STPS20100HR Aerospace 1 x 20 and 2 x 20 A - 100 V Schottky rectifier Features Forward current: 1 x 20 and 2 x 20 A Repetitive peak voltage: 100 V Low forward voltage drop: 0.8 V Maximum junction temperature: 175 C Negligible switching losses Low capacitance High reverse avalanche surge capability Hermetic packages Target radiation qualification: - 150 krad (Si) low dose rate - 1 Mrad high dose rate ESCC qualified SMD.5 TO-254 Description This power Schottky rectifier is designed and packaged to comply with the ESCC5000 specification for aerospace products. Housed in hermetically sealed packages both surface mount and through hole, it is ideal for use in applications for aerospace and other harsh environments. The STPS20100HR is intended for use in medium voltage application and particularly, in high frequency circuits where low switching losses and low noise are required. Table 1. Device summary Order code STPS20100S1 ESCC detailed specification Quality level Configuration Package Mass - Engineering model Single die SMD.5 2.0 g STPS20100SHRB 5106/016/05 ESCC flight STPS20100FSYHRB 5106/016/01 ESCC flight - Engineering model 5106/016/02 ESCC flight STPS20100AFSY1 STPS20100AFSYHRB Single die - Double die, common anode Y TO-254 - Engineering model STPS20100CFSYHRB 5106/016/03 ESCC flight STPS20100SFSYHRB 5106/016/04 ESCC flight STPS20100CFSY1 March 2010 EPPL Double die, common cathode 10.0 g Y Double die, serial Doc ID 16953 Rev 1 Y 1/10 www.st.com 10 Characteristics 1 STPS20100HR Characteristics Table 2. Absolute maximum ratings Symbol IFSM Characteristic Forward surge current (per diode)(1) Value Unit 250 A (2) 100 V (3) 1 A Average output rectified current (50% duty cycle):(4), (5) All variants (per diode) Variants 02, and 03 (per device) 20 40 A IF(RMS) Forward rms current (per diode) 30 A TOP Operating temperature range(6) (case temperature) -65 to +175 C +175 C -65 to +175 C VRRM IRRM IO TJ Repetitive peak reverse voltage Repetitive peak reverse current Junction temperature (6) TSTG Storage temperature range TSOL Soldering temperature: For TO-254(7) For SMD.5(8) +260 +245 oC dV/dt Critical rate of rise of reverse voltage 10000 V/s 1. Sinusoidal pulse of 10 ms duration 2. Pulsed, duration 5 ms, F = 50 Hz 3. Pulsed, duration 2 s, F = 1 kHz 4. For Tcase > +140 C, derate linearly to 0 A at +175 C. 5. The "per Device" ratings apply only as follows: Variant 02: when both cathode terminals are tied together Variant 03: when both anode terminals are tied together. 6. For variants with hot solder dip lead finish all testing performed at Tamb > +125 C are carried out in a 100% inert atmosphere. 7. Duration 10 seconds maximum at a distance of not less than 1.5 mm from the device body and the same lead shall not be resoldered until 3 minutes have elapsed. 8. Duration 5 seconds maximum and the same package shall not be resoldered until 3 minutes have elapsed. Table 3. Symbol Rth(j-c)(1) Thermal resistance Characteristic Thermal resistance, junction to case Variants 01, and 05 Variants 02, 03 and 04 (per diode) Variants 02, and 03 (per device)(2) Value 1.65 1.65 0.85 Unit C/W 1. Package mounted on infinite heatsink 2. The per device ratings apply for variant 02 when both cathode terminals are tied together and for variant 03 when when both anode terminals are tied togther. 2/10 Doc ID 16953 Rev 1 STPS20100HR Table 4. Symbol IR VF1 Characteristics s Electrical measurements at ambiant temperature (per diode), Tamb = 22 3 C Characteristic MIL-STD-750 test method Reverse Current 4016 Forward Voltage 4011 (1) VF2(1) C Zth(j-c) Values Test conditions Units Min. Max. DC method, VR = 100 V - 30 A Pulse method, IF = 10 A - 780 mV Pulse method, IF = 20 A - 1 V - 700 pF Capacitance 4001 VR = 10 V, F = 1 MHz Relative thermal impedance, junction to case 3101 IH = 15 to 40 A, tH = 50 ms IM = 50 mA, tmd = 100 s Calculate VF C/W 1. Pulse width 680s, Duty Cycle 2% Table 5. Symbol IR VF2 (1) Electrical measurements at high and low temperatures (per diode) Characteristic Reverse Current Forward Voltage MIL-STD-750 test method 4016 4011 Values Test conditions Units Min. Max. Tcase = +125 (+0, -5) C DC method, VR = 100 V - 20 mA Tcase = +125 (+0, -5) C pulse method, IF = 20 A - 900 mV Tcase = -55 (+5, -0) C pulse method, IF = 20 A - 1.1 V 1. Pulse width 680s, Duty Cycle 2% Doc ID 16953 Rev 1 3/10 Configurations 2 STPS20100HR Configurations Figure 1. Available device configurations Variant 01 STPS20100FSYHRB Terminal 1: Cathode Terminal 2: No connection Terminal 3: Anode 3 1 Variant 02 STPS20100AFSY1 STPS20100AFSYHRB 1 Terminal 1: Cathode a Terminal 2: Common anode Terminal 3: Cathode b 2 3 Variant 03 STPS20100CFSY1 STPS20100CFSYHRB 1 Terminal 1: Anode a Terminal 2: Common cathode Terminal 3: Anode b 2 3 Variant 04 STPS20100SFSYHRB 3 Terminal 1: Anode a Terminal 2: Center tap Terminal 3: Cathode b 2 1 Variant 05 STPS20100S1 STPS20100SHRB 1 Terminal 1: Anode Terminal 2: Anode Terminal 3: Cathode 3 2 For TO-254 the case is not connected to any lead For SMD.5 the lid is not connected to any terminal 4/10 Doc ID 16953 Rev 1 STPS20100HR 3 Package Information Package Information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Figure 2. Metal flange mount package (TO-254(a)), 3 lead dimension definitions B R1 D E H OF C G A 3 2 1 N OM R2 L K OI K J a. The terminal identification is specified by the device configuration. See Figure 1 for terminal connections Doc ID 16953 Rev 1 5/10 Package Information STPS20100HR Table 6. Metal flange mount package (TO-254), 3-lead dimension values Dimension in millimetres Dimlension in inches Reference Min. Max. Min. Max. A 13.59 13.84 0.535 0.545 B 13.59 13.84 0.535 0.545 C 20.07 20.32 0.790 0.800 D 6.3 6.7 0.248 0.264 E 1 3.9 0.039 0.154 OF 3.5 3.9 0.138 0.154 G 16.89 17.4 0.665 0.685 H OI (1) 6.86 BSC 0.89 0.270 BSC 1.14 0.045 J 3.81 BSC 0.150 BSC K 3.81 BSC 0.150 BSC L 12.95 14.5 OM 0.510 3.05 Typ. 0.571 0.120 Typ. N - 0.71 - 0.028 R1(2) - 1 - 0.039 (3) 1.65 Typ. R2 1. 3 locations 2. Radius of heatsink flange corner - 4 locations 3. Radius of body corner - 4 locations 6/10 0.035 Doc ID 16953 Rev 1 0.065 STPS20100HR Package Information Figure 3. Surface mount package (SMD.5), 3-terminal dimension definitions A e A1 b2 b3 1 2 E D1 D b1 3 b Table 7. Surface mount package (SMD.5), 3-terminal dimension values Dimension in millimetres Dimlension in inches Reference Min. Max. Min. Max. A 2.84 3.15 0.112 0.124 A1 0.25 0.51 0.010 0.20 b 7.13 7.39 0.281 0.291 b1 5.58 5.84 0.220 0.230 b2(1) 2.28 2.54 0.090 0.100 (1) 2.92 3.18 0.115 0.125 D 10.03 10.28 0.395 0.405 D1(1) 0.76 - 0.030 - E 7.39 7.64 0.291 0.301 b3 e(1) 1.91 BSC 0.075 1. 2 locations Doc ID 16953 Rev 1 7/10 Ordering Information STPS20100HR 4 Ordering Information Table 8. Ordering information Order code STPS20100S1 ESCC detailed Package specification - Lead finish Marking EPPL Gold STPS20100S1 - SMD.5 5106/016/05 Gold 510601605 - STPS20100FSYHRB 5106/016/01 Solder dip 510601601 + BeO - - Gold STPS20100AFSY1 + BeO - 5106/016/02 Solder dip 510601602 + BeO Y - Gold STPS20100CFSY1 + BeO - STPS20100CFSYHRB 5106/016/03 Solder dip 510601603 + BeO Y STPS20100SFSYHRB 5106/016/04 Solder dip 510601604 + BeO Y STPS20100AFSYHRB TO-254 STPS20100CFSY1 8/10 Packing 2.0 STPS20100SHRB STPS20100AFSY1 Mass (g) Waffle pack 10.0 Doc ID 16953 Rev 1 STPS20100HR 5 Revision history Revision history Table 9. Document revision history Date Revision 25-Mar-2010 1 Changes Initial release. Doc ID 16953 Rev 1 9/10 STPS20100HR Please Read Carefully: Information in this document is provided solely in connection with ST products. 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