Audio ICs Low power consumption headphone driver for digital audio BA3576FS The BA3576FS is a headphone driver developed for use in 3.0V portable digital audio equipment. Applications Portable CD and MD players. Features 1) Low power consumption (when Po = 0.5mW per channel, the power supply current is 4.7mA, and the B current is 6.8mA (Typ.)). 2) High S / N ratio (96dB). Absolute maximum ratings (Ta = 25C) Recommended operating conditions (Ta = 25C) 884 3) AVC circuit. 4) Beep output function 5) Mute circuit. Audio ICs BA3576FS Block diagram 885 Audio ICs BA3576FS Electrical characteristics (unless otherwise noted, Ta = 25C, VCC = 3.0V, B = 2.4V, f = 1kHz, RL = 16, DIN AUDIO PWSTB = 3.0V, MUTE = 0V, ATT = OFF and AVC = OFF) 886 Audio ICs BA3576FS Measurement circuit 887 Audio ICs Measurement conditions 888 BA3576FS Audio ICs BA3576FS Application example 889 Audio ICs BA3576FS Operation notes (1) By operating the BA3576FS according to the timing chart shown in Fig.3, it is possible to suppress generation of "pop" noise in the headphone output. (2) The BA3576FS ripple filter pins (1 and 2) and the bias amp pins (3 and 4) cannot be used as external power supplies or reference voltages. (3) The BEEP signal is only output when PWSTB (pin 7) and MUTE (pin 9) are high level. Also, input a rectangular wave of between 500Hz and 5kHz and with an amplitude of VCC (with respect to ground) to BEEP IN (pin 11). Electrical characteristics curves 890 Audio ICs BA3576FS External dimensions (Units: mm) 891 Product Designation Page 1 of 2 ROHM-logo Product Designation l l l When ordering, specify the part number. Check each code against the tables shown below. Fill in from the left, leaving any extra boxes empty on the right. Product Designation Ordering information Packing and forming information only required for SOP, and QFP parts that are required in tape and reel containers. For example, to order part BA4558F on paper tape type E2, order number is BA4558F-E2, when required in tube container, order number is BA4558F. Quick reference of packaging specifications Package Container type DIP/SDIP Tube container SIP/HSIP/ZIP/SZIP/RSIP-A3 Tube container SOP/SSOP/HSOP/WSOP-10/WSOPL10 Packaging specification code Tube container Embossed E1, E2 tape file://F:\export\projects\bitting1\imaging\BITTING\cpl\20010105\01042001\ROHM...\7form.htm 1/5/01 Product Designation SSOP-A54 Page 2 of 2 Embossed E2 tape Tray Tray (dry QFP/SQFP/VQFP/UQFP/TQFP/PBGA pack) VP Embossed E1, E2 tape Bulk TO220FP Tube container SMP5 Embossed TL, TR tape TO252 Embossed E1, E2 tape RSLP8 Embossed E2(Sprocket 1pin, tape Horizontal) RSIP13 E2(Sprocket 1pin, Embossed Horizontal), E4 tape (Sprocket 1pin, Vertical) Note: SOP type can be delivered in tube, paper tape, or embossed tape. BGA/CSP package | SIP/ZIP package QFP package | Photo package SOP package | Product Designation DIP package | Packaging Specification [LSI Package Assemblies] [HOME | Selection Guide] file://F:\export\projects\bitting1\imaging\BITTING\cpl\20010105\01042001\ROHM...\7form.htm 1/5/01