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FSB50450A / FSB50450AS / FSB50450AT Motion SPM® 5 Series

July 2016

FSB50450A / FSB50450AS / FSB50450AT Rev. 1.7

FSB50450A / FSB50450AS / FSB50450AT

Motion SPM® 5 Series

Features

• UL Certified No. E209204 (UL1557)

• 500 V RDS(on) = 2.4 Max FRFET MOSFET 3-Phase

Inverter with Gate Drivers and Protection

• Built-In Bootstrap Diodes Simplify PCB Layout

• Separate Open-Source Pins from Low-Side MOSFETs

for Three-Phase Current-Sensing

• Active-HIGH Interface, Works with 3.3 / 5 V Logic,

Schmitt-trigger Input

• Optimized for Low Electromagnetic Interference

• HVIC Temperature-Sensing Built-In for Temperature

Monitoring

• HVIC for Gate Driving and Under-Voltage Protection

• Isolation Rating: 1500 Vrms / min.

• Moisture Sensitive Level (MSL) 3

• RoHS Compliant

Applications

• 3-Phase Inverter Driver for Small Power AC Motor

Drives

Related Source

•RD-FSB50450A - Reference Design for Motion SPM

Series Ver.2

• AN-9082 - Motion SPM5 Series Thermal Performance

by Contact Pressure

• AN-9080 - User’s Guide for Motion SPM 5 Series V2

General Description

The FSB50450A/AS/AT is an advanced Motion SPM® 5

module providing a fully-featured, high-performance

inverter output stage for AC Induction, BLD C and PMSM

motors. These modules integrate optimized gate drive of

the built-in MOSFET s (FRFET® technology) to minimize

EMI and losses, while also providing multiple on-module

protection features including under-voltag e lockouts and

thermal monitoring. The built-in high-speed

HVIC requires only a single supply voltage and

translates the incoming logic-level gate inputs to the

high-voltage, high-current drive signals required to

properly drive the module's internal MOSFETs.

Separate open-source MOSFET terminals are available

for each phase to support the widest variety of control

algorithms.

Package Marking & Ordering Information

Device Marking Device Package Reel Size Packing Type Quantity

FSB50450A FSB50450A SPM5P-023 NA Rail 15

FSB50450AS FSB50450AS SPM5Q-023 330mm Tape-Reel 450

FSB50450AT FSB50450AT SPM5N-023 NA Rail 15

FSB50450AS

FSB50450A FSB50450AT

FSB50450A / FSB50450AS / FSB50450AT Motion SPM® 5 Series

FSB50450A / FSB50450AS / FSB50450AT Rev. 1.7

Absolute Maximum Ratings

Inverter Part (each MOSFET unless otherwise specified.)

Control Part (each HVIC unless otherwise specified.)

Bootstrap Diode Part (each bootstrap diode unless otherwise specified.)

Thermal Resistance

Total System

1st Notes:

1. For the m easurement point of case temperature TC, please refer to Figure 4.

2. Marking “ * “ is calculation value or design factor.

Symbol Parameter Conditions Rating Unit

VDSS Drain-Source Voltage of Each MOSFET 500 V

*ID 25 Each MOSFET Drain Current, Continuous TC = 25°C 1.5 A

*ID 80 Each MOSFET Drain Current, Continuous TC = 80°C 1.1 A

*IDP Each MOSFET Drain Current, Peak TC = 25°C, PW < 100 s 3.9 A

*IDRMS Each MOSFET Drain Current, Rms TC = 80°C, FPWM < 20 kHz 0.8 Arms

*PDMaximum Power Dissipation TC = 25°C, For Each MOSFET 14 W

Symbol Parameter Conditions Rating Unit

VCC Control Supply Voltage Applied between VCC and COM 20 V

VBS High-side Bias Voltage Applied between VB and VS20 V

VIN Input Signal Voltage Applied between VIN and COM -0.3 ~ VCC + 0.3 V

Symbol Parameter Conditions Rating Unit

VRRMB Maximum Repetitive Reverse Voltage 500 V

* IFB Forward Current TC = 25°C 0.5 A

* IFPB Forward Current (Peak) TC = 25°C, Under 1ms Pulse Width 1.5 A

Symbol Parameter Conditions Rating Unit

RJC Junction to Case Thermal Resistance Each MOSFET under Inverter Oper-

ating Condition (1st Note 1) 8.9 °C/W

Symbol Parameter Conditions Rating Unit

TJOperating Junction Tem perature -40 ~ 150 °C

TSTG Storage Temperature -40 ~ 125 °C

VISO Isolation Voltage 60 Hz, Sinusoidal, 1 Minute, Con-

nect Pins to Heat Sink Plate 1500 Vrms

FSB50450A / FSB50450AS / FSB50450AT Motion SPM® 5 Series

FSB50450A / FSB50450AS / FSB50450AT Rev. 1.7

Pin descriptions

Figure 1. Pin Configuration and Internal Block Diagram (Bottom View)

1st Notes:

3. Source t e rminal of e ach low-s i de MOS FET is no t c onn ect e d to sup p ly gr ou nd o r b ia s voltag e gr ound in si de M ot io n S P M® 5 product. External connections should be made as

indicated in Figure 3.

Pin Number Pin Name Pin Description

1 COM IC Common Supply Ground

B(U) Bias Voltage for U-Phase High-Side MOSFET Driving

CC(U) Bias Voltage for U-Phase IC and Low-Side MOSFET Driving

4IN

(UH) Signal Input for U-Phase High-Side

5IN

(UL) Signal Input for U-Phase Low-Side

6 N.C No Connection

B(V) Bias Voltage for V-Phase High Side MOSFET Driving

CC(V) Bias Voltage for V-Phase IC and Low Side MOSFET Driving

9IN

(VH) Signal Input for V-Phase High-Side

10 IN(VL) Signal Input for V-Phase Low-Side

11 VTS Output for HVIC Temperature Sensing

12 VB(W) Bias Voltage for W-Phase High-Side MOSFET Driving

13 VCC(W) Bias Voltage for W-Phase IC and Low-Side MOSFET Driving

14 IN(WH) Signal Input for W-Phase High-Side

15 IN(WL) Signal Input for W-Phase Low-Side

16 N.C No Connection

17 P Positive DC-Link Input

18 U, VS(U) Output for U-Phase & Bias Voltage Ground for High-Side MOSFET Driving

19 NUNegative DC-Link Input for U-Phase

20 NVNegative DC-Link Input for V-Phase

21 V, VS(V) Output for V-Phase & Bias Voltage Ground for High-Side MOSFET Driving

22 NWNegative DC-Link Input for W-Phase

23 W, VS(W) Output for W Phase & Bias Voltage Ground for High-Side MOSFET Driving

(1) COM

(2) VB(U)

(3) VCC(U)

(4) I N (UH)

(5) I N (UL)

(6) N.C

(7) VB(V)

(8) VCC(V)

(9) I N (VH)

(10) IN(VL)

(11) VTS

(12 ) VB(W)

(13) VCC(W)

(14) IN (WH)

(15) IN (WL)

(16)

(17) P

(18) U, VS(U)

(19) NU

(20) NV

(21) V, VS(V)

(22) NW

(23) W, VS(W)

COM

VCC

LIN

HIN

COM

VCC

LIN

HIN

VTS

COM

VCC

LIN

HIN

N.C

FSB50450A / FSB50450AS / FSB50450AT Motion SPM® 5 Series

FSB50450A / FSB50450AS / FSB50450AT Rev. 1.7

Electrical Characteristics (TJ = 25°C, VCC = VBS = 15 V unless otherwise specified.)

Inverter Part (each MOSFET unless otherwise specified.)

Control Part (each HVIC unless otherwise specified.)

Bootstrap Diode Part (each bootstrap diode unless otherwise specified.)

Symbol Parameter Conditions Min Typ Max Unit

BVDSS Drain - Source

Breakdown Voltage VIN = 0 V, ID = 1 mA (2nd Note 1) 500 - - V

IDSS Zero Gate Voltage

Drain Current VIN = 0 V, VDS = 500 V - - 1 mA

RDS(on) Static Drain - Source

Turn-On Resistance VCC = VBS = 15 V, VIN = 5 V, ID = 1.0 A - 1.9 2.4 

VSD Drain - Source Diode

Forward Voltage VCC = VBS = 15V, VIN = 0 V, ID = -1.0 A - - 1.2 V

tON

Switching Times

VPN = 300 V, VCC = VBS = 15 V, ID = 1.0 A

VIN = 0 V  5 V, Inductive Load L = 3 mH

High- and Low-Side MOSFET Switching

(2nd Note 2)

- 1250 - ns

tOFF - 680 - ns

trr - 200 - ns

EON -60- J

EOFF -10- J

RBSOA Reverse Bias Safe Oper-

ating Area

VPN = 400 V, VCC = VBS = 15 V, ID = IDP, VDS = BVDSS,

TJ = 150°C

High- and Low-Side MOSFET Switching (2nd Note 3) Full Square

Symbol Parameter Conditions Min Typ Max Unit

IQCC Quiescent VCC Current VCC = 15 V,

VIN = 0 V Applied between VCC and COM - - 200 A

IQBS Quiescent VBS Current VBS = 15 V,

VIN = 0 V Applied between V B(U) - U,

VB(V) - V, VB(W) - W - - 100 A

IPCC Operating VCC Supply

Current VCC - COM VCC = 15 V, fPWM = 20 kHz, duty

= 50%, Applied to One PWM Sig-

nal Input for Low-Side - - 800 A

IPBS Operating VBS Supply

Current

VB(U) - VS(U), VB(V)

- VS(V), VB(W) -

VS(W)

VCC = VBS = 15 V, fPWM = 20 kHz,

Duty = 50%, Applied to One PWM

Signal Input for High-Side - - 700 A

UVCCD Low-Side Under-Voltage

Protection (Figure 8) VCC Under-Voltage Protection Detectio n Level 7.4 8.0 9.4 V

UVCCR VCC Under-Voltage Protection Reset Level 8.0 8.9 9.8 V

UVBSD High-Side Under-Voltage

Protection (Figure 9) VBS Under-Voltage Protection Detection Level 7.4 8.0 9.4 V

UVBSR VBS Under-Voltage Protection Reset Level 8.0 8.9 9.8 V

VTS HVIC Temperature Sens-

ing Voltage Output VCC = 15 V, THVIC = 25°C (2nd Note 4) 600 790 980 mV

VIH ON Threshold Voltage Logic HIGH Level Applied between VIN and COM --2.9V

VIL OFF Threshold Voltage Logic LOW Level 0.8 - - V

Symbol Parameter Conditions Min Typ Max Unit

VFB Forward Voltage IF = 0.1 A, TC = 25°C (2nd Note 5) - 2.5 - V

trrB Reverse Recovery Time IF = 0.1 A, TC = 25°C - 80 - ns

FSB50450A / FSB50450AS / FSB50450AT Motion SPM® 5 Series

FSB50450A / FSB50450AS / FSB50450AT Rev. 1.7

Recommended Operating Condition

Figure 2. Built-In Bootstrap Diode Characteristics (Typical)

2nd Notes:

1. BVDSS is the absolute maxi mum voltage rating between drain and source terminal of each MOSFET inside Motion SPM® 5 product. VPN shou ld be sufficiently less than this

value consideri ng the ef fect of the stray inductance so that VPN should not exceed BVDSS in any case.

2. tON and tOFF include the propagation delay of the internal drive IC. Listed values are measured at the laboratory test condition, and they can be different according to the field

applications due to the effect of different printed circuit boards and wirings. Please see Figure 6 for the switching time definition with the switching test circuit of Figure 7.

3. The peak current and voltage of each MOSFET during the switching operation should be included in the Safe Operating Area (SOA). Please see Figure 7 for the RBSOA test

circuit that is same as the switching test circuit.

4. Vts is only for sensing-temperature of modu l e and can not shut down MOSFETs automati ca ll y.

5. Built-in bootstrap diode includes around 15 Ωresistance characte ristic. Please refer to Figure 2.

Symbol Parameter Conditions Min. Typ. Max. Unit

VPN Supply Voltage Applied between P and N - 300 400 V

VCC Control Supply Voltage Applied between VCC and COM 13.5 15.0 16.5 V

VBS High-Side Bias Voltage Applied between VB and VS13.5 15.0 16.5 V

VIN(ON) Input ON Threshold Voltage Applied between VIN and COM 3.0 -VCC V

VIN(OFF) Input OFF Threshold Voltage 0 -0.6 V

tdead Blanking Time for Preventing

Arm-Short VCC = VBS = 13.5 ~ 16.5 V, TJ 150°C 1.0 - - s

fPWM PWM Switching Frequency TJ 150°C - 15 - kHz

0123456789101112131415

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0 Built-In Bootstrap Diode VF-IF C haracteristic

IF [A]

VF [V ]

= 25°C

FSB50450A / FSB50450AS / FSB50450AT Motion SPM® 5 Series

FSB50450A / FSB50450AS / FSB50450AT Rev. 1.7

Figure 3. Recommended MCU Interface and Bootstrap Circuit with Parameters

3rd Notes:

1. Parameters for bootstrap circuit elements are dependent on PWM algorithm. For 15 kHz of switching fr equency, typical example of parameters is shown above.

2. RC-coupli ng (R 5 and C5) and C4 at each input of Motion SPM 5 product and MCU (Indicated as Dotted Lines) may be used to prevent improper signal due to surge-noise.

3. Bold lines should be short and thick in PCB pattern to have small stray inductance of circuit, which results in the reduction of surge-voltage. Bypass capacitors such as C1, C2

and C3 should ha ve good high-frequency characteristics to absorb high-frequency ripple-current.

Figure 4. Case Temperature Measurement

3rd Notes:

4. Attach the thermocouple on top of the heat-sink of SPM 5 package (between SPM 5 package and heatsink if applied) to get the correct temperature measurement.

Figure 5. Temperature Profile of VTS (Typical)

HIN LIN Output Note

0 0 Z Both FRFET Off

0 1 0 Low side F RFET On

10 V

DC High side FRFET On

1 1 Forbidden Shoot through

Open Open Z Same as (0,0)

COM

VCC

LIN

HIN

NR3

Inverter

Output

MCU

+15 V

10F

These values depend on PWM control algorithm

* Example of Boot s t ra p Param te rs:

C1 = C2 = 1 F Ceramic Capacitor

VDC

VTS

* Example Circuit : V phase

One Leg Diagram of Mo ti on SPM® 5 Product

20 40 60 80 100 120 140 160

0.5

1.0

1.5

2.0

2.5

3.0

3.5

VTS [V]

THVIC [oC]

FSB50450A / FSB50450AS / FSB50450AT Motion SPM® 5 Series

FSB50450A / FSB50450AS / FSB50450AT Rev. 1.7

Figure 6. Switching Time Definitions

Figure 7. Switching and RBSOA (Single-Pulse) Test Circuit (Low-side)

Figure 8. Under-Voltage Protection (Low-Side)

Figure 9. Under-Voltage Protection (High-Side)

tON trr

Irr

100% of ID120% of ID

(a) Turn -on

tOFF

(b) Tu rn -o ff

VDS

VIN VIN

10% of ID

COM

VCC

LIN

HIN

VCC

CBS

VDS

VTS

One Leg Diagram of Motion SPM® 5 Product

UVCCD

UVCCR

Input Signal

UV Protection

Status

Low-side Supply, VCC

MOSFET Current

RESET DETECTION RESET

UVBSD

UVBSR

Input Signal

UV Protection

Status

High-si de Supply, VBS

MOSFET Current

RESET DETECTION RESET

FSB50450A / FSB50450AS / FSB50450AT Motion SPM® 5 Series

FSB50450A / FSB50450AS / FSB50450AT Rev. 1.7

Figure 10. Example of Application Circuit

4th Notes:

1. About pin position, refer to Figure 1.

2. RC-coupling (R5 and C5, R4 and C6) and C4 at each input of Motion SPM® 5 product and MCU are useful to prevent improper input signal caused by surge-noise.

3. The voltage -drop acros s R3 affects the low-side switching performance and the bootstrap characteristics since it is placed between COM and the source terminal of the low-

side MOSFET. For this reason, the voltage-drop across R3 shou ld be less than 1 V in the steady-state.

4. Ground-wires and output terminals, should be thick and short in order to avoid surge-voltage and malfunction of HVIC.

5. All the filter capacitors should be connected close to Motion SPM 5 product, and they should h ave good charac teristics for r ejecting high-freque ncy ripple current.

COM

VCC

LIN

HIN

COM

VCC

LIN

HIN

COM

VCC

LIN

HIN

(1) COM

(2) VB(U)

(3) VCC(U)

(4) IN (UH)

(5) IN (UL)

(6) N.C

(7) VB(V)

(8) VCC(V)

(9) IN (VH)

(10) I N(VL)

(11) V TS

(12) V B(W)

(13) V CC(W)

(14) I N(WH)

(15) I N(WL)

(16) N .C

(17) P

(18) U, VS(U)

(19) N U

(22) N W

Micom

15 V

Supply

C3VDC

For current-sensing and protection

VTS

(21) V, VS(V)

(20) N V

(23) W, V S(W)

FSB50450A / FSB50450AS / FSB50450AT Motion SPM® 5 Series

FSB50450A / FSB50450AS / FSB50450AT Rev. 1.7

Detailed Package Outline Drawings(FSB50450A)

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or data on the drawing and contact a FairchildSemiconductor representative to verify or

obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide therm and conditions,

specifically the the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

https://www.fairchildsemi.com/package-drawings/MO/MOD23DC.pdf

FSB50450A / FSB50450AS / FSB50450AT Motion SPM® 5 Series

FSB50450A / FSB50450AS / FSB50450AT Rev. 1.7

Detailed Package Outline Drawings(FSB50450AS)

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or data on the drawing and contact a FairchildSemiconductor representative to verify or

obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide therm and conditions,

specifically the the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

https://www.fairchildsemi.com/package-drawings/MO/MOD23DG.pdf

FSB50450A / FSB50450AS / FSB50450AT Motion SPM® 5 Series

FSB50450A / FSB50450AS / FSB50450AT Rev. 1.7

Detailed Package Outline Drawings(FSB50450AT)

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or data on the drawing and contact a FairchildSemiconductor representative to verify or

obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide therm and conditions,

specifically the the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

https://www.fairchildsemi.com/package-drawings/MO/MOD23DF.pdf

FSB50450A / FSB50450AS / FSB50450AT Motion SPM® 5 Series

FSB50450A / FSB50450AS / FSB50450AT Rev. 1.7

TRADEMARKS

The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not

intended to be an exhaustive list of all such trademarks.

AccuPower¥

AttitudeEngine™

Awinda

AX-CAP

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Global Power Resource

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Making Small Speakers Sound Louder

and Better™

MegaBuck¥

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MicroPak¥

MicroPak2¥

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MTi

MTx

MVN

mWSaver

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OPTOLOGIC

OPTOPLANAR

Power Supply WebDesigner¥

PowerTrench

PowerXS™

Programmable Active Droop¥

QFET

QS¥

Quiet Series¥

RapidConfigure¥

Saving our world, 1mW/W/kW at a time™

SignalWise¥

SmartMax¥

SMART START¥

Solutions for Your Success¥

SPM

STEALTH¥

SuperFET

SuperSOT¥-3

SuperSOT¥-6

SuperSOT¥-8

SupreMOS

SyncFET¥

Sync-Lock™

®*

TinyBoost

TinyBuck

TinyCalc¥

TinyLogic

TINYOPTO¥

TinyPower¥

TinyPWM¥

TinyWire¥

TranSiC¥

TriFault Detect¥

TRUECURRENT

PSerDes¥

UHC

Ultra FRFET¥

UniFET¥

VCX¥

VisualMax¥

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XS™

Xsens™

௝❺

* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.

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Advance Information Formative / In Design Datasheet contains the design specifications for product development. Specifications may change

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Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild

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Rev. I77

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