Features
Repetitive Avalanche Ratings
Dynamic dv/dt Rating
Hermetically Sealed
Simple Drive Requirements
The HEXFET® technology is the key to International
Rectifier’s HiRel advanced line of power MOSFET transistors.
The efficient geometry and unique processing of this latest
“State of the Art” design achieves: very low on-state
resistance combined with high trans conductance.
The HEXFET transistors also feature all of the well
established advantages of MOSFETs such as voltage control,
very fast switching and temperature stability of the electrical
parameters.
They are well suited for applications such as switching power
supplies, motor controls, inverters, choppers, audio amplifiers
and high energy pulse circuits.
Absolute Maximum Ratings
Symbol Parameter Value Units
ID1 @ VGS = -10V, TC = 25°C Continuous Drain Current -6.4
A
ID2 @ VGS = -10V, TC = 100°C Continuous Drain Current -4.1
IDM @ TC = 25°C Pulsed Drain Current -26
PD @TC = 25°C Maximum Power Dissipation 20 W
Linear Derating Factor 0.16 W/°C
VGS Gate-to-Source Voltage ± 20 V
EAS Single Pulse Avalanche Energy 120 mJ
IAR Avalanche Current -6.4 A
EAR Repetitive Avalanche Energy 2.0 mJ
dv/dt Peak Diode Recovery dv/dt -4.5 V/ns
TJ Operating Junction and
°C
TSTG Storage Temperature Range
Lead Temperature 300 (0.063 in. /1.6 mm from case for 10s)
Weight 0.98 (Typical) g
-55 to + 150
TO-39
IRFF9024
1 2018-11-13
Product Summary
Part Number BVDSS RDS(on) I
D
IRFF9024 -60V 0.28 -6.4A
60V, P-CHANNEL
REPETITIVE AVALANCHE AND dv/dt RATED
HEXFET®TRANSISTORS
THRU-HOLE TO-205AF (TO-39)
PD-90413A
Description
For Footnotes, refer to the page 2.
International Rectifier HiRel Products, Inc.
2 2018-11-13
IRFF9024
International Rectifier HiRel Products, Inc.
Thermal Resistance
Symbol Parameter Min. Typ. Max. Units
RJC Junction-to-Case ––– ––– 6.25
RJA Junction-to-Ambient (Typical socket mount) ––– ––– 175 °C/W
Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)
Symbol Parameter Min. Typ. Max. Units Test Conditions
BVDSS Drain-to-Source Breakdown Voltage -60 ––– ––– V VGS = 0V, ID = -1.0mA
BVDSS/TJ Breakdown Voltage Temp. Coefficient ––– -0.068 ––– V/°C Reference to 25°C, ID = -1.0mA
RDS(on) Static Drain-to-Source On-Resistance ––– ––– 0.28  VGS = -10V, ID2 = -4.1A 
––– ––– 0.29 VGS = -10V, ID1 = -6.4A 
VGS(th) Gate Threshold Voltage -2.0 ––– -4.0 V VDS = VGS, ID = -250µA
Gfs Forward Transconductance 1.3 ––– ––– S VDS = -15V, ID2 = -4.1A
IDSS Zero Gate Voltage Drain Current ––– ––– -25 µA VDS = -48V, VGS = 0V
––– ––– -250 VDS = -48V,VGS = 0V,TJ =125°C
IGSS Gate-to-Source Leakage Forward ––– ––– -100 nA VGS = -20V
Gate-to-Source Leakage Reverse ––– ––– 100 VGS = 20V
QG Total Gate Charge 8.4 ––– 19
nC
ID1 = -6.4A
QGS Gate-to-Source Charge 2.0 ––– 5.4 VDS = -30V
QGD Gate-to-Drain (‘Miller’) Charge 6.0 ––– 11 VGS = -10V
td(on) Turn-On Delay Time ––– ––– 20
ns
VDD = -30V
tr Rise Time ––– ––– 100 ID1 = -6.4A
td(off) Turn-Off Delay Time ––– ––– 23 RG = 7.5
tf Fall Time ––– ––– 44
Ls +LD Total Inductance ––– 7.0 ––– nH
Measured from Drain lead (6mm / 0.25 in
from package) to Source lead (6mm/ 0.25
in from package) with Source wire
internally bonded from Source pin to Drain
pin
Ciss Input Capacitance ––– 570 –––
pF
VGS = 0V
Coss Output Capacitance ––– 360 ––– VDS = -25V
Crss Reverse Transfer Capacitance ––– 65 ––– ƒ = 1.0MHz
Source-Drain Diode Ratings and Characteristics
Symbol Parameter Min. Typ. Max. Units Test Conditions
IS Continuous Source Current (Body Diode) ––– ––– -6.4
ISM Pulsed Source Current (Body Diode) ––– ––– -26
VSD Diode Forward Voltage ––– ––– -6.3 V TJ = 25°C,IS = -6.4A, VGS = 0V
trr Reverse Recovery Time ––– ––– 200 ns TJ = 25°C, IF = -6.4A, VDD -50V
Qrr Reverse Recovery Charge ––– ––– 2.2 µC di/dt = -100A/µs
ton Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
A
Footnotes:
Repetitive Rating; Pulse width limited by maximum junction temperature.
VDD = -25V, starting TJ = 25°C, Peak IL = -6.4A
ISD -6.4A, di/dt -200A/µs, VDD -60V, TJ 150°C, Suggested RG = 7.5
Pulse width 300 µs; Duty Cycle 2%
3 2018-11-13
IRFF9024
International Rectifier
Fig 3. Typical Transfer Characteristics
Fig 1. Typical Output Characteristics
Fig 4. Normalized On-Resistance Vs. Temperature
Fig 5. Typical Capacitance Vs.
Drain-to-Source Voltage
Fig 6. Typical Gate Charge Vs.
Gate-to-Source Voltage
Fig 2. Typical Output Characteristics
4 2018-11-13
IRFF9024
International Rectifier HiRel Products, Inc.
Fig 7. Typical Source-Drain Diode Forward Voltage Fig 8. Maximum Safe Operating Area
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
Fig 9. Maximum Drain Current Vs.
Case Temperature
Fig 10. Maximum Avalanche Energy
Vs. Drain Current
5 2018-11-13
IRFF9024
International Rectifier HiRel Products, Inc.
Fig 12a. Unclamped Inductive Test Circuit Fig 12b. Unclamped Inductive Waveforms
Fig 13b. Gate Charge Test Circuit
Fig 13a. Gate Charge Waveform
Fig 14b. Switching Time Waveforms
Fig 14a. Switching Time Test Circuit
6 2018-11-13
IRFF9024
International Rectifier HiRel Products, Inc.
Case Outline and Dimensions - TO-205AF (TO-39)
101 N. Sepulveda Boulevard, El Segundo, California 90245, USA Tel: +1 (310) 252-7105
2520 Junction Avenue, San Jose, California 95134, USA Tel: +1 (408) 434-5000
205 Crawford Street, Leominster, Massachusetts 01453, USA Tel: +1 (978) 534-5776
Data and specifications subject to change without notice.
www.infineon.com/irhirel
7 2018-11-13
IRFF9024
International Rectifier HiRel Products, Inc.
IMPORTANT NOTICE
The information given in this document shall be in no event regarded as guarantee of conditions or characteristic. The
data contained herein is a characterization of the component based on internal standards and is intended to
demonstrate and provide guidance for typical part performance. It will require further evaluation, qualification and
analysis to determine suitability in the application environment to confirm compliance to your system requirements.
With respect to any example hints or any typical values stated herein and/or any information regarding the application of
the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind including without
limitation warranties on non- infringement of intellectual property rights and any third party.
In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this
document and any applicable legal requirements, norms and standards concerning customer’s product and any use of
the product of Infineon Technologies in customer’s applications.
The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of any
customer’s technical departments to evaluate the suitability of the product for the intended applications and the
completeness of the product information given in this document with respect to applications.
For further information on the product, technology, delivery terms and conditions and prices, please contact your local
sales representative or go to (www.infineon.com/hirel).
WARNING
Due to technical requirements products may contain dangerous substances. For information on the types in question,
please contact your nearest Infineon Technologies office.