1/9No.EE21-KHDC000-02
KYOCERA CORPORATION
Messrs.Digi-key
EMI FILTER Specification
Part No. :KNH21 Series
RoHS Compliant
19.Aug., 2011
Approved by Masanori Somazu
Checked by Kazuaki Higashi
Checked by Kazuki Shimizu
Issued by Takafumi Nogi
PUBLICATION No.
Reference
2/9No.EE21-KHDC000-02
KYOCERA CORPORATION
EMI FILTER SPECIFICATION
1. Apply
This specification applies to Kyocera chip EMI filter KNH21 Series.
2. Nomenclature
KNH 21 C104 DA 3T S
Termination ( S : STD)
Packaging (3T: 3,000pcs Tape & Reel )
Application (DA : Digital Circuit in General)
Capacitance (C104 : 100nF)
Size code (21 : 2.0*1.2 mm )
Series ( KNH : High current type )
3. Performance / Requirement
3 – 1 Standard requirement
A: Insulation resistance Min. 500 (M ohm)
B: Operating temperature -40 to 85 (deg.)
3 – 2 Electrical characteristics Capacitance Direct - current
( +50 / -20 % ) Rated
current
Rated
voltage resistance
Parts Number ( pF ) ( A ) ( V ) (Ohm)
KNH21C221DA3TS 220 1.0 50 Max. 0.08
KNH21C471DA3TS 470 1.0 50 Max. 0.08
KNH21C473DA3TS 47,000 2.0 50 Max. 0.02
KNH21C104DA3TS 100,000 2.0 25 Max. 0.02
KNH21C105DA3TS 1,000,000 4.0 10 Max. 0.02
KNH21C475DA3TS 4,700,000 4.0 6.3 Max. 0.02
KNH21C106DA3TS 10,000,000 6.0 6.3 Max. 0.01
3 – 3 Frequency Characteristics
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
10
1 10 100 1,000 10,000
Frequency (MHz)
Attenuation (dB)
KNH21C473DA
KNH21C104DA
KNH21C105DA
KNH21C475DA
KNH21C221DA
KNH21C471DA
KNH21C106DA
3/9No.EE21-KHDC000-02
KYOCERA CORPORATION
W
L
P
Q
I/O I/O
1
3
2
GND
T
R
P
Q
P
C
T
Copper foil pattern
Copper foil pattern + Resist
S
W
U
R
Through hole to connect ground plane
D
( Figure – 3 )
Resist
4. Size and dimensions
*1 KNH21C475DA: 1.0+- 0.15
*1 KNH21C106DA: 1.0+- 0.15
5. Recommended land pattern
Symbol Dimensions
L 2.00 + / - 0.20
W 1.25 + / - 0.20
T 0.85 + / - 0.15 *1
P 0.30 + / - 0.20
Q 0.40 + / - 0.20
R Min. 0.01
Symbol Dimensions
T 3.20
W 1.00
R 2.30
C 1.20
P 0.80
Q 0.40
S 0.60
U 2.00
D 0.3 to 0.4
(Figure – 1) (Figure – 2)
Outer Electrode
CERAMIC
Inner electrode
Plating (Sn) : 1-10um
Plating (Ni) : 1-10um
Unit : mm
Unit : mm
4/9No.EE21-KHDC000-02
KYOCERA CORPORATION
6. Requirement and measurement method
No Contents Requirement Measurement method and conditions
1
Appearance
No serious defect.
Microscope (10 magnifications).
2
Dimensions
Figure – 1
Digital caliper and measurement
microscope.
Measured by HP4278A.
Capaci
-tance Measured
frequency
Measured
voltage
22pF to
470pF 1MHz
+- 10kHz
47nF to
10uF 1kHz
+-10Hz
1V+- 0.2V
rms
3
Capacitance
3 – 2 item
4
Insulation
resistance
3 – 1 item
Measured by super meg ohmmeter
model SM – 9E (made by TOA).
1-3 or 2-3 (at figure – 1) measured.
To measure after charging with the rated
voltage for 1 minute at room temperature
and normal humidity.
5
Dielectric
strength
No problem observed.
To charge between 1 ( or 3 ) and 2 (at
figure – 1) with the 2.5 times high of the
rated voltage for 1 to 5 seconds.
6
Current
resistance
No problem observed.
Print rated current for 1 to 5 seconds
between 1-2 (at figure – 1).
7
Solderability
Coverage Min. 90 %
Each termination.
Completely coat parts with flux and
propanol solution and preheat for 1
minute at 120 to 150deg.. Afterwards, dip
parts into solder bath for 2+-0.5 seconds
at 230+-5deg..
Solder level checked by naked eye under
microscope.
5/9No.EE21-KHDC000-02
KYOCERA CORPORATION
45mm 45mm
R340
1.0 mm
No Contents Requirement Measurement method and conditions
8
Soldering heat
resistance
No mechanical defect.
I.R. ; Min. 500M ohms
Capacitance variation
; +- 20%
Completely coat parts with flux and
propanol solution and preheat for 1
minute at 120 to 150deg.. Afterwards, dip
parts into solder bath for 10+-1 seconds
at 260+-5deg..
Measure after 24+-2 hours.
9
Bending
strength test
No mechanical defect.
As shown below glass epoxy board
(t=1.6mm) is soldered. Mechanical
pressure is applied and bent 1 mm for 3
seconds.
( Figure – 4 )
As specified bellow, the steps are
repeated
10 cycles.
Temperature
(deg.) Time
(Minutes)
1 -25+-3 30+-3
2 Room Temp.
2 to 5
3 85+-2 30+-3
4 Room Temp.
2 to 5
10
Temperature
cycle
No mechanical defect.
I.R. ; Min. 500M ohms
Capacitance variation
; +- 30%
Measure after 24+-2 hours.
11
Humidity test
No mechanical defect.
I.R. ; Min. 500M ohm
Capacitance variation
; +- 30%
Leave at 40+-2deg.,humidity 90 to
95%Rh atmosphere for 500+-12 hours.
Measure after 24+-2 hours.
12
High
temperature
with loading
No mechanical defect.
I.R. ; Min. 500Mohm
Capacitance variation
; +- 30%
Loading rated direct – current voltage
continuously under 85+-3 deg.
environment for 500+-12 hours.
Measure after 24+-2 hours.
6/9No.EE21-KHDC000-02
KYOCERA CORPORATION
7. Outgoing quality standards
Randomly inspected by ANSi – ASQC Z 1.4
Contents Standard AQL(%)
Size-dimension S-1 2.5
Appearance I 1
Capacitance S-4 1
Direct-current
resistance S-4 1
Insulation
resistance S-4 1
8. Recommended storage conditions
Temperature ; -10 to 45 deg.
Humidity ; 45 to 75 %RH
9. Product site
KYOCERA Corporation Kagoshima Kokubu plant Japan
10. Standard soldering conditions
[ Reflow soldering condition ]
*Pre-heating : 150 degree,
1minute Min.
*Set a temperature
difference between
Pre-heating and Peak to
less than 130 degree
(Figure – 5)
50
100
150
200
250
40 +/- 10sec 90 +/- 10sec 35 +/- 5sec
Over 250degC
8sec Max
140 +/- 10degC
180 +/- 5degC
220degC Min
260degC Max
Temperature (deg.C)
7/9No.EE21-KHDC000-02
KYOCERA CORPORATION
( Figure – 6 )
K
t
G
H
F
A
B
E
C
D
J
Taping packaging specification
1) Apply
This specification applies to Kyocera chip EMI filter [KNH21 series] taping.
2) Tape
2 – 1 Material Plastic
2 – 2 Dimensions
3) Taping configuration
3 – 1 Unit by reel
Taping for 1 reel is 3,000 pcs STD. Also, components should be placed in consecutively
without any vacancy.
3 – 2 Reel dimensions
Symbol
Dimensions
+0
A d180
-3.0
B D60
+1.0
-0
C d13 +/- 0.5
D d21 +/- 0.8
E 2.0 +/- 0.5
+0
W1 9.3
-0.15
W2 11.4±1.0
Symbol A B C D E
Dimensions 1.45+-0.2 2.25+-0.2 8.0+-0.3 3.5+-0.05 1.75+-0.1
F G H J t K
+0.1 +0.07
4.0+-0.1 2.0+-0.05 4.0+-0.1 1.5
-0 0.25+-0.05 1.15
-0.05
(mm)
B
W1
W2
E
A
C
D
8/9No.EE21-KHDC000-02
KYOCERA CORPORATION
400mm (Min.)
Leader portion
Blank portion
Components
placement
Blank
portion
40mm (Min)
40mm (Min)
Running direction
ْ
1
6
5
~
1
8
0
Running direction
Pulling direction
3 – 3 Leader portion and blank portion
As shown in drawing 8, there is space for leader portion and blank portion.
Furthermore, the pulling strength of carrier tape and top tape is 45 +- 35 g
as shown in drawing 9.
3 – 4 Reel marking
The following contents are marked on one side of reel.
a) Part number b) Lot number c) Quantity d) Customer name
3 – 5 Other case marking
Adequate packaging is done to avoid damages during delivery.
The other cases have the following marking.
a) Part number b) Lot number c) Quantity d) Shipment date
e) Customer name
( Figure – 8 )
( Figure – 9 )
(Figure - 9)
9/9No.EE21-KHDC000-02
KYOCERA CORPORATION
Limitation of use
Make sure to contact us in advance before considering using this product for the
following applications which would require particularly high reliability due to possibility
of direct harm to lives and/or properties.
(1)Use inaerospace or space
(2)Use in seabed or underground
(3)Use in control of power station – firepower, waterpower, nuclearpower, etc
(4)Use in medical treatments including instruments related to lifesaver
(5)Use in transportation – cars, trains, ships, etc.
(6)Use in traffic controls
(7)Use in protection/prevention against disasters or crimes
(8)Use in information processing
(9)Others – Use in the equivalent applications mentioned above
This product is designed and manufactured with intention to be used in general electronic
equipments for standard applications but with no intention to be used in the following environments
which may affect performance of this product. Therefore, make sure to have enough confirmation
on performance and reliability of this product in the following environments in advance before use.
(1)Use in liquids such as water, oil, medical liquid, organic solvent, etc
(2)Use in direct sunshine, rain, wind, or dust/dirt
(3)Use in sea wind or place with corrosive gas such as CI2, H2S, NH3, SO2, NO2, etc
(4)Use in environment with strong static electricity or electromagnetic wave
(5)Use in located nearly to heat generating part or flammable materials such as vinyl wires
(6)Use in condensation
(7)Use in sealed or coated by materials such as resin, etc
