8K x 8 Power-Switched and Reprogrammable PROM
CY7C261
CY7C263/CY7C264
Cypress Semiconductor Corporation • 3901 North First Street • San Jose • CA 95134 • 408-943-2600
March 1986 – Revised December 1994
Features
• CMOS for optimum speed/power
• Windowed for reprogrammability
• High speed
—20 ns (commercial)
—25 ns (military)
•Low power
—660 mW (commercial)
—770 mW (military)
• Super low standby power (7C261)
—Less than 220 mW when deselected
—Fast access: 20 ns
• EPR OM tec hn ology 100% progr ammable
• Slim 300-mil or standard 600-mil packaging available
•5V ± 10% VCC, commercial and military
• Capab le of withsta ndin g gre ater than 20 01V stati c dis-
charge
• TTL-c ompatible I/O
• Direct replacement for bipolar PROMs
Functional Description
The CY7C261, CY7C263, and CY7C264 are high-perfor-
mance 8 192 -word by 8-bi t CMO S PROM s. Wh en de se lec ted,
the 7C26 1 automatica lly powe rs down into a low-po wer stand-
by mode. It is packaged in a 300-mil-wide package. The 7C263
and 7C264 are packaged in 300-mil-wide and 600-mil-wide
packages respectiv ely, and do not power down when deselect-
ed. The r epro g r am mab le pack ag es a re equipped wi th an er a-
sure window; when exposed to UV light, these PROMs are
era sed and can then be repro gramm ed. The memory cells uti-
liz e prov en EPR OM floatin g-gate technolo g y and byt e-wide in-
telligent programming algorithms.
The CY7C261, CY7C263, and CY7C264 are plug-in replace-
ments for bipolar devices and offer the advantages of lower
power, superior performance and programming yield. The
EPR O M cell requ ires onl y 12 .5V for the superv olta ge and l o w
current requirements allow for gang programming. The
EPROM cells allow for each memory location to be tested
100%, as eac h locat ion is written into, erased, and rep eatedl y
e xercised prior to enca psulation. Each PR OM is also tested f or
AC performance to guarantee that after customer program-
ming the product will meet DC and AC specification limits.
Read is accomplished by placi ng an activ e LO W signal on C S.
The contents of the memory location addressed by the ad-
dress line (A0−A12) will become available on the output lines
(O0−O7).
For an 8K x 8 Registered PROM, see theCY7C265.
Logic Block Diagram Pin Configurations
C261-1
C261-2 C261-3
O7
O6
O5
O4
O3
O2
O1
O0
ADDRESS
DECODER
PROGRAM–
MABLE
ARRAY
COLUMN
MULTI–
PLEXER
POWER DOWN
(7C261)
A0
A1
A2
A3
A4
A5
A6
A8
A9
A10
A11
A12
CS
GND
1
2
3
4
5
6
7
8
9
10
11 14
15
16
20
19
18
17
21
24
23
22
Top Vie w
DIP/Flatpack
A6
A5
A4
A3
A2
A1
A0
O0
A7
O3
VCC
A8
A9
A10
O7
O6
O5
O4
CS
O212 13
O1
A12
A11
28
4
5
6
7
8
9
10
321 27
1314151617
26
25
24
23
22
21
20
1112 19
A5
VCC
GND A6
A7
O3
O1
O0
Top View
18
O4
O5
NC
A0
A4
A3
A10
NC
A8
A9
NC
NC
CS
A11
O7
O6
7C261
7C263
7C264
7C261
7C263
A7A2
A1A12
O2
COLUMN
ADDRESS
ROW
ADDRESS LCC/PLCC (Opaque Only)
CY7C261
CY7C263/CY7C264
2
Maximum Ratings
(Above which the usefu l life may be impai red. For user guide-
lines, not tested.)
Storage Temperaturesy................................–65°C to+150°C
Ambient Temperature with
Power Applied................................... ...... .....–55°C to+125°C
Supply Voltage to Ground Potential
(Pin 24 to Pin 12)............................................–0.5V to+7.0V
DC Voltage Applied to Outputs
in High Z State................................................–0.5V to+7.0V
DC Input Voltage........................................... –3.0V to + 7.0V
DC Program Voltage
(Pin 19 DIP, Pin 23 LCC)...............................................13.0V
Static Discharge Voltage............................................>2001V
(per MIL-STD-883, Method 3015)
Latch-Up Current.....................................................>200 mA
UV Exposure ................................................7258 Wsec/cm2
Selection Guide
7C261-20
7C263-20
7C264-20
7C261-25
7C263-25
7C264-25
7C261-35
7C263-35
7C264-35
7C261-45
7C263-45
7C264-45
7C261-55
7C263-55
7C264-55
Maximum Access Time (ns) 20 25 35 45 55
Maximum Operating
Current (mA) Commercial 120 120 100 100 100
Military 140 120 120 120
Maximum Standby
Current (mA)
(7C261 only)
Commercial 40 40 30 30 30
Military 40 30 30 30
Operating Range
Range Ambient
Temperature VCC
Commercial 0°C to + 70°C 5V ± 10%
Industrial[1] –40°C to + 85°C 5V ± 10%
Military[2] –55°C to + 125°C 5V ± 10%
Notes:
1. See the Ordering Information section regarding industrial teperature
range specifcation.
2. TA is the “instant on” case temperature.
CY7C261
CY7C263/CY7C264
3
]]
Electrical Characteristics Over the Operati ng Range[3,4]
7C261-20, 25
7C263-20, 25
7C264-20, 25
7C261-35, 45, 55
7C263-35, 45, 55
7C264-35, 45, 55
Parameter Descrip tion Test Conditions Min. Max. Min. Max. Unit
VOH Output HIGH Voltage VCC = Min., IOH = –2.0 mA 2.4 V
VOH Output HIGH Voltage VCC = Min., IOH = –4.0 mA 2.4 V
VOL Output LOW Voltage VCC = Min., IOL = 8 mA
(6 mA Mil) 0.4 V
VOL Output LOW Voltage VCC = Min., IOL = 16 mA 0.4 V
VIH Input HIGH Level 2.0 2.0 V
VIL Input LOW Level 0.8 0.8 V
IIX Input Current GND < VIN < VCC –10 +10 –10 +10 µA
VCD Input Diode Clamp Voltage Note 4 Note 4
IOZ Output Leakage Current GND <VOUT < VCC
Output Disabled Com’l–10 +10 –10 +10 µA
Mil –40 +40 –40 +40 µA
IOS Output Short Circuit Current[5] VCC = Max., V OUT = GND –20 –90 –20 –90 mA
ICC Power Supply Current VCC = Max.,
f = Max.
IOUT= 0 mA
Com’l 120 100 mA
Mil 140 120
ISB Standby Supply Current (7C261) VCC = Max. ,
CS > V IH Com’l40 30mA
Mil 40 30
VPP Programming Supply Voltage 12 13 12 13 V
IPP Programming Supply Current 50 50 mA
VIHP Input HIGH Programmin g Voltage 4.75 4.75 V
VILP Input LOW Programming Voltage 0.4 0.4 V
Notes:
3. See the last page of this specification for Group A subgroup testing inf ormation.
4. See the “Introduction to CMOS PROMs” section of the Cypress Data Book for general information on testing.
5. For test purposes, not more than one output at a time should be shorted. Short circuit test duration should not exceed 30 seconds.]
Capacitance[4]
Parameter Description Test Conditions Max. Unit
CIN Input Capacitance TA = 2 5°C, f = 1 MHz,
VCC = 5.0V 10 pF
COUT Outp ut Capacitance 10 pF
CY7C261
CY7C263/CY7C264
4
AC Test Loads and Waveforms[4]
Switching Characteristics Over the Operating Range [2,3,4]
7C261-20
7C263-20
7C264-20
7C261-25
7C263-25
7C264-25
7C261-35
7C263-35
7C264-35
7C261-45
7C263-45
7C264-45
7C261-55
7C263-55
7C264-55
Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Unit
tAA Address to Output Va lid 20 25 35 4 5 55 ns
tHZCS1 Chip Select Inactive to High Z
(7C263 and 7C264) 12 12 20 30 35 ns
tHZCS2 Chip Select Inac tive to High Z
(7C261) 20 25 35 45 55 ns
tACS1 Chip Select Active to Output Valid
(7C263 and 7C264) 12 12 20 30 35 ns
tACS2 Chip Select Active to Output Valid
(7C261) 20 25 35 45 55 ns
tPU Chip Select Active to Power-Up
(7C261) 00000ns
tPD Chip Select Inactive to
Power-Down (7C261) 20 25 35 45 55 ns
R2333Ω
(403ΩMIL)
3.0V
5V
OUTPUT
R1500
(658ΩMIL)
30 pF
INCLUDING
JIG AND
SCOPE
GND
90%
10%
90%
10%
≤5ns ≤5ns
5V
OUTPUT
5pF
INCLUDING
JIG AND
SCOPE
(a) Normal Load (b) HighZ Load C261-4 C261-5
OUTPUT RTH 200Ω(250ΩMIL)
5V
OUTPUT 5V
OUTPUT
R1250Ω
30pF
INCLUDING
JIG AND
SCOPE
5pF
INCLUDING
JIG AND
SCOPE
(c)Normal Load (d) HighZ Load C261-6
OUTPUT 2.0V
RTH 100Ω
R1250Ω
R1500Ω
(658ΩMIL)
R2333Ω
(403ΩMIL)
R2167ΩR2167Ω
2.0V(1.9VMIL)
Test Load for –20through –30 speeds
Test Load for –35 through –55 speeds
Equivalent to: THÉ VENIN EQ UIVALENT
Equivalent to: THÉ VENINEQUIVALENT
CY7C261
CY7C263/CY7C264
5
Erasure Characteri stics
Wavelengths of li ght less than 40 00 angs troms begin to eras e
the devices in the windowed package. For this reason, an
opaque label should be placed over the window if the PROM
is exposed to sunlight or fluorescent lighting for extended pe-
riods of time.
The recommended dose of ultraviolet light for erasure is a
wa velength of 2537 angstroms for a minimum dose (UV inten-
sity mult i pl i ed by exposu r e tim e) of 25 W se c /c m2. For an ultra-
violet lamp with a 12 mW/cm2 po wer rating, the exposure time woul-
dbe approximately 35 min utes . The 7C261 o r 7C26 3 needs to
be within 1 inch of the lamp during erasure. Per manent dam-
age may result if the PROM is exposed to high-intensity UV
light for an extended period of time. 7258 Wsec/cm2 is the
recommended maximum dosage.
Operating Modes
Read
Read is the normal oper ating mo de for pro gramm ed dev ice. In
this mode, all signals are normal TTL levels. The PROM is
addressed with a 13-bit field, a chip select, (active LOW), is
applied to the CS pin, and th e conte nts of th e addr essed loca tion
appear on the data out pins.
Program, Program Inhibit, Program Verify
These m odes a re e ntered b y plac ing a h igh voltage VPP on pin
19, wit h pins 18 an d 20 set t o V ILP
. In t his state, p in 21 beco mes a
latch signal, allowin g the upper 5 ad dr ess bit s to b e latc hed i nto an
onboard r egister, pin 2 2 becomes an active LOW program (PGM)
signal and pin 23 becomes an active LOW verify (VFY) signal. Pins
22 and 23 should nev er be active LO W at the same time. The PRO-
GRAM mode exists when PGM is LOW , and VFY is HIGH. The verify
mode exists when the reverse is true, PGM HIGH and VFY LOW and
the program inhibit mode is entered with both PGM and VFY HIGH.
Program inhibit is specifically provided to allow data to be placed on
and removed from the data pins without conflict
Switching Waveforms [4]
tAA
VCC
SUPPLY
CURRENT
A0-A
12
ADDRESS
CS
tPU
O0-O
7
tHZCS tACS
C261-7
50% 50%
tPD
Table 1. Mode Selection
Pin Function[6, 7]
Read or Output Disable A12 A11 A10 A9A8CS O7 - O0
Mode Program NA VPP LATCH PGM VFY CS D7 - D0
Read A12 A11 A10 A9A8VIL O7 - O0
Output Disable A12 A11 A10 A9A8VIH Hi gh Z
Program VILP VPP VILP VILP VIHP VILP D7 - D0
Program Inhibit VILP VPP VILP VIHP VIHP VILP Hi gh Z
Program Verify VILP VPP VILP VIHP VILP VILP O7 - O0
Blank Check VILP VPP VILP VIHP VILP VILP O7 - O0
Notes:
6. X = “don’t care” but not to exceed VCC ±5%.
7. Addresses A 8-A12 must be l atched th rough l ines A 0-A4 i n programmi ng modes.
CY7C261
CY7C263/CY7C264
6
Programming Information
Programming support is available from Cypress as well as
from a number of third-party software vendors. For detailed
prog r a mm ing info rmation, including a listing of software pack-
ages, please see the PR OM Programming Inf ormation locate d
at the end of th is se ction. Progr a mming al gorithm s can be ob-
tained from any Cypress representative.
Figure 1. Pr og ramm ing Pinouts .
C261-8
C261-9
DIP/Flatpack LCC/PLCC
Top View Top View
GND
1
2
3
4
5
6
7
8
9
10
11 14
15
16
20
19
18
17
21
24
23
22
A6
A5
A4/A
12
A3/A
11
A2/A10
A1/A9
A0/A8
D0
A7
D3
VCC
VFY
PGM
LATCH
D7
D6
D5
D4
CS
D212 13
D1
NA
VPP
28
4
5
6
7
8
9
10
321 27
13 14 1516 17
26
25
24
23
22
21
20
1112 19
A5
VCC
GND A6
A7
D3
D1
D018
D4
D5
NC
A0/A8
A4/A12
A3/A11
LATCH
NC
NC
CS
VPP
D7
D6
7C261
7C263
7C264
7C261
7C263
A2/A10
A1/A9NA
D2
PGM
VFY
NC
(Opaque only)
CY7C261
CY7C263/CY7C264
7
Typical DC and AC Characteristi cs
TYPICAL ACCESS TIME CHANGE
vs. OUTPUT LOADING
1.4
1.6
1.0
0.8
4.0 4.5 5.0 5.5 6.0 -55 25 125
1.2
1.1
1.2
1.0
0.8
0.6
4.0 4.5 5.0 5.5 6.0
NORMALIZED ACCESS TIME
SUPPLY VOLTAGE(V)
NORMALIZED SUPPLY CURRENT
vs. SUPPLY VOLTAGE NORMALIZED SUPPLY CURRENT
vs. AMBIENT TEMPERATURE
AMBI EN T TEMPERATURE (°C) SUPPLY VOLTAGE(V)
NORMALIZED ACCESS TIME
vs. SUPPLY VOLTAGE
0.6
1.2
1.6
1.4
1.2
1.0
0.8
- 55 125
NORMALIZED ACCE SS TIME
AMBIENT TEMPERATU RE(°C)
NORMALIZED ACCESS TIME
vs. TEMPERATURE
150
175
125
75
50
25
0.0 1.0 2.0 3.0
OUTPUT SINK CURRENT (mA)
0
100
OUTP U T VOLTAGE(V)
OUTPUT SINK CURRENT
vs. OUTPUT VOLTAGE
1.0
0.9
0.8
NORM ALIZED I
CC
NORMALIZED I
CC
VCC = 5.0V
TA= 25°C
TA= 25°C
0.6
0.4
60
50
40
30
20
10
01.0 2.03.0
OUTPUT SOURCE CURRENT (mA)
OUTPUT VOLTAGE(V)
30
25
20
15
10
5
0 200 400 600 800
DELTA t (ns)
AA
CAPACITANCE(pF)
4.0 1000
VCC = 4.5V
TA= 25°C
TA= 25°C
f= fMAX
25 0
OUTPUT SOURCE CURRENT
vs. VOLTAGE
4.0
1.00
1.05
0.95
0.85
0.80
0.75
025 5075
100
0.70
0.90
NORMALIZED SUPPLY CURRENT
vs. CYCLE PERIOD
CYCLE PERIOD(ns)
NORMALIZED I
CC
VCC = 5.5V
TA= 25°C
0
35
CY7C261
CY7C263/CY7C264
8
]
Ordering Information[8]
Speed
(ns) Ord ering Code Package
Name Package Type Operating
Range
20 CY7C261-20JC J64 28-Lead Plastic Leaded Chip Carrier Commercial
CY7C261-20PC P13 24-Lead (300-Mil) Molded DIP
CY7C261-20WC W14 24-Lead (300-Mil) Windowed CerDIP
25 CY7C261-25JC J64 28-Lead Plastic Leaded Chip Carrier Commercial
CY7C261-25PC P13 24-Lead (300-Mil) Molded DIP
CY7C261-25WC W14 24-Lead (300-Mil) Windowed CerDIP
CY7C261-25DMB D14 24-Lead (300-Mil) CerDIP Military
CY7C261-25LMB L64 28-Square Leadless Chip Carrier
CY7C261-25QMB Q64 28-Pin Windowed Leadless Chip Carrier
CY7C261-25TMB T73 24-Lead Windowed Cerpack
CY7C261-25WMB W14 24-Lead (300- M il) Windowed CerDIP
35 CY7C261-35JC J64 28-Lead Plastic Leaded Chip Carrier Commercial
CY7C261-35PC P13 24-Lead (300-Mil) Molded DIP
CY7C261-35WC W14 24-Lead (300-Mil) Windowed CerDIP
CY7C261-35DMB D14 24-Lead (300-Mil) CerDIP Military
CY7C261-35LMB L64 28-Square Leadless Chip Carrier
CY7C261-35QMB Q64 28-Pin Windowed Leadless Chip Carrier
CY7C261-35TMB T73 24-Lead Windowed Cerpack
CY7C261-35WMB W14 24-Lead (300- M il) Windowed CerDIP
45 CY7C261-45JC J64 28-Lead Plastic Leaded Chip Carrier Commercial
CY7C261-45PC P13 24-Lead (300-Mil) Molded DIP
CY7C261-45WC W14 24-Lead (300-Mil) Windowed CerDIP
CY7C261-45DMB D14 24-Lead (300-Mil) CerDIP Military
CY7C261-45LMB L64 28-Square Leadless Chip Carrier
CY7C261-45QMB Q64 28-Pin Windowed Leadless Chip Carrier
CY7C261-45TMB T73 24-Lead Windowed Cerpack
CY7C261-45WMB W14 24-Lead (300- M il) Windowed CerDIP
55 CY7C261-55JC J64 28-Lead Plastic Leaded Chip Carrier Commercial
CY7C261-55PC P13 24-Lead (300-Mil) Molded DIP
CY7C261-55WC W14 24-Lead (300-Mil) Windowed CerDIP
CY7C261-55DMB D14 24-Lead (300-Mil) CerDIP Military
CY7C261-55LMB L64 28-Square Leadless Chip Carrier
CY7C261-55QMB Q64 28-Pin Windowed Leadless Chip Carrier
CY7C261-55TMB T73 24-Lead Windowed Cerpack
CY7C261-55WMB W14 24-Lead (300- M il) Windowed CerDIP
Note:
8. Most of these products are available in industrial temperature range. Contact a Cypress representative for specifications and product
availability.
CY7C261
CY7C263/CY7C264
9
20 CY7C263-20JC J64 28-Lead Plastic Leaded Chip Carrier Commercial
CY7C263-20PC P13 24-Lead (300-Mil) Molded DIP
CY7C263-20WC W14 24-Lead (300-Mil) Windowed CerDIP
25 CY7C263-25JC J64 28-Lead Plastic Leaded Chip Carrier Commercial
CY7C263-25PC P13 24-Lead (300-Mil) Molded DIP
CY7C263-25WC W14 24-Lead (300-Mil) Windowed CerDIP
CY7C263-25DMB D14 24-Lead (300-Mil) CerDIP Military
CY7C263-25LMB L64 28-Square Leadless Chip Carrier
CY7C263-25QMB Q64 28-Pin Windowed Leadless Chip Carrier
CY7C263-25TMB T73 24-Lead Windowed Cerpack
CY7C263-25WMB W14 24-Lead (300- M il) Windowed CerDIP
35 CY7C263-35JC J64 28-Lead Plastic Leaded Chip Carrier Commercial
CY7C263-35PC P13 24-Lead (300-Mil) Molded DIP
CY7C263-35WC W14 24-Lead (300-Mil) Windowed CerDIP
CY7C263-35DMB D14 24-Lead (300-Mil) CerDIP Military
CY7C263-35LMB L64 28-Square Leadless Chip Carrier
CY7C263-35QMB Q64 28-Pin Windowed Leadless Chip Carrier
CY7C263-35TMB T73 24-Lead Windowed Cerpack
CY7C263-35WMB W14 24-Lead (300- M il) Windowed CerDIP
45 CY7C263-45JC J64 28-Lead Plastic Leaded Chip Carrier Commercial
CY7C263-45PC P13 24-Lead (300-Mil) Molded DIP
CY7C263-45WC W14 24-Lead (300-Mil) Windowed CerDIP
CY7C263-45DMB D14 24-Lead (300-Mil) CerDIP Military
CY7C263-45LMB L64 28-Square Leadless Chip Carrier
CY7C263-45QMB Q64 28-Pin Windowed Leadless Chip Carrier
CY7C263-45TMB T73 24-Lead Windowed Cerpack
CY7C263-45WMB W14 24-Lead (300- M il) Windowed CerDIP
55 CY7C263-55JC J64 28-Lead Plastic Leaded Chip Carrier Commercial
CY7C263-55PC P13 24-Lead (300-Mil) Molded DIP
CY7C263-55WC W14 24-Lead (300-Mil) Windowed CerDIP
CY7C263-55DMB D14 24-Lead (300-Mil) CerDIP Military
CY7C263-55LMB L64 28-Square Leadless Chip Carrier
CY7C263-55QMB Q64 28-Pin Windowed Leadless Chip Carrier
CY7C263-55TMB T73 24-Lead Windowed Cerpack
CY7C263-55WMB W14 24-Lead (300- M il) Windowed CerDIP
Ordering Information[8] (continued)
Speed
(ns) Ord ering Code Package
Name Package Type Operating
Range
CY7C261
CY7C263/CY7C264
10
MILITARY SPECIFICATION
Gr oup A Subgroup Testing
Document #: 38-00005-J
20 CY7C264-20DC D12 24-Lead (600-Mil) CerDIP Commercial
CY7C264-20PC P11 24-Lead (600-Mil) Molded DIP
CY7C264-20WC W12 24-Lead (600-Mil) Windowed CerDIP
25 CY7C264-25DC D12 24-Lead (600-Mil) CerDIP Commercial
CY7C264-25PC P11 24-Lead (600-Mil) Molded DIP
CY7C264-25WC W12 24-Lead (600-Mil) Windowed CerDIP
CY7C264-25DMB D12 24-Lead (600-Mil) CerDIP Military
CY7C264-25WMB W12 24-Lead (600- M il) Windowed CerDIP
35 CY7C264-35DC D12 24-Lead (600-Mil) CerDIP Commercial
CY7C264-35PC P11 24-Lead (600-Mil) Molded DIP
CY7C264-35WC W12 24-Lead (600-Mil) Windowed CerDIP
CY7C264-35DMB D12 24-Lead (600-Mil) CerDIP Military
CY7C264-35WMB W12 24-Lead (600- M il) Windowed CerDIP
45 CY7C264-45DC D12 24-Lead (600-Mil) CerDIP Commercial
CY7C264-45PC P11 24-Lead (600-Mil) Molded DIP
CY7C264-45WC W12 24-Lead (600-Mil) Windowed CerDIP
CY7C264-45DMB D12 24-Lead (600-Mil) CerDIP Military
CY7C264-45WMB W12 24-Lead (600- M il) Windowed CerDIP
55 CY7C264-55DC D12 24-Lead (600-Mil) CerDIP Commercial
CY7C264-55PC P11 24-Lead (600-Mil) Molded DIP
CY7C264-55WC W12 24-Lead (600-Mil) Windowed CerDIP
CY7C264-55DMB D12 24-Lead (600-Mil) CerDIP Military
CY7C264-55WMB W12 24-Lead (600- M il) Windowed CerDIP
Ordering Information[8] (continued)
Speed
(ns) Ord ering Code Package
Name Package Type Operating
Range
DC Characteristics
Parameter Subgroups
VOH 1, 2, 3
VOL 1, 2, 3
VIH 1, 2, 3
VIL 1, 2, 3
IIX 1, 2, 3
IOZ 1, 2, 3
ICC 1, 2, 3
ISB[9] 1, 2, 3
Switching Characteristics
Parameter Subgroups
tAA 7, 8, 9, 10, 11
tACS1[10] 7, 8, 9, 10, 11
tACS2[9] 7, 8, 9, 10, 11
Notes:
9. 7C261 only.
10. 7C263 and 7C264 only.
CY7C261
CY7C263/CY7C264
11
P ackage Diagrams
24-Lead (600-Mil) CerDIPD12
MIL-STD-1835 D-3 Config. A 28-Lead Plastic Leaded Chip Carrier J64
24-Lead (300-Mil) CerDIP D14
MIL-STD-1835 D-9 Config. A 28-Square Leadless Chip Carrier L64
MIL-STD-1835 C-4
CY7C261
CY7C263/CY7C264
12
P ackage Diagrams (continued)
28-PinWindowed Leadless ChipCarrier Q64
MIL-STD-1835 C-4
24-Lead (600-Mil) MoldedDIPP11
CY7C261
CY7C263/CY7C264
13
P ackage Diagrams (continued)
24-Lead (300-M il) Mol ded DIP P13/P13 A
24-Lead WindowedCerpack T73
CY7C261
CY7C263/CY7C264
© Cypress Semiconductor Cor poration, 1996. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any ci rcuitry other than circ uitry embo died in a Cypr ess Semiconductor p roduct. Nor does it conv ey or imply an y license under pa tent or other rights. Cypre ss Semiconductor doe s not authoriz e
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
)
P ackage Diagrams (continued)
24-Lead (600-Mil) WindowedCerDIP W12
MIL-STD-1835 D-3 Config.A
24-Lead (300-Mil) Windowed CerDIP W14
MIL-STD-1835 D-9 Config.A
