Output (STAT)
The AAT2601/AAT2601A provides battery charging sta-
tus via a status pin. This pin is a buffered output with a
supply level up to the LDO1 output (PowerDigital). The
status pin can indicate the following conditions:
Event Description STAT
No battery charging activity Low (to GND)
Battery charging High (to VOUT1)
Charging completed Low (to GND)
Table 2: Charge Status Output (STAT).
CHGIN Bypass Capacitor Selection
CHGIN is the power input for the AAT2601
/AAT2601A
bat-
tery charger. The battery charger is automatically enabled
whenever a valid voltage is present on CHGIN. In most
applications, CHGIN is connected to either a wall adapter
or USB port. Under normal operation, the input of the
charger will often be “hot-plugged” directly to a powered
USB or wall adapter cable, and supply voltage ringing and
overshoot may appear at the CHGIN pin. A high quality
capacitor connected from CHGIN to G, placed as close as
possible to the IC, is sufficient to absorb the energy. Wall-
adapter powered applications provide flexibility in input
capacitor selection, but the USB specification presents
limitations to input capacitance selection. In order to meet
both the USB 2.0 and USB OTG (On The Go) specifications
while avoiding USB supply under-voltage conditions
resulting from the current limit slew rate (100mA/μs)
limitations of the USB bus, the CHGIN bypass capacitance
value must be between 1μF and 4.7μF. Ceramic capacitors
are often preferred for bypassing due to their small size
and good surge current ratings, but care must be taken in
applications that can encounter hot plug conditions as
their very low ESR, in combination with the inductance of
the cable, can create a high-Q filter that induces excessive
ringing at the CHGIN pin. This ringing can couple to the
output and be mistaken as loop instability, or the ringing
may be large enough to damage the input itself. Although
the CHGIN pin is designed for maximum robustness and
an absolute maximum voltage rating of +6.5V for tran-
Constant Current Mode Charge Current
vs. ISET Resistor
(VIN = 5V; VBAT = 3.6V)
ISET Resistor (kΩ
Ω
)
ICH_CC (mA)
0
200
400
600
800
1000
1200
1400
0.1 1 10 100
ISET Voltage vs. Battery Voltage
(CHGIN = 5.0V, RISET = 1.24kΩ
Ω
)
Battery Voltage (V)
VISET (V)
0
0.2
0.4
0.6
0.8
1
1.2
1.4
2.5 2.9 3.3 3.7 4.1 4.5
Figure 5: Constant Current Mode Charge ICH_CC Setting vs. ISET Resistor
and ISET Voltage vs. Battery Voltage.
26
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sients, attention must be given to bypass techniques to
ensure safe operation. As a result, design of the CHGIN
bypass must take care to “de-Q” the filter. This can be
accomplished by connecting a 1Ω resistor in series with a
ceramic capacitor (as shown in Figure 6A), or by bypass-
ing with a tantalum or electrolytic capacitor to utilize its
higher ESR to dampen the ringing (as shown in Figure 6A).
For additional protection, Zener diodes with 6V clamp volt-
ages may also be used. In any case, it is always critical to
evaluate voltage transients at the CHGIN pin with an oscil-
loscope to ensure safe operation.
Thermal Considerations
The actual maximum charging current is a function of
charge adapter input voltage, the state of charge of the
battery at the moment of charge, the system supply cur-
rent from SYSOUT, and the ambient temperature and the
thermal impedance of the package and printed circuit
board. The maximum programmable current may not be
achievable under all operating parameters. One issue to
consider is the amount of current being sourced to the
SYSOUT pin from the CHGIN LDO while the battery is
being charged.
The AAT2601 and AAT2601A are offered in a TQFN55-36
package which can provide up to 4W of power dissipation
when it is properly bonded to a printed circuit board and
has a maximum thermal resistance of 25°C/W. Many
considerations should be taken into account when
designing the printed circuit board layout, as well as the
placement of the charger IC package in proximity to
other heat generating devices in a given application
design. The ambient temperature around the charger IC
will also have an effect on the thermal limits of a battery
charging application. The maximum limits that can be
expected for a given ambient condition can be estimated
by the following discussion. First, the maximum power
dissipation for a given situation should be calculated:
(T
J(MAX) -
T
A
)
P
D(MAX)
= θ
JA
Where:
PD(MAX) = Maximum Power Dissipation (W)
θJA = Package Thermal Resistance (°C/W)
TJ(MAX) = Maximum Device Junction Temperature (°C)
[150°C]
TA = Ambient Temperature (°C)
To USB Port or
Wall Adapter To USB Port or
Wall Adapter
1μF Ceramic
(XR5/XR7)
4.7μF
ESR > 1Ω
1Ω
CHGIN
CHGIN
(A) (B)
Figure 6: Hot Plug Requirements.
27
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Next, the power dissipation for the charger can be cal-
culated by the following equation:
PD = (VCHGIN - VBAT) · ICH_CC + (VCHGIN · IOP) + (VCHGIN - VSYSOUT) · ISYSOUT
+ (VSYSOUT - VOUT1) · IOUT1 + (VSYSOUT - VOUT2) · IOUT2
+ (VSYSOUT - VOUT3) · IOUT3 + (VSYSOUT - VOUT4) · IOUT4
+ (VSYSOUT - VOUT5) · IOUT5
+ IOUTBUCK2 · RDS(ON)L · +
RDS(ON)H · [VSYSOUT - VOUTBUCK]
VSYSOUT
VOUTBUCK
VSYSOUT
⎛
⎝⎞
⎠
Where:
PD = Total Power Dissipation by the Device
VCHGIN = CHGIN Input Voltage
VBAT = Battery Voltage at the BAT Pin
ICH_CC = Constant Charge Current Programmed for the
Application
IOP = Quiescent Current Consumed by the IC for Normal
Operation [0.5mA]
VSYSOUT and ISYSOUT = Output voltage and load current
from the SYSOUT pin for the system LDOs and step-
down converter [3.9V out for SYSOUT]
RDS(ON)H and RDS(ON)L = On-resistance of step-down high
and low side MOSFETs [0.8Ω each]
VOUTX and IOUTX = Output voltage and load currents for
the LDOs and step-down converter [3V out for each
LDO]
By substitution, we can derive the maximum charge cur-
rent before reaching the thermal limit condition (TREG =
100°C, Thermal Loop Regulation). The maximum charge
current is the key factor when designing battery charger
applications.
ICH_CC(MAX) =
- [(VSYSOUT - VOUT1) · IOUT1] - (VSYSOUT - VOUT2) · IOUT2
- [(VSYSOUT - VOUT3) · IOUT3] - (VSYSOUT - VOUT4) · IOUT4
- (VSYSOUT - VOUT5) · IOUT5
VCHGIN - VBAT
- IOUTBUCK
2 · RDS(ON)L · + RDS(ON)H · (VSYSOUT - VOUTBUCK)
VSYSOUT
VOUTBUCK
VSYSOUT
⎛
⎝
⎛
⎝
⎞
⎠
⎞
⎠
(TREG - TA)
θJA
- (VCHGIN · IOP) - (VCHGIN - VSYSOUT) · ISYSOUT)
In general, the worst condition is when there is the
greatest voltage drop across the charger, when battery
voltage is charged up to just past the preconditioning
voltage threshold and the LDOs and step-down con-
verter are sourcing full output current.
For example, if 913mA is being sourced from the 3.9V
SYSOUT pin to the LDOs and Buck channels (300mA to
LDO1, 100mA to LDO2-5, and 213mA to the Buck; see
buck efficiency graph for 300mA output current) with a
CHGIN supply of 5V, and the battery is being charged at
3.0V with 800mA charge current, then the power dissi-
pated will be 3.32W. A reduction in the charge current
(through I2C) may be necessary in addition to the reduc-
tion provided by the internal thermal loop of the charger
itself.
For the above example at TA = 30°C, the ICH_CC(MAX) =
546mA.
Thermal Overload Protection
The AAT2601 and AAT2601A integrate thermal overload
protection circuitry to prevent damage resulting from
excessive thermal stress that may be encountered under
fault conditions, for example. This circuitry disables all
regulators if the AAT2601/AAT2601A die temperature
exceeds 140°C, and prevents the regulators from being
enable until the die temperature drops by 15°C (typ).
Synchronous Step-Down
Converter (Buck)
The AAT2601 and AAT2601A contain a high performance
300mA, 1.5MHz synchronous step-down converter. The
step-down converter operates to ensure high efficiency
performance over all load conditions. It requires only
three external power components (CIN, COUT
, and L). A
high DC gain error amplifier with internal compensation
controls the output. It provides excellent transient
response and load/line regulation. Transient response
time is typically less than 20μs. The converter has soft
start control to limit inrush current and transitions to
100% duty cycle at drop out.
The step-down converter input pin PVIN should be con-
nected to the SYSOUT LDO output pin. The output volt-
age is internally fixed at 1.8V. Power devices are sized
for 300mA current capability while maintaining over
90% efficiency at full load.
28
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Input/Output Capacitor and Inductor
Apart from the input capacitor that is shared with the LDO
inputs, only a small L-C filter is required at the output side
for the step-down converter to operate properly. Typically,
a 3.3μH inductor such as the Sumida CDRH2D11NP-
3R3NC and a 4.7μF ceramic output capacitor are recom-
mended for low output voltage ripple and small compo-
nent size. Ceramic capacitors with X5R or X7R dielectrics
are highly recommended because of their low ESR and
small temperature coefficients. A 10μF ceramic input
capacitor is sufficient for most applications.
Control Loop
The converter is a peak current mode step-down con-
verter. The inner, wide bandwidth loop controls the
inductor peak current. The inductor current is sensed
through the P-channel MOSFET (high side) which is also
used for short circuit and overload protection. A fixed
slope compensation signal is added to the sensed cur-
rent to maintain stability for duty cycles greater than
50%. The peak current mode loop appears as a voltage
programmed current source in parallel with the output
capacitor.
The output of the voltage error amplifier programs the
current mode loop for the necessary peak inductor cur-
rent to force a constant output voltage for all load and
line conditions. The voltage feedback resistive divider is
internal and the error amplifier reference voltage is
0.45V. The voltage loop has a high DC gain making for
excellent DC load and line regulation. The internal volt-
age loop compensation is located at the output of the
transconductance voltage error amplifier.
Soft Start
Soft start slowly increases the internal reference voltage
when the input voltage or enable input is initially applied.
It limits the current surge seen at the input and elimi-
nates output voltage overshoot.
Current Limit and
Over-Temperature Protection
For overload conditions the peak input current is limited.
As load impedance decreases and the output voltage
falls closer to zero, more power is dissipated internally,
raising the device temperature. Thermal protection com-
pletely disables switching when internal dissipation
becomes excessive, protecting the device from damage.
The junction over-temperature threshold is 140°C with
15°C of hysteresis.
Linear LDO Regulators (OUT1-5)
The advanced circuit design of the linear regulators has
been specifically optimized for very fast start-up and
shutdown timing. These proprietary LDOs are tailored for
superior transient response characteristics. These traits
are particularly important for applications which require
fast power supply timing.
There are two LDO input pins, AVIN1/2, which should be
connected to the SYSOUT LDO output pin. All LDO outputs
are initially fixed at 3.0V. The user can program the output
voltages for the LDOs to 2.8V, 2.85V, or 2.9V using I2C.
The high-speed turn-on capability is enabled through the
implementation of a fast start control circuit, which
accelerates the power up behavior of fundamental con-
trol and feedback circuits within the LDO regulator. For
LDO4 and LDO5, fast turn-off time response is achieved
by an active output pull down circuit, which is enabled
when the LDO regulator is placed in the shutdown mode.
This active fast shutdown circuit has no adverse effect on
normal device operation.
Input/Output Capacitors
The LDO regulator output has been specifically optimized
to function with low cost, low ESR ceramic capacitors.
However, the design will allow for operation over a wide
range of capacitor types. The input capacitor is shared
with all LDO inputs and the step-down converter. A 10μF
is sufficient. A 4.7μF ceramic output capacitor is recom-
mended for LDO2-5 and a 22μF output capacitor for
LDO1.
Current Limit and
Over-Temperature Protection
The regulator comes with complete short circuit and
thermal protection. The combination of these two internal
protection circuits gives a comprehensive safety system
to guard against extreme adverse operating conditions.
29
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202179B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 19, 2013
I2C Serial Interface
and Programmability
Serial Interface
Many of the features of the AAT2601/AAT2601A can be
controlled via the I2C serial interface. The I2C serial
interface is a widely used interface where it requires a
master to initiate all the communications with the slave
devices. The I2C protocol consists of 2 active wire SDA
(serial data line) and SCL (serial clock line). Both wires
are open drain and require an external pull up resistor
to VCC (SYSOUT may be used as VCC). The SDA pin
serves I/O function, and the SCL pin controls and refer-
ences the I2C bus. I2C protocol is a bidirectional bus
which allows both read and write actions to take place,
but the AAT2601/AAT2601A supports the write protocol
only. Since the protocol has a dedicated bit for Read or
Write access (R/W), when communicating with the
AAT2601/AAT2601A, this bit must be set to “0”.
The timing diagram in Figure 7 depicts the transmission
protocol.
START and STOP Conditions
START and STOP conditions are always generated by the
master. Prior to initiating a START condition, both the
SDA and SCL pin are idle mode (idle mode is when there
is no activity on the bus and SDA and SCL are pulled to
VCC via external resistor). As depicted in Figure 7, a
START condition is defined to be when the master pulls
the SDA line low and after a short period pulls the SCL
line low. A START condition acts as a signal to all ICs
that something is about to be transmitted on the BUS.
A STOP condition, also shown in Figure 7, is when the
master releases the bus and SCL changes from low to
high followed by SDA low to high transition. The master
does not issue an ACKNOWLEGE and releases the SCL
and SDA pins.
ACK from slave ACK from slave ACK from slave
START
SCL
SDA
including R/W bit,
Chip Address = 0x98
STOP
ACK
W
ACK
ACK
1
1
0
0
1
0
0
0
Data
LSB
MSB
LSB
Chip
Address
MSB
LSB
Register
Address
MSB
Figure 7: I2C Timing Diagram.
30
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Transferring Data
Every byte on the bus must be 8 bits long. A byte is
always sent with a most significant bit first (see Figure
8).
R/W
MSB LSB
Figure 8: Bit Order.
The address is embedded in the first seven bits of the
byte. The eighth bit is reserved for the direction of the
information flow for the next byte of information. For
the AAT2601
/AAT2601A
, this bit must be set to “0”.
The full 8-bit
address including the R/W bit is 0x98
(hex) or 10011000 in binary.
Acknowledge Bit
The acknowledge bit is the ninth bit of data. It is used
to send back a confirmation to the master that the
data has been received properly. For acknowledge to
take place, the MASTER must first release the SDA
line, then the SLAVE will pull the data line low as
shown in Figure 7.
Serial Programming Code
After sending the chip address, the master should send
an 8-bit data stream to select which register to program
and then the codes that the user wishes to enter.
Register 0x00:
Timer RCHG1RCHG0CHG2CHG1CHG0Term1Term0
Register 0x01:
Not used Not used Not used Not used Not used SYS LDO11LDO10
Register 0x02:
LDO51LDO50LDO41LDO40LDO31LDO30LDO21LDO20
Figure 9: Serial Programming Register Codes.
USE_USB Pin CHG2CHG1CHG0
Constant Current Charge
ICH_CC
Constant Current Charge as
% of ISET Current
1000 100mA
(fi xed internally) (default)
0000 800mA
(set by ISET resistor) 100% (default)
X 0 0 1 640mA 80%
X 0 1 0 480mA 60%
X 0 1 1 320mA 40%
X 1 0 0 960mA 120%
X 1 0 1 1120mA 140%
X 1 1 0 1280mA 160%
X 1 1 1 1440mA 180%
Table 3: CHG Bit Setting for the Constant Current Charge Level
(assuming ISET resistor is set to default 800mA charge current).
31
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Notes concerning the operation of the CHG2, CHG1 and
CHG0 bits or ISET code:
• Once the part is turned on using the EN_KEY pin (and
there is a BAT and/or CHGIN supply), and data is sent
through I2C, the I2C codes in the registers will always
be preserved until the part is shut down using the
EN_HOLD (going low) or if the BAT and CHGIN supply
are removed.
• If the part is turned on by connecting supply CHGIN
(and not through EN_KEY), then when the CHGIN is
removed, the part will shut down and all I2C registers
will be cleared.
If USE_USB = L:
• The charge current is set by the ISET code in Register
0x00, bits 2,3,4. (code 000 will equal 100%)
• If the part has been turned on by EN_KEY and CHGIN
is disconnected then reconnected, it will still contain
the code it had before (if it was 60% then it will
remain 60%).
• If the part has NOT been turned on by EN_KEY and
CHGIN is disconnected then reconnected, it will be
reset to 100% (since the whole part was shutdown).
If USE_USB = H:
• ISET Code 000 in Register 0x00, bits 2,3,4 = 100mA.
The other codes stay the same as if USE_USB=H.
• If the part has been turned on by EN_KEY and CHGIN
is disconnected then reconnected, the ISET code will
be forced to 000 and the current will be set to 100mA.
• The next time any I2C register is programmed (even if
it is not for the ISET code), the ISET code will revert
back to what it was before. For example, if the ISET
code is set to 010 and USE_USB=H and the part was
turned on with EN_KEY, then when CHGIN is discon-
nected then reconnected, the charger will be set to
100mA. Then if any other command is sent, the ISET
code will remain 010.
Term1Term0Termination Current (as % of Constant Current Charge)
0 0 5% (default)
0 1 10%
1 0 15%
1 1 20%
Table 4: Term Bit Setting for the Termination Current Level.
RCHG1RCHG0Recharge Threshold
0 0 4.00V (default)
0 1 4.05V
1 0 4.10V
1 1 4.15V
Table 5: RCHG Bit Setting for the Battery Charger Recharge Voltage Level.
32
AAT2601/2601A
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Timer Charger Watchdog Timer
0 ON (default)
1 OFF (and reset to zero)
Table 6: Timer Bit Setting for
the Charger Watchdog Timer.
LDO11LDO10LDO1 Output Voltage
0 0 3.00V (default)
0 1 2.90V
1 0 2.85V
1 1 2.80V
LDO21LDO20LDO2 Output Voltage
0 0 3.00V (default)
0 1 2.90V
1 0 2.85V
1 1 2.80V
LDO31LDO30LDO3 Output Voltage
0 0 3.00V (default)
0 1 2.90V
1 0 2.85V
1 1 2.80V
LDO41LDO40LDO4 Output Voltage
0 0 3.00V (default)
0 1 2.90V
1 0 2.85V
1 1 2.80V
LDO51LDO50LDO5 Output Voltage
0 0 3.00V (default)
0 1 2.90V
1 0 2.85V
1 1 2.80V
Table 7: LDO Bit Setting for
LDO Output Voltage Level.
SYS Bit SYSOUT Power Source
0If USE_USB = H, SYSOUT powered from BAT
If USE_USB = L, SYSOUT powered from CHGIN
1SYSOUT always powered from BAT
Table 8: SYS Bit Setting for SYSOUT Power Path.
Layout Guidance
Figure 10 is the schematic for the evaluation board. The
evaluation board has extra components for easy evalua-
tion; the actual BOM need for a system is shown in Table
9. When laying out the PC board, the following layout
guideline should be followed to ensure proper operation
of the AAT2601/AAT2601A:
1. The exposed pad EP must be reliably soldered to
PGND/AGND and multilayer GND. The exposed ther-
mal pad should be connected to board ground plane
and pins 2 and 16. The ground plane should include
a large exposed copper pad under the package with
VIAs to all board layers for thermal dissipation.
2. The power traces, including GND traces, the LX
traces and the VIN trace should be kept short, direct
and wide to allow large current flow. The L1 connec-
tion to the LX pins should be as short as possible.
Use several via pads when routing between layers.
3. The input capacitors (C1 and C2) should be con-
nected as close as possible to CHGIN (Pin 28) and
PGND (Pin 2) to get good power filtering.
4. Keep the switching node LX away from the sensitive
OUTBUCK feedback node.
5. The feedback trace for the OUTBUCK pin should be
separate from any power trace and connected as
closely as possible to the load point. Sensing along a
high current load trace will degrade DC load regula-
tion.
6. The output capacitor C4 and L1 should be connected
as close as possible and there should not be any
signal lines under the inductor.
7. The resistance of the trace from the load return to
the PGND (Pin 2) should be kept to a minimum. This
will help to minimize any error in DC regulation due
to differences in the potential of the internal signal
ground and the power ground.
33
AAT2601/2601A
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Quantity Value Designator Footprint Description
510μF C1, C2, C3, C14, C15 0603 Capacitor, Ceramic, X5R, 6.3V, ±20%
222μF C9 0805 Capacitor, Ceramic, 20%, 6.3V, X5R
4 4.7μF C4, C5, C6, C7, C8 0603 Capacitor, Ceramic, 20%, 6.3V, X5R
3 0.1μF C10, C11, C12 0402 Capacitor, Ceramic, 16V, 10%, X5R
1 0.01μF C13 0402 Capacitor, Ceramic, 16V, 10%, X7R
1 3.3μH L1 CDRH2D Inductor, Sumida CDRH2D11NP-3R3NC
9 100K R5, R8, R20, R21, R22, R23, R25, R26, R27 0402 Resistor, 5%
8 10K R17, R19, R24, R29, R31, R32, R33, R37 0402 Resistor, 5%
1 1.24K R18 0402 Resistor, 1%
Table 9: Minimum AAT2601/AAT2601A Bill of Materials.
34
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202179B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 19, 2013
1 2
3 4
5 6
7 8
910
11 12
13 14
15 16
17 18
19 20
21 22
23 24
25 26
J1
Header 13X 2H
1 2
3 4
5 6
7 8
910
11 12
13 14
15 16
17 18
19 20
21 22
23 24
25 26
J2
Header 13X 2H
EN_TEST
1EN_HOLD
2EN_KEY
3
ON- K EY 4
EN2
5
EN3
6
EN4
7
EN5
8
OUT5 9
OUT4 10
AVIN2 11
OUT3 12
OUT2 13
AVIN1 14
OUT1 15
AGND 16
CNOISE 17
RESET 18
ADPP 19
LX 20
PGND 21
PVI N 22
OUTBUCK 23
SYSOUT 24
SYSOUT 25
BAT 26
BAT 27
CHGIN
28
USE_USB
29
ENB A T
30
TS
31
ISET
32
CT
33
STAT 34
SDA
35
SCL
36
EP 37
U1
AAT2601/2601A
1
3
2
J11
VBUS/VCHG
C5
4.7
μ
F
J4
BUCK
J5
OU T 5
J6
OUT4
J7
OUT3
J8
OU T 2
J9
OUT1
J3
VBATT
BAT VDIG VDIG VDI G VDIG
CH G I NCHGINVDIGBAT
PW R_ O N
HF_PW R
RX _EN
PWR_HOLD
TX_EN
USE_USB
TCXO_EN A NA_EN
CHG_EN
ST A T
BA T_I D
VANA
VTCXO
VCORE
ACOK_N
RESET_N
BAT_ID
VDIG
PON _N
CH G_ EN
USE_USB
TP2
CH GI N
TP1
VB ATT
TP3
ACOK_N
TP4
PO N _ N
TP5
RESET_N
TP6
ST A T _N
TP7
GND
TP8
GN D
SD A
SCL
SD A
1
SCL
2
GND
3
4
J10
DATA HEA DER
VBATT
PW R_ H O L D
HF_PWR
PW R_ O N
VDIG
VRX
VTX
ANA_EN
TX _E N
RX_EN
VBA TT
TCXO_EN
VBUS
VCHG
VBATT
L1 3.3μH
ACOK _N
PON_N
RESET _N
STAT
VCORE VRX VTX VTCXO VANA VDIG
1
3
2
J13
RX _EN
1
3
2
J14
TX_EN
1
3
2
J15
TCXO_EN
1
3
2
J16
ANA _EN
1
3
2
J20
CH G_ EN
1
3
2
J19
USE_USB
1
3
2
J18
PWR_HOL D
1
3
2
J17
HF_PWR
Q1
CMPT3904
Sy s o ut
buckout
CH GI N
OU T 1
OU T 2
OU T 3
OU T 4
OU T 5
BA T
TP9 LX
TP10 Sysout
VDIG
R34 0
R35 0
R36 0
SW 1
PW R_ O N
R30
1K
D1
LED GREEN
R31
10K
R33
10K
1 3
2J12
I NT /EXT PWR
TP11
EXT PWR
VCORE
R3 0
R2 0
R4 0
R6 0
R9 0
R10 0
R12 0
R14 0
R7 DNP
R11 0
R13 0
R15 0
R16 0
R29
10K
R37
10K
R17
10K
R28
4.75K
R5
100K
R8
100K
R24
10K
R19
10K
R20
100K
R21
100K
R22
100K
R23
100K
R25
100K
R26
100K
R27
100K
Sysout
C1
10μF
C2
10μF
C10
0.1μF
C11
0.1μF
C12
0.1μF
R18
1.24K
C13
0.01
μ
F
C4
4. 7
μ
F
C9
22
μ
F
C6
4.7
μ
F
C7
4.7
μ
F
C8
4.7
μ
F
C3
10μF
R1 0
R32 10K
C14
10μF
TP12
GND
C15
10μF
(TBD)
Figure 10: AAT2601/AAT2601A Evaluation Kit Schematic.
35
AAT2601/2601A
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202179B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 19, 2013
Figure 11: AAT2601/AAT2601A Evaluation Kit Top Layer.
Figure 12: AAT2601/AAT2601A Evaluation Kit Mid1 Layer.
36
AAT2601/2601A
DATA SHEET
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Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
202179B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 19, 2013
Figure 13: AAT2601/AAT2601A Evaluation Kit Mid2 Layer.
Figure 14: AAT2601/AAT2601A Evaluation Kit Bottom Layer.
37
AAT2601/2601A
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Ordering Information
Package Part Marking1Part Number (Tape and Reel)2
TQFN55-36 XPXYY AAT2601IIH-T1
TQFN55-36 Q3XYY AAT2601AIIH-3.3-T1
TQFN55-36 9AXYY AAT2601AIIH-T1
Skyworks Green™ products are compliant with
all applicable legislation and are halogen-free.
For additional information, refer to Skyworks
Definition of Green™, document number
SQ04-0074.
Packaging Information
TQFN55-364
0.750 ± 0.050
0.000 + 0.050
- 0.000
0.203 REF
0.200 ± 0.050
0.450 ± 0.050
0.40 BSC
5.000 ± 0.050
5.000 ± 0.050
3.600 ± 0.050
Detail "A"
3.600 ± 0.050
Top View
Side View
Detail "A"
Bottom View
Index Area
(D/2 x E/2)
R = 0.1
C = 0.3
All dimensions in millimeters.
1. XYY = assembly and date code.
2. Sample stock is generally held on part numbers listed in BOLD.
3. The leadless package family, which includes QFN, TQFN, DFN, TDFN and STDFN, has exposed copper (unplated) at the end of the lead terminals due to the manufacturing
process. A solder fillet at the exposed copper edge cannot be guaranteed and is not required to ensure a proper bottom solder connection.
38
AAT2601/2601A
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202179B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 19, 2013
Copyright © 2012, 2013 Skyworks Solutions, Inc. All Rights Reserved.
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works may change its documentation, products, services, specifi cations or product descriptions at any time, without notice. Skyworks makes no commitment to update the materials or information and shall have no
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