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Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s
technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA
Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended
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FODM30XX — 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers
©2003 Fairchild Semiconductor Corporation www.fairchildsemi.com
FODM30XX Rev. 1.3
May 2017
FODM3011, FODM3012, FODM3022, FODM3023,
FODM3052, FODM3053
4-Pin Full Pitch Mini-Flat Package Random-Phase Triac
Driver Output Optocouplers
Features
• Compact 4-pin Surface Mount Package
(2.4 mm Maximum Standoff Height)
• Peak Blocking Voltage
– 250V (FODM301X)
– 400V (FODM302X)
– 600V (FODM305X)
• Safety and Regulatory Approvals:
– UL1577, 3,750 VACRMS for 1 Minute
– DIN-EN/IEC60747-5-5, 565 V Peak Working
Insulation Voltage
Applications
• Industrial Controls
• Traffic Lights
• Vending Machines
• Solid State Relay
• Lamp Ballasts
• Solenoid/Valve Controls
• Static AC Power Switch
• Incandescent Lamp Dimmers
• Motor Control
Description
The FODM301X, FODM302X, and FODM305X series
consists of a GaAs infrared emitting diode driving a
silicon bilateral switch housed in a compact 4-pin mini-
flat package. The lead pitch is 2.54 mm. They are
designed for interfacing between electronic controls and
power triacs to control resistive and inductive loads for
115 V/240 V operations.
Functional Schematic Package Outlines
Figure 2. Package Outlines
1
2
4
3
MAIN
TERMINAL
MAIN
TERMINAL
ANODE
CATHODE
Figure 1. Func tional Schematic
©2003 Fairchild Semiconductor Corporation www.fairchildsemi.com
FODM30XX Rev. 1.3 2
FODM30XX — 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers
Safety and Insulation Ratings
As per DIN EN/IEC 60747-5-5, this optocoupler is suitable for “safe electrical insulation” only within the safety limit
data. Compliance with the safety ratings shall be ensured by means of protective circuits.
Note:
1. Safety limit values – maximum values allowed in the event of a failure.
Parameter Characteristics
Installation Classifications per DIN VDE
0110/1.89 Table 1, For Rated Mains Voltage
< 150 VRMS I–IV
< 300 VRMS I–III
Climatic Classification 40/100/21
Pollution Degree (DIN VDE 0110/1.89) 2
Comparative Tracking Index 175
Symbol Parameter Value Unit
VPR
Input-to-Output Test Voltage, Method A, VIORM x 1.6 = VPR,
Type and Sample Test with tm = 10 s, Partial Discharge < 5 pC 904 Vpeak
Input-to-Output Test Voltage, Method B, VIORM x 1.875 = VPR,
100% Production Test with tm = 1 s, Partial Discharge < 5 pC 1060 Vpeak
VIORM Maximum Working Insulation Voltage 565 Vpeak
VIOTM Highest Allowable Over-Voltage 6000 Vpeak
External Creepage 5mm
External Clearance 5mm
DTI Distance Through Insulation (Insulation Thickness) 0.4 mm
TSCase Temperature(1) 150 °C
IS,INPUT Input Current(1) 200 mA
PS,OUTPUT Output Power(1) 300 mW
RIO Insulation Resistance at TS, VIO = 500 V(1) > 109
©2003 Fairchild Semiconductor Corporation www.fairchildsemi.com
FODM30XX Rev. 1.3 3
FODM30XX — 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only. TA = 25°C unless otherwise specified.
Symbol Parameter Value Unit
TSTG Storage Temperature -55 to +150 °C
TOPR Operating Temperature -40 to +100 °C
TJJunction Temperature -40 to +125 °C
TSOL Lead Solder Temperature 260 for 10 sec °C
EMITTER
IF (avg) Continuous Forward Current 60 mA
IF (pk) Peak Forward Current (1 μs pulse, 300 pps.) 1 A
VRReverse Input Voltage 3 V
PDPower Dissipation (No derating required over operating temp. range) 100 mW
DETECTOR
IT(RMS) On-State RMS Current 70 mA
(RMS)
VDRM Off-State Output Terminal Voltage
FODM3011, FODM3012 250
VFODM3022, FODM3023 400
FODM3052, FODM3053 600
PDPower Dissipation (No derating required over operating temp. range) 300 mW
©2003 Fairchild Semiconductor Corporation www.fairchildsemi.com
FODM30XX Rev. 1.3 4
FODM30XX — 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers
Electrical Characteristics
TA = 25°C unless otherwise specified.
Individual Component Characteristic s
Notes:
2. Test voltage must be applied within dv/dt rating.
3. This is static dv/dt. See Figure 1 for test circuit Commutating dv/dt is function of the load-driving thyristor(s) only.
Transfer Characteristics
Notes:
4. All devices are guaranteed to trigger at an IF value of less than or equal to the max IFT specification. For optimum
operation over temperature and lifetime of the device, the LED should be biased with an IF that is at least 50%
higher than the maximum IFT specification. The IFT should not exceed the absolute maximum rating of 60 mA.
Example: For FODM0353M, the minimum IF bias should be 5 mA x 150% = 7.5 mA
Isolation Characteristics
Symbol Parameter Test Conditions Device Min. Typ. Max. Unit
EMITTER
VFInput Forward Voltage IF = 10 mA All 1.20 1.50 V
IRReverse Leakage Current VR = 3 V, TA = 25°C All 0.01 100 μA
DETECTOR
IDRM Peak Blocking Current Either
Direction Rated VDRM, IF = 0(2) All 2 100 nA
dV/dt Critical Rate of Rise of
Off-State Voltage IF = 0 (Figure 8)(3)
FODM3011,
FODM3012,
FODM3022,
FODM3023
10
V/μs
FODM3052,
FODM3053 1,000
Symbol Parameter Test Conditions Device Min. Typ. Max. Unit
IT LED Trigger Current Main Terminal
Voltage = 3 V(4)
FODM3011,
FODM3022,
FODM3052
10
mA
FODM3012,
FODM3023,
FODM3053
5
IH Holding Current, Either
Direction All 450 µA
VTM Peak On-State Voltage Either
Direction ITM = 100 mA peak All 2.2 3 V
Symbol Parameter Test Conditions Device Min. Typ. Max. Unit
VISO Steady State Isolation
Voltage
1 Minute,
R.H. = 40% to 60% All 3,750 VACRMS
©2003 Fairchild Semiconductor Corporation www.fairchildsemi.com
FODM30XX Rev. 1.3 5
FODM30XX — 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers
Typical Performance Characteristics
1.7
1.8
((V)
1000
V
DRM
= 600 V
nA)
1.1
1.2
1.3
1.4
1.5
1.6
100 °C
25 °C
T
A
= -40 °C
V
F
- FORWARD VOLTAGE
1
10
100
DDRM
- LEAKAGE CURRENT (
Fig3.LEDForwardVoltagevs.ForwardCurrent Fig4.LeakageCurrentvs.AmbientTemperature
1100
0.9
1.100
10
I
F
- FORWARD CURRENT (mA)
-40 -20 80 100
0.1
I
0 204060
T
A
- AMBIENT TEMPERATURE (°C)
1
10
NORMALIZED TO T
A
= 25 °C
DD)) I
H
(T
A
) / I
H
(T
A
= 25 °C)
1.1
1.2
1.3
1.4
V
TM
= 3 V
NORMALIZED TO T
A
= 25 °C
DD)) I
FT
(T
A
) / I
FT
(T
A
= 25 °C)
-40 -20 80 100
0.1
I
H
(NORMALIZE
0 204060
T
A
- AMBIENT TEMPERATURE (°C)
-40 -20 80 100
0.8
0.9
1.0
I
FT
(NORMALIZE
0 204060
T
A
- AMBIENT TEMPERATURE (°C)
Fig 5. Normalized Holding Current vs. Ambient Temperature Fig 6. Normalized Trigger Current vs. Ambient Temperature
©2003 Fairchild Semiconductor Corporation www.fairchildsemi.com
FODM30XX Rev. 1.3 6
FODM30XX — 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers
Typical Performance Characteristics (Continued)
6
8
10
12
T
A
= 25 °C
NORMALIZED TO PW
IN
>> 100 µs
I
FT
(NORMALIZED) = I
FT
(PPW
IN
) / I
FT
(PW
A
>> 100 µs)
1.0
1.1
1.2
1.3
1.4
NORMALIZED TO T
A
= 25 °C
VV
DRM
(T
A
) / V
DRM
(T
A
= 25 °C)
1100
0
2
4
10
PW
IN
- LED TRIGGER PULSE WIDTH (µs)
-40 -20 80 100
0.6
0.7
0.8
0.9
V
DRM
(NORMALIZED) =
0 204060
T
A
- AMBIENT TEMPERATURE (°C)
Fig 7. LED Current Required to Trigger vs. LED Pulse Width Fig 8. Normalized Off-State Output Terminal Voltage vs. Ambient Temperature
300
400
T
A
= 25 °C
((mA)
0
100
200
I
TM
- ON-STATE CURRENT
Fig 9. On-State Characteristics
-4 -3 3 4
-100
-200
-300
-400
-2 -1 0 1 2
V
TM
- ON-STATE VOLTAGE (V)
©2003 Fairchild Semiconductor Corporation www.fairchildsemi.com
FODM30XX Rev. 1.3 7
FODM30XX — 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers
Typical Application Information
Figure 10. Static dv/dt Test Circuit
Figure 11. Resistive Load
Vdc
600 V (FODM3052)
(FODM3053)
400 V (FODM3022)
(FODM3023)
250 V (FODM3011)
(FODM3012)
R = 10 kΩ
CTEST
X100
SCOPE
PROBE
PULSE
INPUT MERCURY
WETTED
RELAY
378 V (FODM3052, FODM3053)
252 V (FOMD3022, FODM3023)
158 V (FODM3011, FODM3012)
0 VOLTS
APPLIED VOLTAGE
WAVEFORM
Vmax =
dv/dt = 0.63 Vmax
RTEST
D.U.T.D.U.T.
τRC
τRC
Figure 12. Inductive Load with Sensitive Gate Triac (IGT ≤ 15 mA)
VCC
Rin 1
2
4
3
0.1 μF
180
C1
2.4 k
ZL
120 V
60 Hz
FODM3011
FODM3012
FODM3022
FODM3023
FODM3052
FODM3053
VCC
Rin 1
2
4
3
120 V
60 Hz
180
RL
FODM3011
FODM3012
FODM3022
FODM3023
FODM3052
FODM3053
600 V (FODM3052, FODM3053)
= 400 V (FODM3022, FODM3023)
= 250 V (FODM3011, FODM3012)
= 378
τRC (FODM3053)
(FODM3052)
= 252
τRC (FODM3023)
(FODM3022)
= 158
τRC (FODM3011)
(FODM3012)
1. The mercury wetted relay provides a high speed
repeated pulse to the D.U.T.
2. 100x scope probes are used, to allow high speeds and
voltages.
3. The worst-case condition for static dv/dt is established by
triggering the D.U.T. with a normal LED input current,
then removing the current. The variable RTEST allows the
dv/dt to be gradually increased until the D.U.T. continues
to trigger in response to the applied voltage pulse, even
after the LED current has been removed. The dv/dt is
then decreased until the D.U.T. stops triggering. τRC is
measured at this point and recorded.
NOTE: This optoisolator should not be used to drive a load directly. It is
intended to be a trigger device only.
Ω
Ω Ω
©2003 Fairchild Semiconductor Corporation www.fairchildsemi.com
FODM30XX Rev. 1.3 8
FODM30XX — 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers
Typical Application Information (Continued)
Figure 13. Typical Application Circuit
VCC
Rin 1
2
4
3
0.05 μF
0.01 μF
LOAD
360
39
470
240
VAC
HOT
GROUND
FODM3022
FODM3023
FODM3052
FODM3053
In this circuit the “hot” side of the line is switched and the load connected to the cold or ground side.
The 39 Ω resistor and 0.01μF capacitor are for snubbing of the triac, and the 470 Ω resistor and 0.05 μF capacitor are
for snubbing the coupler. These components may or may not be necessary depending upon the particular and load used.
Ω Ω
Ω
©2003 Fairchild Semiconductor Corporation www.fairchildsemi.com
FODM30XX Rev. 1.3 9
FODM30XX — 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers
Reflow Profile
Profile Freature Pb-Free Assembly Profile
Temperature Min. (Tsmin) 150°C
Temperature Max. (Tsmax) 200°C
Time (tS) from (Tsmin to Tsmax) 60–120 seconds
Ramp-up Rate (tL to tP) 3°C/second max.
Liquidous Temperature (TL) 217°C
Time (tL) Maintained Above (TL) 60–150 seconds
Peak Body Package Temperature 260°C +0°C / –5°C
Time (tP) within 5°C of 260°C 30 seconds
Ramp-down Rate (TP to TL) 6°C/second max.
Time 25°C to Peak Temperature 8 minutes max.
Time (seconds)
Temperature (°C)
Time 25°C to Peak
260
240
220
200
180
160
140
120
100
80
60
40
20
0
TL
ts
tL
tP
TP
Tsmax
Tsmin
120
Preheat Area
Max. Ramp-up Rate = 3°C/S
Max. Ramp-down Rate = 6°C/S
240 360
©2003 Fairchild Semiconductor Corporation www.fairchildsemi.com
FODM30XX Rev. 1.3 10
FODM30XX — 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers
Ordering Information
Note:
The product orderable part number system listed in this table also applies to the FODM3012, FODM3022, FODM3023,
FODM3052, and FODM3053 products.
Marking Information
Figure 14. Top Mark
Table 1. Top Mark Definitions
Part Number Package Packing Method
FODM3011 Full Pitch Mini-Flat 4-Pin Tube (100 units)
FODM3011R2 Full Pitch Mini-Flat 4-Pin Tape and Reel (2500 Units)
FODM3011V Full Pitch Mini-Flat 4-Pin, DIN EN/IEC60747-5-5 Option Tube (100 Units)
FODM3011R2V Full Pitch Mini-Flat 4-Pin, DIN EN/IEC60747-5-5 Option Tape and Reel (2500 Units)
1 Fairchild Logo
2 Device Number
3 DIN EN/IEC60747-5-5 Option (only appears on component ordered with this option)
4 One-Digit Year Code, e.g., “6”
5 Digit Work Week, Ranging from “01” to “53”
6 Assembly Package Code
1
2
6
4
35
3011
XV R
YY
©2003 Fairchild Semiconductor Corporation www.fairchildsemi.com
FODM30XX Rev. 1.3 11
FODM30XX — 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers
Tape Specifications
D
D
W
K
t
d
1
0PP
A
P
0
B0
0
2
E
F
W
1
0
Reel Diameter
Devices Per Reel
Max. Component Rotation or Tilt
Cover Tape Thickness
Cover Tape Width
Pocket Hole Dia.
Pocket Dimension
Pocket Location
Sprocket Hole Location
Sprocket Hole Dia.
Sprocket Hole Pitch
Tape Thickness
Pocket Pitch
Tape Width
Description Symbol Dimensions
2.54 Pitch
B
d
W1
D
K0
1
0
E
A
P
0
P
F
2
D
P
0
0
t
W
330 mm (13")
12.00±0.4
7.30±0.20
20° max
1.55±0.20
2.30±0.20
0.065±0.02
9.20
1.75±0.20
8.00±0.20
2.00±0.20
5.50±0.20
4.75±0.20
1.55±0.20
4.00±0.20
0.35±0.02
2500
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ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
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