CY7C261 CY7C263/CY7C264 8K x 8 Power-Switched and Reprogrammable PROM Features Functional Description The CY7C261, CY7C263, and CY7C264 are high-performance 8192-word by 8-bit CMOS PROMs. When deselected, the 7C261 automatically powers down into a low-power standby mode. It is packaged in a 300-mil-wide package. The 7C263 and 7C264 are packaged in 300-mil-wide and 600-mil-wide packages respectively, and do not power down when deselected. The reprogrammable packages are equipped with an erasure window; when exposed to UV light, these PROMs are erased and can then be reprogrammed. The memory cells utilize proven EPROM floating-gate technology and byte-wide intelligent programming algorithms. * CMOS for optimum speed/power * Windowed for reprogrammability * High speed -- 20 ns (commercial) -- 25 ns (military) * Low power -- 660 mW (commercial) -- 770 mW (military) * Super low standby power (7C261) -- Less than 220 mW when deselected -- Fast access: 20 ns EPROM technology 100% programmable Slim 300-mil or standard 600-mil packaging available 5V 10% VCC, commercial and military Capable of withstanding greater than 2001V static discharge * TTL-compatible I/O * Direct replacement for bipolar PROMs * * * * The CY7C261, CY7C263, and CY7C264 are plug-in replacements for bipolar devices and offer the advantages of lower power, superior performance and programming yield. The EPROM cell requires only 12.5V for the supervoltage and low current requirements allow for gang programming. The EPROM cells allow for each memory location to be tested 100%, as each location is written into, erased, and repeatedly exercised prior to encapsulation. Each PROM is also tested for AC performance to guarantee that after customer programming the product will meet DC and AC specification limits. Read is accomplished by placing an active LOW signal on CS. The contents of the memory location addressed by the address line (A0-A12) will become available on the output lines (O0-O7). Pin Configurations O7 A2 A3 ROW ADDRESS PROGRAM- MABLE ARRAY COLUMN MULTI- PLEXER DIP/Flatpack Top View O6 A7 A6 A5 A4 A3 A2 A1 A0 O0 O1 A4 A5 O5 A6 A7 ADDRESS DECODER O4 A8 O3 A9 A10 A11 COLUMN ADDRESS O2 A12 O2 GND O1 POWER DOWN (7C261) 1 24 2 23 3 22 4 21 5 20 6 19 18 7 8 7C261 17 7C263 9 7C264 16 10 15 11 14 12 13 VCC A8 A9 A10 CS A11 A12 O7 O6 O5 O4 O3 C261-2 LCC/PLCC (OpaqueOnly) Top View A5 A6 A7 NC VCC A8 A9 A0 A1 A4 A3 A2 A1 A0 NC O0 4 3 2 1 28 27 26 25 5 24 6 23 7C261 7 22 8 7C263 21 9 20 10 19 11 12 1314151617 18 A10 CS A11 A12 NC O7 O6 O1 O2 GND NC O3 O4 O5 Logic Block Diagram C261-3 O0 CS C261-1 For an 8K x 8 Registered PROM, see theCY7C265. Cypress Semiconductor Corporation * 3901 North First Street * San Jose * CA 95134 * 408-943-2600 March 1986 - Revised December 1994 CY7C261 CY7C263/CY7C264 Selection Guide Maximum Access Time (ns) Maximum Operating Current (mA) Maximum Standby Current (mA) (7C261 only) Commercial 7C261-20 7C263-20 7C264-20 7C261-25 7C263-25 7C264-25 7C261-35 7C263-35 7C264-35 7C261-45 7C263-45 7C264-45 7C261-55 7C263-55 7C264-55 20 25 35 45 55 120 120 100 100 100 140 120 120 120 40 30 30 30 40 30 30 30 Military Commercial 40 Military Maximum Ratings (Above which the useful life may be impaired. For user guidelines, not tested.) Storage Temperaturesy................................-65C to+150C Latch-Up Current..................................................... >200 mA Ambient Temperature with Power Applied ..............................................-55C to+125C Operating Range UV Exposure ................................................ 7258 Wsec/cm2 Supply Voltage to Ground Potential (Pin 24 to Pin 12) ............................................ -0.5V to+7.0V DC Voltage Applied to Outputs in High Z State ................................................ -0.5V to+7.0V DC Input Voltage........................................... -3.0V to + 7.0V Range Ambient Temperature VCC Commercial 0C to + 70C 5V 10% Industrial[1] -40C to + 85C 5V 10% Military[2] -55C to + 125C 5V 10% Notes: 1. See the Ordering Information section regarding industrial teperature range specifcation. 2. TA is the "instant on" case temperature. DC Program Voltage (Pin 19 DIP, Pin 23 LCC)...............................................13.0V Static Discharge Voltage............................................>2001V (per MIL-STD-883, Method 3015) 2 CY7C261 CY7C263/CY7C264 ]] Electrical Characteristics Over the Operating Range[3,4] 7C261-20, 25 7C263-20, 25 7C264-20, 25 Parameter Description Test Conditions VOH Output HIGH Voltage VCC = Min., IOH = -2.0 mA VOH Output HIGH Voltage VCC = Min., IOH = -4.0 mA VOL Output LOW Voltage VCC = Min., IOL = 8 mA (6 mA Mil) VOL Output LOW Voltage VCC = Min., IOL = 16 mA VIH Input HIGH Level VIL Input LOW Level IIX Input Current VCD Input Diode Clamp Voltage IOZ Output Leakage Current GND <VOUT < VCC Output Disabled IOS Output Short Circuit Current[5] VCC = Max., VOUT = GND ICC Power Supply Current VCC = Max., f = Max. IOUT= 0 mA Com'l Mil VCC = Max., CS > VIH Com'l Min. 7C261-35, 45, 55 7C263-35, 45, 55 7C264-35, 45, 55 Max. Min. Max. 2.4 V 2.4 V 0.4 V 0.4 2.0 ISB Standby Supply Current (7C261) VPP Programming Supply Voltage IPP Programming Supply Current VIHP Input HIGH Programming Voltage -10 +10 V 0.8 V +10 A -10 +10 A -10 Note 4 Com'l Mil V 2.0 0.8 GND < VIN < VCC Note 4 -10 +10 -40 +40 -40 +40 A -20 -90 -20 -90 mA 120 100 mA 140 120 40 30 Mil 40 12 mA 30 13 12 50 4.75 13 V 50 mA 4.75 VILP Input LOW Programming Voltage 0.4 Notes: 3. See the last page of this specification for Group A subgroup testing information. 4. See the "Introduction to CMOS PROMs" section of the Cypress Data Book for general information on testing. 5. For test purposes, not more than one output at a time should be shorted. Short circuit test duration should not exceed 30 seconds.] V 0.4 V Capacitance[4] Parameter Description CIN Input Capacitance COUT Output Capacitance Test Conditions TA = 25C, f = 1 MHz, VCC = 5.0V 3 Unit Max. Unit 10 pF 10 pF CY7C261 CY7C263/CY7C264 AC Test Loads and Waveforms[4] Test Load for -20 through -30 speeds R1 500 (658 MIL) R1 500 (658 MIL) 5V 5V OUTPUT 3.0V OUTPUT R2 333 (403 MIL) 30 pF INCLUDING JIG AND SCOPE INCLUDING JIG AND SCOPE (a) Normal Load GND R2 333 (403 MIL) 5 pF 90% 10% 90% 10% 5 ns 5 ns C261-5 C261-4 (b) High Z Load Equivalent to: THEVENIN EQUIVALENT RTH 200 (250 MIL) OUTPUT 2.0V(1.9VMIL) Test Load for -35 through -55 speeds R1250 R1 250 5V 5V OUTPUT OUTPUT R2167 30pF INCLUDING JIG AND SCOPE INCLUDING JIG AND SCOPE (c) Normal Load Equivalent to: R2167 5 pF C261-6 (d) High Z Load THEVENIN EQUIVALENT OUTPUT RTH 100 2.0V Switching Characteristics Over the Operating Range [2,3,4] 7C261-20 7C263-20 7C264-20 Parameter Description Min. 7C261-25 7C263-25 7C264-25 Max. Min. Max. 7C261-35 7C263-35 7C264-35 Min. 7C261-45 7C263-45 7C264-45 Max. Min. Max. 7C261-55 7C263-55 7C264-55 Min. Max. Unit tAA Address to Output Valid 20 25 35 45 55 ns tHZCS1 Chip Select Inactive to High Z (7C263 and 7C264) 12 12 20 30 35 ns tHZCS2 Chip Select Inactive to High Z (7C261) 20 25 35 45 55 ns tACS1 Chip Select Active to Output Valid (7C263 and 7C264) 12 12 20 30 35 ns tACS2 Chip Select Active to Output Valid (7C261) 20 25 35 45 55 ns tPU Chip Select Active to Power-Up (7C261) tPD Chip Select Inactive to Power-Down (7C261) 0 0 20 0 25 4 0 35 0 45 ns 55 ns CY7C261 CY7C263/CY7C264 Switching Waveforms [4] tPU tPD VCC SUPPLY CURRENT 50% 50% A0 - A12 ADDRESS CS tAA tHZCS tACS O0 - O7 C261-7 Erasure Characteristics Operating Modes Wavelengths of light less than 4000 angstroms begin to erase the devices in the windowed package. For this reason, an opaque label should be placed over the window if the PROM is exposed to sunlight or fluorescent lighting for extended periods of time. Read Read is the normal operating mode for programmed device. In this mode, all signals are normal TTL levels. The PROM is addressed with a 13-bit field, a chip select, (active LOW), is applied to the CS pin, and the contents of the addressed location appear on the data out pins. The recommended dose of ultraviolet light for erasure is a wavelength of 2537 angstroms for a minimum dose (UV intensity multiplied by exposure time) of 25 Wsec/cm2. For an ultraviolet lamp with a 12 mW/cm2 power rating, the exposure time wouldbe approximately 35 minutes. The 7C261 or 7C263 needs to be within 1 inch of the lamp during erasure. Permanent damage may result if the PROM is exposed to high-intensity UV light for an extended period of time. 7258 Wsec/cm2 is the recommended maximum dosage. Program, Program Inhibit, Program Verify These modes are entered by placing a high voltage VPP on pin 19, with pins 18 and 20 set to VILP. In this state, pin 21 becomes a latch signal, allowing the upper 5 address bits to be latched into an onboard register, pin 22 becomes an active LOW program (PGM) signal and pin 23 becomes an active LOW verify (VFY) signal. Pins 22 and 23 should never be active LOW at the same time. The PROGRAM mode exists when PGM is LOW, and VFY is HIGH. The verify mode exists when the reverse is true, PGM HIGH and VFY LOW and the program inhibit mode is entered with both PGM and VFY HIGH. Program inhibit is specifically provided to allow data to be placed on and removed from the data pins without conflict Table 1. Mode Selection Pin Function[6, 7] Read or Output Disable A12 A11 A10 A9 A8 CS O7 - O0 Program NA VPP LATCH PGM VFY CS D7 - D0 Read A12 A11 A10 A9 A8 VIL O7 - O0 Output Disable A12 A11 A10 A9 A8 VIH High Z Program VILP VPP VILP VILP VIHP VILP D7 - D0 Mode Program Inhibit VILP VPP VILP VIHP VIHP VILP High Z Program Verify VILP VPP VILP VIHP VILP VILP O7 - O0 Blank Check VILP VPP VILP VIHP VILP VILP O7 - O0 Notes: 6. X = "don't care" but not to exceed VCC 5%. 7. Addresses A8-A12 must be latched through lines A0-A4 in programming modes. 5 CY7C261 CY7C263/CY7C264 DIP/Flatpack Top View 2 23 VFY A5 3 22 PGM A4 /A 12 A 3/ A 11 LATCH 4 21 5 20 CS 6 19 A1/A9 7 18 NA A0/A8 8 7C261 17 D7 D0 9 D6 D1 7C263 16 10 7C264 15 D5 D2 11 14 D4 GND 12 13 D3 4 3 2 1 28 27 26 25 5 24 6 7C261 23 7 22 8 21 9 7C263 20 10 19 11 12 13 14 15 16 17 18 D1 A2/A10 VPP A4/A12 A3/A11 A2/A10 A1/A9 A0/A8 NC D0 VFY PGM A6 LATCH CS VPP NA NC D7 D6 D5 VCC NC D3 D4 24 GND 1 D2 A7 A5 A6 A7 NC VCC LCC/PLCC (Opaque only) Top View C261-9 C261-8 Figure 1. Programming Pinouts. Programming Information Programming support is available from Cypress as well as from a number of third-party software vendors. For detailed programming information, including a listing of software pack- ages, please see the PROM Programming Information located at the end of this section. Programming algorithms can be obtained from any Cypress representative. 6 CY7C261 CY7C263/CY7C264 Typical DC and AC Characteristics 1.2 1.4 1.2 1.0 TA = 25C f = f MAX 0.8 4.5 5.0 5.5 1.1 1.0 0.9 0.8 -55 6.0 SUPPLY VOLTAGE(V) 125 1.4 1.2 1.0 0.8 125 0.6 TA = 25C 0.4 4.0 60 35 50 30 40 30 20 10 0 5.0 1.0 2.0 3.0 OUTPUT SINK CURRENT vs. OUTPUT VOLTAGE 15 10 VCC = 4.5V TA = 25C 4.0 0 0 200 400 1.05 150 1.00 125 100 75 VCC = 5.0V TA = 25C 25 VCC = 5.5V TA = 25C 0.95 0.90 0.85 0.80 0.75 1.0 2.0 3.0 0.70 4.0 0 OUTPUT VOLTAGE(V) 25 50 75 CYCLE PERIOD(ns) 7 600 800 1000 CAPACITANCE(pF) NORMALIZED SUPPLY CURRENT vs. CYCLE PERIOD 175 6.0 20 5 0 5.5 25 OUTPUT VOLTAGE(V) 50 4.5 TYPICAL ACCESS TIME CHANGE vs. OUTPUT LOADING OUTPUT SOURCE CURRENT vs. VOLTAGE AMBIENT TEMPERATURE(C) 0 0.0 0.8 SUPPLY VOLTAGE(V) DELTA t AA (ns) OUTPUT SOURCE CURRENT (mA) 1.6 OUTPUT SINK CURRENT (mA) NORMALIZED ACCESS TIME NORMALIZED ACCESS TIME vs. TEMPERATURE 25 25 1.0 AMBIENT TEMPERATURE(C) NORMALIZED I CC 0.6 4.0 NORMALIZED ACCESS TIME 1.2 NORMALIZED I CC NORMALIZED I CC 1.6 0.6 - 55 NORMALI ZED ACCESS TIME vs. SUPPLY VOLTAGE NORMALIZED SUPPLY CURRENT vs. AMBIENT TEMPERATURE NORMALIZED SUPPLY CURRENT vs. SUPPLY VOLTAGE 100 CY7C261 CY7C263/CY7C264 ] Ordering Information[8] Speed (ns) 20 25 35 45 55 Ordering Code Package Name Package Type CY7C261-20JC J64 28-Lead Plastic Leaded Chip Carrier CY7C261-20PC P13 24-Lead (300-Mil) Molded DIP CY7C261-20WC W14 24-Lead (300-Mil) Windowed CerDIP CY7C261-25JC J64 28-Lead Plastic Leaded Chip Carrier CY7C261-25PC P13 24-Lead (300-Mil) Molded DIP CY7C261-25WC W14 24-Lead (300-Mil) Windowed CerDIP CY7C261-25DMB D14 24-Lead (300-Mil) CerDIP CY7C261-25LMB L64 28-Square Leadless Chip Carrier CY7C261-25QMB Q64 28-Pin Windowed Leadless Chip Carrier CY7C261-25TMB T73 24-Lead Windowed Cerpack CY7C261-25WMB W14 24-Lead (300-Mil) Windowed CerDIP CY7C261-35JC J64 28-Lead Plastic Leaded Chip Carrier CY7C261-35PC P13 24-Lead (300-Mil) Molded DIP CY7C261-35WC W14 24-Lead (300-Mil) Windowed CerDIP CY7C261-35DMB D14 24-Lead (300-Mil) CerDIP CY7C261-35LMB L64 28-Square Leadless Chip Carrier CY7C261-35QMB Q64 28-Pin Windowed Leadless Chip Carrier CY7C261-35TMB T73 24-Lead Windowed Cerpack CY7C261-35WMB W14 24-Lead (300-Mil) Windowed CerDIP CY7C261-45JC J64 28-Lead Plastic Leaded Chip Carrier CY7C261-45PC P13 24-Lead (300-Mil) Molded DIP CY7C261-45WC W14 24-Lead (300-Mil) Windowed CerDIP CY7C261-45DMB D14 24-Lead (300-Mil) CerDIP CY7C261-45LMB L64 28-Square Leadless Chip Carrier CY7C261-45QMB Q64 28-Pin Windowed Leadless Chip Carrier CY7C261-45TMB T73 24-Lead Windowed Cerpack CY7C261-45WMB W14 24-Lead (300-Mil) Windowed CerDIP CY7C261-55JC J64 28-Lead Plastic Leaded Chip Carrier CY7C261-55PC P13 24-Lead (300-Mil) Molded DIP CY7C261-55WC W14 24-Lead (300-Mil) Windowed CerDIP CY7C261-55DMB D14 24-Lead (300-Mil) CerDIP CY7C261-55LMB L64 28-Square Leadless Chip Carrier CY7C261-55QMB Q64 28-Pin Windowed Leadless Chip Carrier CY7C261-55TMB T73 24-Lead Windowed Cerpack CY7C261-55WMB W14 24-Lead (300-Mil) Windowed CerDIP Operating Range Commercial Commercial Military Commercial Military Commercial Military Commercial Military Note: 8. Most of these products are available in industrial temperature range. Contact a Cypress representative for specifications and product availability. 8 CY7C261 CY7C263/CY7C264 Ordering Information[8] (continued) Speed (ns) 20 25 35 45 55 Ordering Code CY7C263-20JC Package Name J64 Package Type 28-Lead Plastic Leaded Chip Carrier CY7C263-20PC P13 24-Lead (300-Mil) Molded DIP CY7C263-20WC W14 24-Lead (300-Mil) Windowed CerDIP CY7C263-25JC J64 28-Lead Plastic Leaded Chip Carrier CY7C263-25PC P13 24-Lead (300-Mil) Molded DIP CY7C263-25WC W14 24-Lead (300-Mil) Windowed CerDIP CY7C263-25DMB D14 24-Lead (300-Mil) CerDIP CY7C263-25LMB L64 28-Square Leadless Chip Carrier CY7C263-25QMB Q64 28-Pin Windowed Leadless Chip Carrier CY7C263-25TMB T73 24-Lead Windowed Cerpack CY7C263-25WMB W14 24-Lead (300-Mil) Windowed CerDIP CY7C263-35JC J64 28-Lead Plastic Leaded Chip Carrier CY7C263-35PC P13 24-Lead (300-Mil) Molded DIP CY7C263-35WC W14 24-Lead (300-Mil) Windowed CerDIP CY7C263-35DMB D14 24-Lead (300-Mil) CerDIP CY7C263-35LMB L64 28-Square Leadless Chip Carrier CY7C263-35QMB Q64 28-Pin Windowed Leadless Chip Carrier CY7C263-35TMB T73 24-Lead Windowed Cerpack CY7C263-35WMB W14 24-Lead (300-Mil) Windowed CerDIP CY7C263-45JC J64 28-Lead Plastic Leaded Chip Carrier CY7C263-45PC P13 24-Lead (300-Mil) Molded DIP CY7C263-45WC W14 24-Lead (300-Mil) Windowed CerDIP CY7C263-45DMB D14 24-Lead (300-Mil) CerDIP CY7C263-45LMB L64 28-Square Leadless Chip Carrier CY7C263-45QMB Q64 28-Pin Windowed Leadless Chip Carrier CY7C263-45TMB T73 24-Lead Windowed Cerpack CY7C263-45WMB W14 24-Lead (300-Mil) Windowed CerDIP CY7C263-55JC J64 28-Lead Plastic Leaded Chip Carrier CY7C263-55PC P13 24-Lead (300-Mil) Molded DIP CY7C263-55WC W14 24-Lead (300-Mil) Windowed CerDIP CY7C263-55DMB D14 24-Lead (300-Mil) CerDIP CY7C263-55LMB L64 28-Square Leadless Chip Carrier CY7C263-55QMB Q64 28-Pin Windowed Leadless Chip Carrier CY7C263-55TMB T73 24-Lead Windowed Cerpack CY7C263-55WMB W14 24-Lead (300-Mil) Windowed CerDIP 9 Operating Range Commercial Commercial Military Commercial Military Commercial Military Commercial Military CY7C261 CY7C263/CY7C264 Ordering Information[8] (continued) Speed (ns) 20 25 35 45 55 Ordering Code CY7C264-20DC Package Name D12 Operating Range Package Type 24-Lead (600-Mil) CerDIP CY7C264-20PC P11 24-Lead (600-Mil) Molded DIP CY7C264-20WC W12 24-Lead (600-Mil) Windowed CerDIP CY7C264-25DC D12 24-Lead (600-Mil) CerDIP CY7C264-25PC P11 24-Lead (600-Mil) Molded DIP CY7C264-25WC W12 24-Lead (600-Mil) Windowed CerDIP CY7C264-25DMB D12 24-Lead (600-Mil) CerDIP CY7C264-25WMB W12 24-Lead (600-Mil) Windowed CerDIP CY7C264-35DC D12 24-Lead (600-Mil) CerDIP CY7C264-35PC P11 24-Lead (600-Mil) Molded DIP CY7C264-35WC W12 24-Lead (600-Mil) Windowed CerDIP CY7C264-35DMB D12 24-Lead (600-Mil) CerDIP CY7C264-35WMB W12 24-Lead (600-Mil) Windowed CerDIP CY7C264-45DC D12 24-Lead (600-Mil) CerDIP CY7C264-45PC P11 24-Lead (600-Mil) Molded DIP CY7C264-45WC W12 24-Lead (600-Mil) Windowed CerDIP CY7C264-45DMB D12 24-Lead (600-Mil) CerDIP CY7C264-45WMB W12 24-Lead (600-Mil) Windowed CerDIP CY7C264-55DC D12 24-Lead (600-Mil) CerDIP CY7C264-55PC P11 24-Lead (600-Mil) Molded DIP CY7C264-55WC W12 24-Lead (600-Mil) Windowed CerDIP CY7C264-55DMB D12 24-Lead (600-Mil) CerDIP CY7C264-55WMB W12 24-Lead (600-Mil) Windowed CerDIP Commercial Commercial Military Commercial Military Commercial Military Commercial Military MILITARY SPECIFICATION Group A Subgroup Testing DC Characteristics Parameter Switching Characteristics Subgroups Parameter VOH 1, 2, 3 tAA VOL 1, 2, 3 tACS1[10] Subgroups 7, 8, 9, 10, 11 [9] 7, 8, 9, 10, 11 VIH 1, 2, 3 tACS2 VIL 1, 2, 3 IIX 1, 2, 3 Notes: 9. 7C261 only. 10. 7C263 and 7C264 only. 7, 8, 9, 10, 11 IOZ 1, 2, 3 ICC 1, 2, 3 ISB[9] 1, 2, 3 Document #: 38-00005-J 10 CY7C261 CY7C263/CY7C264 Package Diagrams 24-Lead (600-Mil) CerDIP D12 28-Lead Plastic Leaded Chip Carrier J64 MIL-STD-1835 D-3 Config. A 24-Lead (300-Mil) CerDIP D14 28-Square Leadless Chip Carrier L64 MIL-STD-1835 D-9 Config. A MIL-STD-1835 C-4 11 CY7C261 CY7C263/CY7C264 Package Diagrams (continued) 28-Pin Windowed Leadless ChipCarrier Q64 MIL-STD-1835 C-4 24-Lead (600-Mil) Molded DIP P11 12 CY7C261 CY7C263/CY7C264 Package Diagrams (continued) 24-Lead (300-Mil) Molded DIP P13/P13A 24-Lead Windowed Cerpack T73 13 CY7C261 CY7C263/CY7C264 Package Diagrams (continued) 24-Lead (600-Mil) WindowedCerDIP W12 MIL-STD-1835 D- 3 Config.A 24-Lead (300-Mil) Windowed CerDIP W14 MIL-STD-1835 D- 9 Config.A ) (c) Cypress Semiconductor Corporation, 1996. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.