BD10KA5WF-E2 - Rohm Semiconductor

Datashee

○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays.

1/15 TSZ02201-0R6R0A600150-1-2

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TSZ22111･14･001 26.Jun.2012 Rev.001

500mA Variable/Fixed Output

LDO Regulators

BDxxKA5 Series BDxxKA5W Series BD00KA5W Series

●General Description

The BDxxKA5 series are low-saturation regulators that are available for output currents up to 500mA. The output voltage

precision is ±1%. These LDO regulators are offered in several output voltages and package lineups with or without

ON/OFF switches (that set the circuit current to 0μA at shutdown). This series can be used for a broad spectrum of

applications ranging from TVs and car audio systems to HDDs, PCs, and DVDs. There regulators have a built-in

overcurrent protection circuit that prevents the destruction of the IC, due to output short circuits and a thermal shutdown

circuit.

●Features

 Output voltage precision: ±1%

 Low-saturation voltage with PMOS output: 0.12V

Typ.(Io=200mA)

 Built-in over-current protection circuit

 Built-in thermal shutdown circuit

 Shutdown switch (BDxxKA5WFP and BDxxKA5WF

series)

 Ceramic capacitor compatible (recommended

capacitance: 1μF or greater)

●Key Specifications

 Input Power Supply Voltage: 5.5V (Max.)

 Output voltage type: BA00KA5 Variable

BAxxKA5 Fixed

 Output current: 500mA (Max.)

 Operating temperature range: -40℃ to +105℃

●Applications

Microcontrollers and all electronic devices that use

logic circuit

●Packages W (Typ.) x D (Typ.) x H (Max.)

SOP8 5.00mm x 6.20mm x 1.71mm

TO252-3 6.50mm x 9.50mm x 2.50mm

TO252-5 6.50mm x 9.50mm x 2.50mm

●Lineup matrix

Part Number Output Voltage (V) Package

1.0 1.2 1.5 1.8 2.5 3.0 3.3 Variable

BDxxKA5WFP ○ ○ ○ ○ ○ ○ ○ ○ TO252-5

BDxxKA5WF ○ ○ ○ ○ ○ ○ ○ ○ SOP8

BDxxKA5FP ○ ○ ○ ○ ○ ○ ○ - TO252-3

●Ordering Information

B D x x K A 5 W x x - E 2

Part Number Output voltage

00:Variable

Other: Fixed

Current capacity

KA5: 500mA

Shutdown Switch

W: Include

None:without

Package

FP : TO252-3

TO252-5

F : SOP8

Packaging and forming specification

E2: Embossed tape and reel

TO252-3 TO252-5

SOP8

Datasheet

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TSZ22111･15･001 26.Jun.2012 Rev.001

●Lineup

Maximum output

current (Max.)

Shutdown

Switch

Package

Output

voltag e (Typ.) Orderable

Part Number

500mA

With Switch

TO252-5 Reel of 2000

1.0V BD10KA5WFP-E2

1.2V BD12KA5WFP-E2

1.5V BD15KA5WFP-E2

1.8V BD18KA5WFP-E2

2.5V BD25KA5WFP-E2

3.0V BD30KA5WFP-E2

3.3V BD33KA5WFP-E2

Variable BD00KA5WFP-E2

SOP8 Reel of 2500

1.0V BD10KA5WF-E2

1.2V BD12KA5WF-E2

1.5V BD15KA5WF-E2

1.8V BD18KA5WF-E2

2.5V BD25KA5WF-E2

3.0V BD30KA5WF-E2

3.3V BD33KA5WF-E2

Variable BD00KA5WF-E2

No Switch TO252-3 Reel of 2000

1.0V BD10KA5FP-E2

1.2V BD12KA5FP-E2

1.5V BD15KA5FP-E2

1.8V BD18KA5FP-E2

2.5V BD25KA5FP-E2

3.0V BD30KA5FP-E2

3.3V BD33KA5FP-E2

Datasheet

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BDxxKA5 Series BDxxKA5W Series BD00KA5W Series

TSZ02201-0R6R0A600150-1-2

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TSZ22111･15･001 26.Jun.2012 Rev.001

●Block Diagrams / Standard Example Application Circuits / Pin Configurations / Pin Descriptions

Fig.1

Fig.2

Fig.3

Fig.4

Fig.5

[BDxxKA5FP] GND(FIN)

N.C.(2PIN)

Datasheet

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TSZ22111･15･001 26.Jun.2012 Rev.001

●Absolute Maximum Ratings (Ta=25℃)

Parameter Symbol Limits Unit.

Power Supply Voltage Vcc -0.3 to +7.0*1 V

Output Control Terminal Voltage VCTL -0.3 to Vcc*1 V

Power Dissipation

TO252-3

1200*2

TO252-5 1300*3

SOP8 687.6*4

Operating Temperature Range Topr -40 to +105 ℃

Ambient Storage Temperature Tstg -55 to +150 ℃

Maximum Junction Temperature Tjmax 150 ℃

*1 Must not exceed Pd

*2 When a 70mm×70mm×1.6mm glass epoxy board is used. Reduce by 9.6 mW/℃ over 25℃.

*3 When a 70mm×70mm×1.6mm glass epoxy board is used. Reduce by 10.4mW/℃ over 25℃.

*4 When a 70mm×70mm×1.6mm glass epoxy board is used. Reduce by 5.5 mW/℃ over 25℃.

●Recommended Operating Ratings (Ta=25℃)

Parameter Symbol Min. Max. Unit.

Input Power Supply Voltage Vcc 2.3 5.5 V

Output Current Io 0 500 mA

Output Voltage Configuration Range*5 Vo 1.0 4.0 V

Output Control Terminal Voltage VCTL 0 Vcc V

*5 Only BD00KA5WFP and BD00KA5WF

●Electrical Characteristics

BDxxKA5 Series BDxxKA5W Series

(Unless otherwise specified,Ta=25℃, VCTL =2V, Vcc=2.5V(Vo=1.0V,1.2V,1.5V,1.8V), Vcc=3.3V(Vo=2.5V), Vcc=5.0V(Vo=3.0V,3.3V))

Parameter Symbol Limit Unit Conditions

Min Typ Max

Output Voltage Vo Vo(T)-0.015 Vo(T) Vo(T)+0.015 V Io=200mA (Vo=1.0V,1.2V)

Vo(T)×0.99 Vo(T) Vo(T)×1.01 Io=200mA (Vo≧1.5V)

Shut Down Current Isd － 0 1 μA VCTL=0V, Io=0mA (OFFmode)

Bias Current Ib － 350 550 μA Io=0mA

Dropout Voltage *6 ΔVd － 0.12 0.20 V

Io=200mA, Vcc=0.95×Vo

Peak Output Current Io 500 －－ mA

Ripple Rejection R.R. － 50 － dB

f=120Hz, ein※9=-10dBV,

Io=100mA

Line Regulation *7 Reg.I － 10 35 mV

Vcc=Vo+0.5V→5.5V,

Io=200mA

Load Regulation Reg.L － 25 75 mV Io=0mA→500mA

Temperature Coefficient

of Output Voltage *8 Tcvo － ±100 － ppm/℃Io=5mA,Tj=0 to 125℃

CTL ON Mode Voltage VCTLON 2.0 －－ V ACTIVE MODE, Io=0mA

CTL OFF Mode Voltage VCTLOFF －－ 0.8 V OFF MODE, Io=0mA

CTL Input Current ICTL 20 40 60 μA Io=0mA

Vo(T) : Output Voltage

*6 Vo≧2.5V

*7 1.0≦Vo≦1.8V,Vcc=2.3V→5.5V

*8 Not 100% tested

*9 ein : Input Voltage Ripple

Datasheet

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BDxxKA5 Series BDxxKA5W Series BD00KA5W Series

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TSZ22111･15･001 26.Jun.2012 Rev.001

●Electrical Characteristics – continued

BD00KA5W Series

(Unless otherwise specified, Ta=25℃, Vcc=2.5V, VCTL=2V ,Vo=1.5V)

Parameter Symbol

Limit Unit Conditions

Min Typ Max

Shut Down Current Isd － 0 1 μA VCTL=0V, Io=0mA (OFFmode)

Bias Current Ib － 350 550 μA Io=0mA

Reference Voltage VADJ 0.742 0.750 0.758 V Io=50mA

Dropout Voltage *10 ΔVd － 0.12 0.20 V Io=200mA, Vcc=0.95×Vo

Peak Output Current Io 500 －－ mA

Ripple Rejection R.R. － 50 － dB

f=120Hz, ein※12=-10dBV, Io=100mA

Line Regulation Reg.I － 10 35 mV Vcc=Vo+0.5V→5.5V, Io=200mA

Load Regulation Reg.L － 25 75 mV Io=0mA→500mA

Temperature Coefficient of

Output Voltage *11 Tcvo － ±100 － ppm/℃Io=5mA,Tj=0 to 125℃

CTL ON Mode Voltage VCTLON 2.0 －－ V ACTIVE MODE, Io=0mA

CTL OFF Mode Voltage VCTLOFF －－ 0.8 V OFF MODE, Io=0mA

CTL Input Current ICTL 20 40 60 μA Io=0mA

*10 Vo≧2.5V

*11 Not 100% tested

*12 ein : Input Voltage Ripple

Datasheet

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BDxxKA5 Series BDxxKA5W Series BD00KA5W Series

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TSZ22111･15･001 26.Jun.2012 Rev.001

●Typical Performance Cur ves

(Unless specified otherwise, Vcc=25V,VCTL =2V,and Io=0mA)

Fig.7

Input Stability（Io=0mA）

Fig.8

Input Stability

（Io=500mA）

Fig.9

Load Stability

OUTPUT VOLTAGE : VO[V]

SUPPLY VOLTAGE : Vcc[V]

OUTPUT CURRENT : IO[A]

OUTPUT VOLTAGE : VO[V]

SUPPLY VOLTAGE : Vcc[V]

CIRCUIT CURRENT : ICC[mA]

SUPPLY VOLTAGE : Vcc[V]

Fig.6

Circuit current

Datasheet

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TSZ22111･15･001 26.Jun.2012 Rev.001

●Typical Performance Curves - continued

Fig.10

Input/Output Voltage Difference

（Vcc=3.135V）

Fig.11

Ripple Rejection

（ein=10dBV,Io=100mA）

Fig.13

Circuit Current

Temperature Characteristics

Fig.12

Output Voltage

（Io=5mA）

[V]

TEMPERATURE : Ta[℃]

OUTPUT VOLTAGE : VO[V]

TEMPERATURE : Ta[℃]

Datasheet

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TSZ22111･15･001 26.Jun.2012 Rev.001

●Typical Performance Curves - continued

Fig.15

CTL Voltage vs. Output Voltage

Fig.17

Thermal Shutdown

Circuit Characteristics (Io=5mA)

Fig.14

Circuit Current by load Level

[mA]

OUTPUT CURRENT : IO[A]

OUTPUT VOLTAGE : VO[V]

TEMPERATURE : Ta[℃]

CONTROL VOLTAGE : VCTL[V]

CIRCUIT CURRENT : ICC[mA]

CONTROL CURRENT : ICTL[µA]

Fig.16

CTL Voltage vs. Output Current

Datasheet

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BDxxKA5 Series BDxxKA5W Series BD00KA5W Series

TSZ02201-0R6R0A600150-1-2

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TSZ22111･15･001 26.Jun.2012 Rev.001

●I/O equivalence circuit

●Power Dissipation

When using at temperatures over Ta=25℃, please refer to the power dissipation shown in Fig.20 through 22.

The IC characteristics are closely related to the temperature at which the IC is used, so if the temperature exceeds the

maximum junction temperature TjMAX, the device may malfunction or be destroyed. The heat of the IC requires sufficient

consideration regarding instantaneous destruction and long-term operation reliability. In order to protect the IC from thermal

damage, it is necessary to operate it at temperatures less than the maximum junction temperature TjMAX.

Even when the ambient temperature Ta is a normal temperature (25℃), the chip(junction) temperature Tj may be quite high,

so please operate the IC at temperatures less than the acceptable loss Pd.

※ With BD00KA5WFP/WF,R1and R2 are connected

outside the IC between ADJ and GND and

between OUT and ADJ.

CTL

Vcc Vcc Vcc

OUT

ADJ

31.25kΩ 2kΩ

25kΩ

(BD00KA5WFP/WF)

Fig.18 Fig.19

Vcc

Fig.20 Power Dissipation heat

reducing characteristics

TO252-5

0.0

0.4

0.8

1.2

1.6

2.0

0 25 50 75 100 125 150

Ambient temperature：Ta(℃)

Power Dissipation

：Pd(W)

1.30

Rohm standard board mounting

Board size：70×70×1.6ｍｍ

Copper foil area：7×7ｍｍ2

θja=96.2(℃/W)

Power Dissipation：Pd(W)

TO252-3

Fig.21 Power Dissipation heat

reducing characteristics

0.0

0.4

0.8

1.2

1.6

2.0

0 25 50 75 100 125 150

周囲温度：Ta(℃)

許容損失：Pd(W)

1.20

Rohm standard board mounting

Board size：70×70×1.6ｍｍ

Copper foil area：7×7ｍｍ2

θja=104.2(℃/W)

Power Dissipation：Pd(W)

Ambient temperature：Ta ( ℃)

SOP8

Fig.22 Power Dissipation heat

reducing characteristics

200

400

600

800

1000

0 25 50 75 100 125 150

周囲温度：Ta(℃)

許容損失：Pd(W)

687.6mW

562.6mW

(1)

(2)

(1)When using a standard board:

θj-c=181.8(℃/W)

(2) When using an IC alone

θj-a=222.2(℃/W)

Power Dissipation：Pd(W)

Ambient temperature：Ta ( ℃)

Datasheet

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TSZ22111･15･001 26.Jun.2012 Rev.001

The calculation method for power consumption Pc(W) is as follows :

Pc = (Vcc-Vo)×Io+Vcc×Icca

Acceptable loss Pd≧Pc

Solving for the load current IO in order to operate within the acceptable loss,

Io≦

It is then possible to find the maximum load current IoMAX with respect to the applied voltage Vcc at the time of thermal design.

Calculation Example

Example 1) When Ta=85℃, Vcc=2.5V, Vo=1.0V

Io≦ θja=96.2℃/W → -10.4mW/℃

Io≦440mA (Icca : 6mA) 25℃=1300mW → 85℃=676mW

Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating

temperature ranges.

The power consumption Pc of the IC when there is a short circuit (short between Vo and GND) is :

Pc=Vcc×(Icca+Ishort)

*Ishort : Short circuit current

●Terminal Vicinity Settings and Cautions

・Vcc Terminal

Please attach a capacitor (greater than 1μF) between Vcc and GND.

The capacitance values differ depending on the application, so chose a capacitor with sufficient margin and verify the

operation on actual board.

・GND Terminal

Please be sure to keep the set ground and IC ground at the same potential level so that a potential difference does not

arise between them. If a potential difference arises between the set ground and the IC ground, the preset voltage will not

be output properly, causing the system to become unstable. Please reduce the impedance by making the ground patterns

as wide as possible and reducing the distance between the set ground and the IC ground as much as possible.

・CTL Terminal

The CTL terminal is turned ON at 2.0V and higher, and OFF at

0.8V and lower, within the operating power supply voltage range.

The power supply and the CTL terminal may be started up and

shut down in any order without problems.

Pc – Vcc×Icca

Vcc－Vo

0.676－2.5×Icca

2.5-1.0

BA10KA5WFP（TO252-5 packaging）

Fig.23 Input equivalent circuit

Vcc：

Vo：

Io：

Icca：

Input voltage

Output voltage

Load current

Circuit current

CTL

25kΩ

31.25kΩ

Datasheet

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TSZ22111･15･001 26.Jun.2012 Rev.001

●Vo Terminal

Please be sure to attach an anti-oscillation capacitor between Vo and GND.

Be sure to place an anti-oscillation capacitor between the output terminal and the GND. Oscillations may arise if the

capacitance value changes, due to factors such as temperature changes. A 1μF capacitor with small internal series resistance

(ESR) such as a ceramic capacitor is recommended as an anti-oscillation capacitor. Ceramic capacitors generally have

favorable temperature characteristics and DC bypass characteristics. When selecting a ceramic capacitor, a high voltage

capacitor (good DC bypass characteristics) with temperature characteristics that are superior to those of X5R or X7R, is

recommended. In applications where input voltage and load fluctuations are rapid, please decide on a capacitor after

sufficiently confirming its properties according to its specifications in the actual application.

100

120

01234

直流バイアスVdc（V)

静電容量変化率(%)

100

120

01234

直流バイアスVdc（V)

静電容量変化率(%)

100

120

-250 255075

Temp(℃)

静電容量変化率(%)

50V Max.Input

16V Max.Input

10V Max.Input

16V Max.Input

10V Max.Input

Y5V

X7R

X5R

Vdc=0

Fig.26 General characteristics of ceramic capacitors

50V Max.Input

DC bypass Vdc(V) DC bypass Vdc(V)

(a) Capacitance-bypass

characteristics (Y5V)

（b）Capacitance-bypass

characteristics（X5R,X7R）

Tem p (℃)

（C）Capacitance-temperature

characteristics（X5R,X7R,Y5V）

Rate of change in electrostatic capacitance (%)

Fig.25 ESR-Io Characteristics

0.01

0.1

100

0 100 200 300 400 500

Io u t(m A )

ESR (Ω)

安定領域

発振領域

Fig.24 Output Equivalent Circuit

OUT

1μF

Oscillation region

Stable region

ADJ

Cin

Vcc

1μF

ESR

Io(ROUT)

R1=30kΩ,R2=2kΩ

Vcc

GND

VCTL

OUT

CTL

ESR(Ω)

Io(mA)

Datasheet

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TSZ02201-0R6R0A600150-1-2

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TSZ22111･15･001 26.Jun.2012 Rev.001

●Operational Notes

○Protection Circuits

Over-current Protection Circuit

A built-in over-current protection circuit corresponding to the current capacity prevents the destruction of the IC when

there are load shorts. This protection circuit is a “7”-shaped current control circuit that is designed such that the current is

restricted and does not latch even when a large current momentarily flows through the system with a high-capacitance

capacitor. However, while this protection circuit is effective for the prevention of destruction due to unexpected accidents,

it is not suitable for continuous operation or transient use. Please be aware when creating thermal designs that the

over-current protection circuit has negative current capacity characteristics with regard to temperature.

○Thermal Shutdown Circuit (Thermal Protection)

This system has a built-in temperature protection circuit for the purpose of protecting the IC from thermal damage. As

shown in Fig. 20-22, this must be used within the range of acceptable loss, but if the acceptable loss is continuously

exceeded, the chip temperature Tj increases, causing the thermal shutdown circuit to operate. When the thermal shutdown

circuit operates, the operation of the circuit is suspended. The circuit resumes operation immediately after the chip

temperature Tj decreases, so the output repeats the ON and OFF states (Please refer to Fig.17 for the temperatures at

which the temperature protection circuit operates).

There are cases in which the IC is destroyed due to thermal runaway when it is left in the overloaded state. Be sure to

avoid leaving the IC in the overloaded state.

○Reverse Current

In order to prevent the destruction of the IC when a reverse current flows through the IC, it is recommended that a diode

be placed between the Vcc and Vo and a pathway be created so that the current can escape (Refer to Fig.27).

○This IC is BI-CMOS IC that has a P-board (substrate) and P+ isolation between each element, as shown in Fig.28. A P-N

junction is formed between this P-layer and the N-layer of each element, and the P-N junction operates as :

- a parasitic diode when the electric potential relationship is GND> Pin A, GND> Pin B, or

- a parasitic transistor when the electric potential relationship is Pin B > GND> Pin A.

Parasitic elements are structurally inevitable in the IC. The operation of parasitic elements induces mutual interference

between circuits, causing malfunctions and eventually the destruction of the IC. Take precaution as not to use the IC in

ways that would cause parasitic elements to operate. For example, applying a voltage that is lower than the GND (P-board)

to the input terminal.

Fig.28 Basic structure example

Status of this document

The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to

help reading the formal version.

If there are any differences in translation version of this document formal version takes priority.

Reverse current

OUT

Vcc

CTL GND

Fig.27 Bypass diode

GND

P+

Parasitic element

or transistor

(Pin B) BE

Transistor (NPN)

GND

C (Pin A)

GND

P+

Resistor

Parasitic element

PP+

(Pin A)

Parasitic element

or transistor

(Pin B)

GND

Parasitic element

GND

Datasheet

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TSZ22111･15･001 26.Jun.2012 Rev.001

●Physical Dimension Tape and Reel Information

(Unit : mm)

TO252-3

21 3

0.8

0.65 0.65

1.5

2.5

0.75

FIN

6.5±0.2

2.3±0.2 2.3±0.2

0.5±0.1

1.0±0.2

2.3±0.2

9.5±0.5

0.5±0.1

5.5±0.2 1.5±0.2

5.1+0.2

0.1 C0.5

Direction of feed

1pin

Reel ∗ Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the lower left when you hold

reel on the left hand and you pull out the tape on the right hand

2000pcs

( )

(Unit : mm)

TO252-5

123 54

0.8

0.5 1.27

1.5

2.5

FIN

6.5±0.2 2.3±0.2

0.5±0.1

1.0±0.2

9.5±0.5

0.5±0.1

5.5±0.2 1.5±0.2

C0.5

5.1+0.2

0.1

Direction of feed

1pin

Reel ∗ Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the lower left when you hold

reel on the left hand and you pull out the tape on the right hand

2000pcs

( )

(Unit : mm)

SOP8

0.9±0.15

0.3MIN

−

0.17 +0.1

0.05

0.595

5.0±0.2

6.2±0.3

4.4±0.2

(MAX 5.35 include BURR)

1.27

0.11

0.42±0.1

1.5±0.1

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

2500pcs

()

Direction of feed

Reel 1pin

Datasheet

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TSZ22111･15･001 26.Jun.2012 Rev.001

●Marking Diagrams

Orderable

Part Number Package Part Number Marking

BD10KA5WFP-E2

TO252-5

10KA5W

BD12KA5WFP-E2 12KA5W

BD15KA5WFP-E2 15KA5W

BD18KA5WFP-E2 18KA5W

BD25KA5WFP-E2 25KA5W

BD30KA5WFP-E2 30KA5W

BD33KA5WFP-E2 33KA5W

BD00KA5WFP-E2 00KA5W

BD10KA5WF-E2

SOP8

10KA5W

BD12KA5WF-E2 12KA5W

BD15KA5WF-E2 15KA5W

BD18KA5WF-E2 18KA5W

BD25KA5WF-E2 25KA5W

BD30KA5WF-E2 30KA5W

BD33KA5WF-E2 33KA5W

BD00KA5WF-E2 00KA5W

BD10KA5FP-E2

TO252-3

10KA5

BD12KA5FP-E2 12KA5

BD15KA5FP-E2 15KA5

BD18KA5FP-E2 18KA5

BD25KA5FP-E2 25KA5

BD30KA5FP-E2 30KA5

BD33KA5FP-E2 33KA5

SOP8(TOP VIEW)

Part Number Marking

LOT Number

1PIN MARK

TO252-3

(TOP VIEW)

Part Number Marking

LOT Number

TO252-5

(TOP VIEW)

Part Number Marking

LOT Number

Datasheet

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TSZ02201-0R6R0A600150-1-2

www.rohm.com

TSZ22111･15･001 26.Jun.2012 Rev.001

●Revision History

Date Revision Changes

26.Jun.2012 001 New Release

Datasheet

Notice - Rev.003

Notice

●General Precaution

1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.

ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any

ROHM’s Products against warning, caution or note contained in this document.

2) All information contained in this document is current as of the issuing date and subject to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales

representative.

●Precaution on using ROHM Products

1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3) Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4) The Products are not subject to radiation-proof design.

5) Please verify and confirm characteristics of the final or mounted products in using the Products.

6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8) Confirm that operation temperature is within the specified range described in the product specification.

9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Datasheet

Notice - Rev.003

●Precaution for Mounting / Circuit board design

1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

●Precautions Regarding Application Examples and External Circuits

1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2) You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

●Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

●Precaution for Storage / Transportation

1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

●Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

●Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

●Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

●Precaution Regarding Intellectual Property Rights

1) All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Datasheet

Notice - Rev.003

●Other Precaution

1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

5) The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.