Surface Mount Ultrafast Power Rectifier MURA160, NRVUA160V, SURA8160 Ideally suited for high voltage, high frequency rectification, or as free wheeling and protection diodes in surface mount applications where compact size and weight are critical to the system. Features * * * * * * Small Compact Surface Mountable Package with J-Bend Leads Rectangular Package for Automated Handling High Temperature Glass Passivated Junction Low Forward Voltage Drop (1.05 V Max @ 1.0 A, TJ = 150C) NRVUA and SURA8 Prefixes for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable* These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant www.onsemi.com ULTRAFAST RECTIFIER 1 AMPERE, 600 VOLTS SMA CASE 403D MARKING DIAGRAM Mechanical Characteristics: * Case: Epoxy, Molded * Weight: 70 mg (Approximately) * Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable * Lead and Mounting Surface Temperature for Soldering Purposes: * * 260C Max. for 10 Seconds Polarity: Polarity Band Indicates Cathode Lead ESD Protection: Human Body Model > 4000 V (Class 3) Machine Model > 400 V (Class C) U4J AYWW G U4J A Y WW G = = = = = Device Code Assembly Location Year Work Week Pb-Free Package ORDERING INFORMATION Package Shipping MURA160T3G SMA (Pb-Free) 5,000/Tape & Reel NRVUA160VT3G SMA (Pb-Free) 5,000/Tape & Reel SURA8160T3G SMA (Pb-Free) 5,000/Tape & Reel Device For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. (c) Semiconductor Components Industries, LLC, 2016 July, 2020 - Rev. 8 1 Publication Order Number: MURA160T3/D MURA160, NRVUA160V, SURA8160 MAXIMUM RATINGS Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Rating VRRM VRWM VR 600 V Average Rectified Forward Current @ TL = 145C @ TL = 110C IF(AV) Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM Operating Junction Temperature Range TJ 1.0 2.0 30 -65 to +175 A A C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction-to-Lead (TL = 25C) (Note 1) Thermal Resistance, Junction-to-Ambient (Note 1) Thermal Resistance, Junction-to-Case Top (Note 1) Symbol Max Unit PsiJL (Note 2) RqJA 24 C/W 216 YJCT 16 C/W Max Unit 1. Rating applies when surface mounted on the minimum pad size recommended, PC Board FR-4. 2. In compliance with JEDEC 51, these values (historically represented by RqJL) are now referenced as PsiJL. ELECTRICAL CHARACTERISTICS Characteristic Symbol Maximum Instantaneous Forward Voltage (Note 3) (iF = 1.0 A, TJ = 25C) (iF = 1.0 A, TJ = 150C) vF Maximum Instantaneous Reverse Current (Note 3) (Rated dc Voltage, TJ = 25C) (Rated dc Voltage, TJ = 150C) iR Maximum Reverse Recovery Time (iF = 1.0 A, di/dt = 50 A/ms) trr 1.25 1.05 5.0 150 75 V mA ns Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0%. www.onsemi.com 2 MURA160, NRVUA160V, SURA8160 IR, REVERSE CURRENT (mA) 10 TJ = 100C 1 0.1 0.01 IF, INSTANTANEOUS FORWARD CURRENT (A) 1000 TJ = 150C TJ = 25C 0 100 300 200 400 500 TJ = 25C 0 100 200 300 400 500 VR, REVERSE VOLTAGE (VOLTS) Figure 1. Typical Reverse Current Figure 2. Maximum Reverse Current 100C TC = 150C 25C 1 0.1 0.3 TJ = 100C 10 VR, REVERSE VOLTAGE (VOLTS) 10 0.01 TJ = 150C 100 1 600 0.5 0.7 0.9 1.1 1.3 1.5 1.7 IF, INSTANTANEOUS FORWARD CURRENT (A) IR, REVERSE CURRENT (mA) 100 10 TC = 150C 100C 25C 1 0.1 0.01 0.3 VF, INSTANTANEOUS VOLTAGE (VOLTS) 0.5 0.7 0.9 1.1 1.3 1.5 1.7 VF, INSTANTANEOUS VOLTAGE (VOLTS) Figure 4. Maximum Forward Voltage Figure 3. Typical Forward Voltage www.onsemi.com 3 600 1.9 MURA160, NRVUA160V, SURA8160 30 C, CAPACITANCE (pF) 20 15 10 5 4 0 12 8 20 16 28 24 32 36 20 15 10 0 40 8 12 16 20 24 28 32 Figure 5. Typical Capacitance Figure 6. Maximum Capacitance dc 3 SQUARE WAVE 2 1 80 4 VR, REVERSE VOLTAGE (VOLTS) 4 60 0 VR, REVERSE VOLTAGE (VOLTS) 5 0 NOTE: MAXIMUM CAPACITANCE AT 0 V = 27 pF 25 5 IF(AV), AVERAGE FORWARD CURRENT (A) 0 IF(AV), AVERAGE FORWARD CURRENT (A) NOTE: TYPICAL CAPACITANCE AT 0 V = 24 pF 100 120 140 160 180 0.6 SQUARE WAVE 0.5 0.4 0.3 0.2 0.1 0 0 20 40 60 100 120 140 Figure 8. Current Derating, Ambient (FR-4 Board with Minimum Pad) dc SQUARE WAVE 2 1.5 1 0.5 0.5 80 TA, AMBIENT TEMPERATURE (C) 3.5 0 180 0.7 4 0 160 0.8 4.5 2.5 40 dc 0.9 Figure 7. Current Derating, Lead 3 36 1 TL, LEAD TEMPERATURE (C) PF, AVERAGE POWER DISSIPATION (W) C, CAPACITANCE (pF) 25 1 1.5 2 2.5 3 IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 9. Power Dissipation www.onsemi.com 4 3.5 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SMA CASE 403D ISSUE H STYLE 1 DATE 23 SEP 2015 STYLE 2 SCALE 1:1 HE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L. E b DIM A A1 b c D E HE L D POLARITY INDICATOR OPTIONAL AS NEEDED (SEE STYLES) A MILLIMETERS NOM MAX 2.10 2.20 0.10 0.20 1.45 1.63 0.28 0.41 2.60 2.92 4.32 4.57 5.21 5.59 1.14 1.52 STYLE 1 SOLDERING FOOTPRINT* xxxx A Y WW G 4.000 0.157 2.000 0.079 INCHES NOM 0.083 0.004 0.057 0.011 0.103 0.170 0.205 0.045 MIN 0.078 0.002 0.050 0.006 0.090 0.160 0.190 0.030 MAX 0.087 0.008 0.064 0.016 0.115 0.180 0.220 0.060 GENERIC MARKING DIAGRAM* xxxx AYWWG A1 c L MIN 1.97 0.05 1.27 0.15 2.29 4.06 4.83 0.76 xxxx AYWWG STYLE 2 = Specific Device Code = Assembly Location = Year = Work Week = Pb-Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb-Free indicator, "G" or microdot " G", may or may not be present. 2.000 0.079 SCALE 8:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON04079D SMA STYLE 1: PIN 1. CATHODE (POLARITY BAND) 2. ANODE STYLE 2: NO POLARITY Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped "CONTROLLED COPY" in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. 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