STPS20100CFSY1 - STMicroelectronics, Inc.

March 2010 Doc ID 16953 Rev 1 1/10

STPS20100HR

Aerospace 1 x 20 and 2 x 20 A - 100 V Schottky rectifier

Features

■Forward current: 1 x 20 and 2 x 20 A

■Repetitive peak voltage: 100 V

■Low forward voltage drop: 0.8 V

■Maximum junction temperature: 175 °C

■Negligible switching losses

■Low capacitance

■High reverse avalanche surge capability

■Hermetic packages

■Target radiation qualification:

– 150 krad (Si) low dose rate

– 1 Mrad high dose rate

■ESCC qualified

Description

This power Schottky rectifier is designed and

packaged to comply with the ESCC5000

specification for aerospace products. Housed in

hermetically sealed packages both surface mount

and through hole, it is ideal for use in applications

for aerospace and other harsh environments.

The STPS20100HR is intended for use in medium

voltage application and particularly, in high

frequency circuits where low switching losses and

low noise are required.

TO-254 SMD.5

Table 1. Device summary

Order code ESCC detailed

specification Quality level Configuration Package Mass EPPL

STPS20100S1 - Engineering

model Single die SMD.5 2.0 g -

STPS20100SHRB 5106/016/05 ESCC flight -

STPS20100FSYHRB 5106/016/01 ESCC flight Single die

TO-254 10.0 g

STPS20100AFSY1 - Engineering

model Double die,

common anode

STPS20100AFSYHRB 5106/016/02 ESCC flight Y

STPS20100CFSY1 - Engineering

model Double die,

common cathode

STPS20100CFSYHRB 5106/016/03 ESCC flight Y

STPS20100SFSYHRB 5106/016/04 ESCC flight Double die, serial Y

www.st.com

Characteristics STPS20100HR

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1 Characteristics

Table 2. Absolute maximum ratings

Symbol Characteristic Value Unit

IFSM Forward surge current (per diode)(1)

1. Sinusoidal pulse of 10 ms duration

250 A

VRRM Repetitive peak reverse voltage(2)

2. Pulsed, duration 5 ms, F = 50 Hz

100 V

IRRM Repetitive peak reverse current(3)

3. Pulsed, duration 2 µs, F = 1 kHz

Average output rectified current (50% duty cycle):(4), (5)

All variants (per diode)

Variants 02, and 03 (per device)

4. For Tcase > +140 °C, derate linearly to 0 A at +175 °C.

5. The “per Device” ratings apply only as follows:

Variant 02: when both cathode terminals are tied together

Variant 03: when both anode terminals are tied together.

IF(RMS) Forward rms current (per diode) 30 A

TOP

Operating temperature range(6)

(case temperature)

6. For variants with hot solder dip lead finish all testing performed at Tamb > +125 °C are carried out in a 100%

inert atmosphere.

-65 to +175 °C

TJJunction temperature +175 °C

TSTG Storage temperature range(6) -65 to +175 °C

TSOL

Soldering temperature:

For TO-254(7)

For SMD.5(8)

7. Duration 10 seconds maximum at a distance of not less than 1.5 mm from the device body and the same

lead shall not be resoldered until 3 minutes have elapsed.

8. Duration 5 seconds maximum and the same package shall not be resoldered until 3 minutes have elapsed.

+260

+245

dV/dt Critical rate of rise of reverse voltage 10000 V/µs

Table 3. Thermal resistance

Symbol Characteristic Value Unit

Rth(j-c)(1)

1. Package mounted on infinite heatsink

Thermal resistance, junction to case

Variants 01, and 05

Variants 02, 03 and 04 (per diode)

Variants 02, and 03 (per device)(2)

2. The per device ratings apply for variant 02 when both cathode terminals are tied together and for variant 03

when when both anode terminals are tied togther.

1.65

0.85

°C/W

STPS20100HR Characteristics

Doc ID 16953 Rev 1 3/10

Table 4. Electrical measurements at ambiant temperature (per diode), Tamb = 22 ±3 °C

Symbol Characteristic MIL-STD-750

test method Test conditions

Values

Units

Min. Max.

IRReverse Current 4016 DC method, VR = 100 V - 30 µA

VF1(1)

Forward Voltage 4011 Pulse method, IF = 10 A - 780 mV

VF2(1) Pulse method, IF = 20 A - 1 V

CCapacitance 4001 VR = 10 V, F = 1 MHz - 700 pF

Zth(j-c)

Relative thermal impedance,

junction to case 3101 IH = 15 to 40 A, tH = 50 ms

IM = 50 mA, tmd = 100 µs Calculate ΔVF°C/W

1. Pulse width ≤ 680µs, Duty Cycle ≤ 2%

Table 5. Electrical measurements at high and low temperatures (per diode)

Symbol Characteristic MIL-STD-750

test method Test conditions

Values

Units

Min. Max.

IRReverse Current 4016 Tcase = +125 (+0, -5) °C

DC method, VR = 100 V -20mA

VF2(1) Forward Voltage 4011

Tcase = +125 (+0, -5) °C

pulse method, IF = 20 A -900mV

Tcase = -55 (+5, -0) °C

pulse method, IF = 20 A -1.1V

1. Pulse width ≤ 680µs, Duty Cycle ≤ 2%

Configurations STPS20100HR

4/10 Doc ID 16953 Rev 1

2 Configurations

Figure 1. Available device configurations

Variant 01

STPS20100FSYHRB

Variant 02

STPS20100AFSY1

STPS20100AFSYHRB

Variant 03

STPS20100CFSY1

STPS20100CFSYHRB

Variant 04

STPS20100SFSYHRB

Variant 05

STPS20100S1

STPS20100SHRB

Terminal 1:

Terminal 2:

Terminal 3:

Cathode

No connection

Anode

Terminal 1:

Terminal 2:

Terminal 3:

Terminal 1:

Terminal 2:

Terminal 3:

Terminal 1:

Terminal 2:

Terminal 3:

Terminal 1:

Terminal 2:

Terminal 3:

For TO-254 the case is not connected to any lead

For SMD.5 the lid is not connected to any terminal

Cathode a

Common anode

Cathode b

Anode a

Common cathode

Anode b

Anode a

Center tap

Cathode b

Anode

Cathode

STPS20100HR Package Information

Doc ID 16953 Rev 1 5/10

3 Package Information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

Figure 2. Metal flange mount package (TO-254(a)), 3 lead dimension definitions

a. The terminal identification is specified by the device configuration. See Figure 1 for terminal connections

ØF

ØI

ØM

123

Package Information STPS20100HR

6/10 Doc ID 16953 Rev 1

Table 6. Metal flange mount package (TO-254), 3-lead dimension values

Reference

Dimension in millimetres Dimlension in inches

Min. Max. Min. Max.

A 13.59 13.84 0.535 0.545

B 13.59 13.84 0.535 0.545

C 20.07 20.32 0.790 0.800

D 6.3 6.7 0.248 0.264

E 1 3.9 0.039 0.154

ØF 3.5 3.9 0.138 0.154

G 16.89 17.4 0.665 0.685

H 6.86 BSC 0.270 BSC

ØI(1)

1. 3 locations

0.89 1.14 0.035 0.045

J 3.81 BSC 0.150 BSC

K 3.81 BSC 0.150 BSC

L 12.95 14.5 0.510 0.571

ØM 3.05 Typ. 0.120 Typ.

N - 0.71 - 0.028

R1(2)

2. Radius of heatsink flange corner - 4 locations

- 1 - 0.039

R2(3)

3. Radius of body corner - 4 locations

1.65 Typ. 0.065

STPS20100HR Package Information

Doc ID 16953 Rev 1 7/10

Figure 3. Surface mount package (SMD.5), 3-terminal dimension definitions

Table 7. Surface mount package (SMD.5), 3-terminal dimension values

Reference

Dimension in millimetres Dimlension in inches

Min. Max. Min. Max.

A 2.84 3.15 0.112 0.124

A1 0.25 0.51 0.010 0.20

b 7.13 7.39 0.281 0.291

b1 5.58 5.84 0.220 0.230

b2(1)

1. 2 locations

2.28 2.54 0.090 0.100

b3(1) 2.92 3.18 0.115 0.125

D 10.03 10.28 0.395 0.405

D1(1) 0.76 - 0.030 -

E 7.39 7.64 0.291 0.301

e(1) 1.91 BSC 0.075

AA1

b3 D1

Ordering Information STPS20100HR

8/10 Doc ID 16953 Rev 1

4 Ordering Information

Table 8. Ordering information

Order code ESCC detailed

specification Package Lead finish Marking EPPL Mass

(g) Packing

STPS20100S1 - SMD.5 Gold STPS20100S1 - 2.0

Waffle

pack

STPS20100SHRB 5106/016/05 Gold 510601605 -

STPS20100FSYHRB 5106/016/01

TO-254

Solder dip 510601601 + BeO -

10.0

STPS20100AFSY1 - Gold STPS20100AFSY1

+ BeO -

STPS20100AFSYHRB 5106/016/02 Solder dip 510601602 + BeO Y

STPS20100CFSY1 - Gold STPS20100CFSY1

+ BeO -

STPS20100CFSYHRB 5106/016/03 Solder dip 510601603 + BeO Y

STPS20100SFSYHRB 5106/016/04 Solder dip 510601604 + BeO Y

STPS20100HR Revision history

Doc ID 16953 Rev 1 9/10

5 Revision history

Table 9. Document revision history

Date Revision Changes

25-Mar-2010 1 Initial release.

STPS20100HR

10/10 Doc ID 16953 Rev 1

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