LM2623
LM2623 General Purpose, Gated Oscillator Based, DC/DC Boost Converter
Literature Number: SNVS188G
LM2623
General Purpose, Gated Oscillator Based, DC/DC Boost
Converter
General Description
The LM2623 is a high efficiency, general purpose, step-up
DC-DC switching regulator for battery-powered and low in-
put voltage systems. It accepts an input voltage between .8
and 14 volts and converts it into a regulated output voltage
between 1.24 and 14 volts. Efficiencies up to 90% are
achievable with the LM2623.
In order to adapt to a number of applications, the LM2623
allows the designer to vary the output voltage, the operating
frequency (300kHz to 2 MHz) and duty cycle (17% to 90%)
to optimize the part’s performance. The selected values can
be fixed or can vary with battery voltage or input to output
voltage ratio. The LM2623 uses a very simple, on/off regu-
lation mode to produce good efficiency and stable operation
over a wide operating range. It normally regulates by skip-
ping switching cycles when it reaches the regulation limit
(Pulse Frequency Modulation).
Note: Please read the "Non-Linear Effect" and "Choosing
The Correct C3 Capacitor" sub-sections of the Design Pro-
cedure section of this data sheet, so that any challenges with
designing with this part can be taken into account before a
board design/layout is finalized.
For Alternative Solutions, See Also: LM2700, LM2622,
LM2731, LM2733, and LM2621.
Features
nGood Efficiency Over a Very Wide Load Range
nVery Low Output Voltage Ripple
nSmall, Mini-SO-8 Package (Half the Footprint of
Standard 8 pin SO Package)
n1.09 mm Package Height
nUp to 2 MHz Switching Frequency
n.8V to 14V Operating Voltage
n1.1V Start-up Voltage
n1.24V - 14V Adjustable Output Voltage
nUp to 2A Load Current at low Output Voltages
n0.17ΩInternal MOSFET
nUp to 90% Regulator Efficiency
n80 µA Typical Operating Current (into V
DD
pin of supply)
n<2.5µA Guaranteed Supply Current In Shutdown
n4mm x 4mm Thermally Enhanced LLP Package Option
Applications
nCameras, Pagers and Cell Phones
nPDAs,Palmtop Computers, GPS devices
nWhite LED Drive, TFT or Scanned LCDs
nFlash Memory Programming
nHand-Held Instruments
n1, 2, 3 or 4 Cell Alkaline Systems
n1, 2 or 3 Cell Lithium-ion Systems
Typical Application Circuit
20038801
December 2005
LM2623 General Purpose, Gated Oscillator Based, DC/DC Boost Converter
© 2005 National Semiconductor Corporation DS200388 www.national.com
Connection Diagram
LLP Package
20038802
Top View
Mini SO-8 (MM) Package
20038818
Top View
Ordering Information
Order Number Package Type NSC Package
Drawing
Package
Marking Supplied As
LM2623MMX Mini SO-8 MUA08A S46B 3500 Units on Tape and Reel
LM2623AMMX Mini SO-8 MUA08A S46A 3500 Units on Tape and Reel
LM2623AMM Mini SO-8 MUA08A S46A 1000 Units on Tape and Reel
LM2623MM Mini SO-8 MUA08A S46B 1000 Units on Tape and Reel
LM2623LDX LLP-14 LDA14A 2623AB 4500 Units on Tape and Reel
LM2623ALDX LLP-14 LDA14A 2623A 4500 Units on Tape and Reel
LM2623LD LLP-14 LDA14A 2623AB 1000 Units on Tape and Reel
LM2623ALD LLP-14 LDA14A 2623A 1000 Units on Tape and Reel
LM2623
www.national.com 2
Pin Description
LLP-14 Pin MSOP-8 Pin Name Function
1 NC No Connect
2, 3 1 PGND Power Ground (LLP Pins2&3must be shorted
together).
4 2 EN Active-Low Shutdown Input
5 3 FREQ Frequency Adjust. An external resistor connected
between this pin and a voltage source sets the
switching frequency of the LM2623.
6 4 FB Output Voltage Feedback
7 NC No Connect
8 NC No connect
9 5 SGND Signal Ground
10 6 V
DD
Power Supply for Internal Circuitry
11 7 BOOT Bootstrap Supply for the Gate Drive of Internal
MOSFET Power Switch
12, 13 8 SW Drain of the Internal MOSFET Power Switch. (LLP Pins
12&13must be shorted together).
14 NC No Connect
DAP DAP To be soldered to board for enhanced thermal
dissipation. To be electrically isolated/floating.
LM2623
www.national.com3
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
SW Pin Voltage −0.5 V to 14.5V
BOOT, V
DD
, EN and FB Pins −0.5V to 10V
FREQ Pin 100µA
T
Jmax
(Note 2) 150˚C
Storage Temperature Range −65˚C to +150˚C
Lead Temp. (Soldering, 5 sec) 260˚C
Power Dissipation (T
A
=25˚C)
(Note 2)
500mW
ESD Rating (Note 3) 2kV
Operating Conditions (Note 1)
V
DD
Pin 3V to 5V
FB, EN Pins 0 to V
DD
BOOT Pin 0 to 10V
Ambient Temperature (T
A
) −40˚C to +85˚C
Electrical Characteristics
Limits in standard typeface are for T
J
= 25˚C, and limits in boldface type apply over the full operating temperature range of
−40˚C to +85˚C. Unless otherwise specified: V
DD
=V
OUT
= 3.3V.
Symbol Parameter Condition Typ Min Max Units
V
DD_ST
Start-Up Supply Voltage 25˚C I
LOAD
= 0mA (Note 4) 1.1 V
V
IN_OP
Minimum Operating Supply
Voltage (once started)
I
LOAD
= 0mA 0.65 .8 V
V
FB
FB Pin Voltage 1.24 1.2028 1.2772 V
V
OUT_MAX
Maximum Output Voltage 14 V
ηEfficiency V
IN
= 3.6V; V
OUT
= 5V; I
LOAD
=
500mA 87
%
V
IN
= 2.5V; V
OUT
= 3.3V; I
LOAD
= 200mA
87
D Switch Duty Cycle 17 %
I
DD
Operating Quiescent Current
(Note 5)
FB Pin >1.3V; EN Pin at V
DD
80 110 µA
I
SD
Shutdown Quiescent Current
(Note 6)
V
DD
, BOOT and SW Pins at
5.0V; EN Pin <200mV
0.01 2.5 µA
I
CL
Switch Peak Current Limit LM2623A 2. 85 2.2 A
I
C
Switch Peak Current Limit LM2623 1.2 A
R
DS_ON
MOSFET Switch On
Resistance
0.17 0.26 Ω
θ
JA
Thermal Resistance MM Package, Junction to
Ambient(Note 2)
240 ˚C/W
θ
JA
Thermal Resistance LLP Package, Junction to
Ambient(Notes 2, 8)
40 ˚C/W
θ
JA
Thermal Resistance LLP Package, Junction to
Ambient(Notes 2, 9)
56 ˚C/W
Enable Section
V
EN_LO
EN Pin Voltage Low (Note 7) 0.15V
DD
V
V
EN_HI
EN Pin Voltage High (Note 7) 0.7V
DD
V
Note 1: Absolute maximum ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when operating the device
outside of its rated operating conditions.
Note 2: The maximum power dissipation must be derated at elevated temperatures and is dictated by Tjmax (maximum junction temperature), θJA (junction to
ambient thermal resistance), and TA(ambient temperature). The maximum allowable power dissipation at any temperature is Pdmax =(T
jmax -T
A)/ θJA or the number
given in the Absolute Maximum Ratings, whichever is lower.
Note 3: The human body model is a 100 pF capacitor discharged through a 1.5 kΩresistor into each pin. For Pin 8 (SW) the ESD rating is 1.0 kV.
Note 4: VDD tied to Boot and EN pins. Frequency pin tied to VDD through 121K resistor. VDD_ST =V
DD when startu-up occurs. VIN is VDD + D1 voltage (usually
10-50 mv at start-up)
Note 5: This is the current into the VDD pin.
Note 6: This is the total current into pins VDD, BOOT, SW and FREQ.
Note 7: When the EN pin is below VEN_LO, the regulator is shut down; when it is above VEN_HI, the regulator is operating.
LM2623
www.national.com 4
Electrical Characteristics (Continued)
Note 8: Junction to ambient thermal resistance (θJA) is taken from a thermal modeling result, performed under the conditions and guidelines set forthe in the JEDEC
standard JESD51-17. The test board is a 4 layer FR-4 board measuring 102mm x 76mm x 1.6mm witha3x2array of thermal vias. The ground plane on the board
is 50mm x 50 mm. Thickness of copper layers are 36mm/18mm/18mm/36mm (1.5oz/10z/1oz/1.5ox). Ambient temperature in simulation is 22˚C, still air. Power
dissipation is 1W. (The DAP is soldered.) Fore more information on LLP thermal topics, as well as LLP mounting and soldering specifications please refer to
Application Note 1187: Leadless Leadframe Package (LLP).
Note 9: Exposed DAP soldered to an exposed 1sq. inch area of 1 oz. copper. Thermal resistance can be decreased by using more copper are to dissipate heat.
LM2623
www.national.com5
Typical Performance Characteristics
Efficiency vs V
IN
V
OUT
= 5.0V
V
FB
vs Temperature
20038829 20038831
Frequency vs V
IN
Maximum Start Up Voltage vs
Temperature
20038828 20038826
Typical R
DS(ON)
vs
Temperature
Typical Current Limit vs
Temperature
20038825 20038827
LM2623
www.national.com 6
Detailed Description
OPERATING PRINCIPLE
The LM2623 is designed to provide step-up DC-DC voltage
regulation in battery-powered and low-input voltage sys-
tems. It combines a step-up switching regulator, N-channel
power MOSFET, built-in current limit, thermal limit, and volt-
age reference in a single 8-pin MSOP package Figure 1. The
switching DC-DC regulator boosts an input voltage between
.8V and 14V to a regulated output voltage between 1.24V
and 14V. The LM2623 starts from a low 1.1V input and
remains operational down to below .8V.
This device is optimized for use in cellular phones and other
applications requiring a small size, low profile, as well as low
quiescent current for maximum battery life during stand-by
and shutdown. A high-efficiency gated-oscillator topology
offers an output of up to 2A at low output voltages.
Additional features include a built-in peak switch current
limit, and thermal protection circuitry.
GATED OSCILLATOR CONTROL SCHEME
The on/off regulation mode of the LM2623, along with its
ultra-low quiescent current, results in good efficiency over a
very wide load range. The internal oscillator frequency can
be programmed using an external resistor to be constant or
vary with the battery voltage. Adding a capacitor to program
the frequency allows the designer to adjust the duty cycle
and optimize it for the application. Adding a resistor in addi-
tion to the capacitor allows the duty cycle to dynamically
compensate for changes to the input/output voltage ratio.
We call this a Ratio Adaptive Gated Oscillator circuit. See the
Application Notes for sample application circuits. Using the
correct RC components to adjust the oscillator allows the
part to run with low ripple and high efficiency over a wide
range of loads and input/output voltages.
20038814
FIGURE 1. Functional Diagram
LM2623
www.national.com7
Detailed Description (Continued)
PULSE FREQUENCY MODULATION (PFM)
Pulse Frequency Modulation is typically accomplished by
switching continuously until the voltage limit is reached and
skipping cycles after that to just maintain it. This results in a
somewhat hysteretic mode of operation. The coil stores
more energy each cycle as the current ramps up to high
levels. When the voltage limit is reached, the system usually
overshoots to a higher voltage than required, due to the
stored energy in the coil (see figure 2). The system will also
undershoot somewhat when it starts switching again be-
cause it has depleted all the stored energy in the coil and
needs to store more energy to reach equilibrium with the
load. Larger output capacitors and smaller inductors reduce
the ripple in these situations. The frequency being filtered,
however, is not the basic switching frequency. It is a lower
frequency determined by the load, the input/output voltage
and the circuit parameters. This mode of operation is useful
in situations where the load variation is significant. Power
managed computer systems, for instance, may vary from
zero to full load while the system is on and this is usually the
preferred regulation mode for such systems.
CYCLE TO CYCLE PFM
When the load doesn’t vary over a wide range (like zero to
full load), ratio adaptive circuit techniques can be used to
achieve cycle to cycle PFM regulation and lower ripple (or
smaller output capacitors). The key to success here is
matching the duty cycle of the circuit closely to what is
required by the input to output voltage ratio. This ratio then
needs to be dynamically adjusted for input voltage changes
(usually caused by batteries running down). The chosen
ratio should allow most of the energy in each switching cycle
to be delivered to the load and only a small amount to be
stored. When the regulation limit is reached, the overshoot
will be small and the system will settle at an equilibrium point
where it adjusts the off time in each switching cycle to meet
the current requirements of the load. The off time adjustment
is done by exceeding the regulation limit during each switch-
ing cycle and waiting until the voltage drops below the limit
again to start the next switching cycle. The current in the coil
never goes to zero like it frequently does in the hysteretic
operating mode of circuits with wide load variations or duty
cycles that aren’t matched to the input/output voltage ratio.
Optimizing the duty cycle for a given set of input/output
voltages conditions can be done by using the circuit values
in the Application Notes.
LOW VOLTAGE START-UP
The LM2623 can start-up from voltages as low as 1.1 volts.
On start-up, the control circuitry switches the N-channel
MOSFET continuously until the output reaches 3 volts. After
this output voltage is reached, the normal step-up regulator
feedback and gated oscillator control scheme take over.
Once the device is in regulation, it can operate down to
below .8V input, since the internal power for the IC can be
boot-strapped from the output using the Vdd pin.
SHUT DOWN
The LM2623 features a shutdown mode that reduces the
quiescent current to less than a guaranteed 2.5uA over
temperature. This extends the life of the battery in battery
powered applications. During shutdown, all feedback and
control circuitry is turned off. The regulator’s output voltage
drops to one diode drop below the input voltage. Entry into
the shutdown mode is controlled by the active-low logic input
pin EN (pinh- 2). When the logic input to this pin is pulled
below .15Vdd, the device goes into shutdown mode. The
logic input to this pin should be above .7Vdd for the device to
work in normal stepup mode.
INTERNAL CURRENT LIMIT AND THERMAL
PROTECTION
An internal cycle-by-cycle current limit serves as a protection
feature. This is set high enough (2.85A typical, approxi-
mately 4A maximum) so as not to come into effect during
normal operating conditions. An internal thermal protection
circuit disables the MOSFET power switch when the junction
temperature (T
J
) exceeds about 160˚C. The switch is re-
enabled when T
J
drops below approximately 135˚C.
20038815
FIGURE 2. Typical Step-Up Regulator Waveforms
LM2623
www.national.com 8
Design Procedure
NON-LINEAR EFFECT
The LM2623 is very similar to the LM2621. The LM2623 is
based on the LM2621, except for the fact that the LM2623
takes advantage of a non-linear effect that allows for the duty
cycle to be programmable. The C3 capacitor is used to dump
charge on the FREQ pin in order to manipulate the duty
cycle of the internal oscillator. The part is being tricked to
behave in a certain manner, in the effort to make this Pulse
Frequency Modulated (PFM) boost switching regulator be-
have as a Pulse Width Modulated (PWM) boost switching
regulator.
CHOOSING THE CORRECT C3 CAPACITOR
The C3 capacitor allows for the duty cycle of the internal
oscillator to be programmable. Choosing the correct C3
capacitor to get the appropriate duty cycle for a particular
application circuit is a trial and error process. The non-linear
effect that C3 produces is dependent on the input voltage
and output voltage values. The correct C3 capacitor for
particular input and output voltage values cannot be calcu-
lated. Choosing the correct C3 capacitance is best done by
trial and error, in conjunction with the checking of the induc-
tor peak current to make sure your not too close to the
current limit of the device. As the C3 capacitor value in-
creases, so does the duty cycle. And conversely as the C3
capacitor value decreases, the duty cycle decreases. An
incorrect choice of the C3 capacitor can result in the part
prematurely tripping the current limit and/or double pulsing,
which could lead to the output voltage not being stable.
SETTING THE OUTPUT VOLTAGE
The output voltage of the step-up regulator can be set by
connecting a feedback resistive divider made of R
F1
and
R
F2
. The resistor values are selected as follows:
R
F1
=R
F2
* [(V
OUT
/ 1.24) −1]
A value of 50k to 100k is suggested for R
F2
. Then, R
F1
can
be selected using the above equation.
V
DD
SUPPLY
The Vdd supply must be between 3 to 5 volts for the
LM2623. This voltage can be bootstrapped from a much
lower input voltage by simply connecting the V
DD
pin to
V
OUT
. In the event that the V
DD
supply voltage is not a low
ripple voltage source (less than 200 millivolts), it may be
advisable to use an RC filter to clean it up. Excessive ripple
on V
DD
may reduce the efficiency.
SETTING THE SWITCHING FREQUENCY
The switching frequency of the oscillator is selected by
choosing an external resistor (R3) connected between V
IN
and the FREQ pin. See the graph titled "Frequency vs V
IN
“in
the Typical Performance Characteristics section of the data
sheet for choosing the R3 value to achieve the desired
switching frequency. A high switching frequency allows the
use of very small surface mount inductors and capacitors
and results in a very small solution size. A switching fre-
quency between 300kHz and 2MHz is recommended.
OUTPUT DIODE SELECTION
A Schottky diode should be used for the output diode. The
forward current rating of the diode should be higher than the
peak input current, and the reverse voltage rating must be
higher than the output voltage. Do not use ordinary rectifier
diodes, since slow switching speeds and long recovery times
cause the efficiency and the load regulation to suffer. Table 1
shows a list of the diode manufacturers.
LLP PACKAGE DEVICES
The LM2623 is offered in the 14 lead LLP surface mount
package to allow for increased power dissipation compared
to the MSOP-8. For details of the thermal performance as
well as mounting and soldering specifications, refer to Ap-
plication Note AN-1187.
TABLE 1. Suggested Manufacturers List
Inductors Capacitors Diodes
Coilcraft
Tel: (800) 322-2645
Fax: (708) 639-1469
Sprague/ Vishay
Tel: (207) 324-4140
Fax: (207) 324-7223
Motorola
Tel: (800) 521-6274
Fax: (602) 244-6609
Coiltronics
Tel: (407) 241-7876
Fax: (407) 241-9339
Kemet
Tel: (864) 963-6300
Fax: (864) 963-6521
International Rectifier (IR)
Tel: (310) 322-3331
Fax: (310) 322-3332
Pulse Engineering
Tel: (619) 674-8100
Fax: (619) 674-8262
Nichicon
Tel: (847) 843-7500
Fax: (847) 843-2798
General Semiconductor
Tel: (516) 847-3222
Fax: (516) 847-3150
LM2623
www.national.com9
Physical Dimensions inches (millimeters) unless otherwise noted
8-Lead Mini SO-8 (MM)
NS Package Number MUA08A
For Order Numbers, refer to the table in the "Ordering Information" section of this document.
LM2623
www.national.com 10
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
NS Package Number LDA14A
For Order Numbers, refer to the table in the "Ordering Information" section of this document.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves
the right at any time without notice to change said circuitry and specifications.
For the most current product information visit us at www.national.com.
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and whose failure to perform when
properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to result
in a significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be reasonably
expected to cause the failure of the life support device or
system, or to affect its safety or effectiveness.
BANNED SUBSTANCE COMPLIANCE
National Semiconductor manufactures products and uses packing materials that meet the provisions of the Customer Products
Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain
no ‘‘Banned Substances’’ as defined in CSP-9-111S2.
Leadfree products are RoHS compliant.
National Semiconductor
Americas Customer
Support Center
Email: new.feedback@nsc.com
Tel: 1-800-272-9959
National Semiconductor
Europe Customer Support Center
Fax: +49 (0) 180-530 85 86
Email: europe.support@nsc.com
Deutsch Tel: +49 (0) 69 9508 6208
English Tel: +44 (0) 870 24 0 2171
Français Tel: +33 (0) 1 41 91 8790
National Semiconductor
Asia Pacific Customer
Support Center
Email: ap.support@nsc.com
National Semiconductor
Japan Customer Support Center
Fax: 81-3-5639-7507
Email: jpn.feedback@nsc.com
Tel: 81-3-5639-7560
www.national.com
LM2623 General Purpose, Gated Oscillator Based, DC/DC Boost Converter
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic."Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Audio www.ti.com/audio Communications and Telecom www.ti.com/communications
Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers
Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps
DLP®Products www.dlp.com Energy and Lighting www.ti.com/energy
DSP dsp.ti.com Industrial www.ti.com/industrial
Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical
Interface interface.ti.com Security www.ti.com/security
Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community Home Page e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright ©2011, Texas Instruments Incorporated
