Multilayer Ceramic Capacitor
Multilayer Ceramic Capacitor
- 1 -
■INTRODUCTION
MLCC(Multilayer Ceramic Capacitor) is SMD(Surface Mounted Device) type capacitor that is used
in wide ranges of capacitance. MLCC is paid more attentions than other capacitors due to the
better frequency characteristics, higher reliability, higher withstanding voltage and so on.
MLCC is made of many layers of ceramic and inner electrodes like sandwich. Pd was used for
inner electrodes. But the price of Pd was skyrocketed and Pd was replaced by the BME(Base
Metal Electrode), which reduced the total cost of MLCC.
This inner electrode is connected to outer termination for surface mounting, which is composed of
three layers, Cu or Ag layer, Ni plating layer, and SnPb or Sn plating layer. Most of MLCCs
become Pb free by the environmental issue at present.
MLCC is divided into two classes. Class I(C0G, etc) is the temperature compensating type. It has
a small TCC(Temperature Coefficient of Capacitance) and a better frequency performance.
Therefore, it is used in RF applications such as cellular phone, tuner, and so on. Class II(X7R,
X5R, Y5V, etc) is the high dielectric constant type, which is used in general electronic circuit.
Especially high capacitance MLCC is replacing other capacitors (Tantalum and Aluminum
capacitor) due to the low ESR(Equivalent Series Resistance) value.
■FEATURE AND APPLICATION
●Feature
-MiniatureSize
- Wide Capacitance and Voltage Range
- Highly Reliable Performance
- Tape & Reel for Surface Mount Assembly
- Low ESR
- High Q at High Frequencies
- Stable Temperature Dependence of Capacitance
●Application
- High Frequency Circuit(Tuner, VCO, PAM etc)
- General Power Supply Circuit(SMPS etc)
- DC-DC Converter
- General Electronic Circuit
Multilayer Ceramic Capacitor
- 2 -
■STRUCTURE
Multilayer Ceramic Capacitor
- 3 -
■APPEARANCE AND DIMENSION
L
BW
TW
CODE EIA CODE DIMENSION ( mm )
L W T(MAX) BW
03 0201 0.6 ±0.03 0.3 ±0.03 0.3 ±0.03 0.15±0.05
05 0402 1.0 ±0.05 0.5 ±0.05 0.5 ±0.05 0.2+0.15/-0.1
10 0603 1.6 ±0.1 0.8 ±0.1 0.8 ±0.1 0.3 ±0.2
21 0805 2.0 ±0.1 1.25 ±0.1 1.25±0.1 0.5+0.2/-0.3
31 1206 3.2 ±0.2 1.6 ±0.2 1.6 ±0.2 0.5+0.2/-0.3
32 1210 3.2 ±0.3 2.5 ±0.2 2.5 ±0.2 0.6 ±0.3
43 1812 4.5 ±0.4 3.2 ±0.3 3.2 ±0.3 0.8 ±0.3
55 2220 5.7 ±0.4 5.0 ±0.4 3.2 ±0.3 1.0 ±0.3
Multilayer Ceramic Capacitor
- 4 -
■PREVIOUS PART NUMBERING
Symbol EIA Code Temperature
Coefficient(PPM/℃)
※Temperature
Characteristics Operation
Temperature Range
CC0G(CH) 0±30 CΔ
-55 ~ +125℃
PP2H -150 ±60 PΔ
RR2H -220 ±60 RΔ
SS2H -330 ±60 SΔ
TT2H -470 ±60 TΔ
UU2J -750 ±120 UΔ
LS2L +350 ~ -1000 SL
▶CLASS Ⅰ(Temperature Compensation)
Temperature
Characteristics below 2.0pF 2.2 ~ 3.9pF above 4.0pF above 10pF
CΔC0G C0G C0G C0G
PΔ-P2J P2H P2H
RΔ-R2J R2H R2H
SΔ-S2J S2H S2H
TΔ-T2J T2H T2H
UΔ-U2J U2J U2J
Symbol EIA Code Capacitance Change
(ΔC:%) Operation
Temperature Range
AX5R ±15 -55 ~ +85℃
BX7R ±15 -55 ~ +125℃
FY5V +22 ~ -82 -30 ~ +85℃
▶CLASS Ⅱ(High Dielectric Constant)
SAMSUNG Multilayer Ceramic Capacitor
Type(Size)
Capacitance Temperature Characteristics
Nominal Capacitance
Capacitance Tolerance
Rated Voltage
Thickness Option
Packaging Type
CL10C101JBNC
CAPACITANCE TEMPERATURE CHARACTERISTICS
※Temperature Characteristics
☞K:±250 PPM/℃
J:±120 PPM/℃
H:±60 PPM/℃
G:±30 PPM/℃
●
3
●
7
●
8
●
2
●
6
●
3
●
4
●
5
●
2●
6
●
3●
4●
5●
7●
8
●
1
●
1
Multilayer Ceramic Capacitor
- 5 -
Temperature
Characteristics Symbol Tolerance Applicable Capacitance & Range
C0G(NPO)
or
T.C Series
B±0.1pF 0.5 ~ 3pF
C±0.25pF 0.5 ~ 10pF
D±0.5pF
F±1pF 6 ~ 10pF
G±2%
E-24 Series for over 10pFJ±5%
K±10%
A(X5R)
B(X7R)
J±5%
E-12 SeriesK±10%
M±20%
F(Y5V) Z-20% ~ +80% E-6 Series
CAPACITANCE TOLERANCE
The nominal capacitance value is expressed in pico-Farad(pF) and identified by three-
digit number, first two digits represent significant figures and last digit specifies the
number of zeros to follow. For values below 1pF, the letter "R" is used as the decimal
point and the last digit becomes significant.
example)
100 : 10 ×10o=10pF
102 : 10 ×102= 1000pF
020 : 2 ×10o=2pF
1R5 : 1.5pF
NOMINAL CAPACITANCE
●
5
●
4
※Please consult us for special tolerances.
Symbol Rated Voltage(Vdc) Symbol Rated Voltage(Vdc)
Q6.3V D200V
P10V G500V
O16V I1000V
A25V J2000V
B50V K3000V
C100V
RATED VOLTAGE
●
6
Multilayer Ceramic Capacitor
- 6 -
Symbol Packaging Symbol Packaging
BBulk FEmbossed Tape, 13" Reel
PCassette LPaper 13" Reel
CPaper Tape, 7" Reel OPaper 10" Reel
DPaper Tape, 13" Reel SEmbossed Tape, 10" Reel
EEmbossed Tape, 7" Reel
PACKAGING TYPE
THICKNESS OPTION
Symbol Description of the Code
NStandard thickness (please refer to standard thickness table on next page)
AThinner than standard thickness
BThicker than standard thickness
CStandard Thickness High Q ( Low ` D.F ` )
DSn-100% (High-Q)
ESn-100% (General)
※Please Consult us for other termination type.
●
7
●
8
Series Capacitance Step
E- 3 1.0 2.2 4.7
E- 6 1.0 1.5 2.2 3.3 4.7 6.8
E-12 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2
E-24 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2
1.1 1.3 1.6 2.0 2.4 3.0 3.6 4.3 5.1 6.2 7.5 9.1
※Standard Capacitance is " Each step ×10n"
▶STANDARD CAPACITANCE STEP
Multilayer Ceramic Capacitor
- 7 -
■NEW PART NUMBERING
CL10C101JB8NNNC
●
1●
2●
3●
4●
5●
6●
7●
8●
9●
10 ●
11
●
1PRODUCT ABBREVIATION
Symbol Product Abbreviation
CL SAMSUNG Multilayer Ceramic Capacitor
●
2SIZE(mm)
Symbol Size(mm)
Length Width
03 0.6 0.3
05 1.0 0.5
10 1.6 0.8
21 2.0 1.2
31 3.2 1.6
32 3.2 2.5
43 4.5 3.2
55 5.7 5.0
SAMSUNG Multilayer Ceramic Capacitor
Size(mm)
Capacitance Temperature Characteristic
Nominal Capacitance
Capacitance Tolerance
Rated Voltage
Thickness Option
Product & Plating Method
Samsung Control Code
Reserved For Future Use
Packaging Type
●
7
●
8
●
2
●
6
●
3
●
4
●
5
●
1
●
9
●
10
●
11
Multilayer Ceramic Capacitor
- 8 -
●
3CAPACITANCE TEMPERATURE CHARACTERISTIC
Symbol Temperature Characteristics Temperature
Range
C
Class Ⅰ
COG C△0±30(ppm/℃)
-55 ~ +125℃
PP2H P△-150±60
RR2H R△-220±60
SS2H S△-330±60
TT2H T△-470±60
UU2J U△-750±60
LS2L S△+350 ~ -1000
A
Class Ⅱ
X5R X5R ±15% -55 ~ +85℃
BX7R X7R ±15% -55 ~ +125℃
FY5V Y5V +22 ~ -82% -30 ~ +85℃
※Temperature Characteristic
Temperature
Characteristics Below 2.0pF 2.2 ~ 3.9pF Above 4.0pF Above 10pF
CΔC0G C0G C0G C0G
PΔ-P2J P2H P2H
RΔ-R2J R2H R2H
SΔ-S2J S2H S2H
TΔ-T2J T2H T2H
UΔ-U2J U2J U2J
J:±120PPM/℃,H:±60PPM/℃,G:±30PPM/℃
●
4NOMINAL CAPACITANCE
Nominal capacitance is identified by 3 digits.
The first and second digits identify the first and second significant figures of the capacitance.
The third digit identifies the multiplier. 'R' identifies a decimal point.
●Example
Symbol Nominal Capacitance
1R5 1.5pF
103 10,000pF, 10nF, 0.01μF
104 100,000pF, 100nF, 0.1μF
Multilayer Ceramic Capacitor
- 9 -
●
5CAPACITANCE TOLERANCE
Symbol Tolerance Nominal Capacitance
A±0.05pF
Less than 10pF
(Including 10pF)
B±0.1pF
C±0.25pF
D±0.5pF
F±1pF
F±1%
More than 10pF
G±2%
J±5%
K±10%
M±20%
Z+80, -20%
●
6RATED VOLTAGE
Symbol Rated Voltage Symbol Rated Voltage
Q6.3V E250V
P10V G500V
O16V H630V
A25V I1,000V
B50V J2,000V
C100V K3,000V
D200V
Multilayer Ceramic Capacitor
- 10 -
●
7THICKNESS OPTION
Type Symbol Thickness(T) Spec
0603 30.30 ±0.03
1005 50.50 ±0.05
1608 80.80 ±0.10
2012
A0.65 ±0.10
C0.85
F1.25 ±0.10
3216
C0.85 ±0.15
F1.25 ±0.15
H1.6 ±0.20
3225
F1.25
±0.20
H1.6
I2.0
J2.5
4532
F1.25
±0.20
H1.6
I2.0
J2.5
L3.2 ±0.30
5750
F1.25
±0.20
H1.6
I2.0
J2.5
L3.2 ±0.30
Multilayer Ceramic Capacitor
- 11 -
●
8PRODUCT & PLATING METHOD
Symbol Electrode Termination Plating Type
APd Ag Sn_100%
NNi Cu Sn_100%
GCu Cu Sn_100%
●
9SAMSUNG CONTROL CODE
Symbol Description of the code Symbol Description of the code
AArray (2-element) NNormal
BArray (4-element) PAutomotive
CHigh - Q W3 Terminal EMI Filter
LLICC
●
10 RESERVED FOR FUTURE USE
Symbol Description of the code
NReserved for future use
●
11 PACKAGING TYPE
Symbol Packaging Type Symbol Packaging Type
BBulk FEmbossing 13" (10,000EA)
PBulk Case LPaper 13" (15,000EA)
CPaper 7" OPaper 10"
DPaper 13" (10,000EA) SEmbossing 10"
EEmbossing 7"
Multilayer Ceramic Capacitor
- 12 -
▶CAPACITANCE vs CHIP THICKNESS STANDARD
Description 0603
(0201) 1005
(0402) 1608
(0603) 2012 Type
(0805) 3216 Type
(1206) 3225 Type
(1210) 4532 Type
(1812) 5750 Type
(2220)
Dimension
(mm)
L0.6
±0.03 1.0
±0.05 1.6
±0.1 2.0±0.1 3.2±0.15 3.2
±0.2 3.2±0.3 4.5±0.4 5.7±0.4
W0.3
±0.03 0.5
±0.05 0.8
±0.1 1.25±0.1 1.6±0.15 1.6
±0.2 2.5±0.2 3.2±0.3 5.0±0.4
T0.3
±0.03 0.5~
±0.05 0.8
±0.1 0.65
±0.1 0.85
±0.1 1.25
±0.1 0.85
±0.15 1.25
±0.15 1.6
±0.2 1.25
±0.2 1.6
±0.2 2.0
±0.2 2.5
±0.2 1.25
±0.2 1.6
±0.2 2.0
±0.2 2.5
±0.2 1.6
±0.2 2.0
±0.2 2.5
±0.2
C
A
P
A
C
I
T
A
N
C
E
R
A
N
G
E
(
p
F
)
SL 50V -0.5~
240 0.5 ~
1000 0.5
~1000 1100 ~
1500 1600~
2700 0.5 ~
2700 3000~
5600 6200~
8200 - - - - - - - - - - -
C, TC
(Except
SL,UJ)
25V 0.5~
47 0.5~
220 0.5 ~
1000 - - 3300~
8200 1500~
3600 3900~
6800 7500~
10000 - - - - - 100000 - - - - -
50V -0.5 ~
180 0.5 ~
1000 0.5 ~
560 620~
1000 1100~
3300 0.5 ~
2200 2400~
4700 -560~
10000 11000
~
22000 24000~
47000 -1000~
13000 15000~
22000 24000~
47000 62000~
68000 43000 93000 130000
C
A
P
A
C
I
T
A
N
C
E
R
A
N
G
E
(
n
F
)
A
(X5R)
6.3V 10 220 2200 - - 10000 - - 10000 - - - 22000 - - - 47000 - - 47000
10V 10 100 1000 - - 2200 - - 4700~
10000 - - - 22000 - - - - - - 47000
16V -47 330~
470 - - 1000 - - 4700 - - - 6800~
10000 - - - - - - -
25V - - - - - - - - - - - - - - - - - - - -
50V -6.8~
10 - - - - - - - - - - - - - - - - - -
B
(X7R)
6.3V 0.1~
10 47~
100 470~
1000 - - 1000 - - 6800~
10000 - - - 22000 - - - - - - -
10V 0.1~
10 33~
100 220~
470 220~
270 330~
470 560~
1000 -1000~
3300 4700 1500~
2200 3300 3900~
4700 - - - - 22000 - - -
16V 0.1~
110~
33 100~
220 68~
200 220~
330 390~
1000 330~
680 1000~
1500 2200~
3300 1500~
2200 3300 3900~
4700 ---2200 - - - -
25V -4.7~
10 47~
100 39~
68 82~
100 150~
470 100~
330 470~
620 680~
1000 680~
1500 1800 2200 ---1000 - - - 10000
50V -0.22~
4.7 0.22~
100 0.22~
39 47~
100 220 1~
150 220 390~
1000 2.2~
680 820~
1000 - - 10~
1000 - - - - - 3300~
4700
F
(Y5V)
6.3V 10~
100 -2200 - - 10000 - - - - - 47000 - - - - - - - -
10V -220~
330 100~
1000 - - 4700 -4700 10000~
22000 - - - 22000 - - - - - - 100000
16V -10~
220 100~
1000 10~
680 820~
1000 1200~
2200 1000~
2200 2700~
4700 10000 3300~
6800 10000 15000 ---22000 - - - -
25V -10~
33 22~
330 10~
220 270~
470 560~
1000 470~
1000 1200~
2200 2700~
3300 1000~
3300 4700~
10000 - - - - - 10000 - - -
50V -2.2~
10 2.2~
100 2.2~
68 82~
150 180~
1000 10~
470 560~
1000 -100~
1000 - - - - - - 10000 - - -
Multilayer Ceramic Capacitor
- 13 -
■PACKAGING
●CARDBOARD PAPER TAPE
Symbol W F E P1 P2 P0 D t A B
Type
D
i
m
e
n
s
i
o
n
03
8.0
±0.3 3.5
±0.05 1.75
±0.1
2.0
±0.05
2.0
±0.05 4.0
±0.1 Φ1.5
+0.1/-0
0.37
±0.03 0.38
±0.03 0.68
±0.03
05 0.6
±0.05 0.65
+0.05/-0.1 1.15
+0.05/-0.1
10
4.0
±0.1 1.1
MAX
1.1
±0.2 1.9
±0.2
21 1.6
±0.2 2.4
±0.2
31 2.0
±0.2 3.6
±0.2
unit:mm
●EMBOSSED PLASTIC TAPE
Symbol W F E P1 P2 P0 Dt0 t1 A B
Type
D
i
m
e
n
s
i
o
n
21
8.0
±0.3 3.5
±0.05 1.75
±0.1 4.0
±0.1 2.0
±0.05 4.0
±0.1 Φ1.5
+0.1/-0 0.6
max 2.5
max
1.45
±0.2 2.3
±0.2
31 2.0
±0.2 3.6
±0.2
32 2.9
±0.2 3.6
±0.2
43 3.6
±0.2 4.9
±0.2
55 5.4
±0.2 6.0
±0.2
unit : mm
A
B
Feeding round holes Perforated square
holes for inserting a chip D
P0 P1P2
W
F
E
t1
t0
A
B
Feeding round holes Perforated square
holes for inserting a chip
D
P0 P1P2
W
F
E
t
Multilayer Ceramic Capacitor
- 14 -
●TAPING SIZE
Empty Section
45 Pitch Packed Part Empty Section
50 Pitch
Loading Section
35 Pitch
STARTEND
●REEL DIMENSION
EC
D
R
A
W
B
t
Symbol A B C D E W t R
7" Reel φ178±2.0 min.φ50
φ13±0.5 21±0.8 2.0±0.5 10±1.5 0.8±0.2 1.0
13"
Reel φ330±2.0 min.φ70
unit:mm
Symbol Cardboard Paper Tape Embossed Plastic Tape
7" Reel 4000 2000
13" Reel 15000 -
unit:pcs
Multilayer Ceramic Capacitor
- 15 -
Size 05(0402) 10(0603) 21(0805)
T≤0.85mm T≥1.0mm
Quantity 50,000 10,000~15,000* 10,000 5,000
●BULK CASE PACKAGING
- Bulk case packaging can reduce the stock space and transportation costs.
- The bulk feeding system can increase the productivity.
- It can eliminate the components loss.
ABT
CDE
FW
L
G
H
I
Symbol A B T C D E
Dimension 6.8±0.1 8.8±0.1 12±0.1 1.5+0.1/-0 2+0/-0.1 4.7±0.1
Symbol F W G H L I
Dimension 31.5+0.2/-0 36+0/-0.2 19±0.35 7±0.35 110±0.7 5±0.35
●QUANTITY
*Option
Multilayer Ceramic Capacitor
- 16 -
■CHARACTERISTIC MAP
●CLASS Ⅰ
Temperature
Characteristics Size Voltage Capacitance Range (㎊)
SL,UJ
05
(0402) 50V
10
(0603) 50V
21
(0805) 50V
31
(1206) 50V
C(COG) &
TC Series
03
(0201) 25V
05
(0402)
25V
50V
10
(0603)
25V
50V
21
(0805)
25V
50V
31
(1206)
25V
50V
32
(1210)
50V
100V
43
(1812)
25V
50V
55
(2220) 50V
10 100 1000 10000 100000 1000000 10000000 100000000
0.5
240
2700
8200
1000
1000
10000
1500
3300
4700
1000
180
220
47
8200
3300
18000
4700
560 47000
680001000
100000
130000
43000
Multilayer Ceramic Capacitor
- 17 -
●CLASS Ⅱ,A(X5R)
Temperature
Characteristics Size Voltage Capacitance Range (㎊)
A(X5R)
0603
(0201)
6.3V
10V
1005
(0402)
6.3V
10V
16V
50V
1608
(0603)
6.3V
10V
16V
2012
(0805)
6.3V
10V
16V
3216
(1206)
6.3V
10V
16V
3225
(1210)
6.3V
10V
16V
4532
(1812) 6.3V
5750
(2220)
6.3V
10V
10 100 1000 10000 100000 1000000 10000000 100000000
10000
100000
10000
10000000
4700000
22000000
2200000
10000000
4700000
22000000
47000000
47000
10000
6800
1000000
2200000
1000000
470000
330000
10000000
10000000
6800000
47000000
47000000
220000
Multilayer Ceramic Capacitor
- 18 -
●CLASS Ⅱ,B(X7R)
Temperature
Characteristics Size Voltage Capacitance Range (㎊)
B(X7R)
03
(0201)
6.3V
10V
16V
05
(0402)
6.3V
10V
16V
25V
50V
10
(0603)
6.3V
10V
16V
25V
50V
21
(0805)
6.3V
10V
16V
25V
50V
31
(1206)
6.3V
10V
16V
25V
50V
10 100 1000 10000 100000 1000000 10000000 100000000
100000
47000
4700000
470000
100000
1000000
470000
220000
1000000
3300000
1000000
1000000
100 10000
10000000
100000
100000
100 10000
100 1000
6800000
33000
10000 33000
100004700
4700220
470000
220000
220000
100000
47000
220
220000
100000068000
39000
220
1000000
330000
100000
10000001000
Multilayer Ceramic Capacitor
- 19 -
●CLASS Ⅱ,B(X7R)
Temperature
Characteristics Size Voltage Capacitance Range (㎊)
B(X7R)
32
(1210)
6.3V
10V
16V
25V
50V
43
(1812)
10V
16V
25V
50V
55
(2220)
25V
50V
10 100 1000 10000 100000 1000000 10000000 100000000
22000000
100000010000
4700000
1500000
22000000
1000000
10000000
4700000
3300000
47000001500000
2200000
680000
10000002200
2200000
Multilayer Ceramic Capacitor
- 20 -
●CLASS Ⅱ,F(Y5V)
Temperature
Characteristics Size Voltage Capacitance Range (㎊)
F(Y5V)
03
(0201) 6.3V
05
(0402)
10 V
16 V
25 V
50 V
10
(0603)
6.3V
10 V
16 V
25 V
50 V
21
(0805)
6.3V
10 V
16 V
25 V
50 V
31
(1206)
10 V
16 V
25 V
50 V
32
(1210)
6.3V
10 V
16 V
25 V
50 V
43
(1812)
16V
25 V
50 V
55
(2220) 10 V
330000
33000
10000
220000
10000
2200
1000000
330000
100000
100000
22000
2200
1000000
2200000
10000
10000
22000000
4700000
10000000
3300000
1000000
1000000
470000
10000
4700000
1000000
15000000
3300000
1000000
100000
10000000
22000000
10000 220000
10000000
10000000
100000000
2200000
10000000
10000010000
1000000
100000
1000000
2200
47000000
22000000
10 100 1000 10000 100000 1000000 10000000 100000000
Multilayer Ceramic Capacitor
- 21 -
■RELIABILITY TEST DATA
NO ITEM PERFORMANCE TEST CONDITION
1APPEARANCE NO ABNORMAL EXTERIOR APPEARANCE THROUGH MICROSCOPE(×10)
2INSULATION
RESISTANCE
10,000㏁OR 500㏁·㎌ PRODUCT WHICHEVER IS
SMALLER
(RATED VOLTAGE IS BELOW 16V
: 10,000㏁OR 100㏁·㎌)
RATED VOLTAGE SHALL BE APPLIED.
MEASUREMENT TIME IS 60 ~ 120 RATED VOLTAGE
TIME 60 SEC.
3WITHSTANDING
VOLTAGE
NO DIELECTRIC BREAKDOWN OR
MECHANICAL BREAKDOWN
CLASSⅠ: 300% OF THE RATED VOLTAGE FOR 1~5 SEC,
CLASSⅡ:250% OF THE RATED VOLTAGE FOR 1~5 SEC
IS APPLIED WITH LESS THAN 50㎃CURRENT
4CAPACIT
ANCE
CLASS
Ⅰ
WITHIN THE SPECIFIED
TOLERANCE
CAPACITANCE FREQUENCY VOLTAGE
1,000㎊AND
BELOW 1㎒±10%
0.5 ~ 5 Vrms
MORE THAN
1,000㎊1㎑±10%
CLASS
Ⅱ
WITHIN THE SPECIFIED
TOLERANCE
CAPACITANCE FREQUENCY VOLTAGE
10㎌AND BELOW 1㎑±10% 1.0±0.2Vrms
MORE THAN
10㎌120㎐±20% 0.5±0.1Vrms
5 Q CLASS
Ⅰ
OVER 30㎊:Q≥1,000
LESS THAN 30㎊:Q≥400 +20C
( C : CAPACITANCE )
CAPACITANCE FREQUENCY VOLTAGE
1,000㎊AND
BELOW 1㎒±10%
0.5 ~ 5 Vrms
MORE THAN
1,000㎊1㎑±10%
6TanδCLASS
Ⅱ
1. CHAR : B
2. CHAR : F
CAPACITANCE FREQUENCY VOLTAGE
10㎌AND BELOW 1㎑±10% 1.0±0.2Vrms
MORE THAN 10㎌120㎐±20% 0.5±0.1Vrms
RATED VOLTAGE DF SPEC
6.3V 0.05 max
10V 0.05 max
16V 0.035 max
25V 0.025 max
50V 이상 0.025 max
6.3V 10V 16V 25V 50V
1005 -0.125max 0.09max (C＜220nF)
0.125max (C≥220nF) 0.05max 0.05max
1608 0.16max 0.125max 0.09max 0.05max(C≤100nF)
0.07max(C>100nF) 0.05max
2012 0.16max 0.125max 0.09max 0.07max 0.05max
3216 0.16max 0.125max 0.09max 0.07max 0.05max
3225 0.16max 0.125max 0.09max 0.07max(C≤6.8㎌)
0.09max(C>6.8㎌)0.05max
4532 0.16max 0.16max 0.09max - -
5750 0.125max - - -
Multilayer Ceramic Capacitor
- 22 -
NO ITEM PERFORMANCE TEST CONDITION
7
CAPACITANCE
TEMPERATURE
COEFFICIENT
CLASS
Ⅰ
THESE SYMMETRICAL TOLERANCE APPLY TO
2 POINT MEASUREMENT OF TEMPERATURE
COEFFICIENT: ONE AT 25℃AND AT 85℃
8
TEMPERATURE
CHARACTERISTIC
S
CLASS
Ⅱ
CAPACITANCE CHANGE
The change of capacitance should be got from
the capacitance at 25℃.
After capacitance measured from Min. Temp. to
Max. Temp.,
itshouldbecalculatedfromtheformulabelow.
C2 - C1
C1
C1 : CAPACITANCE AT STANDARD
TEMPERATURE(25℃)
C2 : CAPACITANCE AT EACH
TEMPERATURE
9ADHESIVE STRENGTH
OF TERMINATION
NO INDICATION OF PEELING SHALL
OCCUR ON THE TERMINAL
ELECTRODE.
A 500g.f PRESSURE SHALL BE
APPLIED FOR 10±1 SECOND.
SEE (FIG.1)
10 BENDING
STRENGTH
APPEARANCE NO MECHANICAL DAMAGE SHALL
OCCUR.
BENDING SHALL BE APPLIED TO
THE LIMIT(1mm) WITH 0.3mm/SEC.
KEEP THE TEST BOARD AT THE LIMIT POINT
IN 5 SEC., THEN MEASURE CAPACITANCE.
SEE (FIG.2)
CAPACITANCE
CHARACTER CHANGE OF
CAPACITANCE
CLASS I
WITHIN ±5%
OR ±0.5 pF
WHICHEVER IS
LARGER
CLASS II
A,B WITHIN ±12.5%
FWITHIN ±30%
CHAR. CAP. CHANGE(%)
A,B ±15%
F+22% ~ -82%
500g.f
×100 %
○○
50
R=340
20
45±145
±1BENDING
LIMIT
CHARACTER LIMIT
C, A, B, F 1mm
CHARACTERISTIC TEMP. COEFFICIENT
(PPM/℃)
C0G 0±30
PH -150 ±60
RH -220 ±60
SH -330 ±60
TH -470 ±60
UL -750 ±120
SL +350 ~ -1000
STEP TEMPERATURE
125 ±2
2MIN RATED TEMP ±2
325 ±2
4MAX RATED TEMP ±2
525 ±2
Multilayer Ceramic Capacitor
- 23 -
*THE INITIAL VALUE OF HIGH DIELECTRIC CONSTANT SERIES SHALL BE MEASURED
AFTER THE HEAT TREATMENT OF 150 +0/-10℃, 1Hr AND SITTING OF 48±4hr AT ROOM TEMPERATURE & ROOM HUMIDITY.
NO ITEM PERFORMANCE TEST CONDITION
11 SOLDERABILITY
MORE THAN 75% OF THE TERMINAL
SURFACEISTOBESOLDEREDNEWLY,
SO METAL PART DOES NOT COME
OUT OR DISSOLVE
IN PB--FREE PART, MORE THAN 95%
OF THE TERMINAL SURFACE IS TO BE
SOLDERED NEWLY
SOLDER TEMPERATURE : 230±5℃
DIP TIME : 3±1Sec
SOLDER : H63A
FLUX : RMA TYPE
*PB-FREE
SOLDER TEMPERATURE : 260±5℃
SOLDER : Sn96.5-3Ag-0.5Cu
Flux : RMA TYPE
DIPTIME:3
±0.1Sec
* PRE-HEATING : AT 80~120℃FOR 10~30SEC.
12
RESISTANCE
TO SOLDERING
HEAT
APPEARANCE NO MECHANICAL DAMAGE
SHALL OCCUR
DIP : SOLDER TEMPERATURE OF
270±5℃
DIPTIME:10
±1 SEC.
EACH TERMINATION SHALL BE FULLY
IMMERSED AND PREHEATED
AS FOLLOWING:
MEASURE AT ROOM TEMP. AFTER
COOLING FOR
CLASSⅠ:24±2 HOURS
CLASSⅡ:48±4 HOURS
CAPACITANCE
CHARACTERISTIC CAP. CHANGE
CLASSⅠ
WITHIN ±2.5% OR
±0.25㎊WHICHEVER
IS LARGER
CLASSⅡA,B WITHIN ±7.5%
FWITHIN ±20%
Q
CLASS Ⅰ
30㎊AND OVER : Q≥1000
LESS THAN 30㎊:Q
≥400+20×C
Tanδ
CLASS Ⅱ
TO SATISFY THE SPECIFIED
INITIAL VALUE
INSULATION
RESISTANCE
TO SATISFY THE SPECIFIED
INITIAL VALUE
WITHSTANDING
VOLTAGE
TO SATISFY THE SPECIFIED
INITIAL VALUE
13 VIBRATION
TEST
APPEARANCE NO MECHANICAL DAMAGE SHALL
OCCUR.
BENDING SHALL BE APPLIED TO
THE LIMIT(1mm) WITH 0.3mm/SEC.
KEEP THE TEST BOARD AT THE LIMIT POINT
IN 5 SEC., THEN MEASURE CAPACITANCE.
THE ENTIRE FREQUENCY RANGE,
FROM 10 TO 55Hz AND RETURN
TO 10Hz, SHALL BE TRAVERSED
IN 1 MINUTE.
THIS CYCLE SHALL BE PERFORMED
2 HOURS IN EACH THERE MUTUALLY
PERPENDICULAR DIRECTION,
FOR TOTAL PERIOD OF 6 HOURS.
CAPACITANCE
CHARACTERISTIC CAP. CHANGE
CLASS Ⅰ
WITHIN ±2.5% OR
±0.25㎊
WHICHEVER
IS LARGER
CLASS
Ⅱ
A,B WITHIN ±5%
FWITHIN ±20%
Q
CLASS Ⅰ
30㎊AND OVER : Q≥1000
LESS THAN 30㎊:Q
≥400+20×C
Tanδ
CLASS Ⅱ
TO SATISFY THE SPECIFIED
INITIAL VALUE
INSULATION
RESISTANCE
TO SATISFY THE SPECIFIED
INITIAL VALUE
STEP TEMP.(℃)TIME
(SEC.)
180~100 60
2150~180 60
CHAR. FREQUENCY RANGE
A,B,C,F 10Hz →55Hz →10Hz
CHAR. TRAVERSED TIME
A,B,C,F 1min
Multilayer Ceramic Capacitor
- 24 -
NO ITEM PERFORMANCE TEST CONDITION
14
HUMIDITY
(STEADY
STATE)
APPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR TEMPERATURE : 40±2℃
RELATIVE HUMIDITY:90~95 %RH
TEST TIME : 500 +12/-0 Hr.
MEASURE AT ROOM TEMPERATURE
AFTER COOLING FOR
CLASSⅠ:24
±2Hr.
CLASSⅡ:48
±4Hr.
CAPACITANCE
CHARACTERISTIC CAPACITANCE CHANGE
CLASS Ⅰ
WITHIN ±5% OR
±0.5㎊WHICHEVER
IS LARGER
CLASS
Ⅱ
A,B WITHIN ±12.5%
FWITHIN ±30%
Q
CLASSⅠ
30㎊AND OVER : Q≥350
10 ~30㎊:Q
≥275 + 2.5×C
LESS THAN 10pF : Q≥200 + 10×C
Tanδ
CLASS Ⅱ
INSULATION
RESISTANCE
MINIMUM INSULATION RESISTANCE:
1,000 ㏁OR 50㏁·㎌ PRODUCT WHICHEVER IS
SMALLER
15
MOISTURE
RESISTANCE
APPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR APPLIED VOLTAGE :
RATED VOLTAGE
TEMPERATURE : 40±2℃
RELATIVE HUMIDITY:90~95%RH
TEST TIME : 500 +12/-0 Hr.
CURRENT APPLIED : 50㎃MAX.
<INITIAL MEASUREMENT>
CLASS ⅡSHOULD BE MEASURED
INITIAL VALUE AFTER BE HEAT-TREATED
FOR 1 HR IN 150℃+0/-10℃AND BE LEFT
FOR 48±4HR AT ROOM TEMPERATURE.
<LATTER MEASUREMENT>
CLASSⅠSHOULD BE MEASURED AFTER
LEFT FOR 24±2 HRS IN ROOM
TEMPERATURE AND HUMIDITY.
CLASS ⅡSHOULD BE MEASURED
LATTERVALUEAFTERBE
HEAT-TREATED FOR 1 HR IN 150℃+0/-10
℃AND BE LEFT FOR 48±4HR AT ROOM
TEMPERATURE.
CAPACITANCE
CHARACTERISTIC CAPACITANCE CHANGE
CLASS Ⅰ
WITHIN ±7.5% OR
±0.75㎊WHICHEVER
IS LARGER
CLASS
Ⅱ
A,B WITHIN ±12.5%
F
WITHIN ±30%
WITHIN +30~－40%
1005 C>0.47μF
1608 C>1.0μF
2012 C>4.7μF
3216 C>10.0μF
3225 C>22.0μF
4532 C>47.0μF
Q
CLASSⅠ
30㎊AND OVER : Q≥200
30㎊AND BELOW : Q≥100 + 10/3×C
Tanδ
CLASSⅡ
INSULATION
RESISTANCE
MINIMUM INSULATION RESISTANCE:
500 ㏁OR 25㏁·㎌ PRODUCT,
WHICHEVER IS SMALLER.
CHAR. 25V
AND
OVER 16V 10V 6.3V 4V
A,B 0.05 0.05 MAX 0.05
MAX 0.075
MAX 0.1
MAX
F0.075
MAX
0.1MAX
(C〈1.0㎌)
0.125
MAX
(C≥1.0㎌)
0.15
MAX 0.195
MAX 0.25
MAX
CHAR. 25V
AND
OVER 16V 10V 6.3V 4V
A,B 0.05
MAX 0.05
MAX 0.05
MAX 0.075
MAX 0.1
MAX
F0.075
MAX
0.1MAX
(C〈1.0㎌)
0.125MAX
(C≥1.0㎌)
0.15
MAX 0.195
MAX 0.25
MAX
6.3V
Tanδ0.125 MAX *Condition
CLASSⅡ
(A,B)
1005 C ≥0.22㎌
1608 C ≥2.2㎌
2012 C ≥4.7㎌
3216 C ≥10.0㎌
3225 C ≥22.0㎌
4532 C ≥47.0㎌
5750 C ≥100.0㎌
6.3V Tanδ0.125 MAX *Condition
CLASSⅡ
(A,B)
1005 C ≥0.22㎌
1608 C ≥2.2㎌
2012 C ≥4.7㎌
3216 C ≥10.0㎌
3225 C ≥22.0㎌
4532 C ≥47.0㎌
5750 C ≥100.0㎌
Multilayer Ceramic Capacitor
- 25 -
NO ITEM PERFORMANCE TEST CONDITION
16
HIGH
TEMPERATURE
RESISTANCE
APPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR
APPLIED VOLTAGE :
150%, 200% OF RATED VOLTAGE
TEST TIME : 1000 +48/-0 Hr.
CURRENT APPLIED : 50㎃MAX.
<INITIAL MEASUREMENT>
CLASS ⅡSHOULD BE MEASURED INITIAL
VALUE AFTER BE HEAT-TREATED FOR 1
HR IN 150℃+0/-10℃AND BE LEFT FOR 48±
4HR AT ROOM TEMPERATURE.
<LATTER MEASUREMENT>
CLASSⅠSHOULD BE MEASURED AFTER
LEFT FOR 24±2 HRS IN ROOM
TEMPERATURE AND HUMIDITY.
CLASS ⅡSHOULD BE MEASURED LATTER
VALUE AFTER BE HEAT-TREATED FOR 1
HR IN 150℃+0/-10℃AND BE LEFT FOR 48±
4HR AT ROOM TEMPERATURE.
(TWICE OF RATED VOLTAGE WILL BE
APPLIED TO ALL SERIES BUT ABOVE)
** HOWEVER, A/B는1005 C ≥0.22㎌
SEE (FIG.3)
CAPACITANCE
CHARACTERISTIC CAP. CHANGE
CLASS ⅠWITHIN ±3% OR ±0.3㎊,
WHICHEVER IS LARGER
CLASS
Ⅱ
A,B WITHIN ±12.5%
F
WITHIN ±30%
WITHIN+30~40%
1005 C>0.47μF
1608 C>1.0μF
2012 C>4.7μF
3216 C>10.0μF
3225 C>22.0μF
4532 C>47.0μF
Q
CLASSⅠ
30㎊AND OVER : Q ≥350
10 ~ 30 ㎊:Q≥275 + 2.5×C
LESS THAN 10㎊:Q ≥200 + 10×C
Tanδ
CLASSⅡ
INSULATION
RESISTANCE
MINIMUM INSULATION RESISTANCE:
1,000 ㏁OR 50㏁·㎌ PRODUCT
WHICHEVER IS SMALLER
17 TEMPERATURE
CYCLE
APPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR CAPACITORS SHALL BE SUBJECTED
TO FIVE CYCLES OF THE
TEMPERATURE CYCLE AS FOLLOWING
STEP TEMP.(℃)TIME(MIN)
1MIN.RATED
TEMP.+0/-3 30
225 2~3
3MAX.RATED
TEMP.+3/-0 30
425 2~3
MEASURE AT ROOM TEMPERATURE
AFTER COOLING FOR
CLASSⅠ:24
±2Hr.
CLASSⅡ:48
±4Hr.
CAPACITANCE
CHARACTERISTIC CAP. CHANGE
CLASS Ⅰ
WITHIN ±2.5%
OR ±0.25㎊WHICHEVER IS
LARGER
CLASS
Ⅱ
A,B WITHIN ±7.5%
FWITHIN ±20%
Q
CLASSⅠ
30 ㎊AND OVER : Q ≥1000
LESS THAN 30㎊:Q ≥400 +20×C
Tanδ
CLASSⅡ
TO SATISFY THE SPECIFIED
INITIAL VALUE
INSULATION
RESISTANCE
TO SATISFY THE SPECIFIED
INITIAL VALUE
CHAR. 25V
AND
OVER 16V 10V 6.3V 4V
A,B 0.05
MAX 0.05
MAX 0.05
MAX 0.075
MAX 0.1
MAX
F0.075
MAX
0.1MAX
(C<1.0㎌)
0.125MAX
(C≥1.0㎌)
0.15
MAX 0.195
MAX 0.25
MAX
CHAR. TEMP.
CLASS Ⅰ125 ±3℃
CLASS
Ⅱ
A85 ±3℃
B125 ±3℃
F85 ±3℃
*150% Authorization Conditions
CLASSⅡ
(A,B,F)
1005 C>0.47μF
1608 C ≥2.2㎌
2012 C ≥4.7㎌
3216 C ≥10.0㎌
3225 C ≥22.0㎌
4532 C ≥47.0㎌
5750 C ≥100.0㎌
Multilayer Ceramic Capacitor
- 26 -
■CHARACTERISTIC GRAPH
0 50 100 1000 10000
0
10
-10
-20
-30
Time(Hr)
ΔC
%
C0G
X7R
Y5V
▶CAPACITANCE CHANGE - AGING
-60 1400-20 20 60 100
Temperature(℃)
ΔC
%0
5
-5
-10
10
C0G
UJ
TH
RH
SH
▶IMPEDANCE - FREQUENCY CHARACTERISTICS
▶CAPACITANCE - DC VOLTAGE CHARACTERISTICS
C0G
0.01
0.1
1
10
100
1.E+06 1.E+07 1.E+08 1.E+09 1.E+10
Ohm
1MHz 10MHz 100MHz 1GHz 10GHz
1000pF
100pF
10pF
X7R/Y5V
0.01
0.1
1
10
100
1.E+06 1.E+07 1.E+08 1.E+09
Ohm
0.1㎌
0.01㎌
0.001㎌
1MHz 10MHz 100MHz 1GHz
-100
-80
-60
-40
-20
0
20
40
0 5 10 15 20 25 30 35 40
DC V oltage(V dc)
C0G 50V
ΔC
%
X7R
50V
Y5V
50V
-60 1200-20 20 40 80
-80
-60
-40
-20
0
20 X7R
Y5V
Temperature(℃)
ΔC
%
▶CAPACITANCE - TEMPERATURE CHARACTERISTICS
●ELECTRICAL CHARACTERISTICS
Multilayer Ceramic Capacitor
- 27 -
■APPLICATION MANUAL
●Storage Condition
▶Storage Environment
The electrical characteristics of MLCCs were degraded by the environment of high temperature
or humidity. Therefore, the MLCCs shall be stored in the ambient temperature and the relative
humidity of less than 40℃and 70%, respectively. Guaranteed storage period is within 6 months
from the outgoing date of delivery.
▶Corrosive Gases
Since the solderability of the end termination in MLCC was degraded by a chemical atmosphere
such as chlorine, acid or sulfide gases, MLCCs must be avoid from these gases.
▶Temperature Fluctuations
Since dew condensation may occur by the differences in temperature when the MLCCs are
taken out of storage, it is important to maintain the temperature-controlled environment.
●Design of Land Pattern
When designing printed circuit boards, the shape and size of the lands must allow for the
proper amount of solder on the capacitor. The amount of solder at the end terminations has a
direct effect on the crack. The crack in MLCC will be easily occurred by the tensile stress which
was due to too much amount of solder. In contrast, if too little solder is applied, the termination
strength will be insufficiently. Use the following illustrations as guidelines for proper land design.
Recommendation of Land Shape and Size
W b
a
Solder
Land
Solder Resist
2/3W < b < W
TSolder Resist
2/3T < a < T
●Adhesives
When flow soldering the MLCCs, apply the adhesive in accordance with the following conditions.
▶Requirements for Adhesives
They must have enough adhesion, so that, the chips will not fall off or move during the
handling of the circuit board.
They must maintain their adhesive strength when exposed to soldering temperature.
They should not spread or run when applied to the circuit board.
They should harden quickly.
They should not corrode the circuit board or chip material.
Multilayer Ceramic Capacitor
- 28 -
They should be a good insulator.
They should be non-toxic, and not produce harmful gases, nor be harmful when touched.
▶Application Method
It is important to use the proper amount of adhesive. Too little and much adhesive will cause
poor adhesion and overflow into the land, respectively.
▶Adhesive hardening Characteristics
To prevent oxidation of the terminations, the adhesive must harden at 160℃or less, within
2 minutes or less.
●Mounting
▶Mounting Head Pressure
Excessive pressure will cause crack to MLCCs. The pressure of nozzle will be 300g maximum
during mounting.
▶Bending Stress
When double-sided circuit boards are used, MLCCs first are mounted and soldered onto one side
of the board. When the MLCCs are mounted onto the other side, it is important to support the
board as shown in the illustration. If the circuit board is not supported, the crack occur to the
ready-installed MLCCs by the bending stress.
support pin
force
nozzle
●Flux
Although the solderability increased by the highly-activated flux, increase of activity in flux may
also degrade the insulation of the chip capacitors. To avoid such degradation, it is recommended
that a mildly activated rosin flux(less than 0.2% chlorine) be used.
Multilayer Ceramic Capacitor
- 29 -
●Soldering
Since a multilayer ceramic chip capacitor comes into direct contact with melted solder during
soldering, it is exposed to potentially mechanical stress caused by the sudden temperature
change. The capacitor may also be subject to silver migration, and to contamination by the
flux. Because of these factors, soldering technique is critical.
▶Soldering Methods
Method Classification
Reflow
soldering
- Overall heating - Infrared rays
- Hot plate
- VPS(vapor phase)
- Local heating - Air heater
-Laser
- Light beam
Flow
soldering - Single wave
- Double wave -
* We recommend the reflow soldering method.
▶Soldering Profile
To avoid crack problem by sudden temperature change, follow the temperature profile in the
adjacent graph.
300
250
200
150
100
50
℃preheating soldering cooling
60~120sec 10~20sec
Reflow Soldering
300
250
200
150
100
50
℃preheating soldering cooling
△T≤150℃
60~120sec 3~4sec
Flow Soldering
▶Manual Soldering
Manual soldering can pose a great risk of creating thermal cracks in chip capacitors. The hot
soldering iron tip comes into direct contact with the end terminations, and operator's carelessness
may cause the tip of the soldering iron to come into direct contact with the ceramic body of
the capacitor. Therefore the soldering iron must be handled carefully, and close attention must
be paid to the selection of the soldering iron tip and to temperature control of the tip.
Multilayer Ceramic Capacitor
- 30 -
▶Amount of Solder
Too much
Solder
Not enough
Solder
Cracks tend to occur due
to large stress
Weak holding force may
cause bad connections or
detaching of the capacitor
Good
▶Cooling
Natural cooling using air is recommended. If the chips are dipped into solvent for cleaning,
the temperature difference(△T) must be less than 100℃
6-6. Cleaning
If rosin flux is used, cleaning usually is unnecessary. When strongly activated flux is used,
chlorine in the flux may dissolve into some types of cleaning fluids, thereby affecting the chip
capacitors. This means that the cleaning fluid must be carefully selected, and should always
be new.
▶Notes for Separating Multiple, Shared PC Boards.
A multi-PC board is separated into many individual circuit boards after soldering has been
completed. If the board is bent or distorted at the time of separation, cracks may occur in the
chip capacitors. Carefully choose a separation method that minimizes the bending of the
circuit board.
Multilayer Ceramic Capacitor
- 31 -
■CROSS REFERENCE
P/N COMPANY SAMSUNG AVX JOHANSON KEMET KYOCERA MURATA NOVACAP PANASONIC ROHM TAIYO
- YUDEN TDK VITRAMON
①COMPANY MODEL(MLCC) CL - - C CM GRM -ECJ MCH MK CVJ
②SIZE
(EIA/JIS)
0201(0603) 03 - - - 03 33 - Z - 063 0603 -
0402(1005) 05 0402 R07 0402 05 36 0402 015 105 1005 0402
0603(1608) 10 0603 R14 0603 105 39 0603 118 107 1608 0603
0805(2012) 21 0805 R15 0805 21 40 0805 221 212 2012 0805
1206(3216) 31 1206 R18 1206 316 42-6 1206 331 316 3216 1206
1210(3225) 32 1210 S41 1210 32 42-2 1210 432 325 3225 1210
1808(4520) 42 1808 R29 1808 42 -1808 - - - 4520 1808
1812(4532) 43 1812 S43 1812 43 43-2 1812 -43 432 4532 1812
2220(5750) 55 - - 2220 55 44-1 2221 - - 550 5650 -
③
TEMPERATURE
CHARACTERISTIC
COG(NPO) C A N G CG COG/CH N C A C COG/CH A
P2H(N150) P S - - P P2H - P - P PH -
R2H(N220) R 1 - - R R2H - R - R RH -
S2H(N330) S 3 - - S S2H - S - S SH -
T2H(N470) T O - - T T2H - T - T TH -
U2J(N750) U Z - - U U2J - U UJ UUJ -
S2L L Y - - SL SL - G SL SL SL -
X7R B C W R(X) X7R X7R B B C BJ X7R(B) Y(X)
Z5U E E Z U - Z5U Z - E - Z5U U
Y5V F G Y V Y5V Y5V Y F F F Y5V -
④NOMINAL CAPACITANCE EX) 103=10,000㎊221=220㎊225=2,200,000㎊=2.2㎌1R5=1.5㎊010=1㎊
⑤CAPACITANCE TOLERANCE B:±0.1㎊C:±0.25㎊D:±0.5㎊F:±1% G:±2% J:±5% K:±10% M:±20% Z:-20~+80%
⑥RATED
VOLTAGE
6.3V Q 6 - 9 06 6.3 -0J - J 0J -
10 V P Z 100 810 10 -1A 4 L 1A -
16 V O Y 160 416 16 160 1C 3 E 1C J
25 V A 3 250 325 25 250 1E 2 T 1E X
50 V B 5 500 550 50 500 1H 5 U 1H A
100 V C 1 101 1100 100 101 2A 1 - 2A B
200V D 2 201 2200 200 201 2D - - - C
250V E V - - 250 250 251 - - - 2E -
500V G 7 501 -500 500 501 - - - - E
630V H - - - 630 630 - - - - 2J -
1000V I A 102 -1000 1K 102 - - - 3A G
2000V J G 202 -2000 2K 202 - - - 3D -
3000V K H 302 -3000 3K 302 - - - 3F H
4000V - J - 4000 -402 - - - - -
⑦TERMINATION NICKEL BARRIER N T V C A (GRM) N - (MCH) - - X
Ag/Pd P 1 - - B (GR) P - (MC) - - F
⑧PACKAGE
BULK(VINYL) B 9 (NONE) - B PB * X - B B B
PAPER TAPING C2, 4 T, R -T, L PT TE,V,W K, L T T C, P
PLASTIC TAPING E1, 3 E, U -H, N PT -F, Y P, Q T - T, R
BULK CASE P 7 - - C PC - C C - - G
Multilayer Ceramic Capacitor
- 32 -
▶SAMSUNG : CL10B104KA8NNNC
CL 10 B 104 K A 8 N N N C
▶AVX : 06033C104KAT2A
0603 3 C 104 K A T 2 A
▶JOHANSON : 250R14W104KV6T
250 R14 W 104 K V 6 T
▶KEMET : C0603C104K3RAC
C0603C 104K 3R A C
Series Size
03 = 0201
05 = 0402
10 = 0603
21 = 0805
31 = 1206
32 = 1210
43 = 1812
55 = 2220
Dielectric
C=C0G
P=P2H
R=R2H
S=S2H
T=T2H
U=U2H
L=S2L
B=X7R
A=X5R
F=Y5V
Capacitance
2
significant
figures
+
number
of zeros
Use "R" for
decimal point
Tolerance
A=±0.05pF
B=±0.1pF
C=±0.25pF
D=±0.5pF
F=±1%
G=±2%
J=±5%
K=±10%
M=±20%
Z = +80,-20%
Voltage
Q = 6.3V
P=10V
O=16V
A=25V
B=50V
C = 100V
D = 200V
E=250V
G = 500V
H = 630V
I = 1000V
Thickness
3 = 0.30
5 = 0.50
8 = 0.80
A=0.65
C = 0.85
H = 1.60
I=2.00
J = 2.50
L = 3.20
Electrode/
Termination/
Plating
A=Pd/Ag/
Sn 100%
N=Ni/Cu/
Sn 100%
G=Cu/Cu/
Sn 100%
Products
A=Array
(2-element)
B=Array
(4-element)
C=High-Q
L=LICC
N = Normal
P=Automotive
W = 3 terminal
chip
Special
Various
Packaging
B=Bulk
P = Cassette
C=Paper7"
D=Paper13"
(10,000EA)
E = Embossing 7"
F = Embossing 13"
L = Paper 13"
(15,000EA)
O=Paper10"
S = Embossing 10"
Size
0201
0402
0603
0805
1206
1210
1812
2220
2225
Voltage
4=4V
6 = 6.3V
Z=10V
Y = 16V
3=25V
B=50V
C = 100V
D = 200V
E = 250V
G = 500V
I = 1000V
Dielectric
A=C0G
C=X7R
D=X5R
E=Z5U
G=Y5V
Capacitance
2
significant
figures
+
number
of zeros
Use "R" for
decimal
point
Tolerance
B=±0.1pF
C=±0.25pF
D=±0.5pF
F=±1%
G=±2%
J=±5%
K=±10%
M=±20%
Z = +80, -20%
P = GMV,+100,-0%
Failure Rate
A=N/A
Termination
T = Sn 100%
7=GoldPlated
1=Pd/Ag
Packaging
2 = 7" Reel
4 = 13" Reel
7 = Cassette
9=Bulk
Special
A = Standard
T = 0.66mm
S = 0.56mm
R = 0.46mm
Voltage
2
significant
figures
+
number
of zeros
Size
R07 = 0402
R14 = 0603
R15 = 0805
R18 = 1206
S41 = 1210
S43 = 1812
S47 = 2220
S48 = 2225
S49 = 1825
S54 = 3640
Dielectric
N=C0G
W=X7R
X=X5R
Z=Z5U
Y=Y5V
Capacitance
2
significant
figures
+
number
of zeros
Use "R" for
decimal point
Termination
V = Ni Barrier
Marking
4=NoMark
6 = Marking
Packaging
E = 7" Reel Plastic
T = 7" Reel Paper
R = 13" Reel Paper
U = 13" Reel Plastic
None = Bulk
Series Size
0402
0603
0805
1206
1210
1812
2220
2225
Specification
C = Standard
A=GR900
P = Mil-C-55681
CDR01-CDR06
N = Mil-C-55681
CDR31-CDR35
Z = Mil-C-123
E=MilEquivalent
(Group A Only)
Capacitance
2
significant
figures
+
number
of zeros
Use "R" for
decimal point
Tolerance
B=±0.1pF
C=±0.25pF
D=±0.5pF
F=±1%
G=±2%
J=±5%
K=±10%
M=±20%
Z=+80,-20%
P = +100, 0%
Voltage
9=6.3V
8=10V
4=16V
3=25V
5=50V
1=100V
2=200V
Dielectric
G=C0G
R=X7R
P=X5R
U=Z5U
X = BX(Mil)
V=Y5V
Tolerance
B=±0.1pF
C=±0.25pF
D=±0.5pF
F=±1%
G=±2%
J=±5%
K=±10%
M=±20%
Z = +80, -20%
P = GMV,+100,-0%
Failure Rate
A=Standard
M=1.0(Mil)
P = 0.1 (Mil)
R=0.01(Mil)
S=0.001(Mil)
Termination
C=Niw/TinPlate
H = Ni w/Solder
T=Silver
G=GoldPlated
Multilayer Ceramic Capacitor
- 33 -
▶KYOCERA : CM105X7R104K25AT
CM 105 X7R 104 K 25 A T
▶MURATA : GRM188R71E104KA01D
GRM 18 8 R7 1E 104 K A01 D
▶NOVACAP : 0603B104K250N_TM
1206 B 104 K 250 N - T M
▶PANASONIC : ECJ1EB1E104K
ECJ 1 E B 1E 104 K
Series Size
03 = 0201
05 = 0402
105 = 0603
21 = 0805
316 = 1206
32 = 1210
42 = 1808
43 = 1812
55 = 2220
Dielectric
CG
X8R
X7R
X5R
Z5U
Y5V
Y5U
Capacitance
2
significant
figures
+
number
of zeros
Use "R" for
decimal point
Tolerance
B=±0.1pF
C=±0.25pF
D=±0.5pF
F=±1%
G=±2%
J=±5%
K=±10%
M=±20%
Z = +80, -20%
P=+100,0%
Voltage
04 = 4V
06 = 6.3V
10 = 10V
16 = 16V
25 = 25V
50 = 50V
100 = 100V
250 = 250V
500 = 500V
1000 = 1000V
Termination
A = Ni Barrier
Packaging
T = 7" Reel (4mm Pitch)
L = 13" Reel (4mm Pitch)
H = 7" Reel (2mm Pitch)
N = 13" Reel (2mm Pitch)
B=Bulk(VinylBags)
C = Bulk Cassette
Series
Ni Barrier
Size
03 = 0201
15 = 0402
18 = 0603
21 = 0805
31 = 1206
32 = 1210
42 = 1808
43 = 1812
55 = 2220
Thickness
3=0.3mm
5=0.5mm
8=0.8mm
A=1.0mm
B = 1.25mm
C = 1.6mm
D = 2.0mm
E=2.5mm
F = 3.2mm
Dielectric
5C = C0G
R7 = X7R
R6 = X5R
E4 = Z5U
F5 = Y5V
Voltage
0J = 6.3V
1A = 10V
1C = 16V
1E = 25V
1H = 50V
2A = 100V
2E = 250V
2H = 500V
3A = 1000V
Capacitance
2
significant
figures
+
number
of zeros
Use "R" for
decimal
point
Tolerance
B=±0.1pF
C=±0.25pF
D=±0.5pF
F=±1%
G=±2%
J=±5%
K=±10%
M=±20%
Z = +80,-20%
P=+100,0%
Individual
Specification
Code
Packaging
D = 7" Reel Paper
L = 7" Reel Plastic
J = 13" Reel Paper
K = 13" Reel Plastic
B=Bulk
C = Bulk Cassette
T=BulkTray
Size
0402
0603
0805
1005
1206
1210
1808
1812
2220
Dielectric
N=C0G
B=X7R
X=BX
Z=Z5U
Y=Y5V
Capacitance
2
significant
figures
+
number
of zeros
Use "R" for
decimal point
Tolerance
B=±0.1pF
C=±0.25pF
D=±0.5pF
F=±1%
G=±2%
J=±5%
K=±10%
M=±20%
Z = +80,-20%
P = +100,
0%
Voltage
2
significant
figures
+
number
of zeros
Termination
P=Pd/Ag
N=NiBarrier
(Sn 100%)
Y = Ni Barrier
(Sn/Pb)
Thickness
Per Specified
Packaging
T = Reel
None = Bulk
W=WafflePack
Marking
Series Size
Z = 0201
0 = 0402
1 = 0603
2 = 0805
3 = 1206
4 = 1210
Packaging
X=Bulk
E = Paper 2mm
V = Paper 4mm
F, Y = Plastic 4mm
W = Large Reels 2mm
Z = Large Reels 4mm
C = Bulk Cassette
Dielectric
C=C0G
B = X7R, X5R
F=Y5V
Voltage
0J = 6.3V
1A = 10V
1C = 16V
1E = 25V
1H = 50V
2A = 100V
2D = 200V
Tolerance
C=±0.25pF
D=±0.5pF
F=±1%
J=±5%
K=±10%
M=±20%
Z = +80, -20%
Capacitance
2
significant
figures
+
number
of zeros
Use "R" for
decimal point
Multilayer Ceramic Capacitor
- 34 -
▶ROHM : MCH182C104KKN
MCH 18 2 C 104 K K N
▶TAIYO-YUDEN : TMK107BJ104K_T
TM K 107BJ104 K -T
▶TDK : C1608X7R1E104KT
C 1608 X7R 1E 104 K T
▶VITRAMON : VJ0603Y104KXXMC
VJ 0603 Y 104 K X X M C
Series Size
15 = 0402
18 = 0603
21 = 0805
31 = 1206
32 = 1210
43 = 1812
Voltag
e
4 = 10V
3 = 16V
2 = 25V
5 = 50V
Dielectric
A=C0G
C=X7R
F=Y5V
Capacitance
2
significant
figures
+
number
of zeros
Use "R" for
decimal point
Tolerance
B=±0.1pF
C=±0.25pF
D=±0.5pF
F=±1%
G=±2%
J=±5%
K=±10%
M=±20%
Z = +80,-20%
P = +100, 0%
Packaging
K = 7" Reel Paper
P=7"ReelPlastic
L = 13" Reel Paper
Q = 13" Reel Plastic
B=Bulk
C = Bulk Cassette
Marking/Thickness
N=Marked
Special Thickness
Voltage
A=4V
J = 6.3V
L=10V
E=16V
T=25V
U = 50V
Type
M = Multilayer
V=HiQ
Termination
K = Ni Barrier
Size
105 = 0402
107 = 0603
212 = 0805
316 = 1206
325 = 1210
432 = 1812
550 = 2220
Dielectric
CG = C0G
CH = C0H
CJ = C0J
CK = C0K
BJ = X5R,
X7R
F=Y5V
Capacitance
2
significant
figures
+
number
of zeros
Use "R" for
decimal point
Tolerance
C=±0.25pF
D=±0.5pF
F=±1%
G=±2%
J=±5%
K=±10%
M=±20%
Z = +80,-20%
Special
Various
Packaging
T = Reel
B=Bulk
Series Size
0603 = 0201
1005 = 0402
1608 = 0603
2012 = 0805
3216 = 1206
3225 = 1210
4532 = 1812
5650 = 2220
Dielectric
CG
X7R
Z5U
Y5V
Voltage
0J = 6.3V
1A = 10V
1C = 16V
1E = 25V
1H = 50V
Capacitance
2
significant
figures
+
number
of zeros
Use "R" for
decimal point
Tolerance
C=±0.25pF
D=±0.5pF
F=±1%
G=±2%
J=±5%
K=±10%
M=±20%
Z = +80, -20%
Packaging
T=Reel
B=Bulk
Series Size
0402
0603
0805
1206
1210
1812
2225
Dielectric
X=BX
A,N = C0G
Y=X7R
U=Z5U
H=X8R
Capacitance
2
significant
figures
+
number
of zeros
Use "R" for
decimal point
Tolerance
B=±0.1pF
C=±0.25pF
D=±0.5pF
F=±1%
G=±2%
J=±5%
K=±10%
M=±20%
Z = +80, -20%
P=+100,0%
Termination
X=Silver,
Ni Barrier
Tin Plated
Voltage
J=16V
X=25V
A=50V
B=100V
C = 200V
Marking
M = Marking
A = No Marking
Packaging
C = 7" Reel Paper
T = 7" Reel Plastic
P = 13" Reel Paper
R = 13" Reel Plastic
B=Bulk
